Probe assembly and test equipment

Abstract

The utility model discloses a probe assembly and test equipment, and belongs to the technical field of electronic test. The probe assembly comprises a probe plate and at least one adapter. The adapter is arranged in the probe assembly and is used for being connected with the test equipment, the signal bonding pad is arranged in the probe plate, the signal bonding pad is arranged at the end, away from the adapter, of the probe plate, and the two ends of the signal line in the probe plate can be electrically connected with the adapter conductor in the adapter and the signal bonding pad respectively. Thus, when the signal transmission quality in the circuit board to be tested is tested through the probe assembly, the signal bonding pad in the probe board can be correspondingly welded with the bonding pad to be tested in the circuit board to be tested, the bad phenomenon that the probe is damaged (such as bending deformation) when touching the circuit board can be avoided, and the test accuracy is improved. Therefore, the test cost of the probe assembly is reduced, and the operation process of an operator can be effectively simplified.

Description

Technical Field

[0001] The present application relates to the technical field of electronic testing, and in particular to a probe assembly and testing equipment. Background Art

[0002] Circuit board, also known as printed circuit board or printed circuit board, is a printed circuit board with high wiring density, light weight, thin thickness and good bending performance. With the widespread application of electronic products, circuit boards are produced in large quantities as important components of electronic products, and the measurement of signal transmission quality of board-level links in circuit boards is one of the important links in the production process of circuit boards, and some signal testing equipment will inevitably be used.

[0003] Currently, when the test equipment inserts the test probe into the corresponding test position to perform signal testing, the needle of the test probe is likely to touch the circuit board and cause damage. Utility Model Content

[0004] The embodiment of the present application provides a method for solving the problem that the test probe in the test equipment in the prior art is prone to damage when touching the circuit board. The technical solution is as follows:

[0005] In one aspect, a probe assembly is provided, the probe assembly comprising:

[0006] A probe card, and at least one adapter;

[0007] The adapter seat has an adapter conductor;

[0008] One end of the probe board is fixedly connected to the adapter, and the probe board has: at least one signal line and at least one signal pad, the at least one signal pad is distributed at one end of the probe board away from the adapter, the first end of the at least one signal line is electrically connected to the transfer conductor in the at least one adapter in a one-to-one correspondence, and the second end of the at least one signal line is electrically connected to the at least one signal pad in a one-to-one correspondence;

[0009] The at least one signal pad is used for corresponding welding with at least one pad to be tested in the circuit board to be tested.

[0010] Optionally, the probe card further has: at least one first positioning pad, the at least one first positioning pad corresponding one-to-one to the at least one signal pad, the at least one first positioning pad and the at least one signal pad are respectively located on two opposite side surfaces of the probe card, and the orthographic projection of each first positioning pad on a reference plane parallel to the probe card overlaps with the orthographic projection of the corresponding signal pad on the reference plane.

[0011] Optionally, the first positioning pads are insulated from the signal pads, and an outer boundary of an orthographic projection of each of the first positioning pads on the reference plane coincides with an outer boundary of an orthographic projection of a corresponding signal pad on the reference plane.

[0012] Optionally, the probe card has at least one wire channel corresponding to at least one signal line, the end of the probe card close to the adapter has a first via hole connected to the corresponding wire channel, and the end of the probe card away from the adapter has a second via hole connected to the corresponding wire channel;

[0013] At least part of the signal line is located in the corresponding wire channel, the first end of the signal line is electrically connected to the transfer conductor in the corresponding adapter through the first via hole, and the second end of the signal line is electrically connected to the corresponding signal pad through the second via hole.

[0014] Optionally, the end of the probe board close to the adapter has a supporting groove connected to the first via hole, and a supporting pad fixed in the supporting groove, the supporting pad is located between the first end of the signal line and the transfer conductor, and the two side surfaces of the supporting pad are respectively fixedly connected to the first end of the signal line and one end of the transfer conductor.

[0015] Optionally, the probe card includes: a plurality of functional medium plates stacked together, the plurality of functional medium plates being divided into: a first functional medium plate and a second functional medium plate located at the outermost sides, and at least one third functional medium plate located between the first functional medium plate and the second functional medium plate, the at least one third functional medium plate having a plurality of through holes.

[0016] Optionally, the multiple functional dielectric plates include: a ground plate and a conductor plate, the ground plate and the conductor plate are insulated, the conductor plate has the at least one signal line, the ground plate has two ground pads at one end away from the adapter, and the at least one signal pad is distributed between the two ground pads.

