Package substrate assembly of press-molded product

Abstract

The utility model provides a packaging substrate assembly of a compression molded product, comprising a packaging substrate body which comprises a base body layer, a conductor layer and a solder mask layer which are arranged in sequence; the groove structure is arranged on the packaging substrate body, the base body layer forms the groove bottom of the groove structure, the groove structure divides the conductor layer into a first sub-conductor layer and a second sub-conductor layer, and the groove structure divides the solder mask layer into a first sub-solder mask layer and a second sub-solder mask layer; the first concave part is arranged on the packaging substrate body and is positioned at the side part of the groove structure; and the marking structure is arranged in the first concave part. According to the technical scheme, the problem that the mark point cannot be accurately identified in the subsequent process due to the fact that the mark point is easily covered by the glue solution in the related technology is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging substrates, in particular to a packaging substrate assembly of a die-cast product. Background Art

[0002] During the production of the package substrate, in order to facilitate the identification and positioning of the package substrate, marking points are generally set on the package substrate. After the LED chip is installed on the package substrate body, glue needs to be injected on the package substrate.

[0003] In the related art, when injecting glue, a die can be used to cooperate with the packaging substrate, and the glue liquid can flow into the gap between the die and the packaging substrate. When the glue liquid flows into the gap between the die and the packaging substrate, the glue liquid may flow out of the die and may flow to the area where the marking point is located, and then may cover the marking point set on the process edge. If the marking point is covered, the marking point may not be accurately identified in the subsequent process. Utility Model Content

[0004] The main purpose of the utility model is to provide a packaging substrate assembly for a die-cast product, so as to solve the problem in the related art that the glue easily covers the marking points, thereby causing the subsequent process to be unable to accurately identify the marking points.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a packaging substrate assembly of a die-cast product, including: a packaging substrate body, the packaging substrate body including a base layer, a conductor layer and a solder resist layer arranged in sequence; a groove structure, arranged on the packaging substrate body, the base layer forming a groove bottom of the groove structure, the groove structure separating the conductor layer into a first sub-conductor layer and a second sub-conductor layer, the groove structure separating the solder resist layer into a first sub-solder resist layer and a second sub-solder resist layer; a first recess, arranged on the packaging substrate body and located on the side of the recess structure; a marking structure, the marking structure being arranged in the first recess.

[0006] Furthermore, the package substrate assembly of the compression molded product further includes a second recess, which is located at a side of the groove structure and is disposed adjacent to the first recess.

[0007] Further, a cross-sectional area of ​​the first recess is smaller than a cross-sectional area of ​​the second recess.

[0008] Furthermore, there are multiple first recesses and multiple second recesses, and at least one second recess is disposed between any two first recesses.

[0009] Furthermore, the distance between the first recess and the groove structure is greater than or equal to the distance between the second recess and the groove structure.

[0010] Furthermore, upper surfaces of the first sub-solder resist layer and the second sub-solder resist layer are arranged flush with each other.

[0011] Furthermore, the marking structure includes a first bar block and a second bar block, and the middle parts of the first bar block and the second bar block are cross-arranged.

[0012] Furthermore, there are multiple marking structures, the first recesses include multiple marking structures, and the multiple marking structures are arranged in a one-to-one correspondence with the multiple first recesses.

[0013] Furthermore, the packaging substrate assembly of the molded product also includes an LED chip and a colloid layer. The LED chip includes multiple LED chips, and the multiple LED chip arrays are arranged on the packaging substrate body. The colloid layer is arranged above the first sub-solder mask layer, and there is a gap between the side of the colloid layer facing the groove structure and the groove structure.

[0014] Furthermore, the width of the groove structure is between 0.2 mm and 3 mm.

[0015] By applying the technical solution of the utility model, the package substrate body includes a base layer, a conductor layer and a solder resist layer, and the base layer, the conductor layer and the solder resist layer are arranged in sequence. A groove structure is arranged on the package substrate body, and the base layer forms the groove bottom of the groove structure. The groove structure divides the conductor layer into a first sub-conductor layer and a second sub-conductor layer, and divides the solder resist layer into a first sub-solder resist layer and a second sub-solder resist layer. A first recess is also arranged on the package substrate body, and the first recess is located at the side of the recess structure. A marking structure is arranged in the first recess. Through the above arrangement, the base layer can support the conductor layer and the solder resist layer. The base layer forms the groove bottom of the groove structure, that is, the conductor layer and the solder resist layer are not arranged in the groove structure. The first recess provides an avoidance space for the marking structure, which is convenient for identifying the package substrate assembly of the die-cast product according to the position of the marking structure. The groove structure can block the glue flowing out of the solder mask layer, reduce the probability of the glue passing over the groove structure and entering the first concave part, and further reduce the probability of the glue contaminating the marking structure, thereby avoiding affecting the recognition and alignment of the package substrate assembly of the die-cast product in the subsequent process. Therefore, the technical solution of the present application effectively solves the problem in the related art that the glue easily covers the marking point, thereby causing the subsequent process to be unable to accurately recognize the marking point. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 A three-dimensional structural schematic diagram of an embodiment of a package substrate assembly of a compression molded product according to the utility model is shown;

