Shielding cover with heat dissipation structure and high-frequency connector

Abstract

The utility model discloses a shielding case and a high-frequency connector with a heat dissipation structure, which comprise a panel, a bottom plate, a left side plate, a right side plate and a rear side plate, the panel, the bottom plate, the left side plate, the right side plate and the rear side plate are rectangular, the front ends of the panel, the bottom plate, the left side plate and the right side plate are aligned to form a rectangular box body structure, and the lengths of the left side plate and the right side plate are greater than the width of the bottom plate. A lower opening is formed behind the bottom plate. At least one partition plate is arranged between the panel and the bottom plate so as to form at least two insertion cavities, the radiator is arranged on the top face of the panel corresponding to the insertion cavities, and the heat dissipation performance is improved. And the lengths of the panel, the bottom plate and the rear side plate are matched with the plurality of inserting cavities. The width of the panel is smaller than the length of the left side plate and the right side plate, an upper opening is formed behind the panel, and a cover plate is arranged behind the panel. The upper opening forms the shielding cover on the circuit board of the high-frequency connector, reflow soldering is achieved at a time, connection between the connector and the shielding cover and the circuit board is achieved, working procedures are reduced, and efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of high-frequency connectors, in particular to a shielding cover with a heat dissipation structure and a high-frequency connector. Background Art

[0002] The main function of the connector is to transmit electrical signals between two electrical devices. At high frequencies, the attenuation and phase delay of the connector will become more significant, which will affect the transmission quality of the signal. In addition, at high frequencies, the connector is also more susceptible to external interference, so shielding technology is needed to reduce the sensitivity of the connector to external interference. The existing multi-port connector composed of multiple connectors includes a circuit board, multiple connectors and a shielding cover. The connector is first fixed to the circuit board, and the connector and the circuit board are welded by reflow soldering. Then, the shielding cover is crimped to the circuit board and the connector is covered therein. In the production process, the shielding cover can be assembled only after the reflow soldering is completed. The shielding cover is plugged into the jack on the circuit board. At the same time, the pins need to be crimped or wave soldered again to achieve the fixing of the shielding cover and the circuit board. The equipment involved in the automated process is complex and the cost is high, so the process efficiency still has room for improvement. On the other hand, since the shielding cover is in a sealed form, the high-frequency connector will continue to emit heat during operation. Although some through holes are set for heat dissipation in the shielding cover of the existing connector, the heat dissipation effect is poor, which can easily cause the connector to overheat and cause failure. Therefore, the heat dissipation performance of the shielding cover needs to be improved. Utility Model Content

[0003] The purpose of the present application is to propose a shielding cover and a high-frequency connector with a heat dissipation structure, so as to make the assembly of the components of the high-frequency connector more convenient and faster, reduce the cost, and realize that the shielding cover of the high-frequency connector has good heat dissipation performance.

[0004] The technical solution disclosed by the utility model is a shielding cover with a heat dissipation structure, comprising a panel, a bottom plate, a left side plate, a right side plate and a rear side plate, wherein the panel, the bottom plate, the left side plate, the right side plate and the rear side plate are rectangular, and the front ends of the panel, the bottom plate, the left side plate and the right side plate are aligned to form a rectangular box structure, the lengths of the left side plate and the right side plate are greater than the width of the bottom plate, and a lower opening is formed at the rear of the bottom plate; at least one partition is provided between the panel and the bottom plate to form at least two plug-in cavities, a radiator is provided on the top surface of the panel corresponding to the plug-in cavity, and the lengths of the panel, the bottom plate and the rear side plate are adapted to the setting of multiple plug-in cavities.

[0005] Furthermore, the width of the panel is smaller than the length of the left panel and the right panel, an upper opening is formed at the rear of the panel, and a cover plate is arranged at the rear of the panel, and the cover plate covers the upper opening.

