Wafer reconstruction jig and wafer fan-out packaging equipment

Abstract

The embodiment of the utility model provides a wafer reconstruction jig and wafer fan-out packaging equipment, and relates to the technical field of semiconductor packaging. The wafer reconstruction jig comprises a base. The base is provided with a wafer placing area, and the wafer placing area is used for bearing wafers. The base is provided with a positioning identification part, and the positioning identification part is located at the periphery of the wafer placement area. And the positioning identification part is provided with a groove or a positioning column. As the positioning identification part is arranged on the base of the wafer reconstruction jig, when a chip is mounted on the base, mounting positioning can be performed by taking the positioning identification part as a reference, thereby being beneficial to improving the positioning precision of chip mounting and improving the packaging quality of a reconstructed wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, and in particular to a wafer reconstruction fixture and a wafer fan-out packaging device. Background Art

[0002] The fan-out wafer level package (FOWLP) structure is widely used in the semiconductor industry. The general process uses a single chip cut from the wafer, then packaged into a carrier, reconstructed wafer and then wired again, while adding output pins. The main advantages are high-density integration, small package product size, superior product performance, and fast signal transmission frequency. When the existing chip is mounted on the carrier, there is a problem of chip mounting offset. Utility Model Content

[0003] The purpose of the utility model is to provide a wafer reconstruction jig and a wafer fan-out packaging device, which can improve the positioning accuracy when the chip is mounted on the wafer reconstruction jig, thereby facilitating the improvement of the chip mounting accuracy and the packaging quality.

[0004] The embodiment of the utility model is achieved as follows:

[0005] In a first aspect, the utility model provides a wafer reconstruction jig, comprising a base;

[0006] The base is provided with a wafer placement area, and the wafer placement area is used to carry the wafer;

[0007] The base is provided with a positioning identification part, and the positioning identification part is located at the periphery of the wafer placement area;

[0008] The positioning identification part is provided with a groove or a positioning column.

[0009] In an optional embodiment, the positioning identification portion is arranged on the edge of the base, and the groove is simultaneously opened on the upper surface and the outer peripheral surface of the base to form a notch shape.

[0010] In an optional embodiment, the cross-section of the groove is semicircular.

[0011] In an optional embodiment, the wafer placement area includes a carrier protruding from the base, and the carrier is used for mounting wafers.

[0012] In an optional embodiment, the wafer placement area includes a receiving groove opened on the base, and the receiving groove is used for mounting the wafer.

[0013] In an optional embodiment, the depth of the receiving groove is consistent with the thickness of the reconstructed wafer after plastic packaging.

[0014] In an optional embodiment, the groove is located at the outer periphery of the receiving groove, and the groove is not connected to the receiving groove.

[0015] In an optional embodiment, it further includes an upper cover, wherein the upper cover and the base are detachably connected, and the upper cover and the base together form a cavity for molding a plastic package body for reconstructing the wafer.

[0016] In an optional embodiment, the upper cover is provided with a positioning block, and the positioning block is plug-fitted into the groove.

[0017] In a second aspect, the utility model provides a wafer fan-out packaging device, including a glue coating machine, a chip placement machine and a wafer reconstruction jig as described in any one of the aforementioned embodiments.

[0018] The beneficial effects of the embodiments of the utility model include:

[0019] The wafer reconstruction jig provided by the embodiment of the utility model is provided with a positioning identification part on the base, and the positioning identification part is located at the periphery. When mounting the chip to the wafer placement area of ​​the base, the positioning can be performed through the positioning identification part, thereby improving the chip placement positioning accuracy and reducing the positioning offset. In addition, a groove or a positioning column is provided on the positioning identification part, which can be used to improve the connection sealing between the upper cover and the base when the upper cover is molded together, and has a blocking effect on the plastic package body to prevent the problem of high difficulty in debonding caused by overflow of the plastic package body. Reduce the difficulty of debonding and improve packaging efficiency and packaging quality.

