Probe card and test machine

Abstract

The utility model provides a probe card and a test bench, the probe card comprises a bearing part, a probe part, a detection control part and an elastic connection part, the bearing part is provided with a groove, the probe part is movably arranged in the groove and is electrically connected with the bearing part, and the probe part is used for transmitting a detection signal of the bearing part to a wafer and transmitting a feedback signal of the wafer to the bearing part. The detection control part is arranged on the bearing part and / or the probe part and used for adjusting the position relation between the probe part and the bearing part, detecting the distance between the wafer and the bearing part or the distance between the wafer and the probe part and changing the position of the probe part relative to the bearing part when the preset distance is reached. The elastic connecting part is arranged between the probe part and the groove and is used for supporting the probe part and applying a force for moving in the direction opposite to the wafer to the probe part, and the probe part moves in the direction opposite to the wafer under the action of the elastic connecting part when needle collision is about to occur, so that needle collision is greatly avoided, and the probability that the probe is bent or seriously worn due to collision is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a probe card and a testing machine. Background Art

[0002] Currently, wafer acceptance testing is carried out through testing machines to determine whether the wafer meets the electrical specification requirements of the process technology platform, thereby reflecting the actual production situation of the production line.

[0003] The test machine includes a probe station and a probe card. The probe card is the data transmission interface between the test machine and the wafer. The probe card cannot move, and the wafer is moved up, down, left, and right by the probe station to complete the needle test. However, if the wafer moves up and down significantly, it is easy to hit the needle, which will cause the probes on the probe card to bend or be severely worn.

[0004] Therefore, it is necessary to provide a new type of probe card and testing machine to solve the above problems existing in the prior art. Utility Model Content

[0005] The utility model aims to provide a probe card and a testing machine, which can greatly reduce the probability of bending or severe wear of the probe due to collision.

[0006] To achieve the above-mentioned purpose, the probe card of the utility model includes a carrying part, a probe part, a detection control part and an elastic connecting part. The carrying part is provided with a groove, and the probe part is movably arranged in the groove and electrically connected to the carrying part, so as to transmit the detection signal of the carrying part to the wafer, and transmit the feedback signal of the wafer to the carrying part. The detection control part is arranged on the carrying part and / or on the probe part, so as to adjust the positional relationship between the probe part and the carrying part and detect the distance of the wafer relative to the carrying part or the distance of the wafer relative to the probe part, and change the position of the probe part relative to the carrying part when the preset distance is reached. The elastic connecting part is arranged between the probe part and the groove, so as to support the probe part and apply a force to the probe part to move in the direction away from the wafer.

[0007] Optionally, the probe part includes a fixed part, a plurality of probes and a plurality of sliding contacts, wherein the plurality of probes are arranged on a side of the fixed part facing the wafer, the plurality of sliding contacts are arranged on the fixed part, the plurality of sliding contacts are electrically connected to the plurality of probes one by one, and the plurality of sliding contacts are electrically connected to the carrying part.

[0008] Optionally, a plurality of fixed contacts are arranged on the inner side wall of the groove, and when the probe part slides or is fixed, the plurality of fixed contacts are in electrical contact with the plurality of sliding contacts in a one-to-one correspondence; or,

[0009] A strip-shaped fixed contact is arranged on the inner side wall of the groove, and the length direction of the fixed contact is arranged along the movable direction of the probe part, and the sliding contact is always in electrical contact with the strip-shaped fixed contact.

[0010] Optionally, the detection control part includes a sensor unit and a control unit, the sensor unit is arranged on a side of the carrying part facing the wafer, and is used to detect the distance of the wafer relative to the carrying part or the distance of the wafer relative to the probe part; the control unit is arranged on the carrying part, and is used to fix the probe part, and cancel the fixation of the probe part when a preset distance is reached between the wafer and the probe part or between the wafer and the carrying part.

[0011] Optionally, the control unit includes at least one control subunit, which includes a snap rod and an electromagnetic switch, the snap rod being used to fix the probe part, and the electromagnetic switch being used to drive the snap rod to move when turned on or off to change the fixing state of the snap rod to the probe part.

