Two-pixel full-color SMD LED lamp bead and four-pixel full-color SMD LED lamp bead

Abstract

The utility model discloses a two-pixel full-color SMD LED lamp bead and a four-pixel full-color SMD LED lamp bead, which are characterized in that a first red light LED chip with a vertical structure is arranged in a first pixel unit, and a second red light LED chip with a vertical structure is arranged in a second pixel unit; according to the LED packaging structure, one electrode of the LED chip of the vertical structure can be directly and downwards attached to the corresponding bonding pad and the other remaining electrode of the LED chip faces upwards during installation so that the LED chip can be subsequently connected to the other bonding pad through the aerial fly wire, the number of adopted aerial fly wires is small, implementation is convenient, and in addition, due to the fact that the aerial fly wires are adopted, the cost is low. According to the scheme, five bonding pads are adopted for two pixels, ten bonding pads are adopted for four pixels, and implementation is convenient.

Description

Technical Field

[0001] The utility model relates to a two-pixel full-color SMD LED lamp bead and a four-pixel full-color SMD LED lamp bead. Background Art

[0002] The LED display screen is composed of many single-pixel LED lamp beads corresponding to a certain dot pitch. In the current display screen manufacturing process, each lamp bead needs to be attached to the display screen PCB board through the SMT process. A single-pixel LED lamp bead needs to undergo a mounting process, which is relatively inefficient and has a high mounting cost. Multi-pixel SMD LED lamp beads came into being, and reducing the size of SMD LED lamp beads with multi-pixel units has become a development direction of the industry. In addition, as shown in the Chinese patent CN110350073A, a 4-in-1 full-color SMD LED, each pixel unit on it uses multiple aerial flying wires, which is not conducive to improving production efficiency on the one hand, and on the other hand, the flying wires between different pixels of the SMD bracket need to make room on the wall between pixels. Too many flying wires are likely to cause light crosstalk between pixels. It is necessary to solve the problem of multiple pixel units and multiple aerial flying wires. Utility Model Content

[0003] The utility model overcomes the shortcomings of the above-mentioned technology and provides a two-pixel full-color SMD LED lamp bead and a four-pixel full-color SMD LED lamp bead.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A two-pixel full-color SMD LED lamp bead includes a lamp bead base 5, wherein the lamp bead base 5 is provided with a first solder pad 601, a second solder pad 602, a third solder pad 603, a fourth solder pad 604, a fifth solder pad 605, and a first pixel unit 1 and a second pixel unit 2 connected to the solder pads; the first pixel unit 1 includes a first red LED chip 11 with a vertical structure, a first green LED chip 12 with a flip-chip structure, and a first blue LED chip 13 with a flip-chip structure; the second pixel unit 2 includes a second red LED chip 21 with a vertical structure, a second green LED chip 22 with a flip-chip structure, and a second blue LED chip 23 with a flip-chip structure, wherein each LED chip is provided with an A electrode and a B electrode with opposite polarities, and the A electrode of the first red LED chip 11 is mounted on the first solder pad 601, The B electrode is electrically connected to the second pad 602 through the first aerial flying wire 71, the A electrode of the first green LED chip 12 is mounted on the first pad 601, and the B electrode is mounted on the third pad 603, the A electrode of the first blue LED chip 13 is mounted on the first pad 601, and the B electrode is mounted on the fourth pad 604, the A electrode of the second red LED chip 21 is mounted on the fifth pad 605, and the B electrode is electrically connected to the second pad 602 through the second aerial flying wire 72, the A electrode of the second green LED chip 22 is mounted on the fifth pad 605, and the B electrode is mounted on the third pad 603, the A electrode of the second blue LED chip 23 is mounted on the fifth pad 605, and the B electrode is mounted on the fourth pad 604.

[0006] Preferably, the first solder pad 601 is provided with a mounting height, and the mounting position of the first red LED chip 11 is lower than the mounting position of the first green LED chip 12 and also lower than the mounting position of the first blue LED chip 13 .