[0017] Optionally, the probe card includes: a probe card body, and an adapter plate body fixedly connected to one end of the probe card body, the end of the adapter plate body facing away from the probe card body is fixedly connected to the at least one adapter seat, and the end of the probe card body facing away from the adapter plate body has the at least one signal pad.

[0018] Optionally, in the case where the probe assembly includes a plurality of the adapters, the plurality of adapters are arranged sequentially around an extension direction of a preset circular arc, and the center of the preset circular arc is distributed toward the probe card body.

[0019] In another aspect, a testing device is provided, the testing device comprising:

[0020] The device body and the probe assembly are detachably connected to the end of the adapter seat away from the probe plate, and the device body is electrically connected to the adapter conductor. The probe assembly is any one of the probe assemblies given above.

[0021] Optionally, the number of the probe assemblies in the test device is two;

[0022] Before the testing device tests the circuit board to be tested, the signal pads in the two probe assemblies are used for docking.

[0023] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0024] A probe assembly may include: a probe board, and at least one adapter. An adapter is provided in the probe assembly for connecting to a test device, and a signal pad is provided in the probe board, and the signal pad is provided at one end of the probe board away from the adapter, and the two ends of the signal line in the probe board can be electrically connected to the adapter conductor and the signal pad in the adapter, respectively. In this way, when the signal transmission quality in the circuit board to be tested is tested by the probe assembly, the signal pad in the probe board can be welded to the corresponding pad to be tested in the circuit board to be tested, which can avoid the undesirable phenomenon that the probe is damaged (for example, bent and deformed) when touching the circuit board, thereby reducing the test cost of the probe assembly and can effectively simplify the operation process of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 It is a structural schematic diagram of a probe assembly provided in an embodiment of the present application from one perspective;

[0027] Figure 2 is a structural schematic diagram of a probe assembly provided in an embodiment of the present application from another perspective;

[0028] Figure 3 is a schematic structural diagram of another probe assembly provided in an embodiment of the present application;

[0029] Figure 4 is a front view of a probe assembly provided in an embodiment of the present application;

[0030] Figure 5 yes Figure 4 A cross-sectional view at A-A';

[0031] Figure 6 is a structural schematic diagram of another probe assembly provided in an embodiment of the present application;

[0032] Figure 7 is a schematic structural diagram of another probe assembly provided in an embodiment of the present application;

[0033] Figure 8 yes Figure 7 A partial structural schematic diagram of a probe assembly is shown;

[0034] Fig. 9 is a structural schematic diagram of a probe assembly provided by another embodiment of the present application;

[0035] Fig.10 is a schematic structural diagram of another probe assembly provided in another embodiment of the present application;

[0036] Fig.11 is a structural schematic diagram of another probe assembly provided by another embodiment of the present application;

[0037] Fig.12 This is a schematic diagram of the structure of two probe assemblies aligned with each other provided in an embodiment of the present application;

[0038] Fig.13 yes Fig.12 A side view of two probe assemblies is shown;

[0039] Fig.14 It is a structural schematic diagram of a test system provided in an embodiment of the present application.

[0040] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0042] In the related art, the test equipment (e.g., desktop probe system) used for testing the signal transmission quality of the circuit board is expensive, and the probe used is relatively fragile and easily damaged during the process of contacting the test area of ​​the circuit board for testing, resulting in the probe being a consumable item and requiring high test operation from the operator. In addition, the current desktop probe system can only support the situation where both ends of the signal to be tested are located on the same side of the circuit board to be tested.

[0043] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of a probe assembly provided in an embodiment of the present application from one perspective, Figure 2 1 is a schematic diagram of a probe assembly provided in an embodiment of the present application from another perspective. The probe assembly 000 may include: a probe card 100 and at least one adapter 200 .

[0044] The adapter 200 in the probe assembly 000 may have a transfer conductor 201 . For example, each adapter 200 in the probe assembly 000 may have one transfer conductor 201 .