[0012] Optionally, the electromagnetic switch comprises a matching part and an electromagnet, the matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate suction force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move; or,

[0013] The matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate a repulsive force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move.

[0014] Optionally, the control subunit further comprises a reset spring for resetting the buckle rod when the electromagnet is turned on or off, so as to change the fixing state of the probe part.

[0015] Optionally, the elastic connection portion includes at least one supporting spring and at least two positioning structures, and the positioning structure is arranged in the groove and cooperates with the supporting spring to limit the movement of the probe portion in directions toward and away from the wafer.

[0016] Optionally, the positioning structure is a positioning column, the probe part includes a fixing part, the probe part includes a fixing part, a plurality of probes and a plurality of sliding contacts, the plurality of probes are arranged on a side of the fixing part facing the wafer, the plurality of sliding contacts are arranged on the fixing part, the plurality of sliding contacts are connected to the plurality of probes in a one-to-one correspondence, at least two positioning holes are opened on the fixing part, the positioning columns are arranged in a one-to-one correspondence with the positioning holes, and the positioning columns are arranged in the positioning holes.

[0017] The utility model also provides a testing machine, comprising a probe station and the probe card.

[0018] The beneficial effect of the utility model lies in that the detection control part is arranged on the carrying part and / or the probe part, and is used to adjust the positional relationship between the probe part and the carrying part and detect the distance between the wafer relative to the carrying part or the wafer relative to the probe part, and when the preset distance is reached, the position of the probe part relative to the carrying part is changed, and the probe part will move back to the wafer under the action of the elastic connecting part, thereby greatly avoiding the pin collision and reducing the probability of the probe being bent or severely worn due to collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the probe card in some embodiments of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure of the control subunit in some embodiments of the present utility model;

[0021] Figure 3 It is a structural schematic diagram of a control subunit in the second embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of the structure of the control subunit in the third embodiment of the utility model;

[0023] Figure 5 Schematic diagram of the structure of the control subunit in the fourth embodiment of the present utility model. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0025] In view of the problems existing in the prior art, an embodiment of the utility model provides a test machine, which includes a probe station and a probe card. The probe station is used to carry a wafer and drive the wafer to move up, down, left, and right, which is a well-known technology in the art and will not be described in detail here.

[0026] In some embodiments, the probe card includes a carrying part, a probe part, a detection control part and an elastic connecting part. The carrying part is provided with a groove, and the probe part is movably arranged in the groove and electrically connected to the carrying part, and is used to transmit the detection signal of the carrying part to the wafer, and transmit the feedback signal of the wafer to the carrying part. The detection control part is arranged on the carrying part and / or on the probe part, and is used to adjust the positional relationship between the probe part and the carrying part and detect the distance of the wafer relative to the carrying part or the distance of the wafer relative to the probe part, and when a preset distance is reached, the position of the probe part relative to the carrying part is changed. The elastic connecting part is arranged between the probe part and the groove, and is used to support the probe part and apply a force to the probe part to move in the direction away from the wafer.

[0027] Specifically, the bearing part is a printed circuit board (PCB).

[0028] Figure 1 Schematic diagram of the structure of the probe card in some embodiments of the present invention. Figure 1 The probe part includes a fixed part 100, a plurality of probes 101 and a plurality of sliding contacts 102, wherein the plurality of probes 101 are arranged on a side of the fixed part 100 facing the wafer, the plurality of sliding contacts 102 are arranged on the fixed part 100, the plurality of sliding contacts 102 are electrically connected to the plurality of probes 101 in a one-to-one correspondence, and the plurality of sliding contacts are electrically connected to the bearing part.

[0029] Reference Figure 1 A plurality of fixed contacts 202 are arranged on the inner wall of the groove 201. The fixed contacts 202 are in a strip shape, or a long fixed contact 202 is arranged, and the length direction of the fixed contact 202 is arranged along the movable direction of the probe part. When the probe part slides or is fixed, the plurality of fixed contacts 103 are in electrical contact with the plurality of sliding contacts 202 in a one-to-one correspondence.