[0006] Furthermore, the left and right sides and the rear side of the cover plate are provided with a plurality of first snap-in ears that are independently bent downward, and the plurality of first snap-in ears and the cover plate are integrally stamped from metal material, and the left side plate, the right side plate and the rear side plate are provided with first snap-in parts that are snap-connected with the first snap-in ears.

[0007] Preferably, the left side panel, right side panel, rear side panel and panel are integrally stamped from metal material, the left side panel, right side panel and rear side panel are bent 90 degrees to the panel, and the rear ends of the left side panel and the right side panel are buckled and connected to the two ends of the rear side panel.

[0008] Preferably, the radiator includes a high thermal conductivity heat dissipation block and a clip-on fixing member, the bottom surface of the high thermal conductivity heat dissipation block is a plane and is attached to the upper surface of the panel, the top surface of the high thermal conductivity heat dissipation block is provided with a plurality of heat dissipation grooves to increase the heat dissipation area of ​​the upper surface, the clip-on fixing member includes pressure strips respectively pressed and laterally connected to the two ends of the upper surface of the high thermal conductivity heat dissipation block, the two ends of the pressure strip are provided with second clipping ears bent downward, and the side walls of the left plate and the right plate are provided with second clipping portions clipped with the second clipping ears.

[0009] Furthermore, the pressure strip is provided with a first concave position elastically pressed in the middle of the heat dissipation groove along its length direction, and a second concave position embedded between two high thermal conductivity heat dissipation blocks, and the second concave position forms a limit for multiple high thermal conductivity heat dissipation blocks.

[0010] Furthermore, the upper and lower sides of the partition are provided with partition fixing pins, and the panel and the bottom plate are provided with holes for inserting the partition fixing pins.

[0011] Furthermore, the bottom edges of the left side plate, the right side plate and the rear side plate are all provided with shield cover fixing pins for fixing and assembling the shield cover.

[0012] The present solution also discloses a high-frequency connector, including a circuit board and a connector arranged on the circuit board, wherein a shielding cover with a heat dissipation structure is arranged on the circuit board, and a lower opening behind the bottom plate covers the periphery of the connector, and holes for plugging in the fixing pins of the shielding cover are arranged on the circuit board, and the shielding cover is connected to the circuit board by crimping or by reflow soldering.

[0013] The shielding cover and high-frequency connector with heat dissipation structure designed by the technical scheme have the following beneficial effects: on the one hand, the panel and rear side panel of the shielding cover structure include a closed structure and a non-closed structure, and an upper opening is formed at the rear of the panel. In addition to the fixed connection between the shielding cover and the circuit board by crimping, the shielding cover can also be connected to the circuit board by reflow soldering. The upper opening is used as a hot air channel for reflow soldering, so that the connector can be placed on the circuit board through an automated process, and then the shielding cover can be placed on the circuit board and the connector through an automated process, and then the connector and the shielding cover can be connected to the circuit board at the same time through a reflow soldering process, which is conducive to improving production efficiency and reducing production costs. On the other hand, the heat dissipation structure is designed, and the high thermal conductivity heat dissipation block and the clamping fixture of the heat dissipation structure are designed, which is easy to assemble. According to the number of connectors of the high-frequency connector, the number of corresponding plug-in cavities, and then the number of high thermal conductivity heat dissipation blocks corresponding to the number of high-frequency connectors can be used for high-frequency connectors and shielding covers with different numbers of plug-in interfaces. Only different clamping fixtures need to be set, which is conducive to reducing product development costs.

[0014] In addition, the cover plate is designed with a plurality of independently downwardly bent first snap-in ears, rather than an overall downward bend, which can disperse the bending stress and help reduce the overall deformation of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the shielding cover embodiment of the utility model.

[0016] Figure 2 This is a schematic structural diagram of the shielding cover embodiment of the utility model in the open state of the cover.

[0017] Figure 3 It is a schematic diagram of the bottom structure of the shielding cover embodiment of the utility model.

[0018] Figure 4 It is a schematic diagram of the overall structure of the rear side of the shielding cover embodiment of the utility model.