[0007] Preferably, the fifth solder pad 605 is provided with a mounting height, and the mounting position of the second red LED chip 21 is lower than the mounting position of the second green LED chip 22 and lower than the mounting position of the second blue LED chip 23 .

[0008] Preferably, the upper end surface of the lamp bead base 5 is concavely provided with a first reflective cavity 10 for arranging each LED chip of the first pixel unit 1 therein, and a second reflective cavity 20 for arranging each LED chip of the second pixel unit 2 therein.

[0009] The present case also protects a four-pixel full-color SMD LED lamp bead, including a lamp bead base 5, wherein the lamp bead base 5 is provided with a first solder pad 601, a second solder pad 602, a third solder pad 603, a fourth solder pad 604, a fifth solder pad 605, and a sixth solder pad 606, a seventh solder pad 607, an eighth solder pad 608, a ninth solder pad 609, a tenth solder pad 610, and a first pixel unit 1, a second pixel unit 2, a third pixel unit 3, and a fourth pixel unit 4 connected to the solder pads, wherein the four pixel units are arranged in a 2*2 pattern; the first pixel unit 1 includes a first red LED having a vertical structure The first pixel unit 2 includes a second red LED chip 21 with a vertical structure, a second green LED chip 22 with a flip-chip structure, and a second blue LED chip 23 with a flip-chip structure. The third pixel unit 3 includes a third red LED chip 31 with a vertical structure, a third green LED chip 32 with a flip-chip structure, and a third blue LED chip 33 with a flip-chip structure. The fourth pixel unit 4 includes a fourth red LED chip 41 with a vertical structure, a fourth green LED chip 42 with a flip-chip structure, and a fourth blue LED chip 43 with a flip-chip structure. Each LED chip is provided with an A electrode and a B electrode with opposite polarities. The A electrode of the first red LED chip 11 is mounted on the first pad 601, and the B electrode is electrically connected to the second pad 602 through the first aerial flying wire 71. The A electrode of the first green LED chip 12 is mounted on the first pad 601, and the B electrode is mounted on the third pad 603. The first blue LED chip 13 The A electrode of the second red LED chip 21 is mounted on the fifth pad 605, and the B electrode is electrically connected to the second pad 602 through the second aerial flying wire 72; the A electrode of the second green LED chip 22 is mounted on the fifth pad 605, and the B electrode is mounted on the third pad 603; the A electrode of the second blue LED chip 23 is mounted on the fifth pad 605, and the B electrode is mounted on the fourth pad 604;The A electrode of the third red LED chip 31 is mounted on the sixth pad 606, and the B electrode is electrically connected to the seventh pad 607 through the third aerial flying wire 73. The A electrode of the third green LED chip 32 is mounted on the sixth pad 606, and the B electrode is mounted on the eighth pad 608. The A electrode of the fourth blue LED chip 43 is mounted on the sixth pad 606, and the B electrode is mounted on the ninth pad 609. The A electrode of the fourth red LED chip 41 is mounted on the tenth pad 610, and the B electrode is electrically connected to the seventh pad 607 through the fourth aerial flying wire 74. The A electrode of the fourth green LED chip 42 is mounted on the tenth pad 610, and the B electrode is mounted on the eighth pad 608. The A electrode of the fourth blue LED chip 43 is mounted on the tenth pad 610, and the B electrode is mounted on the ninth pad 609. ;

[0010] Preferably, the first solder pad 601 is provided with a mounting height, and the mounting position of the first red LED chip 11 is lower than the mounting position of the first green LED chip 12 and lower than the mounting position of the first blue LED chip 13 .

[0011] Preferably, the fifth solder pad 605 is provided with a mounting height, and the mounting position of the second red LED chip 21 is lower than the mounting position of the second green LED chip 22 and lower than the mounting position of the second blue LED chip 23 .

