Groove type cleaning device and semiconductor machine table

Abstract

The utility model provides a groove type cleaning device and a semiconductor machine table. The tank type cleaning device comprises a tank body; the support frame is arranged in the tank body in a lifting manner and is used for driving a wafer to be cleaned to move; the sensor is arranged at a preset detection position, so that the detection range of the sensor covers a wafer cleaning position; when the support frame drives the wafer to be cleaned to move to the wafer cleaning position, the sensor outputs a timing starting signal; and the starting signal input end of the timer is connected with the signal output end of the sensor. According to the groove type cleaning device, the timing accuracy and consistency of the preset cleaning time can be ensured, and the wafer cleaning quality is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a tank cleaning device and a semiconductor machine. Background Art

[0002] Tank cleaning equipment is a type of cleaning equipment used in semiconductor manufacturing, mainly used to remove contaminants from the surface of wafers. It usually consists of a tank filled with chemical cleaning liquid, in which the wafer is immersed and cleaned to ensure that its surface reaches the required cleanliness.

[0003] In the context of cleaning, the “process time” of a tank cleaning system refers to the total time it takes from the start of a wafer cleaning process to the completion of the cleaning process and preparation for the next step in the process. This time can include the time the wafer is immersed in the chemical liquid, the agitation or ultrasonic cleaning time, and any preset processing cycles.

[0004] However, traditional tank cleaning equipment does not accurately monitor process time. The actual process time is longer than the time set in the machine menu, which affects the cleaning quality.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0006] Based on this, the present application provides a tank cleaning device and a semiconductor machine, which can ensure the accuracy and consistency of the preset cleaning time timing and effectively improve the wafer cleaning quality.

[0007] According to some embodiments, the present application provides a tank cleaning device, comprising:

[0008] Tank body;

[0009] A support frame is movably disposed in the tank body and is used to drive the wafer to be cleaned to move;

[0010] A sensor is arranged at a preset detection position so that the detection range of the sensor covers the wafer cleaning position; when the support frame drives the wafer to be cleaned to move to the wafer cleaning position, the sensor outputs a timing start signal;

[0011] A timer, wherein a start signal input terminal of the timer is connected to a signal output terminal of the sensor.

[0012] In some embodiments, the sensor includes an infrared transmitter and an infrared receiver disposed on both sides of the tank body in a horizontal direction; the wafer cleaning position is located in an area between the infrared transmitter and the infrared receiver;

[0013] Wherein, the infrared receiver is connected to the timer for receiving and detecting the detection infrared light emitted from the infrared transmitter; when the wafer to be cleaned is moved to the wafer cleaning position, the infrared receiver responds to the change of the detection infrared light and sends the timing start signal to the timer.

[0014] In some embodiments, the tank cleaning device further includes a cover plate and a first motor, one side of the cover plate is rotatably mounted on the opening side of the tank body, and the first motor is used to drive the cover plate to rotate;

[0015] The start signal input terminal of the first motor is connected to the preparation signal output terminal of the timer.

[0016] In some embodiments, the tank cleaning device further comprises a contact sensor disposed at the opening of the tank body, wherein the contact sensor is configured to: output a cover closing confirmation signal when the cover is closed to seal the opening of the tank body;

[0017] The start signal input terminal of the timer is also connected to the signal output terminal of the contact sensor.

[0018] In some embodiments, the tank-type cleaning device further includes a cleaning chamber and a second motor, wherein the cleaning chamber is arranged in the tank body so as to be liftable, and the second motor is used to drive the cleaning chamber to be lifted and lowered;

[0019] The support frame is installed in the cleaning chamber, and is used for rising and falling in the trough body under the drive of the cleaning chamber, so as to drive the wafer to be cleaned to move.

[0020] In some embodiments, the support frame comprises:

[0021] A fixing part, fixedly mounted on the bottom surface of the cleaning chamber;

[0022] At least one pair of supporting parts is arranged oppositely at two ends of the fixing part.

[0023] In some embodiments, the cleaning chamber comprises a dilute hydrofluoric acid cleaning chamber.

[0024] In some embodiments, the tank body comprises a transparent tank body.

