Carrier plate assembly and wafer carrier

Abstract

The utility model relates to a carrying disc assembly and a wafer carrying table. The loading disc assembly comprises a measuring loading disc, the measuring loading disc comprises a first main body and a first accommodating part, and the first accommodating part is arranged in the center of the first main body and used for accommodating a first wafer when the wafer measuring device measures the first wafer; and the extension part comprises at least one extension carrying disc, the extension carrying disc comprises a second main body and a second accommodating part, the extension part is used for being embedded in the first accommodating part when the wafer measuring device measures a second wafer, the second accommodating part is used for accommodating the second wafer, and the size of the second wafer is smaller than that of the first wafer. According to the loading disc assembly, the first accommodating part of the measurement loading disc is used for accommodating the wafer when the large-size wafer is measured, and accommodating the expansion loading disc when the small-size wafer is measured. The accommodation of small-size wafers is realized through the expansion carrying disc; and the applicability of the carrying disc assembly to wafers of various sizes is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a carrier plate assembly and a wafer carrier. Background Art

[0002] The wafer stage plays a key role in wafer inspection equipment. It not only supports and protects the wafer, but also ensures its stability and precise positioning, thereby achieving efficient and accurate wafer inspection and analysis, which is crucial to quality control and technological development of the semiconductor manufacturing process.

[0003] With the development of semiconductor technology, the diversification of wafer sizes has made the design and manufacture of wafer stages and carriers more challenging. Traditional wafer inspection equipment requires different carriers for wafers of different sizes. Due to the inflexibility of the carrier design, the wafer measurement equipment can only adapt to the size of a specific wafer. In order to meet the measurement needs of wafers of various sizes, it is necessary to design wafer carriers of various sizes, and disassemble and install the entire stage when the wafer size changes; not only is the operation process complicated and cumbersome, limiting the efficiency of wafer measurement, but the installation and adjustment of the carrier also increases labor costs.

[0004] There is no effective solution to the problem of poor applicability of wafer measurement equipment in related technologies. Utility Model Content

[0005] Based on this, it is necessary to provide a carrier assembly and a wafer stage to address the problem of low efficiency in wafer equipment detection.

[0006] The present disclosure provides a carrier assembly for a wafer measuring device, the carrier assembly comprising: a measuring carrier, the measuring carrier comprising a first main body and a first accommodating portion, the first accommodating portion being arranged in the center of the first main body and being used to accommodate the first wafer when the wafer measuring device measures the first wafer; an extension portion, the extension portion comprising at least one extended carrier, the extended carrier comprising a second main body and a second accommodating portion, the extension portion being embedded in the first accommodating portion when the wafer measuring device measures the second wafer, the second accommodating portion being used to accommodate the second wafer, the size of the second wafer being smaller than the first wafer.

[0007] The carrier assembly provided in the embodiment of the present disclosure accommodates the wafer when measuring a large-sized wafer and accommodates the extended carrier when measuring a small-sized wafer through the first accommodating portion of the measuring carrier. The extended carrier allows the accommodation of small-sized wafers, thereby improving the applicability of the carrier assembly to wafers of various sizes.

[0008] In one embodiment, the extension portion includes at least two stacked extension carriers of different sizes, wherein the second body of the extension carrier located on the bottom layer is placed in the first accommodating portion of the measuring carrier; the second accommodating portion of the extension carrier located on the top layer is used to accommodate a second wafer; and of two adjacent extension carriers, the second body of the extension carrier located on the upper layer can be detachably placed in the second accommodating portion of the extension carrier located on the lower layer.

[0009] In one embodiment, the second body is annular, and the second accommodating portion is a step portion extending from the second body toward the center of the circle.

[0010] In one embodiment, the second body is disc-shaped, the second accommodation portion is a circular groove, and the axis of the first body is colinear with the axis of the first accommodation portion.

[0011] In one embodiment, the extended carrier further includes a fixing portion, and the fixing portion is disposed on the second body along an edge of the second accommodating portion.

[0012] In one embodiment, the fixing portion includes a detachably connected mounting base and a mounting knob, the mounting base is arranged on the second body along the edge of the second accommodating portion, and the projection of the mounting knob in the vertical direction at least partially covers the second accommodating portion.

[0013] In one embodiment, the extended carrier includes at least three fixing portions, and the fixing portions are arranged around the second accommodating portion at an angle of 120°.

