Double-layer high-speed sorting and discharging device

Abstract

The utility model relates to a double-layer high-speed sorting and discharging device which comprises a main flow line, a plurality of adsorption transverse moving flow lines, a plurality of upper-layer silicon wafer transverse moving flow lines, a plurality of upper-layer sorting transverse moving flow lines, a plurality of lower-layer silicon wafer transverse moving flow lines, a plurality of lower-layer sorting transverse moving flow lines and a plurality of material box mechanisms. Silicon wafers of different quality grades are conveyed to the position of the upper-layer silicon wafer transverse moving streamline or the lower-layer silicon wafer transverse moving streamline in a direct current mode through the adsorption transverse moving streamline, and then the silicon wafers are adsorbed through the upper-layer silicon wafer transverse moving streamline or the lower-layer silicon wafer transverse moving streamline and conveyed to the upper-layer sorting transverse moving streamline or the lower-layer silicon wafer transverse moving streamline. And the silicon wafers are conveyed to the upper-layer material boxes or the lower-layer material boxes of the corresponding material box mechanisms through the upper-layer sorting transverse moving streamline or the lower-layer sorting transverse moving streamline, double-layer sorting is achieved, the silicon wafers can be received by the material boxes only through conveying of the upper-layer sorting transverse moving streamline or the lower-layer sorting transverse moving streamline, the material box receiving action structural form is simplified, and the efficiency is improved. And expansion of batch automatic discharging from the material box is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer sorting equipment, in particular to a double-layer high-speed sorting and unloading device. Background Art

[0002] As an important raw material for solar cells, silicon wafers are widely used in the production of solar cells, circuit boards and other products. In the production process of silicon wafers, silicon wafer sorting machines, as terminal equipment for quality control, detect and grade silicon wafers in terms of size, dirt, cracks, holes, resistivity, etc., to ensure the quality of solar cells, circuit boards and other products made from silicon wafers.

[0003] Patent CN114871153A discloses a non-contact adsorption type slicing device, a material sorting device and a sorting system, wherein the slicing device comprises an adsorption sorting main module, a first adsorption branch module and a second adsorption branch module, each of which is integrated with an adsorption module and a belt drive module. The bottom surfaces of the three modules are arranged flush, wherein the first adsorption branch module and the second adsorption branch module are suspended and arranged at two discharge ends of the adsorption sorting main module; the adsorption sorting main module is used to adsorb and pick up the silicon wafers transported by the material discharging center shaft belt streamline below and to bidirectionally select the first adsorption branch module arranged perpendicular to the material discharging center shaft belt streamline direction on both sides according to the analysis results of the silicon wafer type. The attached branch line module or the second adsorption branch line module conveys the material to the corresponding material adsorption position, picks up the silicon wafer below by non-contact adsorption, and optionally transfers it to the multi-layer material box on both sides; but the horizontal suspension adsorption streamline composed of the adsorption sorting main module, the first adsorption branch line module and the second adsorption branch line module in the patent is too long, which is easy to cause the problem of wafer dropping caused by air flow disturbance; in addition, this structure of horizontal suspension adsorption and vertical free falling material discharge requires frequent acceleration and deceleration, which increases the probability of chasing and dropping wafers, and the action structure of the receiving material box is complicated or can only receive silicon wafers in a single-layer material box, which is not conducive to the expansion of batch automatic unloading from the material box. Utility Model Content

[0004] The purpose of the utility model is to design a double-layer high-speed sorting and unloading device, which can realize double-layer sorting, high efficiency, excellent space utilization, low cost and excellent scalability of automatic unloading in the later process, so as to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a double-layer high-speed sorting and unloading device is provided, comprising a main flow line, a plurality of adsorption transverse flow lines, a plurality of upper silicon wafer transverse flow lines, a plurality of upper sorting transverse flow lines, a plurality of lower silicon wafer transverse flow lines, a plurality of lower sorting transverse flow lines and a plurality of material box mechanisms, wherein the adsorption transverse flow line is located directly above the main flow line, a plurality of upper silicon wafer transverse flow lines are respectively installed on both sides of the main flow line, and the feed end of the upper silicon wafer transverse flow line is flush with the two discharge ends of the adsorption transverse flow line; the feed end of the upper sorting transverse flow line is located directly below the discharge end of the upper silicon wafer transverse flow line;