[0045] One end of the probe card 100 in the probe assembly 000 can be fixedly connected to the adapter 200, and the probe card 100 can have: at least one signal line 101 and at least one signal pad 102, the at least one signal pad 102 can be distributed at one end of the probe card 100 away from the adapter 200, the first end of at least one signal line 101 can be electrically connected to the transfer conductor 201 in at least one adapter 200 in a one-to-one correspondence, and the second end of at least one signal line 101 can be electrically connected to at least one signal pad 102 in a one-to-one correspondence. For example, the number of signal lines 101 in the probe card 100 and the number of signal pads 102 in the probe card 100 can be the same, and the number of signal lines 101 in the probe card 100 can be the same as the number of adapters 200 in the probe assembly 000.

[0046] Among them, at least one signal pad 102 can be used for corresponding welding with at least one welding pad to be tested in a circuit board to be tested (not shown in the figure). For example, the probe assembly 000 is welded with the welding pad to be tested in the circuit board to be tested through the signal pad 102, so that the signal in the circuit board to be tested can be transmitted to the test equipment through the probe assembly.

[0047] In the embodiment of the present application, a transfer seat 200 is provided in the probe assembly 000 for connecting with the test equipment, a signal pad 102 is provided in the probe board 100, and the signal pad 102 is provided at one end of the probe board 100 away from the transfer seat 200, and the two ends of the signal line 101 in the probe board 100 can be electrically connected to the transfer conductor 201 and the signal pad 102 in the transfer seat 200, respectively. In this way, when the signal transmission quality in the circuit board to be tested is tested through the probe assembly 000, the signal pad 102 in the probe board 100 can be welded to the corresponding pad to be tested in the circuit board to be tested, which can avoid the undesirable phenomenon that the probe is damaged (for example, bent and deformed) when touching the circuit board, thereby reducing the test cost of the probe assembly 000 and effectively simplifying the operation process of the operator.

[0048] In summary, the embodiment of the present application provides a probe assembly, which may include: a probe board, and at least one adapter. By setting an adapter in the probe assembly for connecting to a test device, a signal pad is set in the probe board, and the signal pad is set at one end of the probe board away from the adapter, and the two ends of the signal line in the probe board can be electrically connected to the transfer conductor and the signal pad in the adapter, respectively. In this way, when the signal transmission quality in the circuit board to be tested is tested by the probe assembly, the signal pad in the probe board can be welded to the corresponding pad to be tested in the circuit board to be tested, which can avoid the undesirable phenomenon that the probe is damaged (for example, bent and deformed) when touching the circuit board, thereby reducing the test cost of the probe assembly, and can effectively simplify the operator's operation process.

[0049] Optional, please refer to Figure 3 , Figure 3 It is a structural schematic diagram of another probe assembly provided by an embodiment of the present application. The probe board 100 in the probe assembly 000 may also have at least one first positioning pad 103, and the at least one first positioning pad 103 may correspond to at least one signal pad 102 one by one, and at least one first positioning pad 103 and at least one signal pad 102 may be respectively located on two oppositely disposed sides of the probe board 100, and the orthographic projection of each first positioning pad 103 on a reference plane parallel to the probe board 100 may overlap with the orthographic projection of the corresponding signal pad 102 on the reference plane. In this case, by setting the first positioning pad 103 in the probe board 100, the first positioning pad 103 and the signal pad 102 are respectively arranged on two oppositely disposed sides of the probe board 100, so that in the process of welding the probe assembly to the circuit board to be tested, the first positioning pad 103 can effectively play a role in alignment, ensuring the welding position accuracy of the signal pad 102 in the probe board 100 and the circuit board to be tested, thereby ensuring the reliability and stability of the subsequent signal transmission quality test.

[0050] In this application, if Figure 3 As shown, the first positioning pad 103 and the signal pad 102 on the probe card 100 can be insulated, and the outer boundary of the orthographic projection of each first positioning pad 103 on the reference plane parallel to the probe card 100 can coincide with the outer boundary of the orthographic projection of the corresponding signal pad 102 on the reference plane. In this case, the first positioning pad 103 is insulated from the signal pad 102, and the first positioning pad 103 only plays the role of welding positioning of the probe assembly 000, and the outer boundary of the orthographic projection of the first positioning pad 103 on the reference plane is set to coincide with the outer boundary of the orthographic projection of the corresponding signal pad 102 on the reference plane. In this way, it can further facilitate the operator to align the welding of the signal pad 102 and the circuit board to be tested during the process of welding the probe assembly 000 with the circuit board to be tested.