[0014] In one embodiment, the measuring carrier further comprises a calibration piece accommodating portion, and the calibration piece accommodating portion is arranged at an outer edge of the measuring carrier along a radial direction of the measuring carrier.

[0015] In one embodiment, the calibration element includes a plane mirror and / or a standard wafer.

[0016] The disclosed embodiments further provide a wafer stage, which includes a wafer carrier assembly as described in any of the above embodiments.

[0017] The above-mentioned carrier assembly includes a measuring carrier and an extension part. The first accommodating part of the measuring carrier accommodates the wafer when measuring a large-sized wafer, and accommodates the extended carrier when measuring a small-sized wafer. The extended carrier can accommodate small-sized wafers, thereby improving the applicability of the carrier assembly to wafers of various sizes.

[0018] The extended carriers are arranged in a stacked manner, which expands the number and size of the extended carriers that can be accommodated in the measurement carrier, and improves the high availability of the carrier assembly.

[0019] The setting of the fixing part realizes the fixing and limiting of the extended carrier, ensures the stability of the extended carrier during the wafer measurement process, and correspondingly improves the accuracy of wafer measurement.

[0020] The calibration component is arranged on the wafer carrier, which simplifies the steps of taking and placing the calibration component during the wafer measurement process and improves the wafer detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a carrier assembly according to an embodiment of the present application;

[0022] Figure 2 This is an exploded schematic diagram of a carrier assembly according to an embodiment of the present application;

[0023] Figure 3 A schematic diagram of an extended carrier according to an embodiment of the present application;

[0024] Figure 4 is a schematic diagram of an extended carrier according to another embodiment of the present application;

[0025] Figure 5 is a schematic diagram of a fixing part according to an embodiment of the present application;

[0026] Figure 6 A schematic diagram of a measuring carrier according to an embodiment of the present application;

[0027] Figure 7 Schematic diagram of a carrier assembly according to a preferred embodiment of the present application.

[0028] Explanation of the accompanying drawings: 10, measuring carrier; 11, first main body; 12, first accommodating portion; 20, extension portion; 21, extension carrier; 22, second main body; 23, second accommodating portion; 24, side opening; 30, fixing portion; 31, mounting base; 32, mounting knob; 40, calibration component accommodating portion. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0035] In the field of semiconductor manufacturing, in order to ensure the quality of wafer production, it is necessary to measure the surface morphology and thickness of the produced wafers. In related technologies, the commonly used measurement method is optical measurement, such as irradiating the wafer surface with a light source, and optical equipment such as an interferometer receives the light reflected by the wafer to obtain a reflection spectrum, and then determines the morphology or thickness of the measured wafer by analyzing the spectrum. With the development of semiconductor manufacturing technology, the size of wafers is becoming more and more diversified. In order to meet the measurement needs of wafers of different sizes, a wafer measurement solution that can adapt to a variety of wafer sizes is urgently needed.

[0036] See also Figures 1 to 7 In the utility model, a carrier assembly is provided for a wafer measuring device, and the wafer measuring device includes an optical element for wafer measurement, a manipulator for moving the wafer, and a measuring stage. The carrier assembly is a set of carriers for carrying wafers of different sizes, which can be connected to the transfer mechanism of the measuring stage, and the wafer is transported to the measuring position under the control of a computer program. The carrier assembly includes a measuring carrier 10 and an extension part 20, wherein the measuring carrier 10 includes a first main body 11 and a first accommodating part 12, and the first accommodating part 12 is arranged in the center of the first main body 11, and is used to accommodate the first wafer when the wafer measuring device measures the first wafer. The measuring carrier 10 refers to the carrier with the largest size in the carrier assembly, which is used to realize the functions of accommodating wafers and supporting the extension part 20. The first accommodating part 12 is arranged in the center of the measuring carrier 10. When performing wafer measurement, the wafer is placed in the first accommodating part 12 manually or by a manipulator. When the measuring carrier 10 is moved to the preset measuring position, the wafer measuring device is started to measure the wafer.