[0018] Figure 2 Shows Figure 1A cross-sectional schematic diagram of an LED display device;

[0019] Figure 3 Shows Figure 1 A schematic diagram of an exploded structure of an LED display device;

[0020] Figure 4 Shows Figure 1 A schematic diagram of the three-dimensional structure of a package substrate assembly of a compression molded product when no colloid layer is provided;

[0021] Figure 5 Shows Figure 4 A partial enlarged schematic diagram of the package substrate assembly of the molded product at point A;

[0022] Figure 6 Shows Figure 4 A schematic cross-sectional view of a package substrate assembly of a die-molded product;

[0023] Figure 7 Shows Figure 4 A schematic diagram of the exploded structure of a package substrate assembly of a die-cast product;

[0024] Figure 8 Shows Figure 4 A schematic cross-sectional view of a molded product when a colloid layer of a package substrate assembly is formed.

[0025] The above drawings include the following reference numerals:

[0026] 1. die; 10. package substrate body; 11. base layer; 12. conductor layer; 121. first sub-conductor layer; 122. second sub-conductor layer; 13. solder resist layer; 131. first sub-solder resist layer; 132. second sub-solder resist layer; 20. groove structure; 30. first recess; 40. marking structure; 41. first strip block; 42. second strip block; 50. second recess; 100. colloid layer. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0028] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0030] In the existing technology, as the definition requirements of display products become higher and higher, the package size of a single lamp bead becomes smaller and smaller. There are tens of thousands of components in each package substrate assembly. Once the mold overflows, it will cause the subsequent processes to be unable to operate normally, such as the alignment points being submerged, the cutting alignment failure frequency is high, and automatic operation cannot be performed. In serious cases, it will be directly scrapped.

[0031] like Figure 1 and Figure 4 As shown, the package substrate assembly of the die-cast product of this embodiment includes: a package substrate body 10, a groove structure 20, a first recess 30 and a marking structure 40. The package substrate body 10 includes a base layer 11, a conductor layer 12 and a solder resist layer 13 arranged in sequence. The groove structure 20 is arranged on the package substrate body 10, the base layer 11 forms the groove bottom of the groove structure 20, the groove structure 20 separates the conductor layer 12 into a first sub-conductor layer 121 and a second sub-conductor layer 122, and the groove structure 20 separates the solder resist layer 13 into a first sub-solder resist layer 131 and a second sub-solder resist layer 132. The first recess 30 is arranged on the package substrate body 10 and is located at the side of the groove structure 20. The marking structure 40 is arranged in the first recess 30.

[0032] Applying the technical solution of this embodiment, the package substrate body 10 includes a base layer 11, a conductor layer 12 and a solder resist layer 13, and the base layer 11, the conductor layer 12 and the solder resist layer 13 are arranged in sequence. A groove structure 20 is arranged on the package substrate body 10, and the base layer 11 forms the groove bottom of the groove structure 20. The groove structure 20 divides the conductor layer 12 into a first sub-conductor layer 121 and a second sub-conductor layer 122, and divides the solder resist layer 13 into a first sub-solder resist layer 131 and a second sub-solder resist layer 132. A first recess 30 is also arranged on the package substrate body 10, and the first recess 30 is located at the side of the recess structure 20. A marking structure 40 is arranged in the first recess 30. Through the above arrangement, the base layer 11 can support the conductor layer 12 and the solder resist layer 13. The base layer 11 forms the groove bottom of the groove structure 20, that is, the conductor layer 12 and the solder resist layer 13 are not arranged in the groove structure 20. The first recess 30 provides an escape space for the marking structure 40, which facilitates the identification of the package substrate assembly of the die-cast product according to the position of the marking structure 40. The groove structure 20 can block the glue flowing out from the solder mask 13, reducing the probability of the glue passing through the groove structure 20 and entering the first recess 30, thereby reducing the probability of the glue contaminating the marking structure 40, thereby avoiding affecting the identification and alignment of the package substrate assembly of the die-cast product in the subsequent process. Therefore, the technical solution of this embodiment effectively solves the problem in the related art that the glue easily covers the marking point, thereby causing the subsequent process to be unable to accurately identify the marking point.

