Die for fixing glue extruding rod during die sealing

Abstract

The utility model provides a mold for fixing glue extruding rods during mold sealing, and the mold comprises a bottom plate, a plurality of glue extruding rods are arranged on the bottom plate at intervals, the top surfaces of the plurality of glue extruding rods are flush, and a protruding part is arranged on the side wall of the bottom plate; the fixing structure comprises a first part and a second part, the first part and the second part are arranged at the two ends of the two opposite side walls of the bottom plate respectively, and a groove is formed in the fixing structure and used for containing the protruding part. Thus, under the condition that the fixing structure is provided with a groove, the bottom plate can be accurately guided and clamped, and the mold sealing problems such as mold sealing deviation or mold sealing cavitation bubbles caused by guide deviation are solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a mold for fixing a glue extrusion rod during molding. Background Art

[0002] Semiconductor molding generally requires the use of a plastic extruder connected to the bottom plate to squeeze the colloid so that the colloid flows downward under pressure and covers the product to be molded. In this process, the pressure applied by the bottom plate must be horizontal and stable. Therefore, two fixed structures with flat contact surfaces are often used to clamp the bottom plate to guide its movement.

[0003] However, in the case of assembly errors or deformations, the guide position of the fixed structure will deviate, which will cause the base plate to apply unstable pressure, which may then lead to problems such as mold seal deviation, mold seal cavitation, and even glue rod breakage. Utility Model Content

[0004] The present application provides a mold for fixing a glue extrusion rod during mold sealing.

[0005] In a first aspect, the present application provides a mold for fixing a glue extrusion rod during mold sealing, the mold comprising:

[0006] A bottom plate, on which a plurality of glue extruding rods are arranged at intervals, the top surfaces of the plurality of glue extruding rods are flush, and a side wall of the bottom plate is provided with a protruding portion;

[0007] The fixing structure comprises a first part and a second part, wherein the first part and the second part are respectively arranged at two ends of two opposite side walls of the bottom plate, and a groove is arranged on the fixing structure, and the groove is used to accommodate the protruding part.

[0008] As a possible implementation manner, the mold further includes:

[0009] An alignment plate is disposed on the fixing structure and is opposite to the bottom plate.

[0010] As a possible implementation manner, the alignment plate is disposed between the first part and the second part.

[0011] As a possible implementation manner, the alignment plate is provided with a through hole, and the through hole is used to accommodate the colloid and / or the glue squeezing rod.

[0012] As a possible implementation manner, the mold further includes:

[0013] A pressure structure is arranged on the top surface of the bottom plate and is used to provide a force to move the bottom plate toward the alignment plate.

[0014] As a possible implementation manner, the protruding portion moves vertically in the groove under the force provided by the pressure structure.

[0015] As a possible implementation manner, the bottom plate further includes an extension portion, and the extension portion and the protruding portion form a space.

[0016] As a possible implementation manner, the projection of the space in the vertical direction accommodates the fixed structure, and the projection of the space in the vertical direction is conformal to the fixed structure.

[0017] As a possible implementation manner, a projection of the extending portion in a vertical direction is outside the fixed structure.

[0018] As a possible implementation manner, the groove does not communicate with the upper surface and the lower surface of the fixing structure.

[0019] As a possible implementation manner, the groove is conformal to the protruding portion.

[0020] As a possible implementation manner, there are a plurality of the grooves and a plurality of the protruding portions, and the grooves correspond to the protruding portions one by one.

[0021] As a possible implementation manner, the mold further includes:

[0022] A mold structure is located below the fixed structure.

[0023] As a possible implementation manner, the mold structure includes an upper mold structure and a lower mold structure, and a mold cavity for accommodating a sample to be molded is formed between the upper mold structure and the lower mold structure.

[0024] As a possible implementation manner, a through hole is provided on the upper mold structure.

[0025] As a possible implementation manner, an ejection structure is provided on the lower mold structure.

[0026] As a possible implementation manner, the protruding portion is circular, square or trapezoidal.

[0027] As a possible implementation manner, a spring is sleeved on the glue extruding rod.