[0030] In some embodiments, the detection control part includes a sensor unit and a control unit. The sensor unit is arranged on a side of the carrying part facing the wafer, and is used to detect the distance of the wafer relative to the carrying part or the distance of the wafer relative to the probe part. The control unit is arranged on the carrying part, and is used to fix the probe part, and cancel the fixation of the probe part when a preset distance is reached between the wafer and the probe part or between the wafer and the carrying part. The control unit includes at least one control sub-unit.

[0031] In one embodiment, referring to Figure 1 The sensor unit is a distance sensor 300, which is arranged on a side of the carrier 200 facing the wafer, and the control unit includes two control subunits 203. The inner side wall of the groove 201 is provided with two control subunit accommodating grooves 202, and the control subunits 303 are arranged in a one-to-one correspondence with the control subunit accommodating grooves 202, and the control subunits 203 are arranged in the control subunit accommodating grooves 202. In other embodiments, the distance sensor 300 can also be arranged in the probe part.

[0032] In some embodiments, the control subunit includes a snap rod and an electromagnetic switch, the snap rod is used to fix the probe part, and the electromagnetic switch is used to drive the snap rod to move when turned on or off to change the fixing state of the snap rod to the probe part.

[0033] In some embodiments, the electromagnetic switch includes a matching part and an electromagnet, the matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate suction force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move; or, the matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate repulsion force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move. Wherein, the matching part is a metal part or a permanent magnet.

[0034] Figure 2 This is a schematic diagram of the structure of the control subunit in some embodiments of the present utility model. Figure 2 The control subunit includes a buckle rod 2031 and an electromagnetic switch. The electromagnetic switch includes a metal part 2032 and an electromagnet 2033. The metal part 2032 is arranged at one end of the buckle rod 2031.

[0035] Reference Figure 2The control subunit further includes a shell 2034 , in which a sliding receiving groove 2035 is provided. The electromagnet 2033 is arranged on the right side wall of the sliding receiving groove 2035 , and the buckle rod 2031 is arranged in the sliding receiving groove 2035 .

[0036] Reference Figure 1 and Figure 2 The side wall of the fixing part 100 is provided with the same number of snap grooves 103 as the control subunit 203. When the distance between the wafer and the probe part is not less than or equal to the preset distance, the other end of the snap rod 2031 extends out of the sliding receiving groove 2035 and is embedded in the snap groove 103 to fix the position of the fixing part 100, thereby fixing the probe part; when the distance between the wafer and the probe part is less than or equal to the preset distance, the electromagnet 2033 is energized and turned on, and the electromagnet 2033 generates magnetic force, thereby generating suction to the metal part 2032, so that the metal part 2032 drives the snap rod 2031 to move, and the other end of the snap rod 2031 is disengaged from the snap groove 103.

[0037] Figure 3 Schematic diagram of the structure of the control subunit in the second embodiment of the present utility model. Figure 3 and Figure 2 The difference is that the electromagnet 2033 is arranged at one end of the buckle rod 2031, and the metal part 2032 is arranged on the right side wall of the sliding receiving groove 2035.

[0038] Figure 4 Schematic diagram of the structure of the control subunit in the third embodiment of the present utility model. Figure 4 and Figure 2 The difference is that: a first blocking block 2037 is provided on the side wall of the sliding receiving groove 2035, a second blocking block 2038 is provided on the snap rod 2031, and the control subunit also includes a reset spring 2036, and the reset spring 2036 is sleeved on the snap rod 2031, one end of the reset spring 2036 is blocked by the first blocking block 2037, and the other end of the reset spring 2036 is blocked by the second blocking block 2038. When the electromagnet 2033 is powered on and turned on, the electromagnet 2033 generates magnetic force, which in turn generates suction force on the metal part 2032, so that the metal part 2032 drives the snap rod 2031 to move. At this time, the return spring 2036 is squeezed by the first blocking block 2037 and the second blocking block 2038 to generate elastic force; when the electromagnet 2033 is powered on and turned off, the electromagnet 2033 loses its magnetic force, and the snap rod 2031 is reset under the action of the elastic force of the return spring 2036, and is embedded in the snap groove 103 again to fix the probe part.

