Inspection method and apparatus for component thermal pad design, and device and medium

Abstract

Disclosed in the present invention are an inspection method and apparatus for component thermal pad design, and a device and a medium. The inspection method comprises: reading a PCB design document and screening for packages comprising thermal pads; and performing an inspection step on a thermal pad of each screened package, the inspection step covering multiple inspection items in a certain inspection order, when any inspection item does not meet a corresponding design requirement, determining that the thermal pad needs to be redesigned, and when the multiple inspection items all meet their corresponding design requirements, determining that the thermal pad meets all the design requirements, wherein the inspection order is generated on the basis of design constraints among the multiple inspection items when meeting a thermal pad reliability requirement, and the multiple inspection items at least include copper foil area design of thermal pads, solder mask bridge design, solder mask opening area design, hole design in solder mask openings, air guide groove design, hole design on thermal pads, plug hole design, and back-side copper exposure design. According to the present invention, automatic inspection can be performed after PCB design is completed, thereby improving the inspection efficiency and accuracy.

Description

Inspection methods, devices, equipment and media for component heat dissipation pad design Technical Field

[0001] The present invention belongs to the field of PCB design, and in particular relates to an inspection method, device, equipment and medium for component heat dissipation pad design. Background Art

[0002] Electronic devices generate a certain amount of heat during operation, causing the internal temperature of the device to rise rapidly. If this heat is not dissipated in time, the device will continue to heat up, and the components will fail due to overheating. The reliability of the electronic equipment will be reduced, and the function may fail at the least, or even explode, catch fire, or even cause a safety accident at the worst. Therefore, it is very important to perform good heat dissipation on the circuit board.

[0003] Electronic devices generate heat because their circuit boards contain numerous components that generate significant heat, such as MOSFETs, LEDs, and transistors. This is especially true under full load. If heat dissipation from these components isn't properly managed, the circuit boards could fail at any time. Common heat dissipation methods include creating through-holes in heat-concentrated areas on the PCB, allowing copper foil to connect the top and bottom surfaces of the board. This increases the area and volume available for heat dissipation, reducing thermal resistance and facilitating heat dissipation during operation.

[0004] In practice, EDA engineers often only consider graphical data when designing PCB component packages, easily overlooking component heat dissipation. This can lead to poor heat dissipation in component packages and their associated drilling and solder mask design. Once components are mounted on the PCB and powered on, various heat dissipation issues can arise during operation. Therefore, performing heat dissipation inspections after the PCB layout is complete can help identify these design flaws early and improve product quality. However, the industry currently lacks comprehensive and efficient automated inspection methods.

[0005] Summary of the Invention

[0006] In order to solve the above problems existing in the prior art, the present invention provides a method, device, equipment and medium for inspecting the design of heat dissipation pads of components. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0007] In a first aspect, an embodiment of the present invention provides a method for inspecting a component heat dissipation pad design, the method comprising:

[0008] Reading a PCB design file and filtering out packages containing heat dissipation pads according to the PCB design file; wherein the PCB design file includes basic PCB information, information of each PCB layer, component information, and component packaging information;

[0009] For each screened thermal pad of the package, an inspection step is performed on the thermal pad, wherein the inspection step covers multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned. When the multiple inspection items all meet their respective corresponding design requirements, it is determined that the thermal pad meets all design requirements.

[0010] Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat dissipation pad; the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plugging design and the back bright copper design.

[0011] In a second aspect, an embodiment of the present invention provides an inspection device for component heat dissipation pad design, the device comprising:

[0012] An information reading and heat dissipation pad screening module is used to read a PCB design file and screen out packages containing heat dissipation pads according to the PCB design file; wherein the PCB design file includes basic PCB information, information on each PCB layer, component information, and component packaging information;

[0013] a thermal pad inspection module, configured to perform an inspection step on the thermal pad of each screened package, wherein the inspection step covers multiple inspection items in a certain inspection order, and when any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned; when the multiple inspection items all meet their respective corresponding design requirements, it is determined that the thermal pad meets all design requirements;

[0014] Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat dissipation pad; the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plugging design and the back bright copper design.

[0015] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0016] The memory is used to store computer programs;

[0017] The processor is configured to implement the steps of the component heat dissipation pad design inspection method provided by the embodiment of the present invention when executing the program stored in the memory.

[0018] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the inspection method for component heat dissipation pad design provided by the embodiment of the present invention are implemented.

[0019] Beneficial effects of the present invention:

[0020] An embodiment of the present invention proposes an inspection method for component heat dissipation pad design. First, the PCB design file is read, and the package containing the heat dissipation pad in the PCB design is extracted. Then, for the heat dissipation pad of each screened package, an inspection step is performed on the heat dissipation pad, wherein the inspection step covers multiple inspection items in a certain inspection order. When any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned. When the multiple inspection items all meet their respective corresponding design requirements, it is determined that the heat dissipation pad meets all design requirements. The inspection order of the embodiment of the present invention is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat dissipation pad. Each inspection item has a corresponding inspection standard. The heat dissipation pad that meets the design requirements can continue to be used, while the heat dissipation pad that does not meet the design requirements is given modification suggestions, thereby guiding the designer to redesign according to the modification suggestions, and can be re-inspected again until the PCB design requirements are finally met. Among them, the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plug hole design and the back bright copper design, which can cover all possible heat dissipation pad design items in the PCB design. After the PCB design is completed, the method of the embodiment of the present invention can check whether the heat dissipation pad design meets the specifications through computer software and other means, and find out whether the design is reasonable in advance. At the same time, it can provide modification suggestions for the design end for reference, which not only ensures the unity of design and manufacturing, but also greatly shortens the new product development cycle, improves the yield rate, and can create more profits for the enterprise. The inspection sequence of the embodiment of the present invention can improve the inspection efficiency and accuracy, avoid missed inspections; and the automated inspection method can also avoid errors and omissions caused by manual inspections, and can also greatly reduce labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a schematic flow chart of a method for inspecting component heat dissipation pad design according to an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of the solder resist bridge design;

[0023] FIG3 is a schematic diagram of a drilling design within a solder mask pattern area;

[0024] FIG4 is a schematic diagram of a heat dissipation pad without an air guide groove;

[0025] The left and right figures of FIG5 are schematic diagrams of a heat dissipation pad with an air guide groove design;

[0026] FIG6 is a schematic diagram of the drilling design on the heat dissipation pad;

[0027] FIG7 is a schematic diagram of the distribution of multiple drill holes on the heat dissipation pad;

[0028] FIG8 is a schematic diagram of the spacing between a group of adjacent drill hole profiles in the target area;

[0029] FIG9 is a schematic diagram of a plug hole on a PCB;

[0030] Figure 10 is a schematic diagram of the back side bright copper;

[0031] FIG11 is a schematic diagram of a flow chart of an inspection step performed according to an embodiment of the present invention;

[0032] FIG12 is a schematic diagram of a PCB in an exemplary embodiment;

[0033] FIG13 is a schematic diagram of component information of a PCB in an exemplary embodiment;

[0034] FIG14 is a schematic diagram of component packaging information of a PCB in an exemplary embodiment;

[0035] FIG15 is a schematic diagram of the PKG001 package in an example embodiment;

[0036] FIG16 is a schematic diagram of the PKG002 package in an example embodiment;

[0037] FIG17 is a schematic diagram of a solder resist pattern area on a heat dissipation pad of a PKG003 package in an exemplary embodiment;

[0038] FIG18 is a schematic diagram showing a drill hole in a solder mask pattern region of a specific pattern area according to an exemplary embodiment;

[0039] FIG19 is a schematic diagram of a design of an air guide groove for a heat dissipation pad on a package in an exemplary embodiment;

[0040] FIG20 is a schematic diagram of a heat dissipation pad having a drilled hole design on a package in an exemplary embodiment;

[0041] FIG21 is a schematic diagram illustrating inspection of drilling size, density, and spacing of holes drilled on a heat dissipation pad or a solder mask pattern area in an exemplary embodiment;

[0042] FIG22 is a schematic diagram showing a method for checking whether a hole drill has a plug hole design according to an exemplary embodiment;

[0043] FIG23 is a schematic diagram of a non-plugged via drilling design within a solder mask pattern area according to an embodiment of the present invention;

[0044] FIG24( a ) and FIG24 ( b ) are schematic diagrams showing inspection of backside bright copper when drilling holes in the target area without plugging holes in an exemplary embodiment;

[0045] FIG25 is a schematic structural diagram of an inspection device designed for component heat dissipation pads provided by an embodiment of the present invention;

[0046] FIG26 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0048] In order to comprehensively, efficiently and automatically perform heat dissipation-related inspections after the PCB layout design is completed, embodiments of the present invention provide an inspection method, apparatus, device and medium for component heat dissipation pad design.

[0049] It should be noted that the execution subject of the inspection method for component heat dissipation pad design provided by the embodiment of the present invention can be an inspection device for component heat dissipation pad design, and the device can be run in an electronic device. Among them, the electronic device can be a server or a terminal device, of course, but is not limited to this. Optionally, the method of the embodiment of the present invention can be executed by a system core data module in a computer, and the system core data module can be associated with EDA design software, for example, it can be built into the EDA software, etc., which is all reasonable.

[0050] To facilitate understanding of the embodiments of the present invention, a summary of the multiple algorithms involved is first given.

[0051] (1) Graphic area calculation algorithm

[0052] The size information of the graphics on each layer of the PCB can be represented by the MBR(A, B) of the graphics, where MBR (Minimum Bounding Rectangle) represents the maximum outer contour of the graphics; A and B represent the sizes of the maximum outer contour of the graphics in the X and Y directions, that is, the size of the minimum circumscribed rectangular frame of the graphics.

[0053] If the figure is a rectangle, then A and B represent the length and width of the smallest circumscribed rectangle of the figure, respectively. The area of ​​the figure is S = A*B.

[0054] If the figure is a circle, then A and B are equal to the diameter of the circle, and the area of ​​the figure is S = π*(A / 2) 2 ;

[0055] If the figure is a polygon, you can get the coordinates of each vertex of the figure P1(x1,y1),P2(x2,y2),…,P n (x n ,y n ), the area of ​​the figure is:

[0056] Where n is the total number of polygon vertices of the figure.

[0057] (2) Graphics distance calculation algorithm

[0058] If the center coordinates of a graphic object P on a layer are (x1, y1) and the center coordinates of a graphic object Q are (x2, y2), then the distance between the centers of graphics objects P and Q is the distance between the two graphics, calculated using the following formula:

[0059] (3) Graphics Overlap Comparison Algorithm

[0060] Specifically, the collision calculation is performed on graphic area 1 and graphic area 2. If a collision occurs, the area of ​​the collision area is calculated. Otherwise, the value can be NULL.

[0061] The area of ​​the collision region may be calculated using a graphic area calculation algorithm, which will not be described in detail here.