[0033] It should be noted that the thickness of the first sub-conductor layer 121 is the same as the thickness of the second sub-conductor layer 122, and the thickness of the first sub-solder resist layer 131 is the same as the thickness of the second sub-solder resist layer 132. The first recess 30 includes a first connecting groove and a second connecting groove, the first connecting groove is arranged on the second sub-solder resist layer 132 and penetrates the second sub-solder resist layer 132, the second connecting groove is arranged on the second sub-conductor layer 122 and penetrates the second sub-conductor layer 122, and the base layer 11 forms the groove bottom of the first recess 30.

[0034] like Figure 4 As shown, in this embodiment, the package substrate assembly of the compression molded product further includes a second recess 50, which is located at the side of the recess structure 20 and is disposed adjacent to the first recess 30. After the glue passes over the recess structure 20, part of the glue can enter the second recess 50, thereby reducing the glue entering the first recess 30, thereby reducing the probability of the marking structure 40 being covered.

[0035] It should be noted that the second recess 50 includes a third connecting groove and a fourth connecting groove. The third connecting groove is arranged on the second sub-solder resist layer 132 and penetrates the second sub-solder resist layer 132. The fourth connecting groove is arranged on the second sub-conductor layer 122 and penetrates the second sub-conductor layer 122. The base layer 11 forms the bottom of the groove of the second recess 50.

[0036] like Figure 1 , Figure 3 as well as Figure 5 As shown, in this embodiment, the cross-sectional area of ​​the first recess 30 is smaller than the cross-sectional area of ​​the second recess 50. The above arrangement makes it more likely that the glue that passes through the groove structure 20 enters the second recess 50, so that the second recess 50 can accommodate more glue and reduce the glue that enters the first recess 30.

[0037] In this embodiment, the volume of the first recess 30 is smaller than that of the second recess 50 , so that the probability of the glue entering the first recess 30 can be further reduced.

[0038] like Figure 1 and Figure 4 As shown, in the present embodiment, there are multiple first recesses 30 and multiple second recesses 50, and at least one second recess 50 is provided between any two first recesses 30. Multiple second recesses 50 can accommodate more glue, thereby reducing the glue entering the first recesses 30. At least one second recess 50 is provided between any two first recesses 30, so that the probability of the glue entering the first recesses 30 can be further reduced. The above arrangement can also reduce the probability of the glue overflowing to the lower surface of the package substrate body 10.

[0039] Specifically, Figure 1 As shown, the package substrate assembly of the die-molded product further includes two third recesses, and the plurality of first recesses 30 and the plurality of second recesses 50 are both arranged between the two third recesses. The two third recesses are both connected to the outer side of the package substrate assembly of the die-molded product. The base layer 11 forms the groove bottom of the third recess. The third recess can accommodate part of the glue that overflows the groove structure 20, reducing the probability of the glue entering the first recess 30.

[0040] like Figure 1 As shown, in this embodiment, the distance between the first recess 30 and the groove structure 20 is greater than or equal to the distance between the second recess 50 and the groove structure 20. The above arrangement increases the probability of the glue entering the second recess 50 after the glue passes through the groove structure 20, thereby reducing the probability of the glue entering the first recess 30.

[0041] Specifically, the distance between the first recess 30 and the groove structure 20 is equal to the distance between the second recess 50 and the groove structure 20 .

[0042] like Figure 3 As shown, in this embodiment, the upper surfaces of the first sub-solder resist layer 131 and the second sub-solder resist layer 132 are arranged flush. The above arrangement facilitates the bonding of the die 1 and the solder resist layer 13 when injecting glue on the package substrate assembly of the die product, and also facilitates the production of the solder resist layer 13.

[0043] It should be noted that the stamping mold 1 is used to shape the colloid layer 100 of the LED display device.

[0044] like Figure 5 As shown, in this embodiment, the marking structure 40 includes a first bar block 41 and a second bar block 42, and the middle parts of the first bar block 41 and the second bar block 42 are arranged crosswise. The above arrangement enables the marking structure 40 to be more easily identified.