[0012] Preferably, the sixth solder pad 606 is provided with a mounting height, and the mounting position of the third red LED chip 31 is lower than the mounting position of the third green LED chip 32 and lower than the mounting position of the third blue LED chip 33 .

[0013] Preferably, the tenth solder pad 610 is provided with a mounting height, and the mounting position of the fourth red LED chip 41 is lower than the mounting position of the fourth green LED chip 42 and lower than the mounting position of the fourth blue LED chip 43 .

[0014] Preferably, the upper end surface of the lamp bead base 5 is recessed with a first reflective cavity 10 for setting each LED chip of the first pixel unit 1, a second reflective cavity 20 for setting each LED chip of the second pixel unit 2, a third reflective cavity 30 for setting each LED chip of the third pixel unit 3, and a fourth reflective cavity 40 for setting each LED chip of the fourth pixel unit 4.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. This case has two-pixel full-color SMD The structure of the LED lamp beads is simple and easy to implement. The arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the first pixel unit and the arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the second pixel unit facilitates direct mounting between the corresponding pads, so that there is no need for additional aerial flying wire welding, which is beneficial to reducing the number of solder joints and the area of ​​the pads. The arrangement of the first red LED chip of the vertical structure in the first pixel unit and the second red LED chip of the vertical structure in the second pixel unit facilitates the installation so that one electrode of the vertical LED chip can be directly mounted downward on the corresponding pad and the remaining other electrode is upward so as to be connected to the other pad through the aerial flying wire later. The number of aerial flying wires used is small, which is convenient for implementation. In addition, the use of aerial flying wires is conducive to reducing the number of pads and the number of cut gaps. In this case, a total of 5 pads are used for the two pixels, which is convenient for implementation. Compared with the technical solution of using 4 pads for a single pixel, this case only adds 1 more pad. Compared with the technical solution of using 8 pads for two pixels, this case reduces the size of 3 pads, which is beneficial to reducing the product's external dimensions and has good practicality.

[0017] 2. The thickness of the vertical structure red LED chip is thicker than that of the flip-chip structure LED chip. Therefore, some pads in this case are provided with mounting height settings, which is conducive to reducing the height of the upper end surface of the vertical structure red LED chip after mounting, and adapting to the height of the upper end surface of the flip-chip structure LED chip after mounting, which is conducive to reducing the overall bowl depth of the product after mounting, thereby reducing the external dimensions of the SMD LED lamp beads, and having good practicality.

[0018] 3. The four-pixel full-color SMD LED lamp bead structure of this case is simple and easy to implement. The green LED chip and the blue LED chip of the flip-chip structure in the first pixel unit and the green LED chip and the blue LED chip of the flip-chip structure in the second pixel unit are convenient for direct mounting between corresponding pads, so that there is no need for additional aerial flying wire welding, which is conducive to reducing the number of solder joints and the pad area; and the first red LED chip of the vertical structure in the first pixel unit and the second red LED chip of the vertical structure in the second pixel unit are convenient for the vertical structure LED chips to be mounted. One electrode can be directly mounted downward on the corresponding pad and the remaining electrode can be facing upward to facilitate subsequent connection to another pad through an aerial flying wire. The number of aerial flying wires used is small, and the implementation is convenient. In addition, the use of aerial flying wires is beneficial to reduce the number of pads and the number of cut gaps. In this case, a total of 10 pads are used for four pixels, which is convenient to implement. Compared with the technical solution of using 4 pads for a single pixel, this case only adds 5 more pads. Compared with the technical solution of 16 pads for four pixels, this case reduces the size of 11 pads, which is beneficial to reducing the product's external dimensions and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is one of the schematic diagrams of the two-pixel full-color SMD LED lamp bead in this case.

[0020] Figure 2 This is the second schematic diagram of the two-pixel full-color SMD LED lamp bead in this case.