[0062] In a first aspect, an embodiment of the present invention provides a method for inspecting a component heat dissipation pad design, as shown in FIG1 , which may include the following steps:

[0063] S1, reading a PCB design file, and screening out packages containing heat dissipation pads according to the PCB design file;

[0064] The PCB design file is an ECAD file output after the design is completed in the EDA software. The PCB design file includes basic PCB information, PCB layer information, component information, and component packaging information. The embodiment of the present invention does not limit the EDA design software used.

[0065] Specifically, in the PCB design file:

[0066] The basic PCB information includes: PCB length, PCB width, PCB thickness, number of signal layers and signal layer copper thickness;

[0067] The PCB layer information includes: circuit layer, solder mask layer, drill layer, plug layer, solder paste layer, coordinates, shape and size of all graphics on each layer; wherein the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics;

[0068] The component information includes: component number, component coordinates and component package name; and may also include angles; wherein the component coordinates include the center coordinates of the component and the vector coordinates of each point on the edge contour of the component; the center coordinates in the embodiment of the present invention refer to the X and Y coordinates relative to the coordinate origin;

[0069] The component packaging information includes: package name, package type and package graphic information; wherein, the package graphic information includes component body information and pin pad information; the component body information includes the length, width and position of the body pad; the pin pad information includes the length, width, direction, position and number of the pin pad.

[0070] The above concepts should be understood in conjunction with relevant knowledge of PCB design and will not be explained in detail here.

[0071] In an optional implementation, screening out packages including heat dissipation pads according to the PCB design file may include the following steps:

[0072] 1) obtaining the area of ​​the body pad and all the pin pads in each package based on the solder paste layer;

[0073] The information about the solder paste layer in each layer of the PCB contains the coordinates, shape, and size of the pad graphic. Based on this information, the area of ​​the pad graphic can be calculated using a graphic area calculation algorithm. For example, if the pad graphic is rectangular, its length and width are used for calculation; if the pad graphic is circular, its diameter is used for calculation; and if the pad graphic is polygonal, the vector coordinates of its vertices are used for calculation. For the sake of uniform processing, the area of ​​pad graphics of various shapes can be calculated using their vector coordinates. For details, please refer to the relevant content of the graphic area calculation algorithm described in this application.

[0074] Therefore, for each package, the areas of the body pad and all the pin pads can be obtained.

[0075] It should be noted that the embodiments of the present invention can calculate the graphic area in each layer of the PCB based on the vector coordinates of the graphic using a graphic area calculation algorithm. This can cover the calculation methods of all graphic shapes, which will be specifically explained in the relevant steps following this application.

[0076] 2) For each package, calculate the ratio between the area of ​​the largest pad and the area of ​​the smallest pad in the package;

[0077] Specifically, among all areas of the body pad and all pin pads of the package, the maximum value and the minimum value are selected to obtain the ratio.

[0078] 3) When it is determined that the ratio is greater than the preset ratio, it is determined that the largest pad in the package is a heat dissipation pad, and the package is a package including a heat dissipation pad.

[0079] The preset ratio can be set based on experience, for example, it can be 8, etc., and is not limited here.

[0080] If the ratio is greater than the preset ratio, it is determined that the largest pad in the package is a heat dissipation pad, and the package is a package containing a heat dissipation pad, then step S2 is executed; otherwise, it is determined that the package is a package not containing a heat dissipation pad, step S2 is not executed, that is, no operation is performed on the package.

[0081] The embodiment of the present invention can automatically find all packages containing thermal pads in a PCB through step S1, and only perform subsequent thermal pad design inspection on the packages containing thermal pads, while no processing is performed on the packages not containing thermal pads. Since a one-by-one inspection method is not adopted, the inspection workload can be reduced and the inspection efficiency can be improved.

[0082] S2, for each screened thermal pad of the package, performing an inspection step on the thermal pad, wherein the inspection step covers multiple inspection items in a certain inspection order, and when any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned; when the multiple inspection items all meet their respective corresponding design requirements, it is determined that the thermal pad meets all design requirements;

[0083] Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat dissipation pad; the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plugging design and the back bright copper design.

[0084] Those skilled in the art will appreciate that the various designs of a PCB heat sink pad have a certain order and dependency, and each inspection item has its own design requirements. The embodiment of the present invention takes into account the design constraints between multiple design items when the heat sink pad meets the reliability requirements, and uses multiple design items, such as the copper foil area design of the heat sink pad, the solder mask bridge design, the solder mask window area design, the drilling design within the solder mask window, the air guide groove design, the drilling design on the heat sink pad, the plugging design, and the backside bright copper design, as inspection items. A certain inspection sequence is designed, and the inspection steps are performed on each packaged heat sink pad in the inspection sequence to inspect each inspection item. This ensures that all inspection items of the heat sink pad are fully covered while avoiding unnecessary inspection paths and improving inspection efficiency. In addition, during the inspection process, if any inspection item does not meet the corresponding design requirements, it is determined that the heat sink pad needs to be redesigned, and the designer can be reminded to modify the design in a timely manner by outputting a corresponding warning message, etc., which can ensure that the design items to be modified are recorded in a timely and comprehensive manner to avoid missing modifications. At the same time, performing the above inspections one by one on the heat dissipation pads in a certain order can avoid the situation where the heat dissipation pads are missed. Among them, the order of traversing the heat dissipation pads can be based on the name, bit number, etc. of the corresponding device, which is not limited here.

[0085] The following takes a heat dissipation pad as an example to illustrate the specific method of performing the inspection steps on the heat dissipation pad.

[0086] The step of inspecting the heat dissipation pad may include the following steps a1 to a5:

[0087] Step a1, determining a target thermal resistance value corresponding to the component package to which the thermal pad belongs from a preset correspondence between component packages and thermal resistances, based on the package type corresponding to the thermal pad in the component package information and the number of signal layers in the PCB basic information;

[0088] Thermal resistance refers to the resistance encountered by heat along a heat flow path. It reflects the heat transfer capacity of a medium or between media and indicates the temperature rise caused by 1W of heat. The unit is °C / W. The temperature rise along this heat transfer path is calculated by multiplying the heat dissipation by the thermal resistance.

[0089] The embodiments of the present invention can predetermine the correspondence between component packaging and thermal resistance through experimental testing and other methods. For example, a correspondence table between component packaging and thermal resistance can be determined, which lists the thermal resistance values ​​of various component packaging types under different numbers of signal layers.

[0090] Then, for the heat dissipation pad, the target thermal resistance value corresponding to the component package to which the heat dissipation pad belongs can be determined by querying the above table based on the package type corresponding to the heat dissipation pad in the component package information and the number of signal layers in the PCB basic information.

[0091] Step a2, substituting the target thermal resistance value into a preset formula to calculate the minimum copper foil area corresponding to the heat dissipation pad that meets the thermal resistance requirement;

[0092] In surface mount applications, to ensure that the component's thermal resistance (Rth) meets the required requirements, a corresponding heat dissipation area is required, namely, the copper foil area corresponding to the heat dissipation pad. This step requires calculating the minimum copper foil area corresponding to the heat dissipation pad that meets the thermal resistance requirements, taking into account the heat dissipation needs as well as the layout area and cost requirements.

[0093] A large number of sample data sets of thermal resistance Rth and the corresponding minimum copper foil area can be obtained in advance through experimental testing and other methods, and the relationship between thermal resistance Rth and the corresponding minimum copper foil area can be determined. For example, the sample data set can be used to determine the minimum copper foil area S by numerical fitting and other methods. min The default formula is: S min =K / (Rth-ρ);

[0094] Where Rth represents thermal resistance; S min Indicates the minimum copper foil area corresponding to the heat sink pad; K and ρ are coefficients, such as 12500 and 30 respectively.

[0095] Then, the target thermal resistance value Rth is substituted into the preset formula to calculate the minimum copper foil area S corresponding to the heat dissipation pad that meets the thermal resistance requirement. min .

[0096] Step a3, obtaining the areas of all patterns on the surface circuit layer to which the heat dissipation pad is connected, and summing them to obtain the actual copper foil area of ​​the heat dissipation pad;

[0097] Specifically, the coordinates, shapes and sizes of all graphics on all surface circuit layers connected to the heat dissipation pad can be obtained, and the graphic area calculation algorithm is used according to the vector coordinates of the graphics to obtain the areas of all graphics on all surface circuit layers connected to the heat dissipation pad, and then the sum is obtained to obtain the actual copper foil area of ​​the heat dissipation pad; the specific process will not be described in detail here.

[0098] Step a4, determining whether the actual copper foil area of ​​the heat dissipation pad is greater than or equal to the calculated minimum copper foil area;

[0099] Step a5: If yes, determine that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirement; if not, determine that the copper foil area of ​​the heat dissipation pad does not meet the thermal resistance requirement, record the component number and component package name corresponding to the heat dissipation pad, and indicate that the heat dissipation pad needs to be redesigned.

[0100] Of course, if so, it is determined that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirement, that is, the inspection item of the copper foil area design of the heat dissipation pad meets the corresponding design requirement, and subsequent inspection items can be carried out.

[0101] In the above embodiment, the corresponding relationship between the component package and the thermal resistance is first queried by the package type and number of signal layers corresponding to the heat dissipation pad to determine the thermal resistance value of the heat dissipation pad; the determined thermal resistance value is then substituted into a preset formula to calculate the minimum copper foil area required for the heat dissipation pad; the actual copper foil area of ​​the heat dissipation pad is then obtained and compared with the calculated minimum copper foil area, and when the actual copper foil area is not less than the calculated minimum copper foil area, it is determined that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirement. In the embodiment of the present invention, the corresponding relationship between the component package and the thermal resistance and the preset formula for characterizing the relationship between the thermal resistance value and the minimum copper foil area are determined in advance through means such as big data experiments, which can ensure that the accurate thermal resistance value of the heat dissipation pad to be inspected is quickly obtained and the minimum copper foil area corresponding to any thermal resistance value is determined as the design standard. Then, by accurately calculating the actual copper foil area of ​​the heat dissipation pad and comparing it with the design standard, it can be quickly determined whether the copper foil area of ​​the heat dissipation pad meets the design requirements.

[0102] In an embodiment of the present invention, if it is prompted that the heat dissipation pad needs to be redesigned, a reminder box may be popped up, etc., so that the designer can observe it intuitively. Moreover, information such as the component position number and component package name corresponding to the heat dissipation pad may be directly displayed in the reminder box, or recorded in other designated locations in the form of other documents, etc., which are all reasonable. In an embodiment of the present invention, if it is prompted that the heat dissipation pad needs to be redesigned, the designer can modify the design items that are prompted to be modified in a timely manner, and check again after the modification is completed, and then conduct subsequent inspections after passing; or after the inspection sequence is executed, multiple design items that need to be modified can be modified collectively, and the inspection sequence can be executed again after all modifications are completed, which are all reasonable.