[0037] The extension part 20 includes at least one extension carrier 21, and the extension carrier 21 includes a second main body 22 and a second accommodating part 23. The extension part 20 is embedded in the first accommodating part 12 when the wafer measuring device measures the second wafer, and the second accommodating part 23 is used to accommodate the second wafer, and the size of the second wafer is smaller than the first wafer. Specifically, the extension carrier 21 is used to carry small-sized wafers. Small size refers to a size that is smaller than the size of the adapted size of the measuring carrier 10. In the measurement process of multi-sized wafers, due to the small size of some wafers, the position of these small-sized wafers in the wafer accommodating groove of the measuring carrier 10 may be offset during the measurement process, and the measurement result measured at the offset position is difficult to meet the wafer measurement wafer to meet the wafer measurement accuracy requirements. By designing the extension carrier 21, small-sized wafers can be accommodated by the extension carrier 21. By using the measuring carrier 10 and the extension part 20 in combination, the applicability of the carrier in the wafer measuring device is improved, and the measurement efficiency of the multi-sized wafer measurement process is improved.

[0038] In one embodiment, see Figure 3 The extension part 20 includes at least two stacked extension carriers 21 of different sizes, wherein the second body 22 of the extension carrier 21 located at the bottom layer is placed in the first accommodating part 12 of the measuring carrier 10; the second accommodating part 23 of the extension carrier 21 located at the top layer is used to accommodate the second wafer. The sizes of the first accommodating part 12 and the second accommodating part 23 are adapted to the size of the wafer to be tested, the size of the first accommodating part 12 is larger than the size of the second accommodating part 23, and the size of the first accommodating part 12 includes at least one of 4 inches, 5 inches, 6 inches, 8 inches and 12 inches. Preferably, the size of the first accommodating part 12 is 8 inches. The size of the second accommodating part 23 includes at least one of 2 inches, 4 inches, 5 inches, 6 inches and 8 inches.

[0039] In two adjacent extended carriers 21, the second main body 22 of the extended carrier 21 located at the upper layer can be detachably placed in the second accommodating portion 23 of the extended carrier 21 located at the lower layer. As the number of extended carriers 21 included in the extended portion 20 increases, the number of second accommodating portions 23 of the corresponding extended carriers 21 also increases accordingly. The size of the second accommodating portion 23 is adapted to the size of the wafer to be measured. By adopting the stacking arrangement of this embodiment, the detection of wafers of different sizes can be achieved through the combination of extended carriers 21 of different sizes.

[0040] In one embodiment, the second body 22 is annular, and the second accommodating portion 23 is a step portion extending from the second body 22 toward the center of the circle. When the second body 22 is annular, the extended carrier 21 is a hollow piece. The annular shape can reduce the weight of the second body 22, thereby reducing the weight of the entire extension portion 20 and the carrier assembly, reducing the driving resistance of the wafer stage, and reducing the overall power consumption of the wafer measurement device. In addition, the annular design can avoid large-area contact between the carrier and the wafer surface, reduce wafer surface contamination, and improve detection accuracy and product yield.

[0041] In one embodiment, the second body 22 is disc-shaped, the second receiving portion 23 is a circular groove, and the axis of the first body 11 is collinear with the axis of the first receiving portion 12. When the second body 22 is disc-shaped, the extended carrier 21 is a sheet-like member. The second receiving portion 23 of the lower extended carrier 21 is in full contact with the second body 22 of the adjacent upper extended carrier 21, and the stability of supporting the second body 22 is better. At the same time, since the axis of the first body 11 is collinear with the axis of the first receiving portion 12, the stable installation of the extended portion 20 on the measuring carrier 10 can be ensured.

[0042] In one embodiment, see Figure 4 , the first accommodating portion 12 and the second accommodating portion 23 also include a side opening 24. The width of the side opening 24 is the same as the width of the robot for taking and placing wafers in the wafer measuring device. The robot can freely move in and out of the tray through the side opening 24 to take and place wafers. For example, the robot is inserted into the gap between the wafers in the wafer loading box, moves upward a certain distance, and then retracts, and the wafer can be lifted and taken out, and then the robot moves to transport the wafer to the first accommodating portion 12 or the second accommodating portion 23, and the robot retracts from the side opening 24, and the wafer is retained under the limiting effect of the first accommodating portion 12 or the second accommodating portion 23. After the wafer is measured, the robot enters from the side opening 24, lifts the wafer and moves it to the unloading box. In some other embodiments, the height of the side opening 24 is greater than or equal to the depth of the first accommodating portion 12 or the second accommodating portion 23. By providing the side opening 24, the wafer transportation efficiency is improved, the safety during the wafer placement process is improved, and the product yield is improved.