[0020] The wafer fan-out packaging equipment provided by the embodiment of the utility model includes a glue coating machine, a chip mounter and the above-mentioned wafer reconstruction jig. It is beneficial to improve the chip placement positioning accuracy and reduce positioning deviation. It reduces the difficulty of debonding and improves packaging efficiency and packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the first structure of a wafer reconstruction jig provided by an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the structure of a wafer reconstruction jig provided in an embodiment of the utility model forming a plastic package on a carrier;

[0024] Figure 3A schematic diagram of the structure of a reconstructed wafer formed by a wafer reconstruction jig provided in an embodiment of the utility model;

[0025] Figure 4 A second structural schematic diagram of the wafer reconstruction jig provided in an embodiment of the utility model.

[0026] Icons: 100 - base; 110 - positioning identification part; 111 - upper surface; 113 - peripheral surface; 120 - carrier; 130 - receiving groove; 200 - reconstructed wafer; 210 - chip; 220 - plastic package. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] The fan-out wafer level package (FOWLP) structure is widely used in the semiconductor industry. The general process is to cut a single chip from the wafer, then package it into a carrier, reconstruct the wafer, and then perform the wiring process again, while adding output pins. The main advantages are high-density integration, small package product size, superior product performance, and fast signal transmission frequency. When the existing chip is mounted on the carrier, there is a problem of chip mounting offset. In addition, the existing reconstruction fixture has a planar design and the plastic seal overflows to the edge of the fixture during plastic sealing, resulting in contamination of the adhesive layer, making it difficult to debond, which increases the difficulty of debonding.

[0034] In order to overcome at least one defect in the prior art, this embodiment proposes a wafer reconstruction jig, which is conducive to improving the chip placement positioning accuracy, reducing positioning deviation, reducing the difficulty of debonding, and improving packaging efficiency and packaging quality.

[0035] Please refer to Figures 1 to 4 , this embodiment provides a wafer reconstruction jig, including a base 100. A wafer placement area is provided on the base 100, and the wafer placement area is used to carry the wafer. A positioning identification part 110 is provided on the base 100, and the positioning identification part 110 is located at the periphery of the wafer placement area. A groove or a positioning column is provided on the positioning identification part 110. Since the positioning identification part 110 is provided on the base 100 of the wafer reconstruction jig, when the chip 210 is mounted on the base 100, the positioning identification part 110 can be used as a reference for mounting and positioning, which is beneficial to improve the positioning accuracy of the chip 210 mounting, reduce the positioning deviation, and improve the packaging quality of the reconstructed wafer 200.

[0036] The positioning identification part 110 is arranged at the edge of the base 100, and the groove is simultaneously provided on the upper surface 111 and the outer peripheral surface 113 of the base 100, forming a notch shape. In other words, the notch of the groove simultaneously passes through the upper surface 111 and the outer peripheral surface 113. It can be understood that the base 100 includes an upper surface 111, a lower surface and an outer peripheral surface 113 which are arranged relatively. The outer peripheral surface 113 is used to connect the upper surface 111 and the lower surface. The upper surface 111 and the lower surface of the base 100 in this embodiment are respectively circular, and the outer peripheral surface 113 is a circular surface.

[0037] In this embodiment, the groove is located at the edge of the upper surface 111. There are multiple grooves, which are evenly spaced along the circumferential direction. Optionally, six grooves are provided. The cross section of the groove is semicircular. There is a certain interval between the groove and the wafer placement area, which will not affect the plastic packaging of the chip 210.

[0038] Optionally, in some other embodiments, the cross-section of the groove may be rectangular, triangular, elliptical, circular, diamond-shaped, fan-shaped or any other shape, which is not specifically limited here.

[0039] Optionally, the wafer placement area includes a carrier 120 protruding from the base 100, and the carrier 120 is used to mount the chip 210. A plurality of chips 210 are plastic-encapsulated on the carrier 120 to form a reconstructed wafer 200. The carrier 120 can be designed to be rectangular, circular, elliptical or diamond-shaped. A plurality of chips 210 are distributed in an array on the carrier 120. The carrier 120 is higher than the upper surface 111 of the base 100. When plastic-encapsulating, an upper cover (not shown) is covered on the base 100. The plastic encapsulation body 220 covers the chip 210 on the carrier 120, and the plastic encapsulation body 220 is formed by plastic encapsulation between the upper cover and the base 100. The upper cover and the base 100 can play the role of closing the upper mold and the lower mold to achieve the plastic encapsulation molding of the plastic encapsulation body 220.