[0025] In some embodiments, the cell body comprises a quartz cell body.

[0026] According to some embodiments, the present application further provides a semiconductor machine, including a machine body, and a tank cleaning device provided by any of the aforementioned embodiments, wherein the tank cleaning device is disposed on the machine body.

[0027] The tank cleaning device and semiconductor machine provided by the present application can / at least have the following advantages:

[0028] In the embodiment of the present application, a sensor is set to detect whether the wafer to be cleaned reaches the wafer cleaning position, so that when the wafer to be cleaned reaches the preset wafer cleaning position, a timing start signal can be output from the signal output end of the sensor. The timing start signal is transmitted to the start signal input end of the timer to accurately instruct the timer to start the preset cleaning time, thereby ensuring the accuracy of the preset cleaning time.

[0029] For example, when the embodiment of the present application is used to perform a cleaning operation with a preset cleaning time, the actual cleaning time of the trough cleaning device for cleaning the wafer to be cleaned can be compared with the preset cleaning time specified in the machine menu, and the two can achieve a high degree of consistency, thereby effectively improving the wafer cleaning quality.

[0030] Other advantages, objectives and features of the present application will be described in the following description to some extent, and will be apparent to those skilled in the art based on the following examination and research, or can be taught from the practice of the present invention to some extent. The objectives and other advantages of the present invention can be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0032] Figure 1 is a schematic diagram of the structure of a tank cleaning device provided in some embodiments of the present application;

[0033] Figure 2 This is a schematic diagram of the structure of the tank cleaning device after cleaning is completed provided in some embodiments of the present application.

[0034] Reference numerals:

[0035] 11. trough body; 12. support frame; 121. fixing part; 122. support part; 131. infrared transmitter; 132. infrared receiver; 14. cover plate; 15. cleaning chamber; 20. wafer to be cleaned. DETAILED DESCRIPTION

[0036] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0038] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0039] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] In the context of cleaning, the “process time” of a tank cleaning system refers to the total time it takes from the start of a wafer cleaning process to the completion of the cleaning process and preparation for the next step in the process. This time can include the time the wafer is immersed in the chemical liquid, the agitation or ultrasonic cleaning time, and any preset processing cycles.

[0041] However, traditional tank cleaning equipment does not accurately monitor process time. The actual process time is longer than the time set in the machine menu, which affects the cleaning quality.

[0042] In view of the shortcomings of the related art, the present application provides a tank cleaning device and a semiconductor machine, which can ensure the accuracy and consistency of the preset cleaning time and effectively improve the wafer cleaning quality. The details will be described in the subsequent embodiments.

[0043] According to some embodiments, the present application provides a tank cleaning device. Figure 1 The tank-type cleaning device may specifically include a tank body 11, a support frame 12, a sensor and a timer.

[0044] The support frame 12 is movably arranged in the tank body 11, and is used to drive the wafer 20 to be cleaned to move. The sensor can be set at a preset detection position so that the sensor's detection range covers the wafer cleaning position; when the support frame 12 drives the wafer 20 to be cleaned to move to the wafer cleaning position, the sensor outputs a timing start signal. The start signal input end of the timer is connected to the signal output end of the sensor, and can be used to start the preset cleaning time timing when the timing start signal is received.

[0045] It should be noted that, in the present application, the wafer cleaning position refers to a preset position in a tank cleaning device; the wafer to be cleaned is placed at the wafer cleaning position so that the tank cleaning device cleans it. For example, Figure 1 As shown, when the support frame 12 is lowered to the bottom of the tank body 11, the wafer 20 to be cleaned will be driven to the wafer cleaning position. The preset cleaning time refers to the "process time" set by the tank cleaning device, that is, the total time required from the start of wafer cleaning to the completion of cleaning and preparation for the next process; illustratively, the preset cleaning time can be determined by setting the machine menu.

[0046] In the embodiment of the present application, a sensor is set to detect whether the wafer 20 to be cleaned reaches the wafer cleaning position, so that when the wafer 20 to be cleaned reaches the preset wafer cleaning position, a timing start signal can be output from the signal output end of the sensor. The timing start signal is transmitted to the start signal input end of the timer to accurately instruct the timer to start the preset cleaning time, thereby ensuring the accuracy of the preset cleaning time.