[0021] Figure 3 This is one of the schematic diagrams of the four-pixel full-color SMD LED lamp beads in this case.

[0022] Figure 4 This is the second schematic diagram of the four-pixel full-color SMD LED lamp bead in this case. DETAILED DESCRIPTION

[0023] The following examples further illustrate the features of the present invention and other related features to facilitate understanding by those skilled in the art:

[0024] like Figure 1 to Figure 2As shown, a two-pixel full-color SMD LED lamp bead and a four-pixel full-color SMD LED lamp bead include a lamp bead base 5, wherein the lamp bead base 5 is provided with a first solder pad 601, a second solder pad 602, a third solder pad 603, a fourth solder pad 604, a fifth solder pad 605, and a first pixel unit 1 and a second pixel unit 2 connected to the solder pads; the first pixel unit 1 includes a first red light LED chip 11 with a vertical structure, a first green light LED chip 12 with a flip-chip structure, and a first blue light LED chip 13 with a flip-chip structure; the second pixel unit 2 includes a second red light LED chip 21 with a vertical structure, a second green light LED chip 22 with a flip-chip structure, and a second blue light LED chip 23 with a flip-chip structure, wherein each LED chip is provided with an A electrode and a B electrode with opposite polarities, and the A electrode of the first red light LED chip 11 is mounted on the first solder pad 601, The B electrode is electrically connected to the second pad 602 through the first aerial flying wire 71, the A electrode of the first green LED chip 12 is mounted on the first pad 601, and the B electrode is mounted on the third pad 603, the A electrode of the first blue LED chip 13 is mounted on the first pad 601, and the B electrode is mounted on the fourth pad 604, the A electrode of the second red LED chip 21 is mounted on the fifth pad 605, and the B electrode is electrically connected to the second pad 602 through the second aerial flying wire 72, the A electrode of the second green LED chip 22 is mounted on the fifth pad 605, and the B electrode is mounted on the third pad 603, the A electrode of the second blue LED chip 23 is mounted on the fifth pad 605, and the B electrode is mounted on the fourth pad 604.

[0025] As described above, in a specific implementation, each soldering pad extends to the lower end of the lamp bead holder 5 to form a pin for SMD.

[0026] As described above, according to the connection relationship between the LED chips and the pads, each LED chip is electrically connected between two pads, and the working condition of the corresponding LED chip can be controlled by controlling the voltage between the corresponding two pads.

[0027] As described above, the full-color SMD LED lamp bead structure of the two pixels in this case is simple and easy to implement. The arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the first pixel unit 1 and the arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the second pixel unit 2 are convenient for direct mounting between the corresponding pads, so that there is no need for additional aerial flying wire welding, which is beneficial to reducing the number of solder joints and the pad area; and the arrangement of the first red LED chip 11 of the vertical structure in the first pixel unit 1 and the arrangement of the second red LED chip 21 of the vertical structure in the second pixel unit 2 are convenient for the vertical structure to be installed. One electrode of the LED chip can be directly mounted downward on the corresponding pad and the remaining electrode can be facing upward to facilitate subsequent connection to another pad through aerial flying wires. The number of aerial flying wires used is small, and the implementation is convenient. In addition, the use of aerial flying wires is beneficial to reduce the number of pads and the number of cut gaps. In this case, a total of 5 pads are used for the two pixels, which is convenient to implement. Compared with the technical solution of using 4 pads for a single pixel, this case only adds 1 more pad. Compared with the technical solution of using 8 pads for two pixels, this case reduces the size of 3 pads, which is beneficial to reducing the product's external dimensions and has good practicality.

[0028] As described above, in a specific implementation, the first solder pad 601 is provided with a mounting high and low position, and the mounting position of the first red LED chip 11 is lower than the mounting position of the first green LED chip 12 and lower than the mounting position of the first blue LED chip 13 .

