Silicon wafer grinding carrier

Abstract

The utility model discloses a silicon wafer grinding carrier which comprises a supporting piece, two sets of first electric push rods are symmetrically installed at the top end of the supporting piece, the output ends of the first electric push rods are connected with a first baffle, a first connecting base is arranged at the bottom end of the first baffle, and slidable limiting bases are arranged at the two ends of the first connecting base. The first electric push rod extends out to push the first baffle to be far away from the supporting piece, the first electric push rod can push the first baffle to be far away from the supporting piece, the first electric push rod can push the first baffle to be far away from the supporting piece, and the supporting piece can push the first electric push rod to be far away from the supporting piece. The first connecting base and the limiting base are driven to be separated from the carrier, then the carrier can be replaced, the limiting base can be driven to move through the adjusting assembly, then the carrier connected with the limiting base in a pluggable mode is driven to move, adjustment can be conducted according to carriers of different sizes, and it is guaranteed that the carrier can be connected with the driving assembly and matched with the grinding piece to grind placed silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding, in particular to a grinding carrier for silicon wafers. Background Art

[0002] A silicon wafer grinding carrier is a specially designed tool used to fix and support silicon wafers during the grinding process to ensure the uniformity and accuracy of grinding. It is usually used in conjunction with equipment such as grinders to remove saw marks and damaged layers on the surface of the silicon wafer through mechanical grinding to improve the flatness of the silicon wafer surface.

[0003] In the prior art, a carrier that matches the size of the silicon wafer is selected. Before grinding silicon wafers of different sizes, the carrier that matches the wafer needs to be replaced. However, the replacement of the carrier is cumbersome and the replacement efficiency is low, which affects the grinding efficiency. For this reason, we propose a carrier for silicon wafer grinding. Utility Model Content

[0004] The purpose of the utility model is to provide a silicon wafer polishing carrier to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a carrier for silicon wafer grinding, comprising a support member, two groups of first electric push rods are symmetrically installed on the top of the support member, the output end of the first electric push rod is connected to the first baffle, the bottom end of the first baffle is provided with a first connecting seat, both ends of the first connecting seat are provided with slidable limit seats, the limit seats can be moved by an adjusting component, the limit seats are plug-in connected to a carrier, the carrier can be rotated by a driving component, a grinding member is provided under the carrier, and the grinding member is placed in the inner cavity of the support member.

[0006] Preferably, the adjustment assembly includes a first slide groove, a second slide groove, an adjusting bolt and a second connecting seat, the first slide grooves are opened at both ends of the first connecting seat, the second slide groove is opened through the bottom side of the first slide groove, the inner cavity of the second slide groove is provided with a slidable limit seat, the top end of the limit seat is threadedly connected to the adjusting bolt, the adjusting bolt is rotatably connected to the second connecting seat, and the second connecting seat is installed in the inner cavity of the first slide groove.

[0007] Preferably, the carrier includes a first rotating rod, a rotating disk, a placement slot and a gear ring, the top end of the first rotating rod can be inserted into the limit seat, the turntable is installed on the bottom end of the first rotating rod, the turntable is circumferentially equidistantly provided with a plurality of placement slots, the placement slots can be closed by a shielding assembly, the outer ring of the turntable is integrally formed with the gear ring, and the gear ring can be rotated by the driving assembly.

[0008] Preferably, the driving assembly includes a gear, a second rotating rod and a motor, the ring gear is meshed with the gear, the gear is connected to one end of the second rotating rod, and the other end of the second rotating rod penetrates the first connecting seat and the first baffle and is connected to the output end of the motor.

[0009] Preferably, the shielding assembly includes a second electric push rod, a second baffle and a third slide groove, two groups of the second electric push rods are symmetrically installed at the bottom end of the first connecting seat, the output end of the second electric push rod is connected to the second baffle, and the second baffle is penetrated to open two groups of the third slide grooves.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] 1. The utility model can push the first baffle away from the supporting member by extending the first electric push rod, thereby driving the first connecting seat and the limiting seat to be separated from the carrier, so that the carrier can be replaced. The replacement is convenient. The limiting seat can be driven to move by the adjusting component, and then the carrier connected to it in a plug-in manner can be driven to move. The carrier can be adjusted according to different sizes to ensure that it can be connected to the driving component, and then the placed silicon wafer can be ground in cooperation with the grinding piece. Compared with the prior art, the replacement of the carrier is convenient and quick, thereby improving the grinding efficiency.

[0012] 2. The adjusting bolt of the utility model is rotatably connected to the second connecting seat. By rotating the adjusting bolt, the limit seat threadedly connected to it can slide along the second sliding groove, which can drive the carrier to move. The position of the carrier can be adjusted to keep it connected with the driving assembly, and it can be adapted according to carriers of different sizes.