[0006] A plurality of lower silicon wafer transverse flow lines are respectively installed on both sides of the main flow line, and the feed end of the lower silicon wafer transverse flow line is located directly below the discharge end of the adsorption transverse flow line; the feed end of the lower separation transverse flow line is connected to the discharge end of the lower silicon wafer transverse flow line;

[0007] The plurality of material box mechanisms are respectively installed on both sides of the main flow line, and the material box mechanisms are located on one side of the discharge end of the upper-layer sorting transverse flow line and the discharge end of the lower-layer sorting transverse flow line.

[0008] Furthermore, the adsorption transverse movement streamline includes a suspension mounting plate, an adsorption transverse movement bracket installed on the suspension mounting plate, an adsorption belt transmission assembly installed on both sides of the adsorption transverse movement bracket, and an adsorption transverse movement drive assembly transmission-connected to the adsorption belt transmission assembly.

[0009] Furthermore, the adsorption belt transmission assembly includes an adsorption transverse shift driving wheel transmission-connected to the adsorption transverse shift driving assembly and a plurality of adsorption transverse shift belt idler wheels installed on the adsorption transverse shift bracket, the plurality of adsorption transverse shift belt idler wheels are all located below the adsorption transverse shift driving wheel, the adsorption transverse shift driving wheel and the plurality of adsorption transverse shift belt idler wheels are transmission-connected via a perforated vacuum belt, a vacuum chamber is installed on the adsorption transverse shift bracket, and the vacuum chamber is connected to the perforated vacuum belt.

[0010] Furthermore, the upper silicon wafer lateral streamline has the same structure and connection method as the adsorption lateral streamline.

[0011] Furthermore, the upper layer sorting transverse movement flow line includes two upper layer sorting transverse movement brackets and an upper layer sorting transverse movement conveying assembly. The two upper layer sorting transverse movement brackets are fixedly connected by a fixed block, and the upper layer sorting transverse movement conveying assembly is installed on the upper layer sorting transverse movement bracket.

[0012] Furthermore, the upper-layer sorting transverse conveying assembly includes a first motor, a first rotating shaft and a second rotating shaft. The first rotating shaft and the second rotating shaft are respectively rotatably connected to one end of the upper-layer sorting transverse conveying bracket. Both ends of the first rotating shaft are equipped with first synchronous wheels, and both ends of the second rotating shaft are equipped with second synchronous wheels. The first synchronous wheel is transmission-connected to the second synchronous wheel through a first synchronous belt; the output end of the first motor is connected to a transmission member, and the first motor is transmission-connected to the first rotating shaft through the transmission member.

[0013] Furthermore, adsorption lateral movement suction cups are respectively installed on the upper layer sorting lateral movement flow line, the lower layer sorting lateral movement flow line and the lower layer silicon wafer lateral movement flow line.

[0014] Furthermore, a blowing assembly is installed below the main flow line and directly below the adsorption transverse flow line, and the blowing assembly includes a fixing plate, a mounting plate, a nozzle fixing part and a nozzle, the mounting plate is mounted on the fixing plate, the nozzle fixing part is mounted on the mounting plate, and the nozzle is mounted on the nozzle fixing part.

[0015] Furthermore, the material box mechanism includes a material box mounting seat, a longitudinal switching drive assembly mounted on the material box mounting seat, a material box support plate mounted on the longitudinal switching drive assembly, and a plurality of material boxes mounted on the material box support plate.