[0103] In an optional embodiment, after determining that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirement, the step of inspecting the heat dissipation pad may further include the following steps b1 to b4:

[0104] Step b1, obtaining the minimum circumscribed rectangular frame size information of the heat dissipation pad based on the component packaging information; the minimum circumscribed rectangular frame size information of the heat dissipation pad includes the maximum outer contour size of the heat dissipation pad in the X and Y directions;

[0105] Because the component package information includes the package name, package type, and package graphic information, the minimum bounding rectangle information of the thermal pad can be obtained based on the package graphic information. The minimum bounding rectangle information is the MBR (A, B) of the graphic described in this application. Here, A and B correspond to the maximum outer contour dimensions of the thermal pad graphic in the X and Y directions.

[0106] Step b2, determining that the larger value and the smaller value in the minimum circumscribed rectangular frame size information of the heat dissipation pad are respectively the length and width of the heat dissipation pad;

[0107] The length and width of the heat dissipation pad can be denoted as L1 and W1 respectively.

[0108] Step b3, judging whether the size of the heat dissipation pad is within a specific heat dissipation pad size range based on the length and width of the heat dissipation pad;

[0109] A specific thermal pad size range can refer to and in, and The threshold values ​​corresponding to the length and width can be selected based on experience, and the values ​​can be 2.5 mm and 2 mm, etc., respectively. There is no specific limitation here.

[0110] Step b4: If yes, check whether the heat dissipation pad has a solder bridge design; if not, check whether the heat dissipation pad has an air guide groove design.

[0111] If the size of the heat sink pad is within the specific heat sink pad size range, it means that the heat sink pad area is large and there should be a solder bridge design. Therefore, the solder bridge design inspection item needs to be checked.

[0112] If the size of the heat sink pad is not within the specific heat sink pad size range, it means that the heat sink pad area is small and no solder mask bridge design is required, but there may be an air guide groove design, so the air guide groove design inspection item needs to be checked.

[0113] In the above embodiment, by obtaining the minimum bounding rectangle size information of the thermal pad, the length and width data therein are used to determine whether the thermal pad size is within a specific thermal pad size range. If so, the thermal pad is checked for solder mask bridges. If not, the thermal pad is checked for air guide grooves. Therefore, the corresponding inspection items can be targeted according to the size of the thermal pad, avoiding unnecessary inspection paths and thus improving inspection efficiency.

[0114] Wherein, with respect to step b4, the checking whether the heat dissipation pad has a solder bridge design may include the following steps:

[0115] Step c1, obtaining a corresponding heat dissipation pad graphic area according to the center coordinates and vector coordinates of the heat dissipation pad;

[0116] Among them, the center coordinates and vector coordinates of the heat dissipation pad can be obtained from the information of the solder paste layer in each layer information of the PCB, and can be obtained when the package of the heat dissipation pad is screened out according to the PCB design file. Therefore, the vector coordinates of the heat dissipation pad can be used to determine the area of ​​the corresponding heat dissipation pad graphic area, wherein the area calculation is implemented using the graphic area calculation algorithm described in this application.

[0117] Step c2, obtaining at least one solder resist pattern area according to the center coordinates and vector coordinates of the pattern in the solder resist layer;

[0118] The solder mask pattern area can be obtained from the solder mask information within the various layers of the PCB. Specifically, the area of ​​the solder mask pattern area can be calculated using the center coordinates and vector coordinates of the solder mask pattern using a pattern area calculation algorithm. It is understood that there may be multiple solder mask pattern areas, and embodiments of the present invention require that the overlapping areas with the heat sink pattern area be determined one by one in step c3.

[0119] Step c3: if the overlapping area between the heat dissipation pad pattern area and all solder mask pattern areas is equal to 0, then it is determined that the heat dissipation pad has no solder mask window design and no solder mask bridge design; if the overlapping area between the heat dissipation pad pattern area and any solder mask pattern area is greater than 0, then it is determined that the heat dissipation pad has a solder mask window design;

[0120] Among them, determining the overlapping area between the heat dissipation pad pattern area and the solder mask pattern area can be achieved by using the pattern overlap comparison algorithm described in this application, which will not be described in detail here.

[0121] The solder mask bridge design can be understood by referring to Figure 2. The large light gray rectangle in Figure 2 represents the heat dissipation pad graphic area, and the multiple dark small rectangular areas are the solder mask graphic area, which here represent the solder mask openings.

[0122] Step c4, when it is determined that the heat dissipation pad has a solder resist window design, if the number of solder resist graphic areas whose overlapping area with the heat dissipation pad graphic area is greater than 0 is greater than or equal to 2, it is determined that there is a solder resist bridge design on the heat dissipation pad; if the number of solder resist graphic areas whose overlapping area with the heat dissipation pad graphic area is greater than 0 is less than 2, it is determined that there is no solder resist bridge design on the heat dissipation pad.

[0123] Among them, when the overlapping area of ​​the heat dissipation pad graphic area and any solder resist graphic area is greater than 0, it is determined that the heat dissipation pad has a solder resist window design. On this basis, if it is further determined that the number of solder resist graphic areas with an overlapping area greater than 0 with the heat dissipation pad graphic area is greater than or equal to 2, it is determined that there is also a solder resist bridge design on the heat dissipation pad; if it is further determined that the number of solder resist graphic areas with an overlapping area greater than 0 with the heat dissipation pad graphic area is less than 2, it is determined that there is only a solder resist window design but no solder resist bridge design on the heat dissipation pad.

[0124] In the above implementation, the presence of a solder mask window is first determined by the overlap area between the thermal pad pattern and the solder mask pattern. If no solder mask window exists, the absence of a solder mask bridge is determined. Then, if a solder mask window exists, the presence of a solder mask bridge is further determined based on the number of solder mask pattern areas with an overlap area greater than 0. This allows for accurate determination of whether a thermal pad contains a solder mask bridge, facilitating subsequent review to determine whether the solder mask bridge meets design requirements.

[0125] In an optional embodiment, after determining that there is a solder bridge design on the heat dissipation pad, the step of inspecting the heat dissipation pad may further include the following steps:

[0126] Step d1, for each solder resist pattern region within the corresponding range of the heat dissipation pad, determining whether the area of ​​the solder resist pattern region is larger than a specific pattern area;

[0127] Specifically, the vector coordinates of each solder resist graphic area within the corresponding range of the heat dissipation pad can be obtained based on the information of the solder resist layer, and the area of ​​the corresponding solder resist graphic area can be calculated using the vector coordinates and the graphic area calculation algorithm;

[0128] Referring to FIG. 2 , it can be understood that the areas of the respective solder mask graphic regions represented by the four dark rectangles are obtained.

[0129] The specific graphic area is determined based on empirical values, for example, it can be 3mm 2 , no specific limitation is given here.

[0130] This step can correspond to the inspection items for the solder mask window area design.

[0131] Step d2: If yes, check whether there are drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check whether the size, density and spacing of the drill holes meet the corresponding design requirements. If there are no drill holes, record the component number and component package name corresponding to the heat sink pad where the solder mask pattern area is located, and prompt that the heat sink pad needs to be redesigned.

[0132] In PCB design, for larger area situations (in the embodiment of the present invention, the area of ​​the solder mask pattern area is larger than the specific pattern area), drilling holes are usually designed in the solder mask pattern area to achieve good heat dissipation. This step is completed based on this design requirement.

[0133] For the design of drilling holes in the solder mask pattern area, please refer to Figure 3, where black dots represent drilling holes.

[0134] If it is a larger area as mentioned above, the embodiment of the present invention checks whether there are drill holes in the solder resist pattern area. If there are drill holes, it only means that there are drill holes in the solder resist window of a specific solder resist window area, that is, the inspection item of having drill holes in the solder resist pattern area larger than the specific pattern area meets the corresponding design requirements. Further, the number of drill holes must be counted, and the size, density and spacing of the drill holes must be checked to see whether they meet the corresponding design requirements, that is, the inspection item of drilling design in the solder resist window (that is, drilling design in the solder resist pattern area) must be checked.

[0135] If the above-mentioned large area situation exists but there is no drilling, it means that the inspection item of drilling in the solder mask window of the specific solder mask window area meets the non-corresponding design requirements. Then record the component position number and component package name corresponding to the heat dissipation pad where the solder mask graphic area is located, and prompt that the heat dissipation pad needs to be redesigned.

[0136] Step d3: If not, it is determined to be a normal design and no inspection or judgment is performed.

[0137] If it does not fall into the above-mentioned large area situation, there is no need to design drilling holes in the solder mask pattern area, and no inspection and judgment are required.

[0138] In the above-mentioned embodiment, for the solder resist graphic area within the corresponding range of the heat dissipation pad that is larger than the specific graphic area, check whether there are drill holes in the solder resist graphic area. If there are drill holes, further count the number of drill holes, and check whether the size, density and spacing of the drill holes meet the corresponding design requirements, so as to complete the inspection of the inspection item of the need for drill holes in the solder resist window of the specific solder resist window area and the inspection item of the drilling design in the solder resist window; if there are no drill holes, it means that the inspection item of the need for drill holes in the solder resist window of the specific solder resist window area does not meet the corresponding design requirements, and a corresponding record is made to prompt that the heat dissipation pad needs to be redesigned. The embodiment of the present invention is designed for solder resist graphic areas that are larger than the specific graphic area, and has a series of inspection items for drilling holes, which can avoid the occurrence of missed detection. In an optional embodiment, in step d2, the inspection of whether there are drill holes in the solder resist graphic area may include the following steps:

[0139] Step e1, obtaining at least one drilling pattern area according to the center coordinates and vector coordinates of the drilling layer pattern;

[0140] The drilling graphic area can obtain the center coordinates and vector coordinates from the information of the drilling layer in each layer information of the PCB, and is implemented using the graphic area calculation algorithm.

[0141] Step e2: if the overlapping area between the solder resist pattern area and any one of the drill hole pattern areas is greater than 0, it is determined that there is a drill hole in the solder resist pattern area;

[0142] Among them, the area of ​​the solder mask graphic area is obtained by obtaining the corresponding vector coordinates from the information of the solder mask layer in each layer information of the PCB using the graphic area calculation algorithm, which will not be described in detail here.

[0143] The overlapping area between the solder mask pattern area and any drilling pattern area can be determined by using the pattern overlap comparison algorithm described in this application, which will not be described in detail here.

[0144] Step e3: If the overlapping area between the solder resist pattern area and all the drilling pattern areas is equal to 0, it is determined that there is no drilling in the solder resist pattern area.

[0145] In the above embodiment, by judging the overlapping area between the solder resist pattern area and the obtained drilling pattern area, it is possible to quickly determine whether there are drill holes in the solder resist pattern area, so as to facilitate further review of the size, density and spacing of the drill holes to see whether they meet the corresponding design requirements.