[0047] The timing mode currently used in traditional tank cleaning equipment is usually: first, the cleaning chamber (Tan k) door panel is opened, and the wafer to be cleaned is loaded into the bottom of the Tank with the lifting structure (LFT). After the LFT reaches the bottom, the machine checks the LFT position and the door panel switch, and starts the cleaning time timing after confirmation. After the wafer is cleaned, wait for the LID to turn on and the LFT rises again. Since the machine needs to check the LFT position and the door panel switch after the LFT reaches the bottom, and after the wafer is cleaned, it still needs to wait for the LID to turn on and the LFT to rise again, the timing of the process time will be longer than the actual cleaning time, and the actual process time is inaccurate.

[0048] By using the embodiment of the present application to perform a cleaning operation with a preset cleaning time, interference factors such as the time for checking the LFT position and the door panel switch after the LFT reaches the bottom, and waiting for the LID to turn on and the LFT to rise again can be eliminated during the timer counting the preset cleaning time. This allows the actual cleaning time of the trough cleaning device for cleaning the wafer 20 to be cleaned to achieve a high degree of consistency with the preset cleaning time specified in the machine menu, thereby effectively improving the wafer cleaning quality.

[0049] It can be understood that in the embodiments of the present application, the timer can be implemented using commercially available products.

[0050] Meanwhile, the embodiment of the present application does not specifically limit the type of sensor used in the tank cleaning device. As an example, the sensor may include but is not limited to an infrared sensor.

[0051] See also Figure 1 The sensor, such as an infrared sensor, may include an infrared transmitter 131 and an infrared receiver 132 arranged horizontally on both sides of the tank 11. At this time, the preset detection position set by the sensor should be able to make the wafer cleaning position fall in the area between the infrared transmitter 131 and the infrared receiver 132.

[0052] The infrared receiver 132 is connected to the timer and can be used to receive and detect the detection infrared light emitted from the infrared transmitter 131. Figure 1 As shown, when the wafer 20 to be cleaned is moved to the wafer cleaning position, the wafer 20 to be cleaned will enter the area between the infrared transmitter 131 and the infrared receiver 132, and the infrared receiver 132 will sense the change of the detected infrared light, thereby triggering a corresponding response and sending a timing start signal to the timer. The infrared transmitter 131 and the infrared receiver 132 can be commercially available products, and the infrared receiver 132 uses a product that senses the change of infrared light and outputs a sensing signal to the outside, and the output end of the infrared receiver 132 is connected to the input end of the timer, triggering the timer to start timing, so the sensing signal input to the timer by the infrared receiver 132 is defined here as the timing start signal.

[0053] For example, Figure 1 As shown, the tank-type cleaning device may be provided with a tank body 11 with a hollow interior, and the tank body 11 is hollow inside and has an opening at the top.

[0054] Please continue reading Figure 1 In some embodiments, the tank cleaning device further comprises a cover plate 14 and a first motor. One side of the cover plate 14 is rotatably mounted on the opening side of the tank body 11, and the first motor is used to drive the cover plate 14 to rotate.

[0055] The embodiment of the present application does not specifically limit the form of the cover plate 14. As an example, Figure 2 As shown, the cover plate 14 may include a pair of sub-cover plates and motor units corresponding to the sub-cover plates. One side of each sub-cover plate is rotatably mounted on one side of the opening of the slot body 11, and the motor unit corresponding to the sub-cover plate is used to drive the sub-cover plate to rotate. The two sub-cover plates are respectively mounted on the opposite sides of the opening of the slot body 11, so that the opening of the slot body 11 can be closed together.

[0056] In some embodiments, the start signal input terminal of the first motor is connected to the ready signal output terminal of the timer.

[0057] In the above embodiment, the timer can also be used to output a ready signal from the ready signal output terminal before the preset cleaning time ends. The ready signal can be used to start the first motor so that the first motor drives the cover plate 14 to rotate open to open the opening of the trough body 11.