[0051] In the examples of this application, please refer to Figure 4 and Figure 5 , Figure 4 is a front view of a probe assembly provided in an embodiment of the present application, Figure 5 yes Figure 4Cross-sectional view at A-A'. The interior of the probe card 100 may have at least one wire channel 104 corresponding to at least one signal line 101, the end of the probe card 100 close to the adapter 200 may have a first via 105 connected to the corresponding wire channel 104, and the end of the probe card 100 away from the adapter 200 may have a second via 106 connected to the corresponding wire channel 104. At least part of the signal line 101 in the probe card 100 may be located in the corresponding wire channel 104, and the first end of the signal line 101 may be electrically connected to the transfer conductor 201 in the corresponding adapter 200 through the first via 105, and the second end of the signal line 101 may be electrically connected to the corresponding signal pad 102 through the second via 106. In this case, each signal line 101 in the probe card 100 can be located in the wire channel 104 inside the probe card 100, which can prevent the signal line 101 from being exposed to the external environment. In addition, a first via 105 connected to the wire channel 104 is provided at the end of the probe board 100 close to the adapter 200, and a second via 106 connected to the wire channel 104 is provided at the end of the probe board 100 away from the adapter 200. In this way, the first end of the signal line 101 located in the wire channel 104 can be electrically connected to the transfer conductor 201 in the adapter 200 corresponding to the signal line 101 through the first via 105, and the second end of the signal line 101 can be electrically connected to the signal pad 102 corresponding to the signal line 101 through the second via 106. It should be noted that the end of the transfer conductor 201 in the adapter 200 for electrically connecting to the first end of the signal line 101 and the signal pad 102 for electrically connecting to the second end of the signal line 101 can be respectively located on two oppositely disposed outer side surfaces of the probe card 100. In this way, the electrical connection between the two ends of the signal line 101 and the transfer conductor 201 and the signal pad 102 in the adapter 200 can be conveniently achieved through two vias.

[0052] Optional, please refer to Figure 5 and Figure 6 , Figure 6It is a structural schematic diagram of another probe assembly provided in an embodiment of the present application. The end of the probe plate 100 in the probe assembly 000 close to the transfer seat 200 may have a bearing groove 107 connected to the first via 105, and a support pad 108 fixed in the bearing groove 107, the support pad 108 may be located between the first end of the signal line 101 and the transfer conductor 201, and the two sides of the support pad 108 may be fixedly connected to the first end of the signal line 101 and one end of the rotating conductor 201, respectively. In this case, a bearing groove 107 connected to the first via 105 is provided at the end of the probe plate 100 close to the adapter 200, and a support pad 108 is fixed in the bearing groove 107, and one end of the transfer conductor 201 in the adapter 200 and the first end of the signal line 101 are respectively located on both sides of the support pad 108, so that the connection area between the transfer conductor 201 and the first end of the signal line 101 is effectively increased by the support pad 108, and the connection stability between the first end of the signal line 101 and the transfer conductor 201 is ensured. It should be noted that during the preparation process of the probe plate in the present application, components such as signal pads and signal lines can be prepared, and then fixedly connected to the adapter, and the transfer conductor in the adapter can be welded to the support pad. For example, the signal line 101 in the probe plate 100 can be a strip line with a characteristic impedance of 50Ω, which can ensure the impedance continuity of the probe assembly 000 after welding with the circuit board to be tested, and improve the bandwidth of the probe assembly 000.

[0053] In the examples of this application, please refer to Figure 7 and Figure 8 , Figure 7 is a schematic diagram of the structure of another probe assembly provided in an embodiment of the present application, Figure 8 yes Figure 7 A partial structural schematic diagram of the probe assembly is shown. The probe board 100 in the probe assembly 000 may include: a plurality of functional medium plates A stacked together, the plurality of functional medium plates A may be divided into: a first functional medium plate A1 and a second functional medium plate A2 located on the outermost sides, and at least one third functional medium plate A3 located between the first functional medium plate A1 and the second functional medium plate A2, the at least one third functional medium plate A3 may have a plurality of through holes a1. In this case, by providing a plurality of through holes a1 arranged in an array on the third functional medium plate A3 in the probe board 100, the provision of the plurality of through holes a1 may effectively prevent resonance between the planes of the plurality of functional medium plates of the probe board 100. It should be noted that Figure 8The multiple cylinders in represent the locations where the through holes are opened. For example, the multiple functional medium plates can be divided into: a first functional medium plate A1 and a second functional medium plate A2 located on the outermost side, and a plurality of third functional medium plates A3 located between the first functional medium plate A1 and the second functional medium plate A2, each of the third functional medium plates A3 can have a plurality of sub-through holes, and a column of sub-through holes on the multiple third functional medium plates can form a through hole a1 after being connected. And the axis of each through hole a1 can be perpendicular to a reference plane parallel to the probe plate 100. For example, the multiple through holes a1 can be distributed at equal intervals, and the distance between two adjacent through holes a1 can be 0.5 mm.