[0146] As mentioned above, after determining in step c4 that the heat dissipation pad has no solder bridge design, it is necessary to check whether the heat dissipation pad has an air guide groove design. That is to say, after determining that the heat dissipation pad has no solder bridge design, the inspection step performed on the heat dissipation pad also includes: checking whether the heat dissipation pad has an air guide groove design.

[0147] In the above embodiment, after determining that the heat dissipation pad has no solder bridge design, it is checked whether the heat dissipation pad has an air guide groove design. The relevant inspection items can be inspected for the heat dissipation pad's no solder bridge design, which can ensure the comprehensiveness of the overall inspection.

[0148] Specifically, the step of checking whether the heat dissipation pad has an air guide groove design may include the following steps:

[0149] Step f1, performing an overlap comparison between the heat dissipation pad pattern area corresponding to the heat dissipation pad and the minimum circumscribed rectangular frame of the heat dissipation pad to determine whether there is a gap;

[0150] It can be understood that the heat dissipation pad graphic area corresponding to the heat dissipation pad and the minimum circumscribed rectangular frame of the heat dissipation pad have been obtained in step c1 and step b1 of the present application.

[0151] The excess portion of the smallest circumscribed rectangular frame of the heat dissipation pad compared to the heat dissipation pad graphic area corresponding to the heat dissipation pad is a gap. The overlap comparison is implemented using the graphic overlap comparison algorithm described in this application.

[0152] Step f2: if there is no notch, determine that the heat dissipation pad does not have an air guide groove design;

[0153] An example of a heat dissipation pad without an air guide groove design is shown in FIG4 .

[0154] Step f3: If there is a gap, calculate the length and width of the gap and count the number of gaps; if the number of gaps is greater than or equal to 3, and the ratio of the gap width to the width of the heat dissipation pad is less than a first preset percentage, and the ratio of the gap length to the length of the heat dissipation pad is greater than a second preset percentage, determine that the heat dissipation pad has an air guide groove design and meets the corresponding design requirements; otherwise, determine that the heat dissipation pad does not have an air guide groove design.

[0155] The length and width of the gap are calculated and the number of gaps is counted using a graphic overlap comparison algorithm and the vector coordinates of the heat dissipation pad. The specific process will not be described in detail here.

[0156] The first preset percentage and the second preset percentage can be set according to empirical values, such as 10% and 30% respectively, and are not limited to this. If it is determined that the heat dissipation pad has an air guide groove design, then the inspection item for the air guide groove design meets the corresponding design requirements.

[0157] An example of a heat dissipation pad with an air guide groove design is shown in FIG5 .

[0158] In the above embodiment, whether there is a gap is determined by overlapping and comparing the heat dissipation pad graphic area corresponding to the heat dissipation pad with the minimum circumscribed rectangular frame of the heat dissipation pad. When there is no gap, it is directly determined that the heat dissipation pad has no air guide groove design; when there is a gap, the number of gaps, the ratio of the gap width to the width of the heat dissipation pad, and the ratio of the gap length to the length of the heat dissipation pad are further used to determine whether the heat dissipation pad has an air guide groove design. It can accurately determine whether the heat dissipation pad has an air guide groove design according to different situations.

[0159] In an optional embodiment, after determining in step f2 that the heat dissipation pad does not have an air guide groove design, the step of inspecting the heat dissipation pad may further include the following steps:

[0160] Step g1, obtaining at least one drilling pattern area according to the center coordinates and vector coordinates of the drilling layer pattern;

[0161] This step is the same as step e1 and will not be described in detail here.

[0162] Step g2, calculating the overlapping area between the heat dissipation pad pattern area corresponding to the heat dissipation pad and any drill pattern area;

[0163] The heat dissipation pad pattern area corresponding to the heat dissipation pad has been obtained in step c1 of the present application. The overlapping area calculation in step g2 is implemented using the pattern overlap comparison algorithm described in the present application.

[0164] Step g3: If the overlapping area between the heat dissipation pad pattern area and any drill hole pattern area is greater than 0, then the heat dissipation pad is determined to have a drill hole design, the number of drill holes is counted, and the size, density, and spacing of the drill holes are checked to see if they meet the corresponding design requirements;

[0165] The drilling design on the heat dissipation pad can be understood by referring to Figure 6, where the rectangle represents the heat dissipation pad and the dot represents the drilling hole.

[0166] Similarly, the overlapping area calculation in step g3 is implemented using the graphic overlapping comparison algorithm described in this application.

[0167] Step g4: if the overlapping area between the heat dissipation pad graphic area and all the drilling areas is equal to 0, it is determined that the heat dissipation pad has no drilling design, and the component number and component package name corresponding to the heat dissipation pad are recorded, indicating that the heat dissipation pad needs to be redesigned.

[0168] If step g4 determines that the heat dissipation pad has no drilling design, it means that the inspection item of the drilling design on the heat dissipation pad has failed.

[0169] In the above embodiment, whether the heat dissipation pad is drilled is determined by calculating the overlapping area of ​​the heat dissipation pad graphic area and the drilling graphic area corresponding to the heat dissipation pad, and the number of drill holes is further counted after the drilling design, and it is checked whether the size, density and spacing of the drill holes meet the corresponding design requirements. A series of inspection items for drilling can be designed for the heat dissipation pad graphic area, which can avoid missed inspections.

[0170] In an optional embodiment, after determining that there are drill holes in the solder mask pattern area in step d2, and after determining that there are drill holes in the heat sink pad in step g3, checking whether the size, density, and spacing of the drill holes meet the corresponding design requirements includes:

[0171] Step h1, checking the size of the drill hole, includes: obtaining the diameter of the drill hole from the information of the drill hole layer in the information of each layer of the PCB, and determining whether the diameter of the drill hole is within a preset diameter range; if so, determining that the drill hole diameter meets the corresponding design requirements; if not, recording the position of the drill hole and indicating that the drill hole needs to be redesigned;

[0172] Specifically, when checking whether the size, density and spacing of the drill holes meet the corresponding design requirements, the embodiments of the present invention can target drill holes in the solder mask graphic area or drill holes on the heat dissipation pad. Regardless of the type of drill holes, since the information of the drill hole layer contains the coordinates, shapes and sizes of all the graphics of the layer, the diameter of the corresponding drill holes can be obtained therefrom, and the specific process will not be described in detail.

[0173] The preset diameter range of the embodiment of the present invention can be set based on experience, for example, it can be 0.2 to 0.4 mm, etc. If the diameter of the drill hole is within the preset diameter range, it is determined that the drill hole diameter meets the corresponding design requirements, and then proceed to step h2; if the diameter of the drill hole is not within the preset diameter range, it is determined that the drill hole diameter does not meet the corresponding design requirements, then the position of the drill hole is recorded, and a prompt is given that the drill hole needs to be redesigned, and suggestions for modifying the aperture can be given. Among them, the multiple drill holes distributed on the heat dissipation pad can be understood by referring to Figure 7, in which hole represents a drill hole, D represents the diameter of the drill hole, and Thermal pad represents the heat dissipation pad.

[0174] Step h2, checking the drilling density, includes: obtaining the number of drill holes and the area of ​​the target area where the drill holes are located; calculating the number of drill holes per unit area of ​​the target area to obtain the actual drilling density; determining whether the actual drilling density is greater than a drilling density threshold of the target area; if so, determining that the drilling density meets the corresponding design requirements; if not, proposing a modification suggestion to increase drilling holes;

[0175] The target area includes the heat sink pad and / or solder mask pattern area containing the drilled holes; the number of drilled holes is calculated after the presence of the drilled holes is determined in step d2 or g3. The area of ​​the heat sink pad where the drilled holes are located can be obtained based on the vector coordinates of the heat sink pad, and the area of ​​the solder mask pattern area where the drilled holes are located can be obtained based on the vector coordinates of the solder mask pattern area. This can be processed using a pattern area calculation algorithm, and the specific process is not described in detail here.

[0176] The actual drilling density indicates the number of drill holes per unit area of ​​the target area. It is calculated as the number of drill hole patterns in the heat sink pad / the area of ​​the heat sink pad, and the number of drill hole patterns in the solder mask pattern area / the area of ​​the solder mask pattern area.

[0177] The drilling density threshold of the target area is set based on empirical values, indicating the minimum drilling density of the target area when heat dissipation performance is met. For example, it can be 25 holes / cm 2 , i.e. 0.25 pieces / mm 2 .

[0178] If the actual drilling density is greater than the drilling density threshold of the target area, it is determined that the drilling density meets the corresponding design requirements and the process proceeds to step h3; otherwise, it indicates that the number of drilling holes is insufficient and a modification suggestion of increasing drilling holes is proposed;

[0179] Step h3, the step of checking the drilling spacing, includes: when the number of holes drilled in the target area is less than 2, determining that the drilling spacing meets the corresponding design requirements; when the number of holes drilled in the target area is greater than or equal to 2, calculating the center distance of each group of adjacent holes based on the center coordinates of the group of adjacent holes; calculating the spacing between the contours of the group of adjacent holes based on the center distance of the group of adjacent holes and the respective diameters of the group of adjacent holes using a preset spacing calculation formula; if the spacing between the contours of the group of adjacent holes is greater than the preset spacing value, determining that the spacing between the contours of the group of adjacent holes meets the corresponding design requirements, if not, recording the respective positions of the group of adjacent holes and the spacing between the contours of the group of adjacent holes, and proposing modification suggestions.

[0180] In this step, when the number of holes drilled in the target area is less than 2, that is, when the number of holes drilled is 1, it means that there are no adjacent holes, and the hole spacing can be considered to meet the corresponding design requirements; this step mainly performs a specific inspection of the hole spacing when the number of holes drilled in the target area is greater than or equal to 2.

[0181] Among them, according to the center coordinates of each group of adjacent drill holes, the center distance of the group of adjacent drill holes is calculated according to the graphic distance calculation algorithm:

[0182] In the above formula, d1 represents the center distance between the adjacent holes in the group, and (x1, y1) and (x2, y2) are the center coordinates of the adjacent holes in the group.

[0183] Substituting the center distance of the group of adjacent drill holes and the diameters of the respective adjacent drill holes into the preset spacing calculation formula, the spacing between the contours of the group of adjacent drill holes is obtained as follows: d2 = d1 - D1 / 2 - D2 / 2;

[0184] The above formula is the preset spacing calculation formula, where d2 is the spacing between the contours of the adjacent drill holes in the group, which can be understood by referring to FIG8 ; D1 and D2 are the diameters of the adjacent drill holes in the group.

[0185] The preset spacing value in the embodiment of the present invention can be determined based on empirical values, such as 0.6 mm, etc., and will not be described in detail here.