[0039] Figure 5 Schematic diagram of the structure of the control subunit in the fourth embodiment of the present utility model. Figure 5 and Figure 4 The difference is that the electromagnet 2033 is arranged at one end of the buckle rod 2031, and the metal part 2032 is arranged on the right side wall of the sliding receiving groove 2035.

[0040] In some embodiments, the control unit includes a snap rod and an electromagnetic switch, the snap rod is used to fix the probe part, and the electromagnetic switch is used to drive the snap rod to move when closed to cancel the fixation of the probe part by the snap rod.

[0041] In some embodiments, the control subunit includes a buckle rod and an electromagnetic switch, the electromagnetic switch includes a permanent magnet and an electromagnet, and the permanent magnet is arranged at one end of the buckle rod. The control subunit also includes a housing, a sliding receiving groove is provided in the housing, the electromagnet is arranged on the right side wall of the sliding receiving groove, and the buckle rod is arranged in the sliding receiving groove. The side wall of the fixing part is provided with the same number of snap grooves as the control sub-units. When the distance sensor detects that the distance between the wafer and the bearing part or the distance between the wafer and the probe part is greater than a preset distance, the electromagnet is turned on to generate a repulsive force on the permanent magnet, and the other end of the snap rod extends out of the sliding receiving groove and is embedded in the snap groove to fix the position of the fixing part, thereby fixing the probe part; when the distance sensor detects that the distance between the wafer and the bearing part or the distance between the wafer and the probe part is less than or equal to a preset distance, the electromagnet is turned off. Since the electromagnet has an iron core, the permanent magnet generates an attractive force on the electromagnet, so that the permanent magnet drives the snap rod to move, and the other end of the snap rod is disengaged from the snap groove.

[0042] In some other embodiments, the control subunit includes a buckle rod and an electromagnetic switch, the electromagnetic switch includes a permanent magnet and an electromagnet, and the electromagnet is arranged at one end of the buckle rod. The control subunit also includes a housing, a sliding receiving groove is provided in the housing, the magnet is arranged on the right side wall of the sliding receiving groove, and the buckle rod is arranged in the sliding receiving groove. The side wall of the fixing part is provided with the same number of snap grooves as the control sub-units. When the distance sensor detects that the distance between the wafer and the bearing part or the distance between the wafer and the probe part is greater than a preset distance, the electromagnet is turned on to generate a repulsive force on the permanent magnet, and the other end of the snap rod extends out of the sliding receiving groove and is embedded in the snap groove to fix the position of the fixing part, thereby fixing the probe part; when the distance sensor detects that the distance between the wafer and the bearing part or the distance between the wafer and the probe part is less than or equal to a preset distance, the electromagnet is turned off. Since the electromagnet has an iron core, the permanent magnet generates an attractive force on the electromagnet, so that the electromagnet drives the snap rod to move, and the other end of the snap rod is disengaged from the snap groove.

[0043] In some embodiments, the elastic connection portion includes at least one supporting spring. In some other embodiments, the elastic connection portion also includes at least two positioning structures, which are arranged in the groove and are used to limit the movement of the probe portion in the direction toward and away from the wafer.

[0044] In some embodiments, the positioning structure is a positioning column, the fixing portion is provided with at least two positioning holes, the positioning columns are arranged in a one-to-one correspondence with the positioning holes, and the positioning columns are arranged in the positioning holes.

[0045] Reference Figure 1 The elastic connection part includes two supporting springs 400 and two positioning structures, wherein the positioning structure is a positioning column 401. Two positioning holes 104 are provided on the fixing part 100, and the positioning column 401 is disposed in the positioning holes 104. The positioning column 401 is cylindrical or prismatic, and the positioning hole 104 is adapted to the shape of the positioning column 401, so as to ensure that the positioning column 401 can slide in the positioning hole 104 without shaking.