[0054] Optional, such as Figure 8 As shown, the multiple functional medium plates A in the probe card 100 may include: a ground plate 100a and a conductor plate 100b, the ground plate 100a and the conductor plate 100b may be insulated, the conductor plate 100b may have at least one signal line 101, the end of the ground plate 100a away from the adapter 200 may have two grounding pads B1, and at least one signal pad 102 in the probe card 100 may be distributed between the two grounding pads B1. In this case, at least one signal line 101 is formed in the conductor plate 100b, and two grounding pads B1 are set at the end of the ground plate 100a away from the adapter 200, and at least one signal pad 102 in the probe card 100 is distributed between the two grounding pads B1. In this way, after the two grounding pads B1 on the probe card 100 are welded to the circuit board to be tested, grounding is formed, thereby improving the signal transmission effect of the probe assembly 000. In the present application, as Figure 7 As shown, the end surface of the adapter 200 close to the probe card 100 may have two grounding portions 202 , and one side surface of the grounding plate 100 a may have two welding areas b1 , and the two grounding portions 202 may be welded in the two welding areas b1 respectively.

[0055] Optional, such as Figure 7 As shown, the end of the ground plate 100a in the probe card 100 facing away from the adapter 200 may have two second positioning pads B2, the two grounding pads B1 and the two positioning pads B2 may be located on two oppositely disposed side surfaces of the ground plate 100a, and the orthographic projection of each second positioning pad B2 on a reference plane parallel to the probe card 100 may overlap with the orthographic projection of the corresponding grounding pad B1 on the reference plane. For example, the outer boundary of the orthographic projection of each second positioning pad B2 on the reference plane parallel to the probe card 100 may overlap with the outer boundary of the orthographic projection of the corresponding grounding pad B1 on the reference plane.

[0056] In the embodiments of the present application, Figure 7As shown, the probe card 100 in the probe assembly 000 may include: a probe card body 100c, and an adapter board 100d fixedly connected to one end of the probe card body 100c, the end of the adapter board 100d away from the probe card body 100c may be fixedly connected to at least one adapter seat 200, and the end of the probe card body 100c away from the adapter board 100d may have at least one signal pad 102. Here, the first positioning pad 103 and the grounding pad B1 in the probe card 100 may be located at the end of the probe card body 100c away from the adapter board 100d.

[0057] In this application, if Figure 7 and Figure 8 As shown, in the case where the probe assembly 000 includes an adapter 200, the adapter 200 can be fixedly connected to the end of the adapter board 100d away from the probe board body 100c. Here, a signal pad 102 and two ground pads B1 located on both sides of the signal pad 102 can be distributed on the probe board 100, that is, a pad structure in the form of GSG can be formed. The probe assembly structure can be applicable to the single-ended signal pin distribution of a common printed circuit board (PCB).

[0058] Optional, please refer to Fig. 9 , Fig. 9 1 is a schematic diagram of the structure of a probe assembly provided by another embodiment of the present application. In the case where the probe assembly 000 includes a plurality of adapters 200, the plurality of adapters 200 can be arranged in sequence around the extension direction of a preset arc Y, and the center of the preset arc Y can be distributed toward the probe card body 100c. For example, Fig. 9 As shown, when the probe assembly 000 includes two adapters 200, the two adapters 200 can be fixedly connected to the end of the adapter board 100d away from the probe board body 100c, and the two adapters 200 are arranged in sequence around the extension direction of the preset arc Y. Here, two signal pads 102 can be distributed on the probe board 100, and two ground pads B1 located at the outermost sides of the two signal pads 102, that is, a GSSG pad structure can be formed. The probe assembly structure can be suitable for the common differential signal pin distribution of PCB boards. For examples, please refer to Fig.10 , Fig.10It is a structural schematic diagram of another probe assembly provided by another embodiment of the present application. When the probe assembly 000 includes three adapters 200, the three adapters 200 can be fixedly connected to one end of the adapter board body 100d away from the probe board body 100c, and the three adapters 200 are arranged sequentially around the extension direction of the preset arc Y. Here, three signal pads 102 can be distributed on the probe board 100, and two ground pads B1 located at the outermost sides of the three signal pads 102, that is, a pad structure in the form of GSSSG can be formed, and the probe assembly structure can be suitable for the common C-PHY signal distribution of PCB boards.