[0186] In the above-described embodiment, whether the drill hole size meets the corresponding design requirements is checked by determining whether the diameter of the drill hole is within a preset diameter range; whether the drill hole density meets the corresponding design requirements is checked by obtaining the number of drill holes and the area of ​​the heat sink pad and / or solder mask pattern area where the drill holes are located, calculating the actual drill hole density, and determining whether the actual drill hole density is greater than a drill hole density threshold; when there are at least two drill holes on the heat sink pad and / or solder mask pattern area, the drill hole spacing is checked by calculating the center distance of each group of adjacent drill holes, and combining the diameters of each group of adjacent drill holes, using a preset spacing calculation formula to calculate the spacing between the outlines of the group of adjacent drill holes, and comparing it with the preset spacing value. It can be seen that with respect to drill hole size, density, and spacing, the present application can accurately check whether the corresponding design requirements are met through a certain calculation method, thereby ensuring that the drill hole design on the heat sink pad and / or solder mask pattern area meets the requirements.

[0187] In an optional embodiment, after determining that the size, density, and spacing of the drill holes in the target area meet the corresponding design requirements, the method may further include the following steps:

[0188] Step i1, determining the minimum bounding rectangle size information of the target area, and the smaller one is the width of the target area;

[0189] The corresponding design requirement for checking in this embodiment is that when the single-side size of a specific device is constant, the drilled holes in the heat dissipation pad or solder mask pattern area need to be designed as plugged holes.

[0190] Understandably, as electronic products evolve toward lighter, thinner, shorter, and smaller designs, PCBs are also becoming denser and more complex. Consequently, a large number of PCBs with high power consumption and high heat generation have emerged. Plug holes serve five primary functions: 1. Preventing tin from penetrating the component surface from the vias during wave soldering, causing short circuits; 2. Preventing flux residue from remaining in the drilled holes; 3. After SMT processing and component assembly at the electronics factory, the PCB must be vacuumed to create a negative pressure on the test machine before completion; 4. Preventing solder paste from flowing into the holes, causing cold solder joints and impacting placement; and 5. Preventing solder balls from ejecting during wave soldering, which could cause short circuits. For more information on plug holes, see Figure 9. The term "PLUGHOLE" in Figure 9 refers to a plug hole.

[0191] Specifically, the target area includes a heat dissipation pad and / or solder mask graphic area containing drilled holes. The corresponding minimum external rectangular frame size information has been obtained in the previous steps of this application through component packaging information, solder mask layer information and drilling layer information, etc., and will not be described in detail here.

[0192] Step i2: If the width of the target area is less than a preset width threshold, it indicates that the drilling on the target area meets the corresponding design requirements;

[0193] The preset width threshold may be set based on empirical values, such as 2 mm, and is not specifically limited here.

[0194] In step i3, if the width of the target area is greater than or equal to the preset width threshold, each drill hole in the target area is checked to see whether it has a plugged hole design; if so, it is determined that the drill holes in the target area have a plugged hole design and meet the corresponding design requirements; if not, it means that the drill holes in the target area do not have a plugged hole design, and the target area is checked to see whether it has a backside bright copper design.

[0195] If the target area width is greater than or equal to the preset width threshold, it indicates that the specific device has a fixed size on one side and requires plugging. If the drilled hole does not have plugging, further check whether the target area has backside bright copper design.

[0196] In the above embodiment, when the width of the target area is less than the preset width threshold, the drilled hole meets the corresponding design requirements and no further inspection is required. When the width of the target area is greater than or equal to the preset width threshold, the drilled holes in the thermal pad or solder mask pattern area need to be plugged, so it is necessary to check whether each drilled hole in the target area has a plugged hole design. If so, it is determined that the corresponding design requirements are met. If not, it is necessary to further check whether the target area has a backside bright copper design. This shows that the above inspection method can ensure that the corresponding design requirements are ultimately met for different target area widths.

[0197] In step i3, checking whether each drill hole in the target area has a plug hole design may include:

[0198] The coordinates of each graphic on the drilling layer in the target area are obtained, and the coordinates of the graphic are compared one by one with the coordinates of the plugging graphic on the plugging layer. If consistent coordinates of the plugging layer graphic are found, it is determined that the drilling hole corresponding to the graphic in the target area has a plugging design and meets the corresponding design requirements; if consistent coordinates of the plugging layer graphic cannot be found, it is determined that the drilling hole corresponding to the graphic in the target area has no plugging design.

[0199] Specifically, for a drill hole, if the coordinates of the pattern on the drill hole layer and the coordinates of the pattern on the plug hole layer are consistent, the hole is considered to have a plug hole. The embodiment of the present invention can sequentially traverse each drill hole in the target area to determine whether the drill hole has a plug hole design.

[0200] In the above embodiment, by obtaining the coordinates of each graphic on the drilling layer in the target area, comparing the coordinates of the graphic with the coordinates of the plugging graphic on the plugging layer one by one, and determining whether a consistent coordinate of the plugging layer graphic can be found, it is checked whether each drill hole in the target area has a plugging design, and the corresponding inspection purpose can be completed accurately and quickly.

[0201] Wherein, for step i3, checking whether the target area has a backside bright copper design may include the following steps:

[0202] Step j1, obtaining at least one reverse solder resist pattern area corresponding to the target area according to the center coordinates and vector coordinates of the solder resist pattern on the reverse side of the surface where the target area is located;

[0203] The design requirement for this implementation is that if the drilled holes in the thermal pad and / or solder mask pattern area are not plugged, then backside bright copper is required. For more information on backside bright copper, see Figure 10. In Figure 10, "BOT" represents the PCB bottom surface, and the target area corresponding to the dark rectangle has multiple drilled holes arranged in it. "NoPlugHole" indicates drilled holes without plugged holes, and "Open Opposite Side" indicates that the reverse solder mask pattern area is open.

[0204] The area of ​​the reverse solder resist graphic region corresponding to at least one of the target regions may be obtained by using a graphic area calculation algorithm based on the center coordinates and vector coordinates of the solder resist layer graphic on the reverse side of the surface where the target region is located.

[0205] For example, if a thermal pad is on the T side (i.e., the TOP side), it is necessary to check the opposite side of the T side, i.e., the B side (i.e., the Bottom side). Based on the center coordinates and vector coordinates of the solder mask pattern on the B side, the area of ​​at least one solder mask pattern area on the B side is determined using a graphic area calculation algorithm.

[0206] Step j2: If the overlapping area between the target area and any corresponding solder mask pattern area on the reverse side is greater than 0, it is determined that the heat dissipation pad has a backside bright copper design and meets the corresponding design requirements;

[0207] If the overlapping area between the target area and any corresponding solder mask pattern area on the reverse side is greater than 0, it indicates that the heat dissipation pad and / or solder mask pattern area have solder mask windows on the opposite side, i.e., there is bright copper on the reverse side, which meets the design requirements.

[0208] The calculation of the overlapping area is achieved by using a graphic overlapping comparison algorithm.

[0209] Step j3: If the overlapping area between the target area and all the corresponding solder mask graphic areas on the reverse side is equal to 0, it is determined that the heat dissipation pad has no back-side bright copper design, and the component number and component package name corresponding to the target area are recorded, and a redesign is prompted.

[0210] If the overlapping area between the target area and all the corresponding solder mask graphic areas on the reverse side is equal to 0, it means that there is no solder mask window on the opposite side of the heat dissipation pad and / or solder mask graphic area, that is, there is no bright copper on the back side, which does not meet the design requirements.

[0211] In the above embodiment, by determining the overlapping area between the target area and its corresponding reverse solder resist pattern area, it is possible to accurately and quickly determine whether the heat dissipation pad has a backside bright copper design, thereby determining whether it meets the corresponding design requirements.

[0212] In combination with the above description, a flow chart of executing the inspection steps in the embodiment of the present invention is exemplarily given, as shown in Figure 11. It should be noted that this flow chart is only an example of the inspection order in the embodiment of the present invention and does not constitute a limitation to the embodiment of the present invention.

[0213] The current industry lacks a review program for component thermal pads. During the actual use of finished PCBs, high heat generation often leads to poor PCB heat dissipation, resulting in impaired product functionality. To address this issue, an embodiment of the present invention proposes an inspection method for component thermal pad design. The method first reads the PCB design file, extracts packages containing thermal pads from the PCB design, and then performs an inspection step on the thermal pad for each screened package. The inspection step covers multiple inspection items in a specific inspection order. If any of the inspection items does not meet the corresponding design requirements, the thermal pad is determined to require redesign. If all of the inspection items meet their respective design requirements, the thermal pad is determined to meet all design requirements. The inspection order in the embodiment of the present invention is generated based on the design constraints between the multiple inspection items when meeting the thermal pad reliability requirements. Each inspection item has a corresponding inspection standard. Thermal pads that meet the design requirements can continue to be used, while those that do not meet the design requirements are given modification suggestions, thereby guiding designers to redesign according to the modification suggestions and re-inspect until the PCB design requirements are finally met. Among them, the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plug hole design and the back bright copper design, which can cover all possible heat dissipation pad design items in the PCB design. After the PCB design is completed, the method of the embodiment of the present invention can check whether the heat dissipation pad design meets the specifications through computer software and other means, and find out whether the design is reasonable in advance. At the same time, it can provide modification suggestions for the design end for reference, which not only ensures the unity of design and manufacturing, but also greatly shortens the new product development cycle, improves the yield rate, and can create more profits for the enterprise. The inspection sequence of the embodiment of the present invention can improve the inspection efficiency and accuracy, avoid missed inspections; and the automated inspection method can also avoid errors and omissions caused by manual inspections, and can also greatly reduce labor costs.

[0214] To facilitate understanding of the embodiments of the present invention, a specific embodiment is given below for illustrative purposes.

[0215] Example:

[0216] Step 1: Read the PCB design file into the system core data module.

[0217] To facilitate understanding, some explanations are first provided. In this embodiment, the PKG002 and PKG003 heat dissipation pads are rectangular, and their shapes are the same size as the minimum circumscribed rectangular frame; the PKG004 heat dissipation pad is an irregular polygon, and the solder mask graphic areas A1, A2, A3, and A4 are all rectangular, and their shapes are the same size as the minimum circumscribed rectangular frame. The solder mask graphic area on the back of PKG002 is also rectangular, and its shape is the same size as the minimum circumscribed rectangular frame. Therefore, in this embodiment, the MBR can be used directly to calculate the corresponding graphic area, etc., without the need to use the graphic vector coordinates. However, those skilled in the art need to understand that when performing graphic area calculations and other processing, using MBR can be used as an example of using graphic vector coordinates.

[0218] Among them, in the PCB design file:

[0219] The basic PCB information includes: PCB length is 50mm; PCB width is 40mm; PCB thickness is 1mm; number of signal layers is 2; signal layer copper thickness is 0.035mm;

[0220] PCB layer information, specifically including: circuit layer, solder mask layer, drill layer, plug layer, solder paste layer, coordinates, shape and size of all graphics on each layer; the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics.

