Semiconductor wafer polishing device

Abstract

The utility model relates to the technical field of semiconductor wafers, and discloses a semiconductor wafer polishing device. Comprising a bottom plate and further comprises a supporting seat fixed to the top of the bottom plate, the top of the supporting seat is fixedly connected with a supporting sleeve, the outer side of the supporting sleeve is rotationally connected with a driving sleeve for overturning a wafer, one side of the driving sleeve is fixedly connected with a fixing plate, and one side of the fixing plate is fixedly connected with a first air cylinder; according to the wafer back polishing device, the driving sleeve rotates to turn over a wafer, the back face of the wafer is polished conveniently, the problem that the wafer needs to be detached and fixed again when the back face of the wafer is polished is solved, the working efficiency is improved, the supporting disc is driven by the second motor to rotate, and the wafer back polishing efficiency is improved. And the clamping position of the wafer body is adjusted, so that the clamped position is conveniently polished, and the polishing quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer polishing device. Background Art

[0002] Semiconductor wafers are thin sheets of semiconductor materials such as silicon. These wafers are the basis of microelectronics and are widely used in computer processors, mobile phones, solar cells and other fields. Depending on the application scenario, semiconductor wafers can be made into chips of various shapes and sizes.

[0003] During the production of semiconductor wafers, it is necessary to polish the wafers. During the use of existing polishing devices, the wafers are usually clamped by a fixed structure to ensure the stability of polishing. However, the fixed structure will block the polishing disk, resulting in the wafer being clamped in an inconvenient position for polishing, and there is a polishing dead angle. In addition, when polishing the back of the wafer, the wafer needs to be disassembled and re-clamped and fixed. The fixing process is relatively cumbersome, which affects the production efficiency of semiconductor wafer polishing.

[0004] Therefore, it is necessary to provide a new semiconductor wafer polishing device to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor wafer polishing device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor wafer polishing device, comprising a base plate, and further comprising:

[0007] A support seat fixed to the top of the bottom plate, the top of the support seat is fixedly connected with a support sleeve, the outer side of the support sleeve is rotatably connected with a driving sleeve for flipping the wafer, one side of the driving sleeve is fixedly connected with a fixing plate, one side of the fixing plate is fixedly connected with a first cylinder, the outer side of the first cylinder is provided with two groups of clamping claws, one end of the clamping claw is fixedly connected with a clamping block;

[0008] A second cylinder is fixed to the top of the base plate, the piston rod of the second cylinder is fixedly connected to an adjustment box, the inner wall of the adjustment box is rotatably connected to a rotating rod, the top of the rotating rod is fixedly connected to a supporting plate for supporting the wafer, and the top of the supporting plate is provided with a wafer body.

[0009] Preferably, the inner cavity of the support sleeve is rotatably connected to two sets of transmission gears, and the outer sides of the transmission gears are meshingly connected to drive gears.

[0010] Preferably, a first motor is fixedly connected to one side of the support sleeve, and a driving rod is fixedly connected to the axis of the driving gear.

[0011] Preferably, the piston rod of the first cylinder is fixedly connected to a support block, and the inner cavity of the support block is rotatably connected to a connecting block.

[0012] Preferably, a second motor is fixedly connected to the inner wall of the regulating box, and a bevel gear set is fixedly connected to the output end of the second motor.

[0013] Preferably, the top of the base plate is fixedly connected to a support frame, the top of the support frame is fixedly connected to a third cylinder, and the piston rod of the third cylinder is fixedly connected to a polishing disk for polishing the wafer.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model drives the driving gear and the transmission gear to rotate by the first motor, so that the driving sleeve rotates to flip the wafer, which is convenient for polishing the back side of the wafer and avoids the problem of needing to disassemble and re-fix the wafer when polishing the back side of the wafer, thereby improving work efficiency. The second motor drives the rotating rod to rotate through the conical gear set, and the rotation of the rotating rod can drive the supporting plate to rotate, so as to adjust the clamping position of the wafer body, facilitate polishing the clamped position, and improve the polishing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a preferred embodiment of a semiconductor wafer polishing device provided by the utility model;

[0017] Figure 2 It is a structural schematic diagram of the support sleeve in the utility model;

[0018] Figure 3 It is a structural schematic diagram of the clamping claw in the utility model;

[0019] Figure 4 It is a structural schematic diagram of the regulating box in the utility model.