[0046] In some embodiments, the probe card also includes a processing unit for processing the detection signal of the sensor unit. The preset distance of the wafer, that is, the distance at which the wafer is about to collide with the probe, when the sensor unit detects that the distance between the wafer and the carrier part or the distance between the wafer and the probe part is less than or equal to the preset distance, the other end of the latch rod disengages from the latch groove, and the fixing part moves under the elastic force of the supporting spring, thereby causing the fixing part to move away from the wafer, thereby moving the probe away from the wafer to prevent a collision.

[0047] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A probe card, characterized in that: It includes a bearing part, a probe part, a detection control part and an elastic connection part. The bearing part is provided with a groove. The probe part is movably arranged in the groove and is electrically connected to the bearing part, and is used to transmit the detection signal of the bearing part to the wafer, and transmit the feedback signal of the wafer to the bearing part. The detection control part is arranged on the bearing part and / or on the probe part, and is used to adjust the positional relationship between the probe part and the bearing part and detect the distance of the wafer relative to the bearing part or the distance of the wafer relative to the probe part, and when the preset distance is reached, change the position of the probe part relative to the bearing part. The elastic connection part is arranged between the probe part and the groove, and is used to support the probe part and apply a force to the probe part to move in the direction opposite to the wafer.

2. The probe card according to claim 1, wherein: The probe part includes a fixed part, a plurality of probes and a plurality of sliding contacts, wherein the plurality of probes are arranged on a side of the fixed part facing the wafer, the plurality of sliding contacts are arranged on the fixed part, the plurality of sliding contacts are electrically connected to the plurality of probes one by one, and the plurality of sliding contacts are electrically connected to the supporting part.

3. The probe card according to claim 2, characterized in that: A plurality of fixed contacts are arranged on the inner side wall of the groove, and when the probe part slides or is fixed, the plurality of fixed contacts are in electrical contact with the plurality of sliding contacts in a one-to-one correspondence; or, A strip-shaped fixed contact is arranged on the inner side wall of the groove, and the length direction of the fixed contact is arranged along the movable direction of the probe part, and the sliding contact is always in electrical contact with the strip-shaped fixed contact.

4. The probe card according to any one of claims 1 to 3, characterized in that: The detection control part includes a sensor unit and a control unit. The sensor unit is arranged on a side of the carrying part facing the wafer, and is used to detect the distance of the wafer relative to the carrying part or the distance of the wafer relative to the probe part. The control unit is arranged on the carrying part, and is used to fix the probe part and cancel the fixation of the probe part when a preset distance is reached between the wafer and the probe part or between the wafer and the carrying part.

5. The probe card according to claim 4, characterized in that: The control unit includes at least one control subunit, which includes a snap rod and an electromagnetic switch. The snap rod is used to fix the probe part, and the electromagnetic switch is used to drive the snap rod to move when turned on or off to change the fixing state of the snap rod to the probe part.

6. The probe card according to claim 5, characterized in that: The electromagnetic switch comprises a matching part and an electromagnet, wherein the matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate suction force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move; or, The matching part or the electromagnet is arranged at one end of the buckle rod, and the electromagnet is used to generate a repulsive force on the matching part when opening or closing, so that the matching part or the electromagnet drives the buckle rod to move.

7. The probe card according to claim 6, wherein: The control subunit further comprises a reset spring, which is used to reset the buckle rod when the electromagnet is turned on or off, so as to change the fixing state of the probe part.

8. The probe card according to claim 1, wherein: The elastic connection part includes at least one supporting spring and at least two positioning structures. The positioning structure is arranged in the groove and cooperates with the supporting spring to limit the movement of the probe part in the direction toward and away from the wafer.

9. The probe card according to claim 8, characterized in that: The positioning structure is a positioning column, the probe part includes a fixed part, the probe part includes a fixed part, a plurality of probes and a plurality of sliding contacts, the plurality of probes are arranged on a side of the fixed part facing the wafer, the plurality of sliding contacts are arranged on the fixed part, the plurality of sliding contacts are connected to the plurality of probes in a one-to-one correspondence, at least two positioning holes are opened on the fixed part, the positioning columns are arranged in a one-to-one correspondence with the positioning holes, and the positioning columns are arranged in the positioning holes.

10. A testing machine, characterized in that: The invention comprises a probe station and a probe card as claimed in any one of claims 1 to 9.

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