[0028] In order to improve the problems of mold seal deviation, mold seal cavitation, and even extrusion rod breakage during mold seal, the present application proposes a mold for fixing the extrusion rod during mold seal, the mold comprising: a bottom plate, a plurality of extrusion rods are arranged at intervals on the bottom plate, the top surfaces of the plurality of extrusion rods are flush, and the side wall of the bottom plate is provided with a protruding portion; a fixed structure, comprising a first part and a second part, the first part and the second part are respectively arranged at the two opposite ends of the side walls of the bottom plate, and the fixed structure is provided with a groove, and the groove is used to accommodate the protruding portion. In this way, when there is a protruding portion on the side wall of the bottom plate and a corresponding groove on the fixed structure, the bottom plate can be accurately guided and clamped, thereby improving mold seal deviation or mold seal cavitation and extrusion rod breakage caused by guidance deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0030] Figure 1 It is a structural schematic diagram of a mold for fixing a glue extrusion rod during mold sealing according to the prior art;

[0031] Figure 2 It is a disassembled diagram of some parts of a mold 100 for fixing a glue extrusion rod during mold sealing according to an embodiment of the present application;

[0032] Figure 3 is a schematic structural diagram of a longitudinal cross section of a mold 100 for fixing a glue extrusion rod during mold sealing according to an embodiment of the present application;

[0033] Figure 4 is a schematic structural diagram of a transverse cross section of a mold 100 for fixing a glue extrusion rod during mold sealing according to an embodiment of the present application;

[0034] Figure 5 It is a schematic diagram of the structure of the protrusion 1012 and the groove 1023 according to an embodiment of the present application.

[0035] Description of reference numerals / symbols:

[0036] 01-glue squeezing rod; 02-guiding structure; 101-bottom plate; 1011-glue squeezing rod; 10111-spring; 1012-protruding part; 1013-extending part; 102-fixing structure; 1021-first part; 1022-second part; 1023-groove; 103-alignment plate; 1031-through hole; 104-pressure structure; 105-mold structure; 1051-upper mold structure; 1052-sample to be molded; 1053-lower mold structure; 10531-ejection structure. DETAILED DESCRIPTION

[0037] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. In addition, for ease of description, only the parts related to the relevant inventions are shown in the accompanying drawings.

[0038] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.

[0039] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0040] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.

[0041] The term "substrate" as used herein refers to a material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafer, etc. Further alternatively, the substrate may have a semiconductor device or circuit formed therein.

[0042] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.

[0043] It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.

[0044] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0045] See also Figure 1 , Figure 1 The figure is a schematic diagram of the structure of a mold for fixing a glue extrusion rod during mold sealing according to the prior art. Figure 1 The structure of the mold for fixing the extrusion rod during mold sealing shown includes:

[0046] Glue extrusion rod 01 and guide structure 02.

[0047] When the mold with the fixed extrusion rod is used for molding, there will be a force above or below the extrusion rod 01, causing it to move up and down in the middle of the guide structure 02, thereby directly extruding the colloid or guiding other structures connected to it to extrude the colloid, so that the colloid covers the product to be molded.

[0048] In this case, the guiding structure 02 can clamp the extruding rod 01, so that the extruding rod 01 moves up and down under the guiding action of the guiding structures 02 on both sides. However, in the prior art, when assembling the mold for fixing the extruding rod, there may be installation errors or deformations, resulting in the deviation of the guiding position of the guiding structure 02, which in turn affects the force of the extruding glue, causing mold seal deviation, mold seal cavitation, and even extruding rod breakage.

[0049] In order to solve the above problems, the present application proposes a mold for fixing a glue extrusion rod during mold sealing.

[0050] Combination Figure 2 and Figure 3, Figure 2 1 is a disassembled view of some parts of a mold 100 for fixing a glue extrusion rod during mold sealing according to an embodiment of the present application. Figure 3 1 is a schematic diagram of a longitudinal cross-section of a mold 100 for fixing a glue extrusion rod during mold sealing according to an embodiment of the present application. The mold 100 for fixing a glue extrusion rod during mold sealing includes:

[0051] The bottom plate 101 has a plurality of glue extruding rods 1011 arranged at intervals on the bottom plate 101, and the top surfaces of the plurality of glue extruding rods 1011 are flush. During the molding process, the bottom plate 101 carries the glue extruding rods 1011 to move up and down. The plurality of glue extruding rods 1011 with flush top surfaces can ensure the uniformity of the colloid during the extrusion process. It should be noted that the side wall of the bottom plate 101 is provided with a protruding portion 1012.

[0052] The fixed structure 102 includes a first part 1021 and a first part 1022. The first part 1021 and the first part 1022 are respectively arranged at two opposite ends of the side walls of the bottom plate 101. During the molding process, the fixed structure 102 does not move, and the bottom plate 101 moves in a preset direction under the clamping of the first part 1021 and the second part 1022. It should be noted that a groove 1023 is arranged on the fixed structure 102, and the groove 1023 is conformal with the protruding part 1012 for accommodating the protruding part 1012. During the molding process, the protruding part 1012 moves up and down in the groove 1023.