[0059] In this application, please refer to Fig. 9 and Fig.11 , Fig.11 It is a structural schematic diagram of another probe assembly provided by another embodiment of the present application. In the case where the probe assembly 000 includes a plurality of adapters 200, the plurality of adapters 200 may correspond to a plurality of signal lines 101, and a gap a2 may be provided between each two adjacent signal lines 101 in the plurality of signal lines 101 of the probe plate 100, so that the two adjacent signal lines 101 can be in a weak coupling state, thereby ensuring the signal transmission quality in each signal line 101. For example, the width of the gap a2 between two adjacent signal lines 101 may be greater than the line width of any of the two signal lines 101. For example, the line widths of the respective signal lines 101 in the probe plate 100 may be equal, and the width of the gap a2 between each two adjacent signal lines 101 may be three times the line width of the signal line 101.

[0060] In summary, the embodiment of the present application provides a probe assembly, which may include: a probe board, and at least one adapter. By setting an adapter in the probe assembly for connecting to a test device, a signal pad is set in the probe board, and the signal pad is set at one end of the probe board away from the adapter, and the two ends of the signal line in the probe board can be electrically connected to the transfer conductor and the signal pad in the adapter, respectively. In this way, when the signal transmission quality in the circuit board to be tested is tested by the probe assembly, the signal pad in the probe board can be welded to the corresponding pad to be tested in the circuit board to be tested, which can avoid the undesirable phenomenon that the probe is damaged (for example, bent and deformed) when touching the circuit board, thereby reducing the test cost of the probe assembly, and can effectively simplify the operator's operation process.

[0061] An embodiment of the present application also provides a testing device, which may include: a device body (not shown in the figure) and a probe assembly 000, wherein the device body can be detachably connected to the end of the adapter 200 facing away from the probe board 100, and the device body can be electrically connected to the adapter conductor 201, and the probe assembly 000 can be any of the probe assemblies given in the above embodiments.

[0062] Optional, please refer to Fig.12 and Fig.13 , Fig.12 This is a schematic diagram of the structure of two probe assemblies aligned with each other provided in an embodiment of the present application. Fig.13 yes Fig.12 Side view of two probe assemblies shown. The number of probe assemblies 000 in the test equipment can be two, wherein, before the test equipment tests the circuit board to be tested, the signal pads 102 in the two probe assemblies 000 are used for docking. In this way, the needle alignment data of the probe assembly 000 can be obtained through the test equipment. Then, the two probe assemblies 000 are separated, and the signal pads 102 in the two probe assemblies 000 are respectively welded to the signal sending end and the signal receiving end of the circuit board to be tested, and the data of the probe + circuit board to be tested is obtained through the test equipment, and finally the original data of the circuit board to be tested can be obtained by de-embedding. In this way, compared with the current "flying line" test method, the present application can accurately obtain the accurate data of the circuit board to be tested without introducing other interference data.

[0063] The present application also provides a test system, please refer to Fig.14 , Fig.14 It is a structural schematic diagram of a test system provided in an embodiment of the present application. The test system may include: a test device and a circuit board 01 to be tested. The test device can be used to measure the signal transmission quality of the board-level link on the circuit board 01 to be tested. The signal pads of the two probe assemblies 000 in the test device can be respectively welded to the signal sending end and the signal receiving end in the circuit board 01 to be tested. It should be noted that, for the case where the signal sending end and the signal receiving end of the circuit board 01 to be tested are located on the same side of the circuit board 01 to be tested or on the two sides of the circuit board 01 to be tested that are relatively arranged, the two probe assemblies 000 provided in the present application are respectively welded to the signal sending end and the signal receiving end of the circuit board to be tested to achieve measurement.