[0058] In this way, since the tank-type cleaning device is provided with a rotatable cover plate 14 at the opening of the tank body 11, the cover plate 14 can open the opening of the tank body 11 when receiving the preparation signal, and the preparation signal is output before the end of the preset cleaning time, so the cover plate 14 can be opened before the wafer cleaning is completed. Opening the cover plate 14 in advance can avoid the need to wait for the cover plate 14 to open after the wafer cleaning is completed, which effectively improves the wafer cleaning efficiency. Therefore, the use of the above-mentioned tank-type cleaning device can help improve the wafer output per unit hour (wafer per hour, referred to as WPH) of the machine.

[0059] In some embodiments, the tank cleaning device may further include a contact sensor disposed at the opening of the tank body 11. When the cover 14 is closed to seal the opening of the tank body 11, the contact sensor may output a cover closing confirmation signal.

[0060] In the above embodiment, the start signal input end of the timer is also connected to the signal output end of the contact sensor. In this way, the timer can start the preset cleaning time timing when it receives the timing start signal and the cover closing confirmation signal. In this embodiment, the timer can be implemented using a commercially available product. The start signal input end of the timer is connected to the infrared receiver 132 and the contact sensor, and the output end is connected to the start signal input end of the first motor corresponding to the cover.

[0061] In the above embodiment, by setting the cover closing confirmation signal, it is ensured that the opening of the tank body 11 is completely closed before cleaning begins, thereby preventing leakage of the cleaning liquid or intrusion of external contaminants, and effectively improving the reliability and consistency of the wafer cleaning process.

[0062] Please continue reading Figure 1 In some embodiments, the tank cleaning device further includes a cleaning chamber 15 and a second motor. Specifically, the cleaning chamber 15 is arranged in the tank body 11 in a manner that it can be raised and lowered, and the second motor is used to drive the cleaning chamber 15 to be raised and lowered. Based on this, the support frame 12 can be installed in the cleaning chamber 15, so that the support frame 12 can be raised and lowered in the tank body 11 driven by the cleaning chamber 15 to drive the wafer 20 to be cleaned to move.

[0063] Please continue reading Figure 1 In some embodiments, the support frame 12 may specifically include a fixing portion 121 and at least one pair of supporting portions 122 .

[0064] The fixing portion 121 is fixedly mounted on the bottom surface of the cleaning chamber 15 ; and two supporting portions 122 of the pair of supporting portions 122 are disposed at two ends of the fixing portion 121 opposite to each other.

[0065] Traditional workbench designs usually have a large contact area and a large risk of particle contamination. The support frame 12 in the above embodiment uses a pair of support parts 122 arranged opposite to each other to support the wafer 20 to be cleaned, which can reduce the direct contact area with the wafer 20 to be cleaned, reduce the deposition and adhesion of particles, thereby improving the cleanliness of the surface of the wafer 20 to be cleaned and avoiding the introduction of new contaminants.

[0066] In some embodiments, the cleaning chamber 15 includes a dilute hydrofluoric acid (DHF) cleaning chamber, also called a DHF Tank.

[0067] In the embodiment of the present application, the diluted hydrofluoric acid cleaning chamber means that the cleaning solution in the cleaning chamber 15 includes hydrofluoric acid with a concentration of 0.5% to 5%. This concentration range can effectively remove the oxide layer on the surface of the wafer without excessively corroding the substrate.

[0068] The embodiment of the present application does not specifically limit the duration of the preset cleaning time range, and the preset cleaning time range can be adaptively set according to the type of wafer 20 to be cleaned.

[0069] In some embodiments, the preset cleaning time range may include 1 minute to 5 minutes; for example, when using diluted hydrofluoric acid to clean oxides, the preset cleaning time can be set to 1 minute to 3 minutes. For example, when using buffered hydrogen fluoride solution to clean oxides, the cleaning time depends on the layer thickness and process requirements, and the preset cleaning time can be set to 1 minute to 5 minutes.

[0070] In some embodiments, the tank body 11 may include a transparent tank body. In this way, it is not only convenient for the infrared sensor to effectively monitor whether the wafer to be cleaned is moved to the wafer cleaning position, but also allows the operator to observe the cleaning status inside the tank body 11 in real time, which is convenient for monitoring and adjusting the cleaning process, thereby helping to improve the controllability of the cleaning operation.