[0016] Furthermore, the longitudinal switching drive assembly includes a second motor and a screw connected to an output end of the second motor, the screw is threadedly connected to a nut seat, and the nut seat is connected to the material box support plate.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] When the utility model is used, by setting the main flow line, the adsorption transverse flow line, the upper silicon wafer transverse flow line, the upper sorting transverse flow line, the lower silicon wafer transverse flow line and the material box mechanism, the silicon wafers of different quality grades are directly transferred to the position where the upper silicon wafer transverse flow line or the lower silicon wafer transverse flow line of the corresponding quality grade is stored through the adsorption transverse flow line, and then the silicon wafers are adsorbed and transferred to the upper sorting transverse flow line or the lower silicon wafer transverse flow line through the upper silicon wafer transverse flow line or the lower silicon wafer transverse flow line, and then transferred to the upper material box or the lower material box of the corresponding material box mechanism through the upper sorting transverse flow line or the lower sorting transverse flow line, so as to realize double-layer sorting. The material box only needs to transfer the silicon wafers through the upper sorting transverse flow line or the lower sorting transverse flow line, and the material box receiving action structure is simple. Singulation is conducive to the expansion of automated batch unloading from material boxes; at the same time, the lateral adsorption flow line composed of the adsorption lateral movement flow line, the upper silicon wafer lateral movement flow line, the upper sorting lateral movement flow line, the lower silicon wafer lateral movement flow line and the lower sorting lateral movement flow line, the silicon wafers only need to be horizontally suspended on the adsorption lateral movement flow line for adsorption and transmission, the upper silicon wafer lateral movement flow line, the upper sorting lateral movement flow line and the lower silicon wafer lateral movement flow line, and the lower sorting lateral movement flow line can directly transport the silicon wafers and deliver them to the upper material box of the corresponding material box mechanism and the lower material box of the material box mechanism respectively, avoiding the problem of wafer dropping due to the lateral suspension adsorption flow line being too long and easy to cause wafer dropping due to airflow disturbance; secondly, it solves the problem of frequent acceleration, deceleration, start and stop due to the structure of lateral suspension adsorption and vertical free falling material discharge, which increases the probability of wafer chasing and wafer dropping. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic structural diagram of the utility model from another angle;

[0022] Figure 3 This is a schematic diagram of the adsorption lateral streamline structure of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the blowing component of the utility model;

[0024] Figure 5 It is the upper layer sorting transverse flow line of the utility model; structural schematic diagram;

[0025] Figure 6 It is a schematic diagram of the structure of the material box mechanism of the utility model.

[0026] The names of the components marked in the figure are as follows:

[0027] 1. Main flow line; 2. Adsorption transverse flow line; 3. Upper silicon wafer transverse flow line; 4. Upper sorting transverse flow line; 5. Lower silicon wafer transverse flow line; 6. Lower sorting transverse flow line; 7. Material box mechanism; 8. Suspension mounting plate; 9. Adsorption transverse support; 10. Adsorption transverse drive assembly; 11. Adsorption transverse driving wheel; 12. Adsorption transverse belt idler; 13. Punching vacuum belt; 14. Vacuum chamber; 15. Upper sorting transverse support; 16. Layer sorting transverse transfer assembly; 17. first motor; 18. first rotating shaft; 19. second rotating shaft; 20. first synchronous wheel; 21. second synchronous wheel; 22. first synchronous belt; 23. transmission member; 24. adsorption transverse suction cup; 25. blowing assembly; 26. fixing plate; 27. mounting plate; 28. nozzle fixing member; 29. ​​nozzle; 30. material box mounting seat; 31. longitudinal switching drive assembly; 32. material box support plate; 33. material box. DETAILED DESCRIPTION