[0221] Component information includes: component number, component coordinates and component package name; wherein the component coordinates include the center coordinates of the component and the vector coordinates of each point on the edge contour of the component;

[0222] The component packaging information includes: package name, package type and package graphic information; wherein the package graphic information includes component body information and pin pad information; the component body information includes the length, width and position of the body pad; the pin pad information includes the length, width, direction, position and number of the pin pad.

[0223] Specifically, in this embodiment, the PCB design file contains four packages. The PCB schematic is shown in Figure 12 , where D1, U1, U2, U3, and U4 are component designators. See Figure 13 for some of the component information, including the component designator, X coordinate, Y coordinate, angle, and package name. See Figure 14 for more information on component packaging.

[0224] Step 2: Filter out packages that include thermal pads.

[0225] The PCB design file contains four types of packages, and it is necessary to determine whether each package includes a thermal pad design.

[0226] 1) For the PKG001 package, please refer to Figure 15.

[0227] In Figure 15, 1, 2, and 3 represent pin pads. From the PCB design file, we can see that pins 1 and 2 are MBR (0.406, 0.457), and Area: 0.1855mm 2 Rectangular; 3 pins are MBR (0.508, 0.457), Area: 0.2322mm 2 Rectangle; where MBR(,) represents the minimum bounding rectangle size information of the heat dissipation pad, and Area represents the area.

[0228] The calculated ratio of the maximum pad area to the minimum pad area of ​​the PKG001 package is 0.2322 / 0.1855=1.25, which is less than the preset ratio of 8. Therefore, the package does not include a heat dissipation pad design.

[0229] 2) For the PKG002 package, please refer to Figure 16.

[0230] The 1 to 32 pins of the PKG002 package are all MBR (0.254mm, 0.610mm), Area: 0.1549mm 2 Rectangular, 33-pin pad is MBR (5.207, 5.207), Area: 27.1128mm 2 The ratio of the area of ​​the largest pad to the area of ​​the smallest pad is 27.1128 / 0.1549=175, which is greater than the preset ratio of 8. The PKG002 package includes a heat dissipation pad design, and the 33-pin pad is a heat dissipation pad.

[0231] 3) Similarly, according to the above judgment method, PKG003 and PKG004 are both packages with heat dissipation pad design.

[0232] Step 3: Check whether the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirements.

[0233] The PCB is a two-layer design. The component package PKG002 is QFP32. The thermal resistance value is 115°C / W, as found in the correspondence between component package and thermal resistance. Substituting the thermal resistance value of 115°C / W into the preset formula, the minimum copper foil area corresponding to the heatsink pad that meets the thermal resistance requirement is calculated as:

[0234]

[0235] The thermal pad corresponds to the QFP32 package and has two bit numbers U1 and U2. For U1 and U2, obtain the area of ​​all graphics on the surface circuit layer connected to the thermal pad respectively, and sum them to obtain the actual copper foil area of ​​the thermal pad;

[0236] Specifically, according to the pattern area calculation algorithm, the sum of the pattern areas on the front and back circuit layers connected to the heat dissipation pad of U1 is obtained: SU1 = 10.24 + 152.5 = 162.74 mm 2 , corresponding to the actual copper foil area of ​​U1, denoted as SU1;

[0237] According to the pattern area calculation algorithm, the sum of the areas of the patterns on the front and back circuit layers connected to the heat dissipation pad of U2 is obtained: SU2 = 10.24 + 144.2 = 154.44 mm 2 , corresponding to the actual copper foil area of ​​U2, expressed as SU2.

[0238] For U1 and U2, determine whether the actual copper foil area of ​​the heat dissipation pad is greater than or equal to the calculated minimum copper foil area;

[0239] Specifically, SU1>S min , indicating that the copper foil area of ​​U1 heat sink pad meets the thermal resistance requirements; SU2>S min , indicating that the copper foil area of ​​the U2 heat sink pad meets the thermal resistance requirement; therefore, the copper foil area of ​​the heat sink pad in package PKG002 meets the thermal resistance requirement.

[0240] Similarly, a similar method can be used to determine that the heat dissipation pad designs of PKG003 and PKG004 both meet the thermal resistance requirements.

[0241] Step 4: Determine whether the size of the heat dissipation pad is within a specific heat dissipation pad size range. If so, check whether the heat dissipation pad has a solder bridge design; if not, check whether the heat dissipation pad has an air guide groove design;

[0242] The MBR (3.000, 3.000) of the heat sink pad of the PKG003 package can be obtained from the component package information. The length L1 and width W1 of the heat sink pad are both 3mm. Since L1>2.5mm and W1>2mm, the size of the heat sink pad is within the specific heat sink pad size range, and it is necessary to check whether there is a solder bridge design.

[0243] Specifically, for the heat dissipation pad, the heat dissipation pad graphic area is obtained according to its center coordinates (0, 0) and MBR (3.000, 3.000). At the same time, according to the center coordinates and MBR of the graphics in the solder mask layer, a total of 4 solder mask graphic areas A1, A2, A3, and A4 are obtained. As shown in Figure 19, the following data can be obtained.

[0244] A1: Center coordinates (-0.600, 0.850), MBR (2.000, 1.500);

[0245] A2: Center coordinates (1.100, 0.850), MBR (1.000, 1.500);

[0246] A3: Center coordinates (-0.600, -0.850), MBR (2.000, 1.500);

[0247] A4: Center coordinates (1.100, -0.850), MBR (1.000, 1.500);

[0248] By calculating the pattern overlap comparison algorithm, it can be concluded that the overlapping area between the heat dissipation pad pattern area and the solder mask pattern area A1 is 1.9*1.4=2.66mm 2 The overlapping area with the solder mask pattern area A2 is 0.9*1.4=1.26mm 2 The overlapping area with the solder mask pattern area A3 is 1.9*1.4=2.66mm 2 The overlapping area with the solder mask pattern area A4 is 0.9*1.4=1.26mm 2 If the overlapping areas of the heat dissipation pad graphic area and the four solder mask graphic areas are all greater than 0, it means that the heat dissipation pad has a solder mask window design, and the number of solder mask graphic areas whose overlapping areas with the heat dissipation pad graphic area are greater than 0 is 4, indicating that there is a solder mask bridge design on the heat dissipation pad.

[0249] Similarly, the number of solder mask pattern areas in the thermal pad pattern area of ​​PKG002 and PKG004 is 1, indicating a design without solder mask bridges.

[0250] If the size of the heat sink pad is not within the specified heat sink pad size range, check whether the heat sink pad has an air guide groove design. If the heat sink pad does not have a solder bridge design, it is also necessary to check whether the heat sink pad has an air guide groove design. Checking whether the heat sink pad has an air guide groove design is described in the subsequent step 6 of the present invention.

[0251] Step 5. After determining that there is a solder bridge design on the heat dissipation pad, determine whether the area of ​​the solder mask pattern area is larger than the specific pattern area. If so, check whether there are drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check whether the size, density and spacing of the drill holes meet the corresponding design requirements.

[0252] Specifically, the areas of all solder mask graphic areas within the corresponding range of the PKG 003 package heat dissipation pad are obtained as SA1 = 2*1.5 = 3mm 2 SA2 = 1 * 1.5 = 1.5 mm 2、SA3=2*1.5=3mm 2 、SA4=1*1.5=1.5mm 2 , judge one by one whether its area is larger than the specific graphic area 2.5mm 2 The areas of solder mask pattern areas A1 and A3 are both larger than 2.5mm 2 , the area of ​​A2 and A4 is less than 2.5mm 2 ;

[0253] It is necessary to continue to determine whether there is a drilling design for solder mask graphic areas A1 and A3, and no determination is made for solder mask graphic areas A2 and A4. According to the center coordinates (-0.600, 0.850) and MBR (2.000, 1.500) of solder mask graphic area A1, and the center coordinates (-0.600, -0.850) and MBR (2.000, 1.500) of solder mask graphic area A3, the areas of the respective solder mask graphic areas are obtained; according to the center coordinates (-0.600, 0.850) and diameter 0.254 of the drilling layer graphic D1, and the center coordinates (-0.600, 0.850) and diameter 0.254 of the drilling layer graphic D2, the areas of the corresponding drilling graphic areas are obtained. The overlapping area of ​​the solder mask graphic area A1 and the drilling graphic area D1 is calculated to be 0.0507mm by the graphic overlap comparison algorithm. 2 , greater than 0, the overlapping area of ​​the solder mask pattern area A3 and the drilling pattern area D2 is 0.0507mm 2 , greater than 0, indicating that the solder mask pattern areas A1 and A2 have drilling designs. See Figure 18.

[0254] Step 6: Check whether the heat sink pad on the package has an air guide groove design.

[0255] Obtain the thermal pad pattern for PKG004. Based on the thermal pad's MBR (4.000, 6.000), the larger value is length L1 = 6 mm and the smaller value is width W1 = 4 mm. Using the pattern overlap comparison algorithm, three gaps are found, as shown in Figure 19. The white rectangular areas represent the gaps.

[0256] Then, according to the vector coordinates of the heat dissipation pad graphic, the center coordinates of the key points of the left rectangular area are obtained: A(-3.000, 0.100), B(0.000, 0.100), C(-3.000, -0.100), and D(0.000, -0.100), and the gap length L is calculated. q =AB=2mm, gap width W q =AC=0.2mm. Similarly, the length and width of the other two gaps are the same.

[0257] Due to the gap width W q The ratio W to the width W1 of the heat dissipation padq / W1=0.2 / 4=0.05, less than 10%, and the gap length L q Ratio L to the width L1 of the heat dissipation pad q / L1=2 / 6≈0.3333, which is greater than 30%, indicating that there is an air guide groove design.

[0258] Similarly, if there is no gap when overlapping the PGK002 graphic and its minimum circumscribed rectangular frame, there is no air guide groove design.

[0259] Step 7. Check whether there is a drilling design on the thermal pad of the package.

[0260] The heat dissipation pad area is obtained according to the center coordinates (0.000, 0.000) and MBR (3.200, 3.200) of the PKG002 heat dissipation pad. At the same time, the drilling pattern area is obtained according to the center coordinates and MBR of the drilling layer pattern. There are five drilling patterns in total: D1 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D2 center coordinates (1.000, 1.000) and MBR (0.254, 0.254), D3 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D4 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D5 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D6 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D7 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D8 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D9 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D10 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D11 center coordinates (-1.000, 1.000) and MBR (0.254, 0.254), D12 center coordinates ( The center coordinates of D4 are (0.000, 0.000) and MBR are (0.254, 0.254), the center coordinates of D4 are (-1.000, -1.000) and MBR are (0.254, 0.254), and the center coordinates of D5 are (1.000, -1.000) and MBR are (0.254, 0.254). The overlapping areas of the heat dissipation pad area and the drilling patterns D1, D2, D3, D4, and D5 are calculated by the graphic overlap comparison algorithm to be 0.0507mm. 2 , are all greater than 0, it means that the heat dissipation pad has a drilling design, as shown in Figure 20.