[0029] As described above, in a specific implementation, the fifth solder pad 605 is provided with a mounting high and low position, and the mounting position of the second red LED chip 21 is lower than the mounting position of the second green LED chip 22 and lower than the mounting position of the second blue LED chip 23 .

[0030] As mentioned above, in the specific implementation, the thickness of the vertical structure red light LED chip is thicker than the thickness of the flip-chip structure LED chip. Thus, some pads in this case are provided with mounting high and low position settings, which is beneficial to reduce the height of the upper end surface of the vertical structure red light LED chip after mounting, and adapts to the height of the upper end surface of the flip-chip structure LED chip after mounting, which is beneficial to reduce the overall bowl depth of the product after mounting, thereby reducing the external dimensions of the SMD LED lamp beads, and has good practicality.

[0031] like Figure 1 to Figure 2As shown, in a specific implementation, the upper end surface of the lamp bead holder 5 is concavely provided with a first reflective cavity 10 for each LED chip of the first pixel unit 1 to be arranged therein, and a second reflective cavity 20 for each LED chip of the second pixel unit 2 to be arranged therein, which is beneficial to enhancing the light emitting effect. When used specifically, it can prevent the problem of cross-light caused by light emission between adjacent SMD LED lamp beads or adjacent pixel units.

[0032] like Figure 3 , Figure 4As shown, the present case also discloses a four-pixel full-color SMD LED lamp bead, including a lamp bead base 5, wherein the lamp bead base 5 is provided with a first solder pad 601, a second solder pad 602, a third solder pad 603, a fourth solder pad 604, a fifth solder pad 605, and a sixth solder pad 606, a seventh solder pad 607, an eighth solder pad 608, a ninth solder pad 609, a tenth solder pad 610, and a first pixel unit 1, a second pixel unit 2, a third pixel unit 3, and a fourth pixel unit 4 connected to the solder pads, wherein the four pixel units are arranged in a 2*2 manner; the first pixel unit 1 includes a first red light LED having a vertical structure The first pixel unit 2 includes a second red LED chip 21 with a vertical structure, a second green LED chip 22 with a flip-chip structure, and a second blue LED chip 23 with a flip-chip structure. The third pixel unit 3 includes a third red LED chip 31 with a vertical structure, a third green LED chip 32 with a flip-chip structure, and a third blue LED chip 33 with a flip-chip structure. The fourth pixel unit 4 includes a fourth red LED chip 41 with a vertical structure, a fourth green LED chip 42 with a flip-chip structure, and a fourth blue LED chip 43 with a flip-chip structure. Each LED chip is provided with an A electrode and a B electrode with opposite polarities. The A electrode of the first red LED chip 11 is mounted on the first pad 601, and the B electrode is electrically connected to the second pad 602 through the first aerial flying wire 71. The A electrode of the first green LED chip 12 is mounted on the first pad 601, and the B electrode is mounted on the third pad 603. The first blue LED chip 13 The A electrode of the second red LED chip 21 is mounted on the fifth pad 605, and the B electrode is electrically connected to the second pad 602 through the second aerial flying wire 72; the A electrode of the second green LED chip 22 is mounted on the fifth pad 605, and the B electrode is mounted on the third pad 603; the A electrode of the second blue LED chip 23 is mounted on the fifth pad 605, and the B electrode is mounted on the fourth pad 604;The A electrode of the third red LED chip 31 is mounted on the sixth pad 606, and the B electrode is electrically connected to the seventh pad 607 through the third aerial flying wire 73. The A electrode of the third green LED chip 32 is mounted on the sixth pad 606, and the B electrode is mounted on the eighth pad 608. The A electrode of the fourth blue LED chip 43 is mounted on the sixth pad 606, and the B electrode is mounted on the ninth pad 609. The A electrode of the fourth red LED chip 41 is mounted on the tenth pad 610, and the B electrode is electrically connected to the seventh pad 607 through the fourth aerial flying wire 74. The A electrode of the fourth green LED chip 42 is mounted on the tenth pad 610, and the B electrode is mounted on the eighth pad 608. The A electrode of the fourth blue LED chip 43 is mounted on the tenth pad 610, and the B electrode is mounted on the ninth pad 609. ;

[0033] As described above, in a specific implementation, each soldering pad extends to the lower end of the lamp bead holder 5 to form a pin for SMD.