[0071] The embodiment of the present application does not specifically limit the material of the tank body 11. As an example, the tank body 11 may include but is not limited to a quartz tank body. Quartz has extremely high corrosion resistance to most cleaning solutions (such as diluted hydrofluoric acid, hydrochloric acid, hydrogen peroxide, ammonia water, etc.), so quartz can be used in various cleaning liquids for a long time without being damaged, thereby ensuring the durability of the tank body 11 and the stability of the cleaning process. In addition, the impurity content of quartz itself is very low, which is beneficial to reduce the contamination of the wafer 20 to be cleaned during the cleaning process, and effectively improve the reliability of the cleaning effect.

[0072] Those skilled in the art will understand that Figure 1 and Figure 2 The structure shown is only a schematic diagram of a part of the structure related to the present application. Other components that may be provided in the tank cleaning device, such as a spray assembly installed in the tank body 11, a pipe and a brush for injecting cleaning solution, etc., are not the focus of the present application and will not be further described here.

[0073] According to some embodiments, the present application further provides a semiconductor machine.

[0074] The semiconductor machine may specifically include a machine body and a tank cleaning device provided in any of the above embodiments, wherein the tank cleaning device is disposed on the machine body. Therefore, the technical effects that can be achieved by the above tank cleaning device can also be achieved by the semiconductor machine, and will not be described in detail here.

[0075] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A tank cleaning device, characterized in that: include: Tank body; A support frame is movably disposed in the tank body and is used to drive the wafer to be cleaned to move; A sensor is arranged at a preset detection position so that the detection range of the sensor covers the wafer cleaning position; when the support frame drives the wafer to be cleaned to move to the wafer cleaning position, the sensor outputs a timing start signal; A timer, wherein a start signal input terminal of the timer is connected to a signal output terminal of the sensor.

2. The tank cleaning device according to claim 1, characterized in that: The sensor comprises an infrared transmitter and an infrared receiver which are arranged on both sides of the tank body in a horizontal direction; the wafer cleaning position is located in the area between the infrared transmitter and the infrared receiver; Wherein, the infrared receiver is connected to the timer for receiving and detecting the detection infrared light emitted from the infrared transmitter; when the wafer to be cleaned is moved to the wafer cleaning position, the infrared receiver responds to the change of the detection infrared light and sends the timing start signal to the timer.

3. The tank cleaning device according to claim 1, characterized in that: The tank cleaning device further comprises a cover plate and a first motor, one side of the cover plate is rotatably mounted on the opening side of the tank body, and the first motor is used to drive the cover plate to rotate; The start signal input terminal of the first motor is connected to the preparation signal output terminal of the timer.

4. The tank cleaning device according to claim 3, characterized in that: It also includes a contact sensor disposed at the opening of the slot body, wherein the contact sensor is configured to: output a cover closing confirmation signal when the cover is closed to seal the opening of the slot body; The start signal input terminal of the timer is also connected to the signal output terminal of the contact sensor.

5. The tank cleaning device according to claim 1, characterized in that: The tank-type cleaning device further comprises a cleaning chamber and a second motor, wherein the cleaning chamber is arranged in the tank body so as to be liftable, and the second motor is used to drive the cleaning chamber to be lifted and lowered; The support frame is installed in the cleaning chamber, and is used for rising and falling in the trough body under the drive of the cleaning chamber, so as to drive the wafer to be cleaned to move.

6. The tank cleaning device according to claim 5, characterized in that: The support frame comprises: A fixing part, fixedly mounted on the bottom surface of the cleaning chamber; At least one pair of supporting parts is arranged oppositely at two ends of the fixing part.

7. The tank cleaning device according to claim 5, characterized in that: The cleaning chamber includes a diluted hydrofluoric acid cleaning chamber.

8. The tank cleaning device according to claim 2, characterized in that: The tank body comprises a transparent tank body.

9. The tank cleaning device according to claim 2, characterized in that: The cell body comprises a quartz cell body.

10. A semiconductor machine, characterized in that: Including the machine body, and The tank cleaning device according to any one of claims 1 to 9, wherein the tank cleaning device is arranged on the machine body.

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