[0028] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0029] Example: Please refer to Figure 1-6A double-layer high-speed sorting and unloading device comprises a main flow line 1, a plurality of adsorption transverse flow lines 2, a plurality of upper silicon wafer transverse flow lines 3, a plurality of upper sorting transverse flow lines 4, a plurality of lower silicon wafer transverse flow lines 5, a plurality of lower sorting transverse flow lines 6 and a plurality of material box 33 mechanisms 7. The adsorption transverse flow line 2 is located directly above the main flow line 1, and the adsorption transverse flow line 2 comprises a suspension mounting plate 8, an adsorption transverse moving bracket 9 mounted on the suspension mounting plate 8, an adsorption belt transmission assembly mounted on both sides of the adsorption transverse moving bracket 9, and an adsorption transverse moving driving assembly 10 connected to the adsorption belt transmission assembly. The adsorption belt transmission assembly includes an adsorption lateral shift driving wheel 11 that is transmission-connected to the adsorption lateral shift driving assembly 10 and a plurality of adsorption lateral shift belt idlers 12 installed on the adsorption lateral shift bracket 9. The plurality of adsorption lateral shift belt idlers 12 are all located below the adsorption lateral shift driving wheel 11. The adsorption lateral shift driving wheel 11 and the plurality of adsorption lateral shift belt idlers 12 are transmission-connected via a perforated vacuum belt 13. A vacuum chamber 14 is installed on the adsorption lateral shift bracket 9, and the vacuum chamber 14 is connected to the perforated vacuum belt 13. The output end of the adsorption lateral shift motor is transmission-connected to the rotating shaft via a synchronous belt assembly. The rotating shaft is rotationally connected to the adsorption lateral shift bracket 9, and one end of the rotating shaft is connected to the adsorption lateral shift driving wheel 11. The position of the adsorption lateral shift belt idler 12 is coordinated with the adsorption lateral shift driving wheel 11, so that the vacuum belt transmission direction is more stable and will not deviate. When silicon wafers are being transported on the mainstream line 1 and need to be sorted, the negative pressure gas source connected to the vacuum generator connected to the vacuum chamber 14 is turned on to generate negative pressure suction so that the silicon wafers on the mainstream line 1 are adsorbed on the perforated vacuum belt 13 of the adsorption transverse flow line 2, and the adsorption transverse movement motor is started and drives the rotating shaft, the adsorption transverse movement driving wheel 11, the vacuum belt and the adsorption transverse movement belt idler wheel 12 in sequence through the synchronous belt assembly, and are transported to the upper silicon wafer transverse movement flow line 3 or the lower silicon wafer transverse movement flow line 5 with the transverse movement of the vacuum belt, and then the silicon wafers are adsorbed and transported to the upper sorting transverse movement flow line 4 or the lower silicon wafer transverse movement flow line 5 through the upper silicon wafer transverse movement flow line 3 or the lower silicon wafer transverse movement flow line 5, completing the transition of the silicon wafers from the main line transmission to the transverse movement sorting.

[0030] A blowing assembly 25 is installed below the mainstream line 1 and directly below the adsorption transverse flow line 2. The blowing assembly 25 includes a fixing plate 26, a mounting plate 27, a nozzle fixing member 28 and a nozzle 29. The mounting plate 27 is mounted on the fixing plate 26, the nozzle fixing member 28 is mounted on the mounting plate 27, and the nozzle 29 is mounted on the nozzle fixing member 28. When silicon wafers are transported and sorted on the mainstream line 1, the vacuum belt and the nozzle 29 are required to adsorb and blow air to the corresponding silicon wafers respectively, so that the silicon wafers on the mainstream line 1 can be adsorbed on the perforated vacuum belt 13 of the adsorption transverse flow line 2. At the same time, under the action of air blowing, the silicon wafers are relatively stable in the process of adsorption on the perforated vacuum belt 13, and the silicon wafers are not easy to be broken. In addition, the air blowing method has the advantage of fast switching, which does not interfere with the subsequent transportation of other silicon wafers, thereby improving the working efficiency of the sorting machine.