[0034] As described above, according to the connection relationship between the LED chips and the pads, each LED chip is electrically connected between two pads, and the working condition of the corresponding LED chip can be controlled by controlling the voltage between the corresponding two pads.

[0035] As described above, the four-pixel full-color SMD LED lamp bead structure of the present invention is simple and easy to implement. The arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the first pixel unit 1 and the arrangement of the green LED chip and the blue LED chip of the flip-chip structure in the second pixel unit 2 are convenient for direct mounting between corresponding pads, so that there is no need for additional aerial flying wire welding, which is beneficial to reducing the number of solder joints and the area of ​​the pads; and the arrangement of the first red LED chip 11 of the vertical structure in the first pixel unit 1 and the arrangement of the second red LED chip 21 of the vertical structure in the second pixel unit 2 are convenient for making the vertical structure LED One electrode of the D chip can be directly mounted downward to the corresponding pad and the remaining electrode can be facing upward to facilitate subsequent connection to another pad through an aerial flying wire. The number of aerial flying wires used is small, and the implementation is convenient. In addition, the use of aerial flying wires is beneficial to reducing the number of pads and the number of cut gaps. In this case, a total of 10 pads are used for four pixels, which is convenient to implement. Compared with the technical solution of using 4 pads for a single pixel, this case only adds 5 more pads. Compared with the technical solution of 16 pads for four pixels, this case reduces the size of 11 pads, which is beneficial to reducing the product's external dimensions and has good practicality.

[0036] As described above, in a specific implementation, the first solder pad 601 is provided with a mounting high and low position, and the mounting position of the first red LED chip 11 is lower than the mounting position of the first green LED chip 12 and lower than the mounting position of the first blue LED chip 13 .

[0037] As described above, in a specific implementation, the fifth solder pad 605 is provided with a mounting high and low position, and the mounting position of the second red LED chip 21 is lower than the mounting position of the second green LED chip 22 and lower than the mounting position of the second blue LED chip 23 .

[0038] As described above, in a specific implementation, the sixth solder pad 606 is provided with a mounting high and low position, and the mounting position of the third red LED chip 31 is lower than the mounting position of the third green LED chip 32 and lower than the mounting position of the third blue LED chip 33 .

[0039] As described above, in a specific implementation, the tenth solder pad 610 is provided with a mounting high and low position, and the mounting position of the fourth red LED chip 41 is lower than the mounting position of the fourth green LED chip 42 and lower than the mounting position of the fourth blue LED chip 43 .

[0040] As mentioned above, in the specific implementation, the thickness of the vertical structure red light LED chip is thicker than the thickness of the flip-chip structure LED chip. Thus, some pads in this case are provided with mounting high and low position settings, which is beneficial to reduce the height of the upper end surface of the vertical structure red light LED chip after mounting, and adapts to the height of the upper end surface of the flip-chip structure LED chip after mounting, which is beneficial to reduce the overall bowl depth of the product after mounting, thereby reducing the external dimensions of the SMD LED lamp beads, and has good practicality.

[0041] like Figure 3 , Figure 4 As shown, in a specific implementation, the upper end surface of the lamp bead holder 5 is concavely provided with a first reflective cavity 10 for each LED chip of the first pixel unit 1 to be arranged therein, a second reflective cavity 20 for each LED chip of the second pixel unit 2 to be arranged therein, a third reflective cavity 30 for each LED chip of the third pixel unit 3 to be arranged therein, and a fourth reflective cavity 40 for each LED chip of the fourth pixel unit 4 to be arranged therein, which is beneficial to enhancing the light emitting effect. When used specifically, it can prevent the problem of cross-light caused by light emission between adjacent SMD LED lamp beads or adjacent pixel units.