[0019] Figure 5 The figure is a schematic diagram of a high-frequency connector embodiment of the utility model.

[0020] Figure 6 This is a schematic diagram of a circuit board of an embodiment of a high-frequency connector of the utility model.

[0021] Figure 7 This is a schematic diagram of a high-frequency connector embodiment of the utility model being placed on a circuit board.

[0022] Figure 8 This is a schematic diagram of the high-frequency connector of the utility model with the shielding cover and the cover plate in the open state.

[0023] Fig. 9The utility model is a schematic diagram of the overall structure of a high-frequency connector provided with a shielding cover.

[0024] Description of reference numerals:

[0025] 1-panel; 101-upper opening; 2-bottom plate; 201-lower opening; 3-left side plate; 31-shielding cover fixing pin; 4-right side plate; 41-first clamping part; 42-second clamping part; 5-rear side plate; 6-cover plate; 61-first clamping ear; 7-partition plate; 71-partition plate fixing pin; 8-high thermal conductivity heat sink; 9-clamping fixing piece; 91-first lower concave position; 92-second lower concave position; 93-second clamping ear; 10-connector; 11-circuit board; 111-hole position; DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] It should also be noted that the directional terms such as left, right, top and bottom in the embodiments of the present application are merely relative concepts or are based on the normal use status of the product, and should not be considered as restrictive.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] Please refer to Figures 1 to 4, is an embodiment of a shielding cover with a heat dissipation structure provided by the technical solution, the shielding cover includes a panel 1, a bottom plate 2, a left side plate 3, a right side plate 4 and a rear side plate 5, the panel 1, the bottom plate 2, the left side plate 3, the right side plate 4 and the rear side plate 5 are rectangular, the front ends of the panel 1, the bottom plate 2, the left side plate 3, and the right side plate 4 are aligned to form a rectangular box structure, the length of the left side plate 3 and the right side plate 4 is greater than the width of the bottom plate 2, and a lower opening 201 is formed at the rear of the bottom plate 2; at least one partition plate 7 is provided between the panel 1 and the bottom plate 2 to form at least two plug-in cavities, a radiator is provided on the top surface of the panel 1 corresponding to the plug-in cavity, and the length of the panel 1, the bottom plate 2 and the rear side plate 5 is adapted to the setting of multiple plug-in cavities.

[0031] Reference Figure 2 , further, the width of the panel 1 is smaller than the length of the left side panel 3 and the right side panel 4, an upper opening 101 is formed at the rear of the panel 1, and a cover plate 6 is provided at the rear of the panel 1, and the cover plate 6 covers the upper opening 101. The upper opening 101 is used to provide a hot air passage when the shielding cover as a whole is fixedly connected to the circuit board 11 of the high-frequency connector 10 through the reflow soldering process. Because the rear side of the panel 1 is a closed structure, there is no opening for the hot air to be blown out during the reflow soldering process, so the upper opening 101 needs to be provided, and for the purpose of shielding, the cover plate 6 still needs to be provided on the basis of the upper opening 101, so as to close the upper opening 101 after the reflow soldering process is completed.

[0032] Furthermore, the left and right sides and the rear side of the cover plate 6 are provided with a plurality of first snap-in ears 61 that are independently bent downward. The plurality of first snap-in ears 61 and the cover plate 6 are integrally stamped from a metal material. The left side plate 3, the right side plate 4 and the rear side plate 5 are provided with a first snap-in portion 41 that is snap-connected with the first snap-in ears 61.

[0033] Preferably, the left side panel 3, the right side panel 4, the rear side panel 5 and the panel 1 are integrally stamped from a metal material; the left side panel 3, the right side panel 4 and the rear side panel 5 are bent at 90 degrees to the panel 1; the rear ends of the left side panel 3 and the right side panel 4 are buckled and connected to the two ends of the rear side panel 5.