[0013] 3. The second rotating rod of the utility model penetrates the second baffle plate without affecting its rotation. The third sliding groove is adapted to the first rotating rod without affecting its sliding during adjustment. By starting the motor, the second rotating rod is driven to rotate, which drives the gear to rotate, and the gear ring meshing with it is rotated, which can drive the turntable to rotate, so that the first rotating rod can rotate along the limiting seat, and drive the silicon wafer in the placement groove to rotate on the grinding piece to achieve grinding. By extending the second electric push rod, the second baffle plate can be pushed down, and the placement groove can be limited, so that the silicon wafer can always keep in contact with the grinding piece, thereby improving the grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is an exploded schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is an enlarged view of structure A of the utility model;

[0016] Figure 3 It is a cross-sectional view of the overall structure of the utility model;

[0017] Figure 4 It is a schematic diagram of the overall structure of the utility model.

[0018] In the figure: 1, support member, 2, first electric push rod, 3, first baffle, 4, first connecting seat, 5, limit seat, 6, grinding member, 7, first slide groove, 8, second slide groove, 9, adjusting bolt, 10, second connecting seat, 11, first rotating rod, 12, rotating disk, 13, placement groove, 14, gear ring, 15, gear, 16, second rotating rod, 17, motor, 18, second electric push rod, 19, second baffle, 20, third slide groove. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] Please refer to Figure 1-4 As shown, the utility model provides a carrier for silicon wafer grinding, including a support member 1, two groups of first electric push rods 2 are symmetrically installed on the top of the support member 1, the output end of the first electric push rod 2 is connected to the first baffle 3, the bottom end of the first baffle 3 is provided with a first connecting seat 4, both ends of the first connecting seat 4 are provided with slidable limit seats 5, the limit seats 5 can be moved by an adjusting component, the limit seats 5 are plug-in connected to the carrier, the carrier can be rotated by a driving component, a grinding member 6 is provided under the carrier, and the grinding member 6 is placed in the inner cavity of the support member 1.

[0022] In this embodiment, by extending the first electric push rod 2, the first baffle 3 can be pushed away from the support member 1, driving the first connecting seat 4 and the limit seat 5 to be separated from the carrier, and the carrier can be replaced. The replacement is convenient, and the adjustment component can be used to drive the limit seat 5 to move, and then drive the carrier connected to it in a plug-in manner to move. It can be adjusted according to carriers of different sizes to ensure that it can be connected to the driving component, and then cooperate with the grinding component 6 to grind the placed silicon wafer. Compared with the existing technology, the replacement of the carrier is convenient and quick, thereby improving the grinding efficiency.

[0023] Please refer to Figure 1-4As shown, the adjustment component includes a first slide groove 7, a second slide groove 8, an adjusting bolt 9 and a second connecting seat 10. The first slide grooves 7 are opened at both ends of the first connecting seat 4, and the second slide groove 8 is opened through the bottom side of the first slide groove 7. A slidable limit seat 5 is set in the inner cavity of the second slide groove 8. The top end of the limit seat 5 is threadedly connected to the adjusting bolt 9. The adjusting bolt 9 is rotatably connected to the second connecting seat 10, and the second connecting seat 10 is installed in the inner cavity of the first slide groove 7.

[0024] In this embodiment, the adjusting bolt 9 is rotatably connected to the second connecting seat 10. By rotating the adjusting bolt 10, the limit seat 5 threadedly connected thereto can slide along the second slide groove 8, thereby driving the carrier to move. The position of the carrier can be adjusted to keep it connected to the driving assembly, and can be adapted to carriers of different sizes.

[0025] Please refer to Figure 1-4 As shown, the carrier includes a first rotating rod 11, a rotating disk 12, a placement groove 13 and a ring gear 14. The top end of the first rotating rod 11 can be inserted into the limiting seat 5, and the rotating disk 12 is installed at the bottom end of the first rotating rod 11. The rotating disk 12 is circumferentially equidistantly provided with multiple groups of placement grooves 13, and the placement grooves 13 can be closed by a shielding component. The outer ring of the rotating disk 12 is integrally formed with a ring gear 14, and the ring gear 14 can be rotated by a driving component. The driving component includes a gear 15, a second rotating rod 16 and a motor 17. The ring gear 14 is meshed with the gear 15, and the gear 15 is connected to one end of the second rotating rod 16. The other end of the second rotating rod 16 penetrates the first connecting seat 4 and the first baffle 3 and is connected to the output end of the motor 17. The shielding component includes a second electric push rod 18, a second baffle 19 and a third slide groove 20. Two groups of second electric push rods 18 are symmetrically installed at the bottom end of the first connecting seat 4. The output end of the second electric push rod 18 is connected to the second baffle 19, and the second baffle 19 is provided with two groups of third slide grooves 20.