[0042] As mentioned above, this case protects a two-pixel full-color SMD LED lamp bead and a four-pixel full-color SMD LED lamp bead. All technical solutions that are the same or similar to this case should be deemed to fall within the scope of protection of this case.

Claims

1. A two-pixel full-color SMD LED lamp bead, characterized in that The invention comprises a lamp bead base (5), wherein the lamp bead base (5) is provided with a first soldering pad (601), a second soldering pad (602), a third soldering pad (603), a fourth soldering pad (604), a fifth soldering pad (605), and a first pixel unit (1) and a second pixel unit (2) connected to the soldering pads; the first pixel unit (1) comprises a first red LED chip (11) with a vertical structure, a first green LED chip (12) with a flip-chip structure, and a first blue LED chip (13) with a flip-chip structure; the second pixel unit (2) comprises a second red LED chip (21) with a vertical structure, a second green LED chip (22) with a flip-chip structure, and a second blue LED chip (23) with a flip-chip structure; wherein each LED chip is provided with an A electrode and a B electrode with opposite polarities; the A electrode of the first red LED chip (11) is mounted on the first soldering pad (601), and the B electrode is mounted on the first soldering pad (601). The first green LED chip (12) has an A electrode mounted on the first soldering pad (601) and a B electrode mounted on the third soldering pad (603); the first blue LED chip (13) has an A electrode mounted on the first soldering pad (601) and a B electrode mounted on the fourth soldering pad (604); the second red LED chip (21) has an A electrode mounted on the fifth soldering pad (605) and a B electrode electrically connected to the second soldering pad (602) through a second aerial flying wire (72); the second green LED chip (22) has an A electrode mounted on the fifth soldering pad (605) and a B electrode mounted on the third soldering pad (603); the second blue LED chip (23) has an A electrode mounted on the fifth soldering pad (605) and a B electrode mounted on the fourth soldering pad (604).

2. A two-pixel full-color SMD LED lamp bead according to claim 1, characterized in that The first solder pad (601) is provided with a mounting height position, and the mounting position of the first red LED chip (11) is lower than the mounting position of the first green LED chip (12), and also lower than the mounting position of the first blue LED chip (13).

3. A two-pixel full-color SMD LED lamp bead according to claim 1, characterized in that The fifth solder pad (605) is provided with a mounting height, and the mounting position of the second red LED chip (21) is lower than the mounting position of the second green LED chip (22) and lower than the mounting position of the second blue LED chip (23).

4. A two-pixel full-color SMD LED lamp bead according to any one of claims 1 to 3, characterized in that The upper end surface of the lamp bead base (5) is concavely provided with a first reflective cavity (10) for arranging each LED chip of the first pixel unit (1) therein, and a second reflective cavity (20) for arranging each LED chip of the second pixel unit (2) therein.