[0043] In one embodiment, the extended carrier 21 further includes a fixing portion 30, and the fixing portion 30 is disposed on the second main body 22 along the edge of the second accommodating portion 23. The number of the fixing portions 30 is one or more. The connection between the fixing portion 30 and the extended carrier 21 may be an integral molding method or a detachable connection method such as a threaded connection or a plug-in connection. The fixing portion 30 may limit the extended carrier 21 within the area enclosed by it, thereby improving the stability of the installation of the extended carrier 21. Preferably, the fixing portion 30 may also be disposed on the measuring carrier 10 at the same time, so as to enhance the stability of the entire extended portion 20 on the measuring carrier 10 and improve the wafer measurement accuracy.

[0044] In one embodiment, the fixing portion 30 includes a detachably connected mounting base 31 and a mounting knob 32 , the mounting base 31 is disposed on the second body 22 along the edge of the second accommodating portion 23 , and the projection of the mounting knob 32 in the vertical direction at least partially covers the second accommodating portion 23 .

[0045] In one of the embodiments, the fixing portion 30 includes a detachably connected mounting base 31 and a mounting knob 32, the mounting base 31 is arranged on the second body 22 along the edge of the second accommodating portion 23, and the projection of the mounting knob 32 in the vertical direction at least partially covers the second accommodating portion 23. The design of the mounting knob 32 can realize convenient and quick installation and removal of the extended carrier 21, and the tightened knob can ensure the firm connection of the carrier. The protruding part of the knob in the horizontal direction can limit the wafer in the vertical direction, avoid the collision between the wafer and the wafer measuring device caused by improper movement of the manipulator, and improve the safety of the measurement process. In one of the embodiments, the extended carrier 21 includes at least three fixing portions 30, and the fixing portions 30 are arranged around the second accommodating portion 23 at an angle of 120°.

[0046] In one embodiment, see Figure 6 The measuring carrier 10 further comprises a calibration component accommodating portion 40, and the standard component accommodating portion is arranged at the outer edge of the measuring carrier 10 along the radial direction of the measuring carrier 10. In one embodiment, the calibration component comprises a plane reflector and / or a standard wafer.

[0047] Before wafer measurement, in order to eliminate the interference of environmental factors and mechanical errors, it is necessary to calibrate the equipment with the help of calibration parts such as plane mirrors, standards, etc. However, the calibration process in the prior art requires placing the calibration part on the carrier, starting the wafer measurement device to calibrate the equipment, and after the calibration is completed, removing the calibration tooling, replacing the wafer to be measured for wafer measurement. This pick-and-place process reduces the measurement efficiency of the wafer, and the casting case requires special storage equipment for storage, which increases the material cost. In this embodiment, the calibration part is placed in the calibration part accommodating portion 40 of the measuring carrier 10. The connection method between the accommodating portion and the measuring carrier 10 can be one-piece molding, or it can be other disassembly methods such as threads, buckles, plug-ins, etc. By providing the calibration part accommodating portion 40 on the measuring carrier 10 and placing the calibration part accommodating portion 40 in the calibration part accommodating portion 40, the storage method of the calibration part is optimized. When calibrating the equipment, it is only necessary to move the calibration component on the carrier to the calibration position, thereby simplifying the calibration process.

[0048] In one preferred embodiment, see Figure 7 , discloses a carrier assembly, including a measuring carrier 10 and an extension part 20, the extension part 20 including a plurality of extension carriers 21, wherein the measuring carrier 10 is an 8-inch wafer carrier, and the extension carrier 21 includes 3 groups, which are 6-inch wafer carriers, 4-inch wafer carriers and 2-inch wafer carriers from the bottom to the top, and the centers of the wafer carriers of each size are located on the same axis. Three groups of fixing parts 30 are arranged on the measuring carrier 10 and each extension carrier 21, and the fixing part 30 includes a mounting base 31 and a mounting knob 32. The fixing part 30 is used to fix and limit the wafer carrier surrounded therein, wherein the 8-inch wafer carrier also includes a calibration part accommodating part 40.

[0049] Based on the carrier assembly of the preferred embodiment, when a 2-inch wafer needs to be inspected, the 2-inch wafer carrier is fixed to the 4-inch wafer carrier through three groups of fixing parts 30, the 4-inch wafer carrier is fixed to the 6-inch wafer carrier through three groups of fixing parts 30, and the 6-inch wafer carrier is fixed to the 8-inch wafer carrier through three groups of mounting knobs 32; the 8-inch wafer carrier is placed on the measuring stage, and wafer measurement of the 2-inch wafer can be performed.