[0064] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0065] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A probe assembly, characterized in that: include: A probe card (100), and at least one adapter (200); The adapter (200) has a adapter conductor (201); One end of the probe card (100) is fixedly connected to the adapter (200), and the probe card (100) has: at least one signal line (101) and at least one signal pad (102), the at least one signal pad (102) is distributed at one end of the probe card (100) away from the adapter (200), the first end of the at least one signal line (101) is electrically connected to the transfer conductor (201) in the at least one adapter (200) in a one-to-one correspondence, and the second end of the at least one signal line (101) is electrically connected to the at least one signal pad (102) in a one-to-one correspondence; The at least one signal pad (102) is used for corresponding welding with at least one pad to be tested in the circuit board to be tested.

2. The probe assembly according to claim 1, characterized in that: The probe card (100) also has: at least one first positioning pad (103), the at least one first positioning pad (103) corresponds one-to-one to the at least one signal pad (102), the at least one first positioning pad (103) and the at least one signal pad (102) are respectively located on two opposite side surfaces of the probe card (100), and the orthographic projection of each first positioning pad (103) on a reference plane parallel to the probe card (100) overlaps with the orthographic projection of the corresponding signal pad (102) on the reference plane.

3. The probe assembly according to claim 2, characterized in that: The first positioning pads (103) are insulated from the signal pads (102), and the outer boundary of the orthographic projection of each of the first positioning pads (103) on the reference surface coincides with the outer boundary of the orthographic projection of the corresponding signal pad (102) on the reference surface.

4. The probe assembly according to claim 1, characterized in that: The probe card (100) has at least one wire channel (104) corresponding to at least one signal line (101) inside, the end of the probe card (100) close to the adapter (200) has a first via hole (105) connected to the corresponding wire channel, and the end of the probe card (100) away from the adapter (200) has a second via hole (106) connected to the corresponding wire channel (104); At least a portion of the signal line (101) is located in the corresponding wire channel (104), the first end of the signal line (101) is electrically connected to the transfer conductor (201) in the corresponding transfer seat (200) through the first via hole (105), and the second end of the signal line (101) is electrically connected to the corresponding signal pad (102) through the second via hole (106).

5. The probe assembly according to claim 4, characterized in that: The probe board (100) has a supporting groove (107) connected to the first via hole (105) at the end thereof close to the transfer seat (200), and a supporting pad (108) fixed in the supporting groove (107), wherein the supporting pad (108) is located between the first end of the signal line (101) and the transfer conductor (201), and the two side surfaces of the supporting pad (108) are respectively fixedly connected to the first end of the signal line (101) and one end of the transfer conductor (201).

6. The probe assembly according to claim 1, characterized in that: The probe plate (100) comprises: a plurality of functional medium plates (A) stacked together, wherein the plurality of functional medium plates (A) are divided into: a first functional medium plate (A1) and a second functional medium plate (A2) located at the outermost sides, and at least one third functional medium plate (A3) located between the first functional medium plate (A1) and the second functional medium plate (A2), wherein the at least one third functional medium plate (A3) has a plurality of through holes (a1).

7. The probe assembly according to claim 6, characterized in that: The plurality of functional dielectric plates (A) include: a ground plate (100a) and a conductor plate (100b), wherein the ground plate (100a) and the conductor plate (100b) are insulated from each other, the conductor plate (100b) has at least one signal line (101), and the end of the ground plate (100a) facing away from the adapter (200) has two ground pads (B1), and the at least one signal pad (102) is distributed between the two ground pads (B1).

8. The probe assembly according to any one of claims 1 to 7, characterized in that: The probe card (100) comprises: a probe card body (100c), and an adapter plate body (100d) fixedly connected to one end of the probe card body (100c), the end of the adapter plate body (100d) facing away from the probe card body (100c) is fixedly connected to the at least one adapter seat (200), and the end of the probe card body (100c) facing away from the adapter plate body (100d) has the at least one signal pad (102).

9. The probe assembly according to claim 8, characterized in that: When the probe assembly includes a plurality of the adapters (200), the plurality of adapters (200) are arranged in sequence around the extension direction of a preset arc (Y), and the center of the preset arc (Y) is distributed toward the probe card body (100c).

10. A testing device, characterized in that: include: A device body (001) and a probe assembly (000), wherein the device body (001) is detachably connected to the end of the adapter (200) facing away from the probe board (100), and the device body (001) is electrically connected to the adapter conductor (201), and the probe assembly (000) is the probe assembly described in any one of claims 1 to 9.

11. The testing device according to claim 10, characterized in that The number of the probe assemblies (000) in the test device is two; Before the testing device tests the circuit board to be tested, the signal pads (102) in the two probe assemblies (000) are used for docking.

Images