Chip baking jig

Abstract

The utility model discloses a chip baking jig which comprises a main frame and a plurality of wafer storage plates, multiple layers of supporting frames are sequentially arranged in the main frame in different height directions, the wafer storage plates are matched with the supporting frames so as to be suitable for being placed on the tops of the supporting frames, the wafer storage plates are provided with containing grooves suitable for containing wafers, and the containing grooves are used for containing the wafers. Wherein the sizes of the accommodating grooves in each layer of wafer storage plate are the same, and the sizes of the accommodating grooves in different layers of wafer storage plates are different. According to the chip baking jig, the wafer can be suitable for being placed on the supporting frame at any height position, process parameters can be verified according to the baking degrees of the wafers of different heights, the influence of human intervention on the baking process is reduced, meanwhile, the wafers are placed through the containing grooves, and the baking efficiency is improved. The maximum wafer storage number of each wafer storage plate can be determined, the influence of human intervention on the wafer baking number can be reduced, and the baking efficiency is easier to control.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing equipment, in particular to a chip baking fixture. Background Art

[0002] There are multiple baking processes in the chip manufacturing process. Due to the limited space in the oven, it is difficult to place the chips in the traditional oven. In addition, it is not easy to control the number of chips baked each time. The number of chips baked often depends on the proficiency of the operator, making it difficult to control the baking efficiency. Utility Model Content

[0003] The embodiment of the present application provides a chip baking jig, which can make chip placement easier, while the chip placement position is relatively fixed and the number of chips placed is easy to control.

[0004] An embodiment of the present application provides a chip baking jig, comprising a main frame and a wafer storage plate, wherein multiple layers of support frames are sequentially arranged in the main frame along different height directions, the wafer storage plate cooperates with the support frames so as to be suitable for being placed on the top of the support frames, and the wafer storage plate is provided with a receiving groove suitable for placing wafers, wherein the size of the receiving groove on each layer of the wafer storage plate is the same, and the size of the receiving groove on different layers of the wafer storage plates is different.

[0005] In one possible implementation, the main frame is provided with an opening on one side suitable for taking and placing the wafer storage plate, and the support frame is symmetrically provided with guide steps on both sides facing the opening, so that a guide slide is formed between the guide steps on both sides and the support frame, and the wafer storage plate slides in cooperation with the slide.

[0006] In a possible implementation, a support structure is provided at the bottom of the receiving groove near the outer circumference to support the wafer, and the inner circle of the support structure is a hollow structure.

[0007] In a possible implementation manner, the support structure is implemented as an annular boss, or the support structure is composed of a plurality of support protrusions uniformly distributed along the annular direction.

[0008] In one possible implementation, an inert gas protection tube is installed on the outer wall of the main frame on one side of the opening. The inert gas protection tube is distributed in an S shape and has a gas outlet on the side close to the main frame to reduce contamination of the wafers stored on the wafer storage plate on each layer of the support frame.

[0009] In a possible implementation, the inert gas protection tube is a nitrogen protection tube.

[0010] Beneficial effect: Compared with the prior art, the chip baking jig provided by the present application arranges multiple layers of support frames on the main frame along different height directions, and wafer storage plates are placed on the support frames. At the same time, the size of the receiving grooves on each layer of wafer storage plates is the same, and the sizes of the receiving grooves on different layers of wafer storage plates are different, so that wafers of different sizes can be placed on the corresponding wafer storage plates. At the same time, the wafer storage plates are suitable for being placed on support frames at any height position. The process parameters can be verified according to the baking degree of wafers at different heights, which can reduce the impact of human intervention on the baking process. At the same time, by placing wafers through the receiving grooves, the maximum number of wafers stored on each wafer storage plate can be determined, which can reduce the impact of human intervention on the number of wafers baked, and make it easier to control the baking efficiency.

[0011] These and other purposes, features and advantages of the present invention are fully reflected in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A schematic structural diagram of a chip baking fixture of the present application is shown.

[0013] Figure 2 A schematic structural diagram of a chip baking fixture of the present application is shown.