[0050] When it is necessary to inspect a 4-inch wafer, the three mounting knobs 32 on the 4-inch wafer carrier are rotated to remove the 2-inch wafer placement table. At this time, the combination state of the remaining carrier components can accommodate the 4-inch wafer. It can be understood that when the 4-inch wafer carrier and the 6-inch wafer carrier are removed in turn, the measurement of the 6-inch wafer and the 8-inch wafer can be gradually achieved.

[0051] The above-mentioned carrier assembly includes a measuring carrier 10 and an extension part 20. The first accommodating part 12 of the measuring carrier 10 is used to accommodate wafers in a large-size wafer measurement chamber, and the extension part 20 is used to accommodate wafers in a small-size wafer measurement chamber. The extension part 20 includes at least one extension carrier 21, and the small-size wafer can be accommodated by the extension carrier 21, thereby improving the applicability of the carrier assembly to wafers of various sizes.

[0052] By providing the side opening 24 in the wafer accommodating portion, a robot for transferring wafers can take and place wafers on the carrier, thereby improving the wafer transportation efficiency and reducing the loss during the wafer transportation process.

[0053] The setting of the fixing part 30 realizes the fixing and limiting of the extended carrier 21, ensures the stability of the extended carrier 21 during the wafer measurement process, and correspondingly improves the accuracy of wafer measurement.

[0054] The calibration component receiving portion 40 is provided on the wafer carrier, which simplifies the steps of taking and placing the calibration component during the wafer measurement process and improves the wafer detection efficiency.

[0055] The utility model also provides a wafer carrier, which includes a carrier plate assembly as described in any of the above embodiments.

[0056] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A carrier assembly for a wafer measuring device, characterized in that: The carrier assembly comprises: A measuring carrier (10), the measuring carrier (10) comprising a first main body (11) and a first accommodating portion (12), the first accommodating portion (12) being arranged at the center of the first main body (11) and being used for accommodating the first wafer when a wafer measuring device measures the first wafer; An extension part (20), the extension part (20) comprising at least one extension carrier (21), the extension carrier (21) comprising a second main body (22) and a second accommodating part (23), the extension part (20) being used to be embedded in the first accommodating part (12) when the wafer measuring device measures a second wafer, the second accommodating part (23) being used to accommodate the second wafer, the second wafer being smaller in size than the first wafer.

2. The carrier assembly according to claim 1, characterized in that: The expansion portion (20) comprises at least two stacked expansion carriers (21) of different sizes, wherein: The second main body (22) of the extended carrier (21) located at the bottom layer is placed in the first accommodating portion (12) of the measuring carrier (10); The second accommodating portion (23) of the extended carrier (21) located at the uppermost layer is used for accommodating the second wafer; In two adjacent extended carriers (21), the second main body (22) of the extended carrier (21) located at the upper layer can be detachably placed in the second accommodating portion (23) of the extended carrier (21) located at the lower layer.

3. The carrier assembly according to claim 1, characterized in that: The second main body (22) is annular, and the second accommodating portion (23) is a step portion extending from the second main body (22) toward the center of the circle.

4. The carrier assembly according to claim 1, characterized in that: The second main body (22) is disc-shaped, the second accommodating portion (23) is a circular groove, and the axis of the first main body (11) is colinear with the axis of the first accommodating portion (12).

5. The carrier assembly according to claim 1, characterized in that: The extended carrier (21) further comprises a fixing portion (30), wherein the fixing portion (30) is arranged on the second main body (22) along an edge of the second accommodating portion (23).

6. The carrier assembly according to claim 5, characterized in that: The fixing portion (30) comprises a detachably connected mounting base (31) and a mounting knob (32); the mounting base (31) is arranged on the second body (22) along the edge of the second accommodating portion (23); and the projection of the mounting knob (32) in the vertical direction at least partially covers the second accommodating portion (23).

7. The carrier assembly according to claim 5, characterized in that: The extended carrier (21) comprises at least three fixing portions (30), and the fixing portions (30) are arranged around the second accommodating portion (23) at an angle of 120°.

8. The carrier assembly according to claim 1, characterized in that: The measuring carrier (10) further comprises a calibration piece accommodating portion (40), wherein the calibration piece accommodating portion (40) is arranged at the outer edge of the measuring carrier (10) along the radial direction of the measuring carrier (10).

9. The carrier assembly according to claim 8, characterized in that: Calibration parts include plane mirrors and / or standard wafers.

10. A wafer stage, characterized in that: The wafer carrier comprises the carrier plate assembly according to any one of claims 1 to 9.

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