Electrode plate polishing device
By designing the position control component of the electrode plate polishing device, the problem that the electrode column and the substrate are not easy to come into contact during the electrode plate polishing process is solved, and a more efficient polishing effect is achieved.
Patent Information
- Application Number
- CN202421797740.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-29
AI Technical Summary
During the polishing process, the electrode plate is not easy to come into contact with the raised portion of the substrate, resulting in a long polishing duration and poor effect.
An electrode plate polishing device is designed, and the position control assembly includes connecting a retention long rod, a linear guide plate, a moving rotary rod and two increasing contact rods to ensure stable contact between the polishing paper and the electrode plate, thereby achieving effective polishing of the connection parts of the electrode column and the substrate.
Through this device, the polishing duration can be significantly reduced, the polishing effect can be improved, and the electrode plate surface can be smoother and more uniform.
Smart Images
Figure CN222831521U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electrode plate processing, and in particular relates to an electrode plate polishing device. Background Art
[0002] Electrode plates are key components that can be used to separate and concentrate ions. They are made of conductive materials, usually stainless steel or titanium, and have good corrosion resistance and conductivity. In an electrodialyzer, the electrode plates are divided into anode plates and cathode plates. The electrode plates are provided with electrode columns, which are the parts used to transfer electrons in electrochemical reactions and are usually made of conductive materials such as carbon, metal, etc.
[0003] The electrode column and the substrate are polished to ensure that their surfaces are smooth and uniform to improve the efficiency and consistency of the electrochemical reaction. However, there are often protrusions between the electrode column and the substrate, which are often difficult to contact with the welding parts during polishing, thereby increasing the duration of polishing and reducing the polishing effect. Utility Model Content
[0004] The utility model provides an electrode plate polishing device, which has the characteristics of connecting a fixed long rod and an increased contact rod to stably limit the contact between the polishing paper and the electrode plate, making it easy to polish the part, reducing the duration of polishing and improving the polishing effect.
[0005] The utility model provides the following technical solution: an electrode plate polishing device, comprising a polishing table, a base plate is provided on the outer side of the polishing table, an electrode column is provided on the base plate, a polishing plate is provided on the outer side of the base plate, a position control component is provided on the polishing table, the position control component comprises a connecting and retaining long rod, a linear guide plate, a movable rotating rod and two position-increasing contact rods, the polishing plate is provided with an avoidance groove for avoiding the position of the electrode column, the connecting and retaining long rod is fixedly connected to the polishing plate, polishing paper is fixedly connected to the bottom of the polishing plate, and the movable rotating rod is slidably connected to the linear guide plate.
[0006] Among them, the two position-increasing contact rods are both fixedly connected to the connecting and retaining long rod, and the two position-increasing contact rods are respectively distributed on both sides of the avoidance groove.
[0007] Wherein, the linear guide plate is provided with a positioning cavity, and the movable rotating rod is slidably connected in the positioning cavity.
[0008] The connecting and retaining long rod is slidably connected to the movable rotating rod, and a pressing nut is threadedly connected to the outer wall of the movable rotating rod.
[0009] Among them, the linear guide plate is provided with a limit cavity, the bottom of the movable rotating rod is fixedly connected to a limit movable disk, and the limit movable disk is located in the limit cavity.
[0010] Wherein, a bottom plate is fixedly connected to the bottom of the linear guide plate, and the bottom plate is fixedly connected to the polishing table.
[0011] The beneficial effects of the utility model are:
[0012] The positioning control assembly includes a connecting and retaining long rod, a linear guide plate, a movable rotating rod and two position-increasing contact rods, which surround the polishing plate outside the connection part between the substrate and the electrode column, so that the connecting and retaining long rod controls the position of the polishing plate, and the movable rotating rod can slide in the linear guide plate to locate the movement position of the polishing paper, so that the connection part between the substrate and the electrode column can be polished, and the position of the pressure nut on the movable rotating rod is controlled, so that the connecting and retaining long rod and the position-increasing contact rod can stably limit the contact between the polishing paper and the electrode plate, so that the part can be polished easily, the duration of polishing can be reduced, and the polishing effect can be improved.