[0261] Step 8: Check whether the size, density and spacing of the holes drilled in the target area meet the design requirements.

[0262] The target area includes a heat sink pad with a drilled hole and / or a solder mask pattern area. For example, the target area is a heat sink pad with a drilled hole, which may specifically include:

[0263] In step 8.1, based on the size of the drill hole pattern on the PKG002 thermal pad, the drill hole diameter D0 is 0.254 mm, which is within the preset diameter range of 0.2 to 0.4 mm and meets the design requirements for the drill hole diameter.

[0264] Step 8.2: The number of drilled holes in the heat dissipation pad is 5 and the area of ​​the heat dissipation pad is 10.24mm. 2 Calculate the number of holes drilled per unit area of ​​the heat sink pad and get the actual drilling density = 5 / 10.24 = 0.488 holes / mm 2, greater than the drilling density threshold of 0.25 per mm 2 , then the design requirements of drilling density are met.

[0265] Step 8.3, according to the coordinates of the nearest holes D1 and D3 on the heat sink (-1.000, 1.000) and (0.000, 0.000), get the center distance The dimensions of adjacent drill holes show that both have a diameter of 0.254 mm. The spacing between their edges, d2 = d1 - 0.254 / 2 - 0.254 / 2 = 1.16 mm, which is greater than the preset spacing of 0.6 mm and meets the design requirements for drill hole spacing. For further information, see Figure 21.

[0266] Similarly, the corresponding solder mask pattern areas A1 and A3 on the PKG003 thermal pad have drill holes D1 and D2, respectively. Refer to Figure 18 for understanding. The diameter of the drill holes is 0.254mm, which is within the preset diameter range of 0.2 to 0.4mm, thus meeting the aperture design requirements. Through the pattern overlap comparison algorithm, it is found that the number of drill hole patterns in solder mask pattern areas A1 and A3 is 1, and the area of ​​the solder mask pattern area is 3mm. 2 The number of holes drilled per unit area of ​​the solder mask pattern, i.e. the actual density of holes = 1 / 3 = 0.3333 holes / mm 2 , greater than the drilling density threshold of 0.25 per mm 2 , the design requirements of drilling density are met; according to the coordinates of the nearest adjacent drilling holes on the heat sink pad (-0.520, 0.770) and (-0.520, -0.770), the center distance is:

[0267] The sizes of adjacent drill holes result in a drill hole diameter of 0.254 mm, and the spacing between their edges is d2 = 1.54-0.254 / 2-0.254 / 2 = 1.286 mm, which is larger than the preset spacing value of 0.6 mm, that is, it meets the design requirements of the drill hole spacing.

[0268] Step 9: The holes of the thermal pads of a specific size need to be plugged.

[0269] According to the MBR (3.200, 3.200) of the PKG002 thermal pad, its length L1 = 3.2 mm and width W1 = 3.2 mm are obtained. Since its width W1 is greater than the preset width threshold of 2 mm, it means that the hole of the thermal pad needs to be plugged.

[0270] Get the coordinates of the graphics on the drill layer in the thermal pad corresponding to position U1 of PKG002, including: D1 center coordinate (-1.000, 1.000), D2 center coordinate (1.000, 1.000), D3 center coordinate (0.000, 0.000), D4 center coordinate (-1.000, -1.000), D5 center coordinate (1.000, -1.000);

[0271] Get the coordinates of the graphics on the plug hole layer in the thermal pad, specifically including: S1 center coordinate (-1.000, 1.000), S2 center coordinate (1.000, 1.000), S3 center coordinate (0.000, 0.000), S4 center coordinate (-1.000, -1.000), S5 center coordinate (1.000, -1.000).

[0272] If the coordinates of the pattern on the drilled hole layer and the pattern on the plugged hole layer match, calculated using a pattern overlap comparison algorithm, the hole is considered plugged and meets the design requirements. Refer to Figure 22 for more information.

[0273] Similarly, the MBRs for solder mask pattern areas A1, A2, A3, and A4 on the PKG003 thermal pad are A1(2.000, 1.500), A2(1.000, 1.500), A3(2.000, 1.500), and A4(1.000, 1.500), respectively. Their widths are 1.5mm, 1mm, 1.5mm, and 1mm, respectively. These are all less than the preset width threshold of 2mm, meaning that plugging is not necessary and the design meets the requirements. See Figure 23 for more information.

[0274] Step 10: If the holes on the thermal pad and / or solder mask pattern area are not plugged, bright copper on the back side is required.

[0275] If there is no plug hole pattern in the thermal pad of PKG002 corresponding to position U2, it is considered that the thermal pad of the component has no plug hole, and it is necessary to further determine whether its back side has bright copper.

[0276] Since U2 is designed on the T side, it is necessary to check whether there is a solder mask pattern at the coordinate on the reverse side, that is, the B side, that is, to determine whether U2 has a reverse solder mask pattern area.

[0277] According to the center coordinates (0.000, 0.000) and MBR (3.300, 3.300) of the solder mask pattern on the reverse side of the component, a reverse solder mask pattern area is obtained. The overlapping area of ​​the reverse solder mask pattern area and the heat dissipation pad pattern area is calculated by the pattern overlap algorithm to be 3*3=9mm. 2 If the value is greater than 0, it means that the heatsink has bright copper on the back side, which meets the design requirements. Please refer to Figure 24(a) and Figure 24(b) for understanding this part.

[0278] The above is an implementation process of a specific example of the inspection method for component heat dissipation pad design provided by an embodiment of the present invention. It can be seen that the embodiment of the present invention can automatically implement the inspection of various inspection items of the heat dissipation pad in a certain inspection order, thereby improving the efficiency and accuracy of the inspection.

[0279] In a second aspect, corresponding to the above method embodiment, an embodiment of the present invention further provides an inspection device for component heat dissipation pad design, as shown in FIG25 , comprising:

[0280] The information reading and heat dissipation pad screening module 2501 is used to read the PCB design file and screen out the packages containing the heat dissipation pad according to the PCB design file; wherein the PCB design file includes the basic information of the PCB, the information of each layer of the PCB, the component information and the component packaging information;

[0281] The thermal pad inspection module 2502 is configured to perform an inspection step on the thermal pad of each screened package, wherein the inspection step covers multiple inspection items in a certain inspection order. If any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned. If all of the inspection items meet their respective design requirements, it is determined that the thermal pad meets all design requirements.

[0282] Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat dissipation pad; the multiple inspection items at least include the copper foil area design of the heat dissipation pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat dissipation pad, the plugging design and the back bright copper design.

[0283] For details, please refer to the relevant content of the inspection method for component heat dissipation pad design described in the first aspect, which will not be repeated here.

[0284] In a third aspect, an embodiment of the present invention further provides an electronic device, as shown in FIG26 , including a processor 2601, a communication interface 2602, a memory 2603, and a communication bus 2604, wherein the processor 2601, the communication interface 2602, and the memory 2603 communicate with each other through the communication bus 2604.

[0285] The memory is used to store computer programs;

[0286] The processor is configured to implement, when executing the program stored in the memory, any of the steps of the inspection method for component heat dissipation pad design provided in the first aspect of the embodiment of the present invention.

[0287] The communication bus mentioned in the above electronic device may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus may be divided into an address bus, a data bus, a control bus, etc.

[0288] The communication interface is used for communication between the above electronic device and other devices.

[0289] The memory may include a random access memory (RAM) or a non-volatile memory (NVM), such as at least one disk memory.

[0290] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), etc.

[0291] The method provided in the embodiment of the present invention can be applied to electronic devices. Specifically, the electronic devices can be: desktop computers, portable computers, smart mobile terminals, servers, etc., which are not limited here.

[0292] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps of any inspection method for component heat dissipation pad design provided in the first aspect of the embodiment of the present invention.

[0293] For the device / electronic device / storage medium embodiments, the specific implementation principles, processes and technical effects are similar to those of the method embodiments and will not be repeated here.

[0294] The above description is a further detailed description of the present invention in conjunction with specific preferred embodiments. The specific implementation of the present invention is not limited to these descriptions. Those skilled in the art may combine and combine the different embodiments or examples described in this specification. Those skilled in the art may also make several simple deductions or substitutions without departing from the scope of the present invention, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A method for inspecting the design of heat dissipation pads of components, characterized in that: include: Reading a PCB design file, and screening out a package containing a heat dissipation pad according to the PCB design file; wherein the PCB design file includes basic PCB information, information of each layer of the PCB, component information, and component packaging information; For each screened thermal pad of the package, an inspection step is performed on the thermal pad, wherein the inspection step covers multiple inspection items in a certain inspection order, and when any of the inspection items does not meet the corresponding design requirements, it is determined that the thermal pad needs to be redesigned, and when the multiple inspection items all meet their respective corresponding design requirements, it is determined that the thermal pad meets all design requirements; Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat sink pad; the multiple inspection items at least include the copper foil area design of the heat sink pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat sink pad, the plugging design and the back bright copper design.

2. The inspection method for component heat dissipation pad design according to claim 1, characterized in that: The basic information of the PCB includes: PCB length, PCB width, PCB thickness, number of signal layers and signal layer copper thickness; The information of each layer of the PCB includes: the circuit layer, solder mask layer, drilling layer, plugging layer, solder paste layer, coordinates, shapes and sizes of all graphics on each layer; wherein the coordinates of the graphics include the center coordinates of the graphics and the vector coordinates of each point on the edge contour of the graphics; The component information includes: component number, component coordinates and component package name; wherein the component coordinates include the center coordinates of the component and the vector coordinates of each point on the edge contour of the component; The component packaging information includes: package name, package type and package graphic information; wherein the package graphic information includes component body information and pin pad information; the component body information includes the length, width and position of the body pad; the pin pad information includes the length, width, direction, position and number of the pin pad.

3. The inspection method for component heat dissipation pad design according to claim 2, characterized in that: The step of selecting a package including a heat dissipation pad according to the PCB design file includes: Acquire the area of ​​the body pad and all the pin pads in each package according to the solder paste layer; For each package, calculate the ratio between the area of ​​the largest pad and the area of ​​the smallest pad in the package; When it is determined that the ratio is greater than the preset ratio, it is determined that the largest pad in the package is a heat dissipation pad, and the package is a package including a heat dissipation pad.

4. The inspection method for component heat dissipation pad design according to claim 2, characterized in that: The step of inspecting the heat dissipation pad includes: According to the package type corresponding to the heat dissipation pad in the component package information and the number of signal layers in the PCB basic information, determine the target thermal resistance value corresponding to the component package to which the heat dissipation pad belongs from the preset correspondence between the component package and the thermal resistance; Substituting the target thermal resistance value into a preset formula, calculating the minimum copper foil area corresponding to the heat dissipation pad that meets the thermal resistance requirement; Obtaining all graphic areas on the surface circuit layer to which the heat dissipation pad is connected, and summing them up to obtain the actual copper foil area of ​​the heat dissipation pad; Determine whether the actual copper foil area of ​​the heat dissipation pad is greater than or equal to the calculated minimum copper foil area; If so, it is determined that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirements; if not, it is determined that the copper foil area of ​​the heat dissipation pad does not meet the thermal resistance requirements, and the component position number and component package name corresponding to the heat dissipation pad are recorded, indicating that the heat dissipation pad needs to be redesigned.