[0053] Optionally, the groove 1023 may or may not be connected to the upper surface and the lower surface of the fixing structure 102. There may be one groove 1023 or more grooves 1023, and the grooves 1023 and the protrusions 1012 may be one-to-one or one-to-many, and the number and shape of the protrusions 1012 correspond to the grooves 1023. In this way, not only the fixing effect of the mold 100 is improved, but also the assembly and disassembly process of the mold 100 is more convenient.

[0054] Therefore, compared with the horizontal setting of the surface of the conventional fixed structure, the groove 1023 provided on the fixed structure 102 can make the fixed structure 102 clamp the bottom plate 101 more firmly, and can effectively prevent the bottom plate 101 from moving during the molding process, further enhancing the overall stability of the mold 100. Even in the case of assembly errors or deformations, the guiding position of the fixed structure 102 will not have a large deviation, so that the pressure applied by the bottom plate 101 remains stable, and will not cause problems such as mold offset, mold cavitation, or even breakage of the extruding rod 1011.

[0055] As a possible implementation, the mold 100 further includes:

[0056] The alignment plate 103 is disposed on the fixed structure 102 and is opposite to the bottom plate 101. Specifically, the alignment plate 103 is disposed between the first portion 1021 and the second portion 1022.

[0057] The alignment plate 103 is provided with a through hole 1031 for accommodating the colloid and / or the glue extruding rod 1011. Before the molding process, part of the colloid can be placed in the through hole 1031; during the molding process, the glue extruding rod 1011 gradually extends downward into the through hole 1031, squeezes the colloid out of the through hole 1031, and makes it enter the mold structure 105 below to complete the molding process. At the same time, the through hole 1031 can also play a positioning role during the molding process to ensure that the colloid can be accurately filled into the predetermined position.

[0058] It should be noted that the colloid may be in liquid, solid, gel or other states. When the colloid is solid, the squeezing rod 1011 may be a squeezing rod 1011 with a constant temperature heating function to heat and melt the colloid into a liquid.

[0059] As a possible implementation, the mold 100 further includes:

[0060] The pressure structure 104 is arranged on the top surface of the bottom plate 101 and is used to provide a force to move the bottom plate 101 toward the alignment plate 103 . The protrusion 1012 moves vertically in the groove 1023 under the force provided by the pressure structure 104 .

[0061] Under the action of the pressure structure 104, the bottom plate 101 can move vertically in the fixed structure 102 under uniform force, thereby achieving effective squeezing of the colloid, improving the efficiency of molding, and making the distribution of the colloid more uniform during the molding process.

[0062] As a possible implementation, see Figure 4 , Figure 4 It is a schematic structural diagram of a transverse cross section of a mold 100 for fixing a plastic extrusion rod during molding according to an embodiment of the present application. In the transverse cross section, protruding portions 1012 may be provided on the left and right sides of the bottom plate 101, and extending portions 1013 may be provided on the upper and lower sides of the bottom plate 101, so that the extending portions 1013 and the protruding portions 1012 form a space, the projection of the space in the vertical direction accommodates the fixed structure 102, and the projection of the space in the vertical direction is conformal to the fixed structure 102, and the projection of the extending portion 1013 in the vertical direction is outside the fixed structure 102.

[0063] In this way, the bottom plate 101 and the fixed structure 102 have more than 3 contact surfaces and more than 1 right-angle positioning structure, forming multiple U-shaped buckles, which make the alignment more precise and the guidance of the bottom plate more accurate, thereby ensuring the stability of the pressure applied by the squeezing rod 1011 and improving the success rate of molding.

[0064] As a possible implementation, see Figure 5 , Figure 5 1012 and the groove 1023 according to an embodiment of the present application. The protrusion 1012 can be Figure 5 The circular, square or trapezoidal shapes shown can also be other shapes, which are not limited here. No matter what shape the protrusion 1012 adopts, the groove 1023 conforms to it to ensure the stability of the overall structure.

[0065] As a possible implementation, the glue extruding rod 1011 may be sleeved with a spring 10111. The spring 10111 is located above the alignment plate 103.

[0066] During the molding process, under the action of the pressure structure 104, the bottom plate 101 provided with the glue squeezing rod 1011 moves downward, the spring 10111 on the glue squeezing rod is compressed, and the glue squeezing rod 1011 moves downward to complete the molding process; after the molding process is completed, the pressure structure 104 no longer applies pressure, and the compressed spring 10111 can automatically restore its shape, driving the bottom plate 101 provided with the glue squeezing rod 1011 to move upward, preparing for the next molding process. This automatic recovery feature not only improves production efficiency, but also reduces the complexity of manual operation, making the entire packaging process more convenient and intelligent.