[0034] Preferably, the radiator includes a high thermal conductivity heat dissipation block 8 and a clip-on fixing member 9, the bottom surface of the high thermal conductivity heat dissipation block 8 is a plane and is attached to the upper surface of the panel 1, and the top surface of the high thermal conductivity heat dissipation block 8 is provided with a plurality of heat dissipation grooves to increase the heat dissipation area of ​​the upper surface, and the clip-on fixing member 9 includes pressure strips respectively pressed and laterally connected to the two ends of the upper surface of the high thermal conductivity heat dissipation block 8, and the two ends of the pressure strip are provided with a second clipping ear 93 bent downward, and the side walls of the left panel 3 and the right panel 4 are provided with a second clipping portion 42 clipped with the second clipping ear 93.

[0035] Furthermore, the pressure strip is provided with a first lower concave position 91 elastically pressed in the middle of the heat dissipation groove along its length direction, and a second lower concave position 92 embedded between two high thermal conductivity heat dissipation blocks 8, and the second lower concave position 92 forms a limit for multiple high thermal conductivity heat dissipation blocks 8. The design of the high thermal conductivity heat dissipation blocks 8 and the clamping fixture 9 of the heat dissipation structure is convenient for assembly. According to the number of connectors 10 of the high-frequency connector 10, the number of corresponding plug-in cavities, and then the number of high thermal conductivity heat dissipation blocks 8 corresponding to the number of high-frequency connectors 10, can be universally used for high-frequency connectors 10 and shielding covers with different numbers of plug-in interfaces, and only different clamping fixtures 9 need to be provided, which is conducive to reducing product development costs.

[0036] Reference Figure 3 , further, the upper and lower sides of the partition 7 are provided with partition fixing pins 71, and the panel 1 and the bottom plate 2 are provided with holes 111 for inserting the partition fixing pins 71. After the partition fixing pins 71 are connected with the holes 111 on the panel 1 and the bottom plate 2, part of the partition fixing pins 71 are bent to buckle the panel 1 and the bottom plate 2 to fix the partition 7. Part of the partition fixing pins 71 are used to connect with the circuit board 11 of the high-frequency connector 10.

[0037] Reference Figure 3 Further, the bottom edges of the left side plate 3, the right side plate 4 and the rear side plate 5 are provided with shield cover fixing pins 31 for fixing and assembling the shield cover.

[0038] Reference Figures 5 to 9 The technical solution discloses an embodiment of a high-frequency connector 10 with a shielding cover having a heat dissipation structure. The high-frequency connector 10 includes a circuit board 11 and a connector 10 arranged on the circuit board 11. The shielding cover having a heat dissipation structure is arranged on the circuit board 11. The lower opening 201 at the rear of the base plate 2 covers the periphery of the connector 10. The circuit board 11 is provided with a hole 111 for plugging in the fixing pins 31 of the shielding cover. The shielding cover is connected to the circuit board 11 by crimping or by reflow soldering.

[0039] In the overall assembly process of the high-frequency connector 10, multiple connectors 10 are placed on the circuit board 11 through an automated process. Usually, the bottom of the connector 10 is provided with positioning pins and welding terminals, and the circuit board 11 is provided with pads for welding with the connector 10. After the connector 10 is placed, the shielding cover without the cover plate 6 is placed on the circuit board 11 as a whole through an automated process, and the fixing pins 31 of the shielding cover are plugged into the holes 111 of the circuit board 11 to achieve the positioning and placement of the shielding cover. Then the whole enters the reflow soldering process to achieve the connection between the connector 10 and the shielding cover and the circuit board 11 through a single reflow soldering process, and the welding connection makes the shielding cover connection more stable, and the shielding cover is not easy to be separated from the circuit board 11 due to vibration during the transportation of the product.