5. A four-pixel full-color SMD LED lamp bead, characterized in that The invention comprises a lamp bead base (5), wherein the lamp bead base (5) is provided with a first soldering pad (601), a second soldering pad (602), a third soldering pad (603), a fourth soldering pad (604), a fifth soldering pad (605), a sixth soldering pad (606), a seventh soldering pad (607), an eighth soldering pad (608), a ninth soldering pad (609), a tenth soldering pad (610), and a first pixel unit (1), a second pixel unit (2), a third pixel unit (3), and a fourth pixel unit (4) connected to the soldering pads, wherein the four pixel units are arranged in a 2*2 manner; the first pixel unit (1) comprises a first red light source having a vertical structure; LED chip (11), a first green LED chip (12) with a flip-chip structure, and a first blue LED chip (13) with a flip-chip structure; the second pixel unit (2) comprises a second red LED chip (21) with a vertical structure, a second green LED chip (22) with a flip-chip structure, and a second blue LED chip (23) with a flip-chip structure; the third pixel unit (3) comprises a third red LED chip (31) with a vertical structure, a third green LED chip (32) with a flip-chip structure, and a third blue LED chip (33) with a flip-chip structure; the fourth pixel unit (4) comprises a fourth A red LED chip (41), a fourth green LED chip (42) of a flip-chip structure, and a fourth blue LED chip (43) of a flip-chip structure, wherein each LED chip is provided with an A electrode and a B electrode of opposite polarity, the A electrode of the first red LED chip (11) is mounted on the first solder pad (601), and the B electrode is electrically connected to the second solder pad (602) via a first aerial flying wire (71), the A electrode of the first green LED chip (12) is mounted on the first solder pad (601), and the B electrode is mounted on the third solder pad (603), and the first blue LED chip (13 ) has its A electrode mounted on the first pad (601) and its B electrode mounted on the fourth pad (604); the A electrode of the second red LED chip (21) is mounted on the fifth pad (605) and its B electrode is electrically connected to the second pad (602) via a second aerial flying wire (72); the A electrode of the second green LED chip (22) is mounted on the fifth pad (605) and its B electrode is mounted on the third pad (603); the A electrode of the second blue LED chip (23) is mounted on the fifth pad (605) and its B electrode is mounted on the fourth pad (604);The A electrode of the third red LED chip (31) is mounted on the sixth pad (606), and the B electrode is electrically connected to the seventh pad (607) via a third aerial flying wire (73); the A electrode of the third green LED chip (32) is mounted on the sixth pad (606), and the B electrode is mounted on the eighth pad (608); the A electrode of the fourth blue LED chip (43) is mounted on the sixth pad (606), and the B electrode is mounted on the ninth pad (609); The A electrode of the fourth red LED chip (41) is mounted on the tenth pad (610), and the B electrode is electrically connected to the seventh pad (607) through a fourth aerial flying wire (74); the A electrode of the fourth green LED chip (42) is mounted on the tenth pad (610), and the B electrode is mounted on the eighth pad (608); the A electrode of the fourth blue LED chip (43) is mounted on the tenth pad (610), and the B electrode is mounted on the ninth pad (609). ; 6. A four-pixel full-color SMD LED lamp bead according to claim 5, characterized in that The first solder pad (601) is provided with a mounting height, and the mounting position of the first red LED chip (11) is lower than the mounting position of the first green LED chip (12) and lower than the mounting position of the first blue LED chip (13).

7. A four-pixel full-color SMD LED lamp bead according to claim 5, characterized in that The fifth solder pad (605) is provided with a mounting height, and the mounting position of the second red LED chip (21) is lower than the mounting position of the second green LED chip (22) and lower than the mounting position of the second blue LED chip (23).

8. A four-pixel full-color SMD LED lamp bead according to claim 5, characterized in that The sixth solder pad (606) is provided with a mounting height position, and the mounting position of the third red LED chip (31) is lower than the mounting position of the third green LED chip (32) and lower than the mounting position of the third blue LED chip (33).

9. A four-pixel full-color SMD LED lamp bead according to claim 5, characterized in that The tenth solder pad (610) is provided with a mounting height position, and the mounting position of the fourth red LED chip (41) is lower than the mounting position of the fourth green LED chip (42) and lower than the mounting position of the fourth blue LED chip (43).

10. A four-pixel full-color SMD LED lamp bead according to any one of claims 5 to 9, characterized in that The upper end surface of the lamp bead base (5) is concavely provided with a first reflective cavity (10) for arranging each LED chip of the first pixel unit (1), a second reflective cavity (20) for arranging each LED chip of the second pixel unit (2), a third reflective cavity (30) for arranging each LED chip of the third pixel unit (3), and a fourth reflective cavity (40) for arranging each LED chip of the fourth pixel unit (4).

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