[0020] In the figure: 1, base plate; 2, support seat; 3, support sleeve; 4, drive sleeve; 5, first motor; 6, fixed plate; 7, first cylinder; 8, clamping claw; 9, clamping block; 10, second cylinder; 11, adjustment box; 12, rotating rod; 13, support plate; 14, wafer body; 15, transmission gear; 16, driving gear; 17, driving rod; 18, support block; 19, connecting block; 20, second motor; 21, bevel gear set; 22, support frame; 23, third cylinder; 24, polishing plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 As shown, a semiconductor wafer polishing device comprises a base plate 1, a support seat 2 is fixed on the top of the base plate 1, a support sleeve 3 is fixedly connected to the top of the support seat 2, a driving sleeve 4 is rotatably connected to the outer side of the support sleeve 3, and the driving sleeve 4 can rotate the wafer to avoid the problem of disassembling and re-fixing the wafer when polishing the back side of the wafer, thereby improving the work efficiency, a fixing plate 6 is fixedly connected to one side of the driving sleeve 4, a first cylinder 7 is fixedly connected to one side of the fixing plate 6, two groups of clamping claws 8 are arranged on the outer side of the first cylinder 7, a clamping block 9 is fixedly connected to one end of the clamping claw 8, the wafer can be clamped and fixed by the clamping claw 8 and the clamping block 9, thereby improving the stability of wafer polishing, a second cylinder 10 is fixed to the top of the base plate 1, and the piston rod of the second cylinder 10 is fixed An adjusting box 11 is fixedly connected, and a rotating rod 12 is rotatably connected to the inner wall of the adjusting box 11. A supporting plate 13 for supporting the wafer is fixedly connected to the top of the rotating rod 12. The rotation of the rotating rod 12 can drive the supporting plate 13 to rotate. A wafer body 14 is arranged on the top of the supporting plate 13. The rotation of the supporting plate 13 can drive the wafer body 14 to rotate, and the clamping position of the wafer body 14 is adjusted, so that polishing of the clamped position is convenient, thereby improving the polishing quality. A supporting frame 22 is fixedly connected to the top of the bottom plate 1, and a third cylinder 23 is fixedly connected to the top of the supporting frame 22. The piston rod of the third cylinder 23 is fixedly connected to a polishing plate 24 for polishing the wafer. The third cylinder 23 is started to drive the polishing plate 24 to move downward to polish the wafer body 14.

[0023] refer to Figure 2 and Figure 3As shown, the inner cavity of the support sleeve 3 is rotatably connected with two sets of transmission gears 15, the outer side of the transmission gear 15 is meshedly connected with the inner wall of the drive sleeve 4, the outer side of the transmission gear 15 is meshedly connected with a driving gear 16, one side of the support sleeve 3 is fixedly connected with a first motor 5, the axis of the driving gear 16 is fixedly connected with a driving rod 17, one end of the driving rod 17 is fixedly connected with the output end of the first motor 5, the piston rod of the first cylinder 7 is fixedly connected with a support block 18, the inner cavity of the support block 18 is rotatably connected with two sets of connecting blocks 19, the outer side of the connecting block 19 is rotatably connected with the inner cavity of the clamping claw 8, and the first cylinder is started. 7 pulls the support block 18 to move, so that the connecting block 19 rotates, the connecting block 19 tightens the two groups of clamping claws 8, and the wafer body 14 is clamped and fixed by the clamping claws 8 and the clamping block 9, and the first motor 5 is started to drive the driving rod 17 to rotate, so that the driving gear 16 rotates, and the two groups of transmission gears 15 are driven to rotate, so that the driving sleeve 4 rotates outside the support sleeve 3, and the fixing plate 6 and the first cylinder 7 are driven to rotate, and the wafer is turned over, which is convenient for polishing the back side of the wafer, avoiding the problem of disassembling and re-fixing the wafer when polishing the back side of the wafer, and improving work efficiency.