[0040] It should be understood that, in the shielding cover with heat dissipation structure of the present solution, if the rear of the panel 1 and the rear side panel 5 are closed, it cannot be connected to the connector 10 and the circuit board 11 by one-time soldering by reflow soldering, and it can be connected by traditional crimping or wave soldering again. As a preferred solution, the rear of the panel 1 is designed to be provided with an upper opening 101 and a cover plate 6, because the assembly is achieved by one-time soldering by reflow soldering, which is conducive to greatly improving production efficiency.

[0041] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A shielding cover with a heat dissipation structure, characterized in that: It includes a panel, a bottom plate, a left side plate, a right side plate and a rear side plate, the panel, the bottom plate, the left side plate, the right side plate and the rear side plate are rectangular, the front ends of the panel, the bottom plate, the left side plate and the right side plate are aligned to form a rectangular box structure, the length of the left side plate and the right side plate is greater than the width of the bottom plate, and a lower opening is formed at the rear of the bottom plate; at least one partition is provided between the panel and the bottom plate to form at least two plug-in cavities, a radiator is provided on the top surface of the panel corresponding to the plug-in cavity, and the length of the panel, the bottom plate and the rear side plate is adapted to the setting of multiple plug-in cavities.

2. The shielding cover with a heat dissipation structure according to claim 1, characterized in that: The width of the panel is smaller than the length of the left side panel and the right side panel. An upper opening is formed at the rear of the panel. A cover plate is arranged at the rear of the panel and covers the upper opening.

3. The shielding cover with a heat dissipation structure according to claim 2, characterized in that: The left and right sides and the rear side of the cover plate are provided with a plurality of first snap-in ears which are independently bent downward. The plurality of first snap-in ears and the cover plate are integrally stamped from metal material. The left side plate, the right side plate and the rear side plate are provided with first snap-in parts which are snap-in to the first snap-in ears.

4. The shielding cover with a heat dissipation structure according to any one of claims 1 or 2, characterized in that: The left side plate, right side plate, rear side plate and panel are integrally stamped from metal materials. The left side plate, right side plate and rear side plate are bent 90 degrees from the panel, and the rear ends of the left side plate and right side plate are buckled and connected with the two ends of the rear side plate.

5. The shielding cover with a heat dissipation structure according to claim 4, characterized in that: The radiator includes a high thermal conductivity heat dissipation block and a clamping fixture. The bottom surface of the high thermal conductivity heat dissipation block is a plane and is attached to the upper surface of the panel. The top surface of the high thermal conductivity heat dissipation block is provided with a plurality of heat dissipation grooves to increase the heat dissipation area of ​​the upper surface. The clamping fixture includes pressure strips respectively pressed and laterally connected to the two ends of the upper surface of the high thermal conductivity heat dissipation block. The two ends of the pressure strip are provided with second clamping ears bent downward. The side walls of the left plate and the right plate are provided with second clamping parts clamped with the second clamping ears.

6. The shielding cover with a heat dissipation structure according to claim 5, characterized in that: The pressure strip is provided with a first concave position elastically pressed in the middle of the heat dissipation groove along its length direction, and a second concave position embedded between two high thermal conductivity heat dissipation blocks, and the second concave position forms a limit for multiple high thermal conductivity heat dissipation blocks.

7. The shielding cover with a heat dissipation structure according to claim 4, characterized in that: The upper and lower sides of the partition are provided with partition fixing pins, and the panel and the bottom plate are provided with holes for plugging the partition fixing pins.

8. The shielding cover with a heat dissipation structure according to claim 7, characterized in that: The bottom edges of the left side plate, the right side plate and the rear side plate are all provided with shielding cover fixing pins for fixing and assembling the shielding cover.

9. A high frequency connector, characterized in that: It comprises a circuit board and a connector arranged on the circuit board, a shielding cover with a heat dissipation structure as claimed in any one of claims 1 to 8 is arranged on the circuit board, a lower opening behind the base plate covers the periphery of the connector, holes for plugging in the fixing pins of the shielding cover are arranged on the circuit board, and the shielding cover is crimped and connected to the circuit board or connected by reflow soldering.

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