[0013] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of the utility model;
[0015] Figure 2 It is a structural schematic diagram of the polishing plate in the utility model;
[0016] Figure 3 It is a top view of the utility model;
[0017] Figure 4 This is a schematic diagram of the structure of the central control position component of the utility model;
[0018] In the figure: 1. polishing table; 2. substrate; 21. electrode column; 3. polishing plate; 31. polishing paper; 32. avoidance groove; 4. position control assembly; 41. connecting and fixing long rod; 42. position increasing contact rod; 43. linear guide plate; 431. positioning cavity; 432. limiting cavity; 44. movable rotating rod; 441. limiting movable disk; 45. bottom disk; 46. pressing nut. DETAILED DESCRIPTION
[0019] See also Figure 1-Figure 4 The utility model provides the following technical solutions: including a polishing table 1, a substrate 2 is provided on the outer side of the polishing table 1, an electrode column 21 is provided on the substrate 2, a polishing plate 3 is provided on the outer side of the substrate 2, a position control component 4 is provided on the polishing table 1, the position control component 4 includes a connecting and fixing long rod 41, a linear guide plate 43, a movable rotating rod 44 and two position-increasing contact rods 42, the polishing plate 3 is provided with an avoidance groove 32 for avoiding the position of the electrode column 21, the connecting and fixing long rod 41 is fixedly connected to the polishing plate 3, a polishing paper 31 is fixedly connected to the bottom of the polishing plate 3, and the movable rotating rod 44 is slidably connected to the linear guide plate 43.
[0020] In this embodiment: a substrate 2 is provided on the outer side of the polishing table 1, and an electrode column 21 is provided on the substrate 2. During base polishing, the electrode plate is fixed on the polishing table 1 and polished. The positioning control component 4 includes a connecting and fixing long rod 41, a linear guide plate 43, a movable rotating rod 44 and two position-increasing contact rods 42. The polishing plate 3 is provided with an avoidance groove 32 for avoiding the position of the electrode column 21. During polishing, the position of the electrode column 21 can be avoided through the avoidance groove 32. The connecting and fixing long rod 41 is fixedly connected to the polishing plate 3. A polishing paper 31 is fixedly connected to the bottom of the polishing plate 3. The connecting and fixing long rod 41 and the position-increasing contact rod 42 stably limit the contact between the polishing paper 31 and the electrode plate, so that the polishing paper 31 can be evenly contacted with the outer surface of the electrode plate. The movable rotating rod 44 is slidably connected to the linear guide plate 43 Then, the polishing plate 3 is surrounded on the outside of the connection part between the substrate 2 and the electrode column 21, so that the connection and fixing long rod 41 controls the position of the polishing plate 3, the movable rotating rod 44 can slide in the linear guide plate 43, and the limiting movable disk 441 can slide in the limiting cavity 432, so as to limit the position of the movable rotating rod 44, thereby positioning the movement position of the polishing paper 31, and the connection part between the substrate 2 and the electrode column 21 can be polished, and the position of the pressing nut 46 is controlled on the movable rotating rod 44. The more the pressing nut 46 is tightened downward, the greater the pressure applied by the connecting and fixing long rod 41 to the substrate 2, and the connecting and fixing long rod 41 and the increasing contact rod 42 can stably limit the contact between the polishing paper 31 and the electrode plate, so that the part can be polished easily, the duration of polishing can be reduced, and the polishing effect can be improved.
[0021] The two additional contact rods 42 are fixedly connected to the connecting and retaining long rod 41, and the two additional contact rods 42 are respectively distributed on both sides of the avoidance groove 32; the connecting and retaining long rod 41 and the additional contact rod 42 stably limit the contact between the polishing paper 31 and the electrode plate, so that the polishing paper 31 can evenly contact the outer surface of the electrode plate.
[0022] The linear guide plate 43 is provided with a positioning cavity 431, and the movable rotating rod 44 is slidably connected in the positioning cavity 431; the movable rotating rod 44 and the positioning cavity 431 cooperate to limit the position of the movable rotating rod 44, thereby positioning the moving position of the polishing paper 31, and the connection portion between the substrate 2 and the electrode column 21 can be polished.
[0023] The connecting and retaining long rod 41 is slidably connected to the movable rotating rod 44, and the outer wall of the movable rotating rod 44 is threadedly connected with a pressure nut 46; the position of the pressure nut 46 is controlled on the movable rotating rod 44, and the tighter the pressure nut 46 is tightened downward, the greater the pressure applied by the connecting and retaining long rod 41 to the substrate 2, and the connecting and retaining long rod 41 and the position-increasing contact rod 42 can be stably limited to contact between the polishing paper 31 and the electrode plate.