[0040] It should be noted that the base 100 is provided with a groove or a positioning column. Taking the groove provided on the base 100 as an example, the groove can play a positioning role in the chip 210 mounting process, thereby improving the positioning accuracy of the chip 210 mounting. At the same time, when the upper cover and the base 100 are covered in the plastic packaging process, the base 100 and the upper cover are plugged and matched through the groove, which improves the sealing of the connection between the base 100 and the upper cover and prevents the plastic packaging body 220 from overflowing to the edge of the base 100. This can reduce the difficulty of subsequent debonding, improve the debonding efficiency, and improve the overall packaging efficiency and packaging quality.

[0041] Optional, combined Figure 4In some other embodiments, the wafer placement area includes a receiving groove 130 provided on the base 100, and the receiving groove 130 is used to mount the chip 210. A plurality of chips 210 are plastic-encapsulated in the receiving groove 130 to form a reconstructed wafer 200. In this embodiment, the receiving groove 130 is provided on the upper surface 111 of the base 100, and the notch of the receiving groove 130 is flush with the upper surface 111.

[0042] Optionally, the depth of the receiving groove 130 is consistent with the thickness of the plastic-sealed reconstructed wafer 200. In this way, the thickness of the reconstructed wafer 200 can be controlled through the base 100, so that the thickness of the reconstructed wafers 200 produced in batches is consistent, thereby improving the packaging quality.

[0043] Optionally, the groove is located at the periphery of the receiving groove 130, and the groove is not connected to the receiving groove 130. There is a certain interval between the edge of the receiving groove 130 and the edge of the groove, so that the groove is not connected to the receiving groove 130. In this way, when plastic sealing is performed, the plastic sealing body 220 in the receiving groove 130 can be prevented from overflowing into the groove, and the edge of the base 100 can be prevented from being contaminated by the plastic sealing body 220. This is conducive to reducing the difficulty of debonding and improving the efficiency of debonding.

[0044] Optionally, the wafer reconstruction jig further includes an upper cover, which is detachably connected to the base 100, and the upper cover and the base 100 together form a cavity for molding the plastic package 220 of the reconstructed wafer 200. The upper cover and the base 100 can play the role of closing the upper mold and the lower mold to achieve the plastic molding of the plastic package 220.

[0045] Optionally, the upper cover is provided with a positioning block, and the positioning block and the groove are plugged and matched. The position of the positioning block corresponds to the position of the groove one by one. The cross-sectional shape and size of the positioning block respectively match the shape and size of the groove.

[0046] Optionally, the positioning block is conical or wedge-shaped, and the cross-sectional area of ​​the end of the positioning block away from the upper cover is smaller than the cross-sectional area of ​​the end of the positioning block connected to the upper cover. This arrangement has a certain guiding effect during plug-in matching, and can make the positioning block of the upper cover conveniently and smoothly inserted into the groove.

[0047] Optionally, the positioning block is coated with a sealing layer. The material of the sealing layer includes but is not limited to an elastic material or a sealing film. The elastic material is not limited to rubber or foam, etc., and is not specifically limited here. By providing a sealing layer, the sealing performance of the connection between the positioning block and the groove can be improved. This is conducive to preventing the plastic package 220 from overflowing and contaminating the fixture, and reducing the difficulty of later debonding.

[0048] It is easy to understand that in this embodiment, the base 100 is provided with a groove, and the upper cover is provided with a positioning block to achieve plug-in cooperation between the two. In some embodiments, a positioning block can be provided on the base 100, and a groove can be provided on the upper cover to achieve plug-in cooperation between the two. Alternatively, a groove and a positioning block are provided on the base 100, respectively, and a positioning block and a groove are provided on the upper cover, respectively. The positioning block on the base 100 is inserted into the groove of the upper cover, and the positioning block of the upper cover is inserted into the groove of the base 100. No specific limitation is made here.

[0049] The wafer reconstruction jig proposed in this embodiment is used as follows:

[0050] First, a layer of bonding glue is coated on the bottom of the carrier 120 or the receiving groove 130 .

