Front-mounted evaporation clamp

Abstract

The utility model belongs to the technical field of chip evaporation, and particularly relates to a front-mounted evaporation clamp. The planet carrier assembly comprises a planet carrier, a mounting disc and a clamping assembly. A plurality of circles of mounting discs are arranged around the center of the planet carrier, connecting rods detachably connected with the planet carrier are arranged at the bottoms of the mounting discs, and chips are placed on the front faces of the mounting discs; the clamping assembly is correspondingly installed on the back face of the installation disc and comprises a plurality of clamping pieces, the first ends of the clamping pieces are connected with the connecting rod, and the second ends of the clamping pieces are overturned from the back face of the installation disc to the front face to be clamped to the edge of the chip. The utility model is used for solving the problems of poor assembly and low yield of a full-crimping chip.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip evaporation, and in particular relates to a front-loading evaporation fixture. Background Art

[0002] Evaporation refers to a process in which a certain heating evaporation method is used to evaporate the coating material under vacuum conditions and gasify it, so that the particles fly to the surface of the substrate and condense into a film. It has the advantages of simple film formation method, high film purity and density, and unique film structure and performance.

[0003] At present, the commonly used tooling for vapor deposition basically adopts a planetary pot. For sintered chips, the chips are usually pressed onto the planetary pot. However, for fully pressed chips, the chip itself is relatively light, and the vapor deposition surface of the fully pressed chip needs to be fully steamed. Therefore, the current method of opening mounting holes on the planetary pot to insert the chip for fixing cannot meet the requirements of vapor deposition, and the installation method of pressing the chip into the mounting hole is also likely to cause damage to the fully pressed chip itself. Therefore, the assembly of fully pressed chips in the current planetary pot will result in a low chip yield. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a front-loading evaporation fixture for solving the problem of poor assembly of full-pressed chips and low yield.

[0005] The utility model solves the above technical problems with the following technical solutions: a front-loading evaporation fixture, comprising:

[0006] Planet carrier;

[0007] A plurality of mounting plates are arranged in a plurality of circles around the center of the planetary frame, a connecting rod for detachably connecting with the planetary frame is provided at the bottom of the mounting plate, and a front side of the mounting plate is used for placing a chip;

[0008] A plurality of snap-in assemblies are correspondingly mounted on the back of the mounting plate, and the snap-in assemblies include a plurality of snap-in parts, wherein the first ends of the snap-in parts are connected to the connecting rods, and the second ends of the snap-in parts are flipped from the back of the mounting plate to the front and snap-in to the edge of the chip.

[0009] Compared with the prior art, the above technical solution has the following beneficial effects:

[0010] By connecting a mounting plate to the planetary frame, the mounting plate is used to mount the chip, and the chip is fixed by a clamping assembly arranged on the back of the mounting plate, so that the full steaming of the front side of the chip is not affected, and the second end of the clamping piece in the clamping piece is wrapped around the back side of the mounting plate to the front side and clamped on the edge of the chip, thereby minimizing the influence on the vapor deposition on the chip surface, and the clamping piece is clamped at the edge of the chip instead of pressing on the surface of the chip, thereby avoiding greater damage to the chip.

[0011] Based on the above technical solution, the embodiment of the present application can also be improved as follows:

[0012] In one embodiment, a plurality of clamping protrusions are provided on the outer peripheral edge of the mounting plate corresponding to the clamping member, and a first clamping groove for limiting the second end of the clamping member is defined in the clamping protrusions.

[0013] In one embodiment, a second clamping groove is formed on at least one of the clamping protrusions, and the distance from the bottom of the second clamping groove to the center of the mounting plate is greater than the distance from the bottom of the first clamping groove to the center of the mounting plate.

[0014] In one embodiment, at least one elastic ring is wound around the middle of the clamping member.

[0015] In one embodiment, a front edge of the mounting plate is provided with a rim for supporting the chip.

[0016] In one embodiment, the edge is provided with a plurality of sections, and avoidance gaps corresponding to the clamping protrusions are formed between the head and tail of the plurality of sections of the edge.

[0017] In one embodiment, a plurality of weight-reducing holes are provided on the planet carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0020] Figure 2 for Figure 1 Schematic diagram of the back structure of the installation plate.

[0021] Figure 3 for Figure 1 Schematic diagram of the front structure of the installation disk.

[0022] Reference numerals:

[0023] 1. Planet carrier; 2. Mounting plate; 3. Connecting rod; 4. Snap-on assembly;

[0024] 401, card connector;

[0025] 5. snap-fit ​​protrusion; 6. first snap-fit ​​groove; 7. second snap-fit ​​groove;

[0026] 8. Elastic ring;

[0027] 9. Edge; 10. Avoid gaps;

[0028] 11. Weight reduction hole. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0030] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0031] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present utility model, the meaning of "plurality" is more than two, unless otherwise clearly and specifically limited.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0034] like Figure 1-3 As shown, the utility model provides a front-loading evaporation fixture, which includes: a planetary frame, a plurality of mounting plates and a plurality of clamping components.

[0035] The planet carrier is spherical in shape as a whole, the front side of the planet carrier is a concave arc surface, the back side is a convex arc surface, and the mounting plate is mounted on the front side of the planet carrier.