[0045] It should be noted that the thickness of the first strip block 41 and the second strip block 42 are the same, and the thickness of the first strip block 41 is the same as the thickness of the second sub-conductor layer 122. The angle between the axis of the first strip block 41 and the axis of the second strip block 42 is between 60° and 120°, specifically, it can be 60°, 75°, 90°, 110° or 120°. In this embodiment, the first strip block 41 and the second strip block 42 are vertically arranged. The material of the first strip block 41, the second strip block 42 and the material of the conductor layer 12 are the same, which can be copper.

[0046] like Figure 7 As shown, in this embodiment, there are multiple marking structures 40, and the first recesses 30 include multiple marking structures 40, and the multiple marking structures 40 are arranged one-to-one with the multiple first recesses 30. There are multiple marking structures, which makes it more accurate to identify the package substrate assembly of the molded product. The multiple marking structures 40 are arranged one-to-one with the multiple first recesses 30, so that each marking structure 40 can be protected, reducing the probability of the marking structure 40 being covered by the glue.

[0047] like Figures 1 to 3 As shown, in this embodiment, the package substrate assembly of the die-cast product further includes an LED chip and a colloid layer 100, the colloid layer 100 is arranged above the first sub-solder resist layer 131, the LED chip includes a plurality of LED chips, and the plurality of LED chip arrays are arranged on the package substrate body 10, and there is a gap between the side of the colloid layer 100 facing the groove structure 20 and the groove structure 20. The colloid layer 100 can protect the package substrate assembly and the LED chip of the die-cast product. There is a gap between the side of the colloid layer 100 facing the groove structure 20 and the groove structure 20, so that during the formation of the colloid layer 100, the die 1 can abut and cooperate with a part of the structure of the first sub-solder resist layer 131, which facilitates the smooth progress of the glue injection process.

[0048] Specifically, the subsequent process may be cutting the package substrate assembly of the die-molded product to obtain a plurality of individual LED chips, thereby avoiding affecting the identification and alignment of the package substrate assembly of the die-molded product in the subsequent process. If the marking structure is covered, the identification and alignment of the package substrate assembly of the die-molded product may fail more frequently during cutting.

[0049] like Figure 1and Figure 6 As shown, in this embodiment, the width of the groove structure 20 is between 0.2 mm and 3 mm. Through the above arrangement, the groove structure 20 can accommodate more glue, reduce the probability of the glue overflowing to the marking structure 40, and also reduce the probability of the glue overflowing to the side of the base layer 11 away from the conductor layer 12.

[0050] Specifically, the width of the groove structure 20 refers to the distance between the two sides of the groove structure in the direction from the first sub-solder resist layer 131 to the second sub-solder resist layer 132, and the width of the groove structure 20 can be 0.2mm, 0.5mm, 0.6mm, 0.8mm, 0.9mm, 1mm, 1.5mm, 2mm, 2.5mm or 3mm. Preferably, the width of the groove structure is between 0.5mm and 1mm. The groove structure 20 is connected to the outer side of the package substrate assembly of the die-molded product in the length direction.

[0051] It should be noted that the side of the first sub-conductor layer 121 facing the second sub-conductor layer 122 and the side of the first sub-solder resist layer 131 facing the second sub-solder resist layer 132 are located in the same vertical plane. The side of the second sub-conductor layer 122 facing the first sub-conductor layer 121 and the side of the second sub-solder resist layer 132 facing the first sub-solder resist layer 131 are located in the same vertical plane. The first sub-conductor layer 121 includes a first area and a second area connected to the first area, and the first sub-solder resist layer 131 includes a third area and a fourth area connected to the third area, and the distance between the first area and the groove structure 20 is equal to the distance between the third area and the groove structure 20. The colloid layer 100 is arranged directly above the third area. The second area is arranged between the first area and the groove structure 20, and the fourth area is arranged between the third area and the groove structure 20. Such an arrangement can avoid excessive copper leakage, resulting in excessive cost of subsequent surface treatment processes.

[0052] A conductive pattern is disposed in the first region, and no conductive pattern is disposed in the second region or the second sub-conductor layer. When etching the conductive pattern in the first region, a portion of the structure of the conductor layer 12 is etched to form a groove structure 20, a portion of the structure of the conductor layer 12 is etched to form a second recess 50, a portion of the structure of the conductor layer 12 is etched to form a first recess 30, a first strip block 41, and a second strip block 42.

[0053] The package substrate assembly of the molded product includes a functional area and a process edge, and the functional area is used to install electronic components. The base layer 11 includes a fifth area and a sixth area, the fifth area is arranged directly below the first area, and the sixth area is located directly below the second area, the fourth area, the groove structure 20 and the second sub-conductor layer 122. The first area, the third area and the fifth area form the functional area, and the second area, the fourth area, the groove structure 20, the second sub-conductor layer 122, the second sub-solder resist layer 132 and the sixth area form the process edge.