[0031] Multiple upper silicon wafer transverse flow lines 3 are installed on both sides of the main flow line 1, and the feed end of the upper silicon wafer transverse flow line 3 is flush with the two discharge ends of the adsorption transverse flow line 2, and the feed end of the upper sorting transverse flow line 4 is located directly below the discharge end of the upper silicon wafer transverse flow line 3. The upper silicon wafer transverse flow line 3 has the same structure and connection method as the adsorption transverse flow line 2, and uses a horizontal hanging adsorption transmission method to deliver silicon wafers to the upper sorting transverse flow line 4. The upper sorting transverse flow line 4 includes two upper sorting transverse brackets 15 and an upper sorting transverse transmission assembly 16. The two upper sorting transverse brackets 15 are fixedly connected by a fixed block, and the upper sorting transverse transmission assembly 16 is installed on the upper sorting transverse bracket 15. The upper layer sorting transverse transmission assembly 16 includes a first motor 17, a first rotating shaft 18 and a second rotating shaft 19. The first rotating shaft 18 and the second rotating shaft 19 are respectively rotatably connected to one end of the upper layer sorting transverse transmission bracket 15. The first synchronous wheel 20 is installed at both ends of the first rotating shaft 18, and the second synchronous wheel 21 is installed at both ends of the second rotating shaft 19. The first synchronous wheel 20 is connected to the second synchronous wheel 21 through a first synchronous belt 22. The output end of the first motor 17 is connected to a transmission member 23, and the first motor 17 is connected to the first rotating shaft 18 through the transmission member 23. The transmission member 23 includes a third rotating shaft connected to the output end of the first motor 17, and a third synchronous wheel is installed on the third rotating shaft. The first rotating shaft 18 is installed with a fourth synchronous wheel, and the first synchronous wheel 20 is connected to the second synchronous wheel 21 through a second synchronous belt. When the upper silicon wafer transverse flow line 3 adsorbs the silicon wafer and transfers it to the upper sorting transverse flow line 4, the first motor 17 starts, drives the first rotating shaft 18 to rotate through the transmission member 23, and then drives the second rotating shaft 19 to rotate through the first synchronous belt 22, and then the silicon wafer is transmitted through the first synchronous belt 22.

[0032] Multiple lower silicon wafer transverse flow lines 5 are respectively installed on both sides of the main line 1, and the feed end of the lower silicon wafer transverse flow line 5 is located directly below the two discharge ends of the adsorption transverse flow line 2; the feed end of the lower sorting transverse flow line 6 is connected to the discharge end of the lower silicon wafer transverse flow line 5; the structure and connection method of the lower sorting transverse flow line 6 and the lower silicon wafer transverse flow line 5 are the same as the structure and connection method of the upper sorting transverse flow line 4, and the silicon wafers are delivered to the lower material box 33 of the material box 33 mechanism 7 by synchronous belt transmission.

[0033] In a further preferred embodiment, the upper layer sorting transverse flow line 4, the lower layer sorting transverse flow line 6 and the lower layer silicon wafer transverse flow line 5 are respectively installed with adsorption transverse suction cups 24. The adsorption transverse suction cups 24 are Bernoulli suction cups, and the suction end is flush with the surface of the synchronous belt, so that the upper layer sorting transverse flow line 4, the lower layer sorting transverse flow line 6 and the lower layer silicon wafer transverse flow line 5 can stably transport the silicon wafers without deviation.

[0034] A plurality of material box mechanisms 7 are respectively installed on both sides of the main flow line 1, and the material box mechanism 7 is located on one side of the discharge end of the upper layer sorting transverse flow line 4 and the discharge end of the lower layer sorting transverse flow line 6. The material box mechanism 7 includes a material box mounting seat 30, a longitudinal switching drive assembly 31 installed on the material box mounting seat 30, a material box support plate 32 installed on the longitudinal switching drive assembly 31, and a plurality of material boxes 33 installed on the material box support plate 32. The longitudinal switching drive assembly 31 includes a second motor and a screw connected to the output end of the second motor, the screw is threadedly connected to a nut seat, and the nut seat is connected to a material box support plate 32; the material box mounting seat 30 is respectively installed with slide rails on both sides of the screw, and a slider is slidably connected to the slide rail, and the slider is connected to the material box support plate 32; when the first material box 33 is full or its position needs to be adjusted, the second motor starts and drives the screw to rotate, and the rotation of the screw drives the nut seat to slide upward on the screw, and under the sliding cooperation of the slide rail and the slider, the nut seat moves and slides and drives the material box support plate 32 and multiple material boxes 33 installed on the material box support plate 32 to move, so that the second material box 33 is aligned with the discharge end of the upper sorting transverse flow line 4 or the lower sorting transverse flow line 6 to receive the corresponding silicon wafers;