5. The inspection method for component heat dissipation pad design according to claim 4, characterized in that: After determining that the copper foil area of ​​the heat dissipation pad meets the thermal resistance requirement, the step of inspecting the heat dissipation pad further includes: Based on the component packaging information, the minimum circumscribed rectangular frame size information of the heat dissipation pad is obtained; the minimum circumscribed rectangular frame size information of the heat dissipation pad includes the size of the maximum outer contour of the heat dissipation pad in the X and Y directions; Determine that the larger value and the smaller value in the minimum circumscribed rectangular frame size information of the heat dissipation pad are respectively the length and the width of the heat dissipation pad; Determining whether the size of the heat dissipation pad is within a specific heat dissipation pad size range according to the length and width of the heat dissipation pad; If yes, check whether the heat dissipation pad has a solder bridge design; if no, check whether the heat dissipation pad has an air guide groove design.

6. The inspection method for component heat dissipation pad design according to claim 5, characterized in that: The checking whether the heat dissipation pad has a solder bridge design includes: Obtaining a corresponding heat dissipation pad graphic area according to the center coordinates and vector coordinates of the heat dissipation pad; Obtain at least one solder mask graphic area according to the center coordinates and vector coordinates of the graphics in the solder mask layer; If the overlapping area of ​​the heat dissipation pad graphic area and all solder mask graphic areas is equal to 0, it is determined that the heat dissipation pad has no solder mask window design and no solder mask bridge design; if the overlapping area of ​​the heat dissipation pad graphic area and any solder mask graphic area is greater than 0, it is determined that the heat dissipation pad has a solder mask window design; When it is determined that the heat dissipation pad has a solder resist window design, if the number of solder resist graphic areas whose overlapping area with the heat dissipation pad graphic area is greater than 0 is greater than or equal to 2, it is determined that there is a solder resist bridge design on the heat dissipation pad; if the number of solder resist graphic areas whose overlapping area with the heat dissipation pad graphic area is greater than 0 is less than 2, it is determined that there is no solder resist bridge design on the heat dissipation pad.

7. The inspection method for component heat dissipation pad design according to claim 6, characterized in that: After determining that there is a solder bridge design on the heat dissipation pad, the step of inspecting the heat dissipation pad further includes: For each solder resist pattern region within the range corresponding to the heat dissipation pad, determine whether the area of ​​the solder resist pattern region is greater than a specific pattern area; If yes, check whether there are drill holes in the solder mask pattern area. If there are drill holes, count the number of drill holes and check whether the size, density and spacing of the drill holes meet the corresponding design requirements. If there are no drill holes, record the component number and component package name corresponding to the heat dissipation pad where the solder mask pattern area is located, and prompt that the heat dissipation pad needs to be redesigned. If not, it is determined to be a normal design and no inspection or judgment is required.

8. The inspection method for component heat dissipation pad design according to claim 7, characterized in that: The checking whether there is a drilling hole in the solder mask pattern area includes: Obtain at least one drilling pattern area according to the center coordinates and vector coordinates of the drilling layer pattern; If the overlapping area between the solder resist pattern area and any drilling pattern area is greater than 0, it is determined that there is a drilling hole in the solder resist pattern area; If the overlapping areas of the solder resist pattern area and all the drilling pattern areas are equal to 0, it is determined that there is no drilling in the solder resist pattern area.

9. The inspection method for component heat dissipation pad design according to claim 6, characterized in that: After determining that the heat dissipation pad has no solder bridge design, the step of performing an inspection on the heat dissipation pad further includes: inspecting whether the heat dissipation pad has an air guide groove design.

10. The inspection method for component heat dissipation pad design according to claim 6 or 9, characterized in that: The checking whether the heat dissipation pad has an air guide groove design includes: Overlapping and comparing the heat dissipation pad graphic area corresponding to the heat dissipation pad with the minimum circumscribed rectangular frame of the heat dissipation pad to determine whether there is a gap; wherein the excess part of the minimum circumscribed rectangular frame of the heat dissipation pad compared to the heat dissipation pad graphic area corresponding to the heat dissipation pad is the gap; If there is no gap, it is confirmed that the heat sink pad has no air guide groove design; If there is a gap, the length and width of the gap are calculated, and the number of gaps is counted; if the number of gaps is greater than or equal to 3, and the ratio of the gap width to the width of the heat dissipation pad is less than the first preset percentage, and the ratio of the gap length to the length of the heat dissipation pad is greater than the second preset percentage, it is determined that the heat dissipation pad has an air guide groove design and meets the corresponding design requirements; otherwise, it is determined that the heat dissipation pad has no air guide groove design.

11. The inspection method for component heat dissipation pad design according to claim 10, characterized in that: After determining that the heat dissipation pad has no air guide groove design, the step of inspecting the heat dissipation pad further includes: Obtain at least one drilling pattern area according to the center coordinates and vector coordinates of the drilling layer pattern; Calculate the overlapping area of ​​the heat dissipation pad graphic area corresponding to the heat dissipation pad and any drilling graphic area; If the overlapping area between the heat dissipation pad pattern area and any drilling pattern area is greater than 0, it is determined that the heat dissipation pad The plate has a drilling design, the number of holes is counted, and the size, density and spacing of the holes are checked to see if they meet the corresponding design requirements; If the overlapping area between the heat dissipation pad graphic area and all drilling areas is equal to 0, it is determined that the heat dissipation pad has no drilling design, and the component number and component package name corresponding to the heat dissipation pad are recorded, indicating that the heat dissipation pad needs to be redesigned.

12. The inspection method for component heat dissipation pad design according to claim 7 or 11, characterized in that: The checking of whether the size, density and spacing of the drill holes meet the corresponding design requirements includes: The step of checking the size of the drill hole includes: obtaining the diameter of the drill hole from the information of the drill hole layer in the information of each layer of the PCB, and judging whether the diameter of the drill hole is within a preset diameter range; if so, determining that the drill hole diameter meets the corresponding design requirements, and if not, recording the position of the drill hole, and prompting that the drill hole needs to be redesigned; The step of checking the drilling density includes: obtaining the number of drilling holes and the area of ​​the target area where the drilling holes are located; calculating the number of drilling holes per unit area of ​​the target area to obtain the actual drilling density; judging whether the actual drilling density is greater than the drilling density threshold of the target area; if so, determining that the drilling density meets the corresponding design requirements, and if not, proposing modification suggestions for adding drilling holes; wherein the target area includes the heat dissipation pad and / or solder mask pattern area containing the drilling holes; The step of checking the spacing between drilling holes comprises: when the number of drilling holes in the target area is less than 2, determining that the spacing between drilling holes meets the corresponding design requirements; when the number of drilling holes in the target area is greater than or equal to 2, calculating the center distance of each group of adjacent drilling holes according to the center coordinates of the group of adjacent drilling holes; calculating the spacing between the contours of the group of adjacent drilling holes according to the center distance of the group of adjacent drilling holes and the respective diameters of the group of adjacent drilling holes using a preset spacing calculation formula; if the spacing between the contours of the group of adjacent drilling holes is greater than the preset spacing value, determining that the spacing between the contours of the group of adjacent drilling holes meets the corresponding design requirements, if not, recording the respective positions of the group of adjacent drilling holes and the spacing between the contours of the group of adjacent drilling holes, and proposing modification suggestions.

13. The inspection method for component heat dissipation pad design according to claim 12, characterized in that: After determining that the size, density and spacing of the drill holes in the target area meet the corresponding design requirements, the method further includes: Determine the minimum bounding rectangle size information of the target area, the smaller one is the width of the target area; If the width of the target area is less than the preset width threshold, it means that the drilling on the target area meets the corresponding design requirements; If the width of the target area is greater than or equal to the preset width threshold, check whether each drill hole in the target area has a plug hole design; if so, determine that the drill holes in the target area have a plug hole design, which meets the corresponding design requirements; if not, it means that the drill holes in the target area have no plug hole design, and check whether the target area has a back bright copper design.

14. The inspection method for component heat dissipation pad design according to claim 13, characterized in that: Check whether each drill hole in the target area has a plug hole design, including: Obtain the coordinates of each pattern on the drilling layer in the target area, and compare the coordinates of the pattern with the coordinates of the plugging pattern on the plugging layer one by one. If the coordinates of the plugging layer pattern are consistent, it is determined that the drill hole corresponding to the pattern on the target area has a plugging design and meets the corresponding design requirements; if the coordinates of the plugging layer pattern cannot be found, it is determined that the The drilled hole design corresponding to this pattern on the target area is not plugged.

15. The inspection method for component heat dissipation pad design according to claim 13, characterized in that: Check if the target area has a backside bright copper design, including: Obtaining at least one reverse solder resist pattern area corresponding to the target area according to the center coordinates and vector coordinates of the solder resist layer pattern on the reverse side of the surface where the target area is located; If the overlapping area between the target area and any corresponding solder mask pattern area on the reverse side is greater than 0, it is determined that the heat dissipation pad has a back bright copper design and meets the corresponding design requirements; If the overlapping area between the target area and all the corresponding solder mask graphic areas on the reverse side is equal to 0, it is determined that the heat dissipation pad has no back bright copper design, and the component number and component package name corresponding to the target area are recorded, indicating that redesign is required.

16. An inspection device for component heat dissipation pad design, characterized in that: include: An information reading and heat dissipation pad screening module, used to read a PCB design file and screen out packages containing heat dissipation pads according to the PCB design file; wherein the PCB design file includes PCB basic information, PCB layer information, component information and component packaging information; A heat dissipation pad inspection module is used to perform an inspection step on the heat dissipation pad for each screened package, wherein the inspection step covers multiple inspection items in a certain inspection order, and when any of the inspection items does not meet the corresponding design requirements, it is determined that the heat dissipation pad needs to be redesigned, and when the multiple inspection items all meet their respective corresponding design requirements, it is determined that the heat dissipation pad meets all design requirements; Among them, the inspection order is generated based on the design constraints between the multiple inspection items when meeting the reliability requirements of the heat sink pad; the multiple inspection items at least include the copper foil area design of the heat sink pad, the solder mask bridge design, the solder mask window area design, the drilling design in the solder mask window, the air guide groove design, the drilling design on the heat sink pad, the plugging design and the back bright copper design.

17. An electronic device, characterized in that: It includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; The memory is used to store computer programs; The processor is used to implement the method steps described in any one of claims 1-15 when executing the program stored in the memory.

18. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps described in any one of claims 1 to 15 are implemented.

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