[0051] The single chip 210 cut from the wafer is mounted on the carrier 120 or the receiving groove 130 of the base 100. During the mounting process, the groove on the base 100 plays a role in mounting positioning and can be used as a positioning identification point for positioning, thereby improving the accuracy of the mounting and reducing the deviation of the mounting position.

[0052] After the chip is attached, the plastic package 220 is poured into the carrier 120 or the receiving groove 130. The upper cover and the base 100 are covered and molded, and the plastic package 220 is formed after curing. At this time, the plastic package 220 covers the chip 210 to form a reconstructed wafer 200 composed of multiple chips 210.

[0053] The upper cover is removed, and debonding is performed by ultraviolet irradiation or other methods. The reconstructed wafer 200 and the base 100 are separated, and the preparation of the reconstructed wafer 200 is completed.

[0054] The utility model provides a wafer fan-out packaging device, comprising a glue coating machine, a chip mounter, and a wafer reconstruction jig as in any one of the above-mentioned embodiments. The glue coating machine is used to apply bonding glue on a base 100. The chip mounter is used to mount a chip 210 on the base 100, and then form a reconstructed wafer 200 after plastic sealing.

[0055] In summary, the wafer reconstruction jig and wafer fan-out packaging equipment provided by the embodiments of the present invention have the following beneficial effects, including:

[0056] The wafer reconstruction jig provided by the embodiment of the utility model is provided with a positioning identification part 110 on the base 100, and the positioning identification part 110 is located at the periphery. When mounting the chip 210 to the wafer placement area of ​​the base 100, the positioning can be performed by the positioning identification part 110, thereby improving the chip positioning accuracy of the chip 210 and reducing the positioning deviation. In addition, a groove or a positioning column is provided on the positioning identification part 110, which can be used to improve the connection sealing of the upper cover and the base 100 when the upper cover is molded, and has a blocking effect on the plastic package 220 to prevent the problem of high difficulty in debonding caused by the overflow of the plastic package 220. Reduce the difficulty of debonding and improve packaging efficiency and packaging quality.

[0057] The wafer fan-out packaging equipment provided by the embodiment of the utility model includes a glue coating machine, a chip mounter and the above-mentioned wafer reconstruction jig, which is beneficial to improve the chip placement positioning accuracy of the chip 210 and reduce the positioning offset, reduce the difficulty of debonding, and improve the packaging efficiency and packaging quality.

[0058] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer reconstruction jig, characterized in that: Including base; The base is provided with a wafer placement area, and the wafer placement area is used to carry the wafer; The base is provided with a positioning identification part, and the positioning identification part is located at the periphery of the wafer placement area; The positioning identification part is provided with a groove or a positioning column.

2. The wafer reconstruction jig according to claim 1, characterized in that: The positioning identification part is arranged on the edge of the base, and the groove is simultaneously opened on the upper surface and the outer peripheral surface of the base to form a notch shape.

3. The wafer reconstruction jig according to claim 1, characterized in that: The cross section of the groove is semicircular.

4. The wafer reconstruction jig according to claim 1, characterized in that: The wafer placement area includes a carrier protruding from the base, and the carrier is used for mounting wafers.

5. The wafer reconstruction jig according to claim 1, characterized in that: The wafer placement area includes a receiving groove opened on the base, and the receiving groove is used for mounting the wafer.

6. The wafer reconstruction jig according to claim 5, characterized in that: The depth of the containing groove is consistent with the thickness of the reconstructed wafer after plastic packaging.

7. The wafer reconstruction jig according to claim 5, characterized in that: The groove is located at the outer periphery of the containing groove, and the groove is not connected with the containing groove.

8. The wafer reconstruction jig according to claim 1, characterized in that: It also includes an upper cover, which is detachably connected to the base, and the upper cover and the base together form a cavity for molding a plastic package of a reconstructed wafer.

9. The wafer reconstruction jig according to claim 8, characterized in that: The upper cover is provided with a positioning block, and the positioning block is plug-fitted with the groove.

10. A wafer fan-out packaging device, characterized in that: It comprises a glue coating machine, a chip placement machine and a wafer reconstruction jig as described in any one of claims 1 to 9.

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