[0067] As a possible implementation, the mold 100 further includes:

[0068] The mold structure 105 is located below the fixed structure 102 and includes an upper mold structure 1051 and a lower mold structure 1053. A mold cavity for accommodating a sample 1052 to be molded is formed between the upper mold structure 1051 and the lower mold structure 1053.

[0069] The upper mold structure 1051 is provided with a through hole 1031, which facilitates the colloid in the through hole 1031 of the alignment plate 103 to flow downward into the mold cavity. The lower mold structure 1053 is provided with an ejection structure 10531. After the mold sealing is completed and solidified, the molded sample 1052 to be molded can be ejected as a whole through the ejection structure 10531, reducing the problems that may occur in the traditional ejection method, such as ejector marks, ejector deformation or breakage, and product deformation caused by uneven ejection force.

[0070] It should be noted that when molding different samples, only the precisely aligned mold structure 105 can be replaced, and there is no need to completely replace the mold 100 used to fix the extrusion rod during molding. This allows different products to be produced on the same production line, reducing the cost of repeated investment in equipment.

[0071] In summary, the present application proposes a mold 100 for fixing a glue extrusion rod during molding, which has strong replaceability, low manufacturing cost, good operability and safety, can accurately guide the bottom plate, ensure the uniformity of glue extrusion by the glue extrusion rod on the bottom plate, and has a high molding success rate.

[0072] The following describes the molding process when the mold 100 used for fixing the extruding rod during molding is used for molding, including:

[0073] Step 1, placing the sample 1052 to be molded in a mold cavity formed between the upper mold structure 1051 and the lower mold structure 1053 for receiving the sample;

[0074] Step 2, after placing the colloid in the through hole 1031 of the alignment plate 103, the mold structure 105 is aligned with the alignment plate 103 on the fixed structure 102;

[0075] Step 3, applying force to the pressure structure 104, so that the bottom plate 101 drives the glue squeezing rod 1011 to move downward between the first part 1021 and the first part 1022, squeezing the colloid in the through hole 1031 of the alignment plate 103, so that the colloid enters the mold cavity between the upper mold structure 1051 and the lower mold structure 1053, and forms a mold seal for the sample 1052 to be molded.

[0076] It should be noted that, compared with inverting the mold 100 used to fix the extruding rod during molding, applying force to the pressure structure 104 to move the extruding rod 1011 upward, the extruding rod 1011 moves downward, which is less likely to generate cavitation.

[0077] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, the thickness of a film or layer is "substantially uniform" and may refer to a standard deviation of less than or equal to ±10% of the average thickness of the film or layer, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered to be "substantially aligned" if, for example, the two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered to be "substantially perpendicular" if the angle between the two surfaces or components is, for example, 90°±10°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°. When used in conjunction with an event or situation, the terms "substantially", "substantial", "approximately", and "about" may refer to situations where the event or situation occurs exactly as well as situations where the event or situation occurs very approximately.

Claims

1. A mold for fixing a glue extrusion rod during mold sealing, characterized in that: The mold comprises: A bottom plate, on which a plurality of glue extruding rods are arranged at intervals, the top surfaces of the plurality of glue extruding rods are flush, and a side wall of the bottom plate is provided with a protruding portion; The fixing structure comprises a first part and a second part, wherein the first part and the second part are respectively arranged at two ends of two opposite side walls of the bottom plate, and a groove is arranged on the fixing structure, and the groove is used to accommodate the protruding part.

2. The mold according to claim 1, characterized in that: The mold further comprises: An alignment plate is disposed on the fixing structure and is opposite to the bottom plate.

3. The mold according to claim 2, characterized in that: The alignment plate is provided with a through hole, and the through hole is used to accommodate the colloid and / or the glue squeezing rod.

4. The mold according to claim 2, characterized in that: The mold further comprises: A pressure structure is arranged on the top surface of the bottom plate and is used to provide a force to move the bottom plate toward the alignment plate.

5. The mold according to claim 4, characterized in that: The protruding portion moves vertically in the groove under the force provided by the pressure structure.

6. The mold according to claim 1, characterized in that: The bottom plate further includes an extending portion, and the extending portion and the protruding portion form a space.

7. The mold according to claim 6, characterized in that: The projection of the space in the vertical direction accommodates the fixed structure, and the projection of the space in the vertical direction is conformal to the fixed structure.

8. The mold according to claim 1, characterized in that: The groove does not communicate with the upper surface and the lower surface of the fixing structure.

9. The mold according to claim 1, characterized in that: The groove is conformal to the protrusion.

10. The mold according to claim 1, characterized in that: The mold further comprises: A mold structure is located below the fixed structure, and includes an upper mold structure and a lower mold structure. A mold cavity for accommodating a sample to be molded is formed between the upper mold structure and the lower mold structure.

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