[0024] refer to Figure 4 As shown, the inner wall of the adjustment box 11 is fixedly connected with the second motor 20, and the output end of the second motor 20 is fixedly connected with a bevel gear set 21. The bevel gear set 21 includes two meshing bevel gears, one bevel gear is fixed at the output end of the second motor 20, and the other is fixed on the outside of the rotating rod 12. Starting the second motor 20 drives the rotating rod 12 to rotate through the bevel gear set 21. The rotation of the rotating rod 12 can drive the supporting plate 13 to rotate, and the clamping position of the wafer body 14 is adjusted, so that the polishing of the clamped position is convenient, thereby improving the polishing quality.

[0025] Working principle: When the device is in use, the first cylinder 7 is started to pull the support block 18 to move, so that the connecting block 19 rotates, the connecting block 19 tightens the two sets of clamping claws 8, and the wafer body 14 is clamped and fixed by the clamping claws 8 and the clamping block 9. The second cylinder 10 is started to drive the adjustment box 11 and the support plate 13 to move upward, so that the support plate 13 supports the wafer body 14, thereby improving the stability of subsequent polishing. The third cylinder 23 is started to drive the polishing plate 24 to move downward, and the wafer body 14 is polished. After polishing is completed, the clamping claw 8 releases the wafer body 14, and the second motor 20 is started to drive the rotating rod 12 to rotate through the bevel gear set 21. The rotating rod 1 The rotation of the second cylinder 10 can drive the support plate 13 to rotate, adjust the clamping position of the wafer body 14, facilitate polishing of the clamped position, and improve the polishing quality. When the back of the wafer body 14 needs to be polished, the second cylinder 10 is started to drive the support plate 13 to move downward, and the first motor 5 is started to drive the driving rod 17 to rotate, so that the driving gear 16 rotates, and drives the two sets of transmission gears 15 to rotate, so that the driving sleeve 4 rotates outside the supporting sleeve 3, drives the fixing plate 6 and the first cylinder 7 to rotate, and flips the wafer, so as to facilitate polishing of the back of the wafer, avoid the problem of disassembling and re-fixing the wafer when polishing the back of the wafer, and improve the work efficiency.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer polishing device, comprising a base plate (1), characterized in that: Also includes: A support seat (2) is fixed to the top of the base plate (1), the top of the support seat (2) is fixedly connected to a support sleeve (3), the outer side of the support sleeve (3) is rotatably connected to a driving sleeve (4) for flipping the wafer, one side of the driving sleeve (4) is fixedly connected to a fixing plate (6), one side of the fixing plate (6) is fixedly connected to a first cylinder (7), two groups of clamping claws (8) are arranged on the outer side of the first cylinder (7), and one end of the clamping claw (8) is fixedly connected to a clamping block (9); A second cylinder (10) is fixed to the top of the base plate (1), the piston rod of the second cylinder (10) is fixedly connected to an adjustment box (11), the inner wall of the adjustment box (11) is rotatably connected to a rotating rod (12), the top of the rotating rod (12) is fixedly connected to a support plate (13) for supporting a wafer, and a wafer body (14) is arranged on the top of the support plate (13).

2. A semiconductor wafer polishing device according to claim 1, characterized in that: The inner cavity of the support sleeve (3) is rotatably connected to two sets of transmission gears (15), and the outer sides of the transmission gears (15) are meshingly connected to drive gears (16).

3. A semiconductor wafer polishing device according to claim 2, characterized in that: A first motor (5) is fixedly connected to one side of the support sleeve (3), and a driving rod (17) is fixedly connected to the axis of the driving gear (16).

4. A semiconductor wafer polishing device according to claim 1, characterized in that: The piston rod of the first cylinder (7) is fixedly connected to a support block (18), and the inner cavity of the support block (18) is rotatably connected to a connection block (19).

5. A semiconductor wafer polishing device according to claim 1, characterized in that: A second motor (20) is fixedly connected to the inner wall of the regulating box (11), and a bevel gear set (21) is fixedly connected to the output end of the second motor (20).

6. A semiconductor wafer polishing device according to claim 1, characterized in that: The top of the base plate (1) is fixedly connected to a support frame (22), the top of the support frame (22) is fixedly connected to a third cylinder (23), and the piston rod of the third cylinder (23) is fixedly connected to a polishing disc (24) for polishing wafers.

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