[0035] The main line 1, the adsorption transverse flow line 2, the upper silicon wafer transverse flow line 3, the upper silicon wafer sorting transverse flow line 4, and the lower silicon wafer transverse flow line 5 form a cross configuration, forming a high-speed sorting structure for main line transmission and transverse sorting; the main line 1 connects with the silicon wafers transmitted by the same direction flow line from the upstream detection equipment, and divides the quality grade of the silicon wafers according to the detection results of the upstream detection equipment, and the adsorption transverse flow line 2 adsorbs the silicon wafers of the corresponding quality grade and transmits them transversely to the upper silicon wafer transverse flow line 3 or the lower silicon wafer transverse flow line 5, and then passes through the upper sorting transverse flow line. The silicon wafers are transferred by transition line 4 or the lower silicon wafer transverse streamline 5 to be sorted into the upper material box 33 or the lower material box 33 of the material box mechanism 7 of the corresponding quality grade, thereby completing the sorting of silicon wafers of different quality grades and realizing double-layer sorting. The material box 33 only needs to transfer the silicon wafers by the upper sorting transverse streamline 4 or the lower sorting transverse streamline 6. The receiving action structure of the material box 33 is simplified, which is conducive to the expansion of batch automatic unloading from the material box 33, and can increase the number of material boxes 33 per unit space, thereby enhancing space utilization, and the cost is low. At the same time, the lateral adsorption streamline is composed of the adsorption lateral movement streamline 2, the upper silicon wafer lateral movement streamline 3, the upper sorting lateral movement streamline 4, the lower silicon wafer lateral movement streamline 5 and the lower sorting lateral movement streamline 6. The silicon wafer only needs to be horizontally suspended on the adsorption lateral movement streamline 2 and the upper silicon wafer lateral movement streamline 3 to realize horizontal suspension adsorption and transmission. The upper sorting lateral movement streamline 4 and the lower silicon wafer lateral movement streamline 5 and the lower sorting lateral movement streamline 6 can directly transport the silicon wafers and deliver them to the upper material box 33 of the corresponding material box mechanism 7 and the lower material box 33 of the material box mechanism 7 respectively, avoiding the problem of the lateral suspension adsorption streamline being too long and easily causing the wafer to fall due to airflow disturbance; secondly, it solves the problem of frequent acceleration, deceleration, start and stop due to the structure of lateral suspension adsorption and vertical free falling material discharge, which increases the probability of chasing and falling wafers.

[0036] The working principle of this embodiment: According to the feedback results of the upstream detection equipment on the silicon wafers, the silicon wafers of different quality grades are directly transmitted through the mainstream line 1 to the position of the adsorption transverse flow line 2 of the corresponding quality grade, and then the silicon wafers are adsorbed and transmitted to the position of the upper silicon wafer transverse flow line 3 or the lower silicon wafer transverse flow line 5 of the corresponding quality grade through the adsorption transverse flow line 2, and then the silicon wafers are transmitted to the upper silicon wafer transverse flow line 4 or the lower silicon wafer transverse flow line 5 through the upper silicon wafer transverse flow line 3 or the lower silicon wafer transverse flow line 5, and transmitted to the upper material box 33 or the lower material box 33 of the corresponding material box mechanism 7 through the upper sorting transverse flow line 4 or the lower sorting transverse flow line 6, and it works in this way.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an element centered thereon. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an element centered thereon. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used herein are for illustrative purposes only.

[0038] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as above in the form of preferred embodiments, it is not intended to limit the present invention. Any technical personnel in the field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A double-layer high-speed sorting and unloading device, characterized in that: It comprises a main flow line (1), a plurality of adsorption transverse flow lines (2), a plurality of upper silicon wafer transverse flow lines (3), a plurality of upper sorting transverse flow lines (4), a plurality of lower silicon wafer transverse flow lines (5), a plurality of lower sorting transverse flow lines (6) and a plurality of material box mechanisms (7), wherein the adsorption transverse flow line (2) is located directly above the main flow line (1), the plurality of upper silicon wafer transverse flow lines (3) are respectively installed on both sides of the main flow line (1), and the feed end of the upper silicon wafer transverse flow line (3) is flush with the two discharge ends of the adsorption transverse flow line (2); the feed end of the upper sorting transverse flow line (4) is located directly below the discharge end of the upper silicon wafer transverse flow line (3); A plurality of lower silicon wafer transverse flow lines (5) are respectively installed on both sides of the main flow line (1), and the feed end of the lower silicon wafer transverse flow line (5) is located directly below the discharge end of the adsorption transverse flow line (2); the feed end of the lower separation transverse flow line (6) is connected to the discharge end of the lower silicon wafer transverse flow line (5); The plurality of material box mechanisms (7) are respectively installed on both sides of the main flow line (1), and the material box mechanisms (7) are located on one side of the discharge end of the upper-layer sorting transverse flow line (4) and the discharge end of the lower-layer sorting transverse flow line (6).

2. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: The adsorption transverse movement streamline (2) comprises a suspension mounting plate (8), an adsorption transverse movement bracket (9) mounted on the suspension mounting plate (8), an adsorption belt transmission component mounted on both sides of the adsorption transverse movement bracket (9), and an adsorption transverse movement drive component (10) drivingly connected to the adsorption belt transmission component.

3. The double-layer high-speed sorting and unloading device according to claim 2 is characterized in that: The adsorption belt transmission component comprises an adsorption transverse shift driving wheel (11) which is transmission-connected to the adsorption transverse shift driving component (10) and a plurality of adsorption transverse shift belt idler wheels (12) mounted on the adsorption transverse shift bracket (9); the plurality of adsorption transverse shift belt idler wheels (12) are all located below the adsorption transverse shift driving wheel (11); the adsorption transverse shift driving wheel (11) and the plurality of adsorption transverse shift belt idler wheels (12) are transmission-connected via a perforated vacuum belt (13); a vacuum chamber (14) is mounted on the adsorption transverse shift bracket (9); and the vacuum chamber (14) is connected to the perforated vacuum belt (13).

4. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: The upper silicon wafer transverse flow line (3) has the same structure and connection method as the adsorption transverse flow line (2).

5. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: The upper layer sorting transverse movement flow line (4) comprises two upper layer sorting transverse movement brackets (15) and an upper layer sorting transverse movement conveying assembly (16). The two upper layer sorting transverse movement brackets (15) are fixedly connected via a fixing block, and the upper layer sorting transverse movement conveying assembly (16) is installed on the upper layer sorting transverse movement brackets (15).

6. The double-layer high-speed sorting and unloading device according to claim 5 is characterized in that: The upper layer sorting transverse transmission assembly (16) comprises a first motor (17), a first rotating shaft (18) and a second rotating shaft (19); the first rotating shaft (18) and the second rotating shaft (19) are respectively rotatably connected to one end of the upper layer sorting transverse transmission bracket (15); both ends of the first rotating shaft (18) are equipped with a first synchronous wheel (20); both ends of the second rotating shaft (19) are equipped with a second synchronous wheel (21); the first synchronous wheel (20) is transmission-connected to the second synchronous wheel (21) via a first synchronous belt (22); the output end of the first motor (17) is connected to a transmission member (23); the first motor (17) is transmission-connected to the first rotating shaft (18) via the transmission member (23).

7. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: Adsorption lateral movement suction cups (24) are respectively installed on the upper layer sorting lateral movement flow line (4), the lower layer sorting lateral movement flow line (6) and the lower layer silicon wafer lateral movement flow line (5).

8. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: A blowing assembly (25) is installed below the main flow line (1) and directly below the adsorption transverse flow line (2). The blowing assembly (25) includes a fixing plate (26), a mounting plate (27), a nozzle fixing member (28) and a nozzle (29). The mounting plate (27) is installed on the fixing plate (26), the nozzle fixing member (28) is installed on the mounting plate (27), and the nozzle (29) is installed on the nozzle fixing member (28).

9. The double-layer high-speed sorting and unloading device according to claim 1 is characterized in that: The material box mechanism (7) comprises a material box mounting seat (30), a longitudinal switching drive assembly (31) mounted on the material box mounting seat (30), a material box support plate (32) mounted on the longitudinal switching drive assembly (31), and a plurality of material boxes (33) mounted on the material box support plate (32).

10. The double-layer high-speed sorting and unloading device according to claim 9 is characterized in that: The longitudinal switching drive assembly (31) comprises a second motor and a screw connected to the output end of the second motor, the screw being threadedly connected to a nut seat, and the nut seat being connected to the material box support plate (32).

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