[0014] Figure 3 Shows this application Figure 2 Schematic diagram of the enlarged structure of part A. DETAILED DESCRIPTION

[0015] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0016] Those skilled in the art should understand that, in the disclosure of the specification, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0017] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0018] refer to Figures 1 to 3 The embodiment of the present application provides a chip baking fixture, including a main frame 10 and a wafer storage plate 20, wherein multiple layers of support frames 11 are sequentially arranged in the main frame 10 along different height directions, and the wafer storage plate 20 cooperates with the support frame 11 to be suitable for being placed on the top of the support frame 11, so that the wafer storage plate 20 can be placed on the support frame 11 at any height position, and the wafer storage plate 20 is provided with a receiving groove 201 suitable for placing wafers, wherein the size of the receiving groove 201 on each layer of the wafer storage plate 20 is the same, and the size of the receiving groove 201 on different layers of the wafer storage plate 20 is different, so that wafers of different sizes can be placed on the wafer storage plate 20 with corresponding receiving grooves 201, so that The chip baking fixture is suitable for baking wafers of various specifications and has a wide range of applications. In addition, since each wafer storage plate 20 is matched with the support frame 11, the height position of the wafer storage plate 20 on which the wafers are placed can be flexibly adjusted, and then the corresponding baking process parameters can be verified according to the baking degree of wafers of different heights, which can reduce the impact of human intervention on the baking process. In addition, the wafer storage plates 20 are all provided with accommodating grooves 201 to carry wafers, so that the maximum storage quantity (i.e., the baking quantity) of each wafer storage plate 20 is fixed, which can reduce the impact of human placement on the baking quantity of wafers, and thus it is easier to control the baking efficiency. The wafers can be placed on the wafer storage plate 20 and then transferred to the support frame 11 together, avoiding the inconvenience caused by the small space for placing wafers, and the operation is simple.

[0019] The sizes of the receiving grooves 201 on the same wafer storage plate 20 are the same, so that wafers of the same specifications can be baked with the same process parameters. In addition, this wafer storage plate 20 can be placed on a support frame 11 of any height, and the sizes of the receiving grooves 201 on different wafer storage plates 20 are different, making the chip baking fixture suitable for baking wafers of different specifications.

[0020] In one embodiment, the main frame 10 is provided with an opening 101 on one side for taking and placing the wafer storage plate 20, and the support frame 11 is symmetrically provided with guide steps 12 on both sides opposite to the opening 101, so that a guide slide 102 is formed between the guide steps 12 on both sides and the support frame 11, and the wafer storage plate 20 is slidably matched with the slide 102. In this way, based on the matching relationship between the wafer storage plate 20 and the slide 102, the wafer storage plate 20 can be placed on the support frame 11 of the main frame 10 more quickly and accurately, or the wafer storage plate 20 can be taken out from the support frame 11, and the wafer storage plate 20 is not easy to shake or deflect during the taking and placing process.

[0021] In one embodiment, a support structure 21 is provided at the bottom of the receiving groove 201 near the outer circumference to support the wafer, and the inner circle of the support structure 21 is a hollow structure 22, so that the wafer can be baked as comprehensively as possible while supporting the wafer.

[0022] Further preferably, the support structure 21 is implemented as an annular boss, or the support structure 21 is composed of a plurality of support protrusions uniformly distributed along the circumferential direction.

[0023] In one embodiment, an inert gas protection tube 13 is installed on the outer wall of the main frame 10 on one side of the opening. At the same time, the inert gas protection tube 13 is distributed in an S shape, and a gas outlet 103 is opened on the side close to the main frame 10 to reduce the contamination of the wafers stored on the wafer storage plate 20 on each layer of the support frame 11, such as reducing the contamination of particles on the chip.

[0024] In one embodiment, the inert gas protection tube 13 is a nitrogen protection tube.

[0025] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A chip baking jig, characterized in that: It includes a main frame and multiple wafer storage plates. Multiple layers of support frames are arranged in sequence along different height directions in the main frame. The wafer storage plates cooperate with the support frames to be placed on the top of the support frames. The wafer storage plates are provided with receiving grooves suitable for placing wafers, wherein the sizes of the receiving grooves on each layer of the wafer storage plates are the same, and the sizes of the receiving grooves on different layers of the wafer storage plates are different.

2. The chip baking jig according to claim 1, characterized in that: The main frame is provided with an opening on one side suitable for taking and placing the wafer storage plate, and the support frame is symmetrically provided with guide steps on both sides facing the opening, so that a guide slide is formed between the guide steps on both sides and the support frame, and the wafer storage plate slides in cooperation with the slide.

3. The chip baking jig according to claim 1, characterized in that: A support structure is arranged at the bottom of the receiving groove near the outer circumference to support the wafer, and the inner circle of the support structure is a hollow structure.

4. The chip baking jig according to claim 3, characterized in that: The support structure is implemented as an annular boss, or the support structure is composed of a plurality of support protrusions uniformly distributed along the circumferential direction.

5. The chip baking jig according to claim 2, characterized in that: An inert gas protection tube is installed on the outer wall of the main frame on one side of the opening. The inert gas protection tube is distributed in an S shape and a gas outlet is opened on the side close to the main frame to reduce contamination of the wafers stored on the wafer storage plate on each layer of the support frame.

6. The chip baking jig according to claim 5, characterized in that: The inert gas protection tube is a nitrogen protection tube.

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