[0026] In this embodiment, the second rotating rod 16 penetrates the second baffle 19 without affecting its rotation. The third sliding groove 20 is adapted to the first rotating rod 11 and will not affect its sliding during adjustment. By starting the motor 17, the second rotating rod 16 is driven to rotate, and the gear 15 is driven to rotate, so that the gear ring 14 engaged therewith is rotated, and the turntable 12 can be driven to rotate, so that the first rotating rod 11 can rotate along the limiting seat 5, and the silicon wafer in the placement groove 13 is driven to rotate on the grinding piece 6 to achieve grinding. By extending the second electric push rod 18, the second baffle 19 can be pushed down, and the placement groove 13 can be limited, so that the silicon wafer can always keep in contact with the grinding piece 6, thereby improving the grinding efficiency.

[0027] Working principle: First, by extending the first electric push rod 2, the first baffle plate 3 can be pushed away from the support member 1, driving the first connecting seat 4 and the limiting seat 5 to disengage from the carrier, so that the carrier can be replaced, and the replacement is convenient. By rotating the adjusting bolt 10, the limiting seat 5 threadedly connected thereto can slide along the second slide groove 8, which can drive the first rotating rod 11 to move, that is, drive the turntable 12 and the ring gear 14 to move, and make the ring gear 14 mesh with the gear 15 to complete the connection with the driving assembly. By starting the motor 17, the second rotating rod 16 is driven to rotate, and the gear 15 is driven to rotate, so that the ring gear 14 meshed therewith is rotated, and the turntable 12 is driven to rotate, so that the first rotating rod 11 can rotate along the limiting seat 5, and drive the silicon wafer in the placement groove 13 to rotate on the grinding member 6 to achieve grinding. By extending the second electric push rod 18, the second baffle plate 19 can be pushed down, and the placement groove 13 can be limited, so that the silicon wafer can always keep in contact with the grinding member 6, thereby improving the grinding efficiency.

[0028] The contents not described in detail in this specification belong to the prior art known to professionals in this field.

[0029] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon wafer polishing carrier, comprising a support member (1), characterized in that: Two groups of first electric push rods (2) are symmetrically installed at the top of the support member (1); the output end of the first electric push rod (2) is connected to a first baffle (3); the bottom end of the first baffle (3) is provided with a first connecting seat (4); both ends of the first connecting seat (4) are provided with slidable limit seats (5); the limit seats (5) can be moved by an adjustment component; the limit seats (5) are pluggably connected to a carrier; the carrier can be rotated by a driving component; a grinding member (6) is provided below the carrier; the grinding member (6) is placed in the inner cavity of the support member (1).

2. The silicon wafer polishing carrier according to claim 1, characterized in that: The adjustment component comprises a first slide groove (7), a second slide groove (8), an adjustment bolt (9) and a second connecting seat (10); the first connecting seat (4) is provided with the first slide groove (7) at both ends; the second slide groove (8) is provided through the bottom side of the first slide groove (7); the inner cavity of the second slide groove (8) is provided with a slidable limit seat (5); the top end of the limit seat (5) is threadedly connected to the adjustment bolt (9); the adjustment bolt (9) is rotatably connected to the second connecting seat (10); and the second connecting seat (10) is installed in the inner cavity of the first slide groove (7).

3. The silicon wafer polishing carrier according to claim 2, characterized in that: The carrier comprises a first rotating rod (11), a rotating disk (12), a placement groove (13) and a gear ring (14); the top end of the first rotating rod (11) can be inserted into the limiting seat (5); the bottom end of the first rotating rod (11) is installed with the rotating disk (12); the rotating disk (12) is provided with a plurality of groups of placement grooves (13) equidistantly extending through the circumference; the placement grooves (13) can be closed by a shielding component; the outer ring of the rotating disk (12) is integrally formed with the gear ring (14); and the gear ring (14) can be rotated by the driving component.

4. The silicon wafer polishing carrier according to claim 3, characterized in that: The driving assembly comprises a gear (15), a second rotating rod (16) and a motor (17); the ring gear (14) is meshed with the gear (15); the gear (15) is connected to one end of the second rotating rod (16); the other end of the second rotating rod (16) penetrates the first connecting seat (4) and the first baffle (3) and is connected to the output end of the motor (17).

5. The silicon wafer polishing carrier according to claim 3, characterized in that: The shielding assembly comprises a second electric push rod (18), a second baffle (19) and a third slide groove (20); two groups of the second electric push rods (18) are symmetrically mounted at the bottom end of the first connecting seat (4); the output end of the second electric push rod (18) is connected to the second baffle (19); and the second baffle (19) is provided with two groups of the third slide grooves (20) through it.

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