[0054] Specifically, Figure 8 As shown, when the glue is injected directly above the third area to form the colloid layer 100, the die 1 is simultaneously abutted with the fourth area and the second sub-solder resist layer 132, and the junction of the die 1 and the third area is the junction of the third area and the fourth area. There is a gap between the die 1 and the third area in the direction from the base layer 11 to the conductor layer 12, and the glue is injected into the gap to form the colloid layer 100. During the glue injection process, since the functional area, the process edge and the marking structure 40 are easily scratched during the production process, the glue may overflow from the scratches, that is, the glue may enter the groove structure 20. When injecting glue, the cleanliness of the die is required to be high, especially during transfer molding, because the mold release agent and glue gas need to be sprayed, which makes it impossible to completely clean each mold, which leads to uneven glue overflow of the die. In order to pursue efficiency, the current die is one mold with multiple cavities. At present, the thickness difference between the package substrate components of the multi-piece die products can only be solved by adjusting the clamping pressure, but the effect is general. The package substrate assembly of the molded product of this embodiment can reduce the proportion of mold overflow glue and effectively control the overflow glue area, thereby reducing the impact on the functional area and the impact on the subsequent process.

[0055] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0056] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0057] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0058] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A package substrate assembly of a die-cast product, characterized in that: include: A packaging substrate body (10), the packaging substrate body (10) comprising a base layer (11), a conductor layer (12) and a solder resist layer (13) which are arranged in sequence; A groove structure (20) is arranged on the packaging substrate body (10), the base layer (11) forms the groove bottom of the groove structure (20), the groove structure (20) separates the conductor layer (12) into a first sub-conductor layer (121) and a second sub-conductor layer (122), and the groove structure (20) separates the solder resist layer (13) into a first sub-solder resist layer (131) and a second sub-solder resist layer (132); A first recess (30) is arranged on the packaging substrate body (10) and is located on a side of the groove structure (20); A marking structure (40), wherein the marking structure (40) is arranged in the first recess (30).

2. The package substrate assembly of the compression molded product according to claim 1, characterized in that: The package substrate assembly of the compression molded product further comprises a second recess (50), wherein the second recess (50) is located at a side of the groove structure (20) and is arranged adjacent to the first recess (30).

3. The package substrate assembly of the compression molded product according to claim 2, characterized in that: The cross-sectional area of ​​the first recess (30) is smaller than the cross-sectional area of ​​the second recess (50).

4. The package substrate assembly of the compression molded product according to claim 2, characterized in that: There are a plurality of the first recessed portions (30) and a plurality of the second recessed portions (50), and at least one second recessed portion (50) is disposed between any two of the first recessed portions (30).

5. The package substrate assembly of the compression molded product according to claim 2, characterized in that: The distance between the first recess (30) and the groove structure (20) is greater than or equal to the distance between the second recess (50) and the groove structure (20).

6. The package substrate assembly of the compression molded product according to any one of claims 1 to 5, characterized in that: The upper surfaces of the first sub-solder resist layer (131) and the second sub-solder resist layer (132) are arranged flush with each other.

7. The package substrate assembly of the compression molded product according to any one of claims 1 to 5, characterized in that: The marking structure (40) comprises a first bar-shaped block (41) and a second bar-shaped block (42), wherein the middle parts of the first bar-shaped block (41) and the second bar-shaped block (42) are arranged crosswise.

8. The package substrate assembly of the compression molded product according to any one of claims 1 to 5, characterized in that: There are a plurality of the marking structures (40), the first recesses (30) include a plurality of the marking structures (40), and the plurality of the marking structures (40) are arranged in a one-to-one correspondence with the plurality of the first recesses (30).

9. The package substrate assembly of the compression molded product according to any one of claims 1 to 5, characterized in that: The package substrate assembly of the die-molded product further comprises an LED chip and a colloid layer (100), the LED chip comprises a plurality of LED chips, an array of the plurality of LED chips is arranged on the package substrate body (10), the colloid layer (100) is arranged above the first sub-solder resist layer (131), and a gap is formed between the side of the colloid layer (100) facing the groove structure (20) and the groove structure (20).

10. The package substrate assembly of the compression molded product according to any one of claims 1 to 5, characterized in that: The width of the groove structure (20) is between 0.2 mm and 3 mm.

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