[0024] The linear guide plate 43 is provided with a limit cavity 432, and the bottom of the movable rotating rod 44 is fixedly connected to a limit movable disk 441, and the limit movable disk 441 is located in the limit cavity 432; the limit movable disk 441 can slide in the limit cavity 432, limit the position of the movable rotating rod 44, thereby positioning the moving position of the polishing paper 31, and can polish the connection portion between the substrate 2 and the electrode column 21.
[0025] The bottom of the linear guide plate 43 is fixedly connected with a bottom plate 45, and the bottom plate 45 is fixedly connected to the polishing table 1; the linear guide plate 43 is fixed on the polishing table 1 for use, and when the connection and fixing long rod 41 is not used, the rotating rod 44 can be directly rotated and moved.
[0026] The working principle and use process of the utility model are as follows: the electrode plate is fixed on the polishing table 1 and polished. The position control component 4 includes a connecting and fixing long rod 41, a linear guide plate 43, a movable rotating rod 44 and two position-increasing contact rods 42. The polishing plate 3 is provided with an avoidance groove 32 for avoiding the position of the electrode column 21. During polishing, the position of the electrode column 21 can be avoided through the avoidance groove 32. The connecting and fixing long rod 41 is fixedly connected to the polishing plate 3. The bottom of the polishing plate 3 is fixedly connected with a polishing paper 31. The movable rotating rod 44 is slidably connected to the linear guide plate 43, and the polishing plate 3 is surrounded at the outside of the connection part between the substrate 2 and the electrode column 21, so that the connecting and fixing long rod 41 controls According to the position of the polishing plate 3, the movable rotating rod 44 can slide in the linear guide plate 43, and the limiting movable disk 441 can slide in the limiting cavity 432, so as to limit the position of the movable rotating rod 44, thereby positioning the moving position of the polishing paper 31, and polishing the connection between the substrate 2 and the electrode column 21. The position of the pressure nut 46 is controlled on the movable rotating rod 44. The tighter the pressure nut 46 is tightened, the greater the pressure applied by the connecting fixing long rod 41 to the substrate 2. The connecting fixing long rod 41 and the position-increasing contact rod 42 can stably limit the contact between the polishing paper 31 and the electrode plate, making it easy to polish this part, reducing the duration of polishing and improving the polishing effect.
Claims
1. An electrode plate polishing device, comprising a polishing table (1), a substrate (2) is arranged outside the polishing table (1), and an electrode column (21) is arranged on the substrate (2), characterized in that: A polishing plate (3) is arranged on the outer side of the base plate (2); a position control assembly (4) is arranged on the polishing table (1); the position control assembly (4) comprises a connecting and fixing long rod (41), a linear guide plate (43), a movable rotating rod (44) and two position-increasing contact rods (42); the polishing plate (3) is provided with an avoidance groove (32) for avoiding the position of the electrode column (21); the connecting and fixing long rod (41) is fixedly connected to the polishing plate (3); a polishing paper (31) is fixedly connected to the bottom of the polishing plate (3); and the movable rotating rod (44) is slidably connected to the linear guide plate (43).
2. An electrode plate polishing device according to claim 1, characterized in that: The two position-increasing contact rods (42) are both fixedly connected to the connecting and retaining long rod (41), and the two position-increasing contact rods (42) are respectively distributed on both sides of the avoidance groove (32).
3. The electrode plate polishing device according to claim 1, characterized in that: The linear guide plate (43) is provided with a positioning cavity (431), and the movable rotating rod (44) is slidably connected in the positioning cavity (431).
4. The electrode plate polishing device according to claim 1, characterized in that: The connecting and retaining long rod (41) is slidably connected to the movable rotating rod (44), and a pressing nut (46) is threadedly connected to the outer wall of the movable rotating rod (44).
5. The electrode plate polishing device according to claim 1, characterized in that: The linear guide plate (43) is provided with a limit cavity (432); the bottom of the movable rotating rod (44) is fixedly connected to a limit movable disk (441); and the limit movable disk (441) is located in the limit cavity (432).
6. The electrode plate polishing device according to claim 1, characterized in that: A bottom plate (45) is fixedly connected to the bottom of the linear guide plate (43), and the bottom plate (45) is fixedly connected to the polishing table (1).