[0036] A plurality of mounting plates are arranged in a plurality of circles around the center of the planetary frame, a connecting rod for detachably connecting with the planetary frame is provided at the bottom of the mounting plate, the connecting rod passes through the planetary frame and is fastened by a nut, and is fixed to the planetary frame through the mounting plate, the front side of the mounting plate is used to place the chip, that is, the side of the mounting plate away from the planetary frame is the mounting surface, the clamping assembly is correspondingly installed on the back side of the mounting plate, each mounting plate is installed with a clamping assembly, and the clamping assembly is used to clamp and fix the chip placed on the front side of the mounting plate;

[0037] Wherein, the clamping assembly includes a plurality of clamping parts. In this embodiment, there are three clamping parts. The first end of the clamping part is connected to the connecting rod. The second end of the clamping part is turned from the back side of the mounting plate to the front side and clamped to the edge of the chip. The three clamping parts are evenly spaced in the circumferential direction. The edge of the chip is clamped by the second ends of the three clamping parts, and the other ends are fixed to the connecting rod to fix the chip on the mounting plate. Specifically, the clamping part can be rod-shaped or wire-shaped, and the second end of the clamping part is wound into a circle or rounded to avoid scratching the chip.

[0038] Among them, at least one elastic ring is wound around the middle part of the clamp to form a spring-like elastic ring, so that the clamp as a whole can provide a larger elastic force. The setting of the elastic ring enables the second end of the clamp to provide an elastic force to contract inward, so as to better and more firmly fix the chip. Combined with the second end folded to the front of the mounting plate to limit the direction of the chip away from the front of the mounting plate, the chip can be better fixed.

[0039] By connecting a mounting plate to the planetary frame, the mounting plate is used to mount the chip, and the chip is fixed by a clamping assembly arranged on the back of the mounting plate, so that the full steaming of the front side of the chip is not affected, and the second end of the clamping piece in the clamping piece is wrapped around the back side of the mounting plate to the front side and clamped on the edge of the chip, thereby minimizing the influence on the vapor deposition on the chip surface, and the clamping piece is clamped at the edge of the chip instead of pressing on the surface of the chip, thereby avoiding greater damage to the chip.

[0040] To facilitate the fixation of the second end of the clip, a plurality of clip protrusions are provided on the outer peripheral edge of the mounting plate corresponding to the clip, and three clip protrusions are provided correspondingly. The three clip protrusions are evenly spaced along the outer peripheral edge of the mounting plate. A first clip groove for limiting the second end of the clip is provided in the clip protrusion. The second end of the clip can be restricted therein through the first clip groove to prevent the second end of the clip from sliding around, thereby limiting the chip from three fixed circumferential directions.

[0041] To facilitate the removal of chips, at least one of the snap-in protrusions is provided with a second snap-in groove, and the distance from the bottom of the second snap-in groove to the center of the mounting disk is greater than the distance from the bottom of the first snap-in groove to the center of the mounting disk; when the chip needs to be removed, the second end of the snap-in piece in the snap-in protrusion is taken from the first snap-in groove and placed in the second snap-in groove. Since the bottom of the second snap-in groove on the snap-in protrusion is higher than the bottom of the first snap-in groove, the second end of the snap-in piece cannot limit the chip at this time, which makes it convenient for the operator to take the chip without removing all three snap-in pieces.

[0042] In order to prevent the chip from being difficult to take out after the back side of the chip is attached to the front side of the mounting plate, a rim for supporting the chip is provided at the front edge of the mounting plate, and the rim is higher than the surface of the mounting plate.

[0043] Specifically, the edge is provided with several sections. In the present embodiment, the edge is provided with three sections. Avoidance gaps corresponding to the snap-on protrusions are formed between the head and tail of the three sections of the edge. The avoidance gaps can conveniently keep air from entering between the chip and the front of the mounting plate to prevent the chip from being adsorbed on the mounting plate, and also facilitate the removal and placement of the chip.

[0044] In this embodiment, a plurality of weight-reducing holes are provided on the planet carrier, and a plurality of circles of weight-reducing holes are provided around the center of the planet carrier. The weight-reducing holes are located adjacent to the two mounting plates.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A front-loading evaporation fixture, characterized in that: include: Planet carrier; A plurality of mounting plates are arranged in a plurality of circles around the center of the planetary frame, a connecting rod for detachably connecting with the planetary frame is provided at the bottom of the mounting plate, and a front side of the mounting plate is used for placing a chip; A plurality of snap-in assemblies are correspondingly mounted on the back of the mounting plate. The snap-in assemblies include a plurality of snap-in parts. The first ends of the snap-in parts are connected to the connecting rods. The second ends of the snap-in parts are flipped from the back of the mounting plate to the front to snap-in to the edge of the chip.

2. The front-loading evaporation fixture according to claim 1, characterized in that: A plurality of clamping protrusions are arranged on the outer peripheral edge of the installation plate corresponding to the clamping member, and a first clamping groove for limiting the second end of the clamping member is arranged in the clamping protrusions.

3. The front loading evaporation fixture according to claim 2, characterized in that: A second clamping groove is formed on at least one of the clamping protrusions, and a distance from the bottom of the second clamping groove to the center of the mounting plate is greater than a distance from the bottom of the first clamping groove to the center of the mounting plate.

4. The front loading evaporation fixture according to claim 1, characterized in that: At least one elastic ring is wound around the middle of the clamping member.

5. The front loading evaporation fixture according to claim 2, characterized in that: The front edge of the mounting plate is provided with a rim for supporting the chip.

6. The front loading evaporation fixture according to claim 5, characterized in that: The edge is provided with a plurality of sections, and avoidance gaps corresponding to the clamping protrusions are formed between the head and tail of the plurality of sections of the edge.

7. The front loading evaporation fixture according to claim 1, characterized in that: A plurality of weight-reducing holes are provided on the planet carrier.

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