Ejector pin device suitable for taking chip from blue film
By designing a device including two sets of thimbles, using the cooperation of the spring body and the pressure sensor, the problem of chip fragmentation and insufficient viscosity caused by excessive thimble pressure is solved, and a more stable chip stripping process is achieved.
Patent Information
- Application Number
- CN202421733126.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-22
AI Technical Summary
During the chip stripping process of existing thimble devices, excessive pressure applied by the thimble may cause the chip to break, or the speed is too low to effectively get rid of the adhesive force of the glue, causing the chip to be unable to stabilize from the blue film.
A device including two sets of thimbles is designed. By approaching the circumference of the blue membrane by the second thimble, the spring body and the pressure sensor are used to apply a smaller pressure to reduce the adhesion of the blue membrane, and then the first thimble applies a greater pressure to resist to ensure stable chip peeling.
A more stable chip stripping process is achieved, avoiding chip fragmentation caused by excessive thimble pressure, and improving the chip's disengagement efficiency by reducing the blue film adhesion.
Smart Images

Figure CN222851422U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of chip ejector devices, and in particular to an ejector device suitable for removing chips from a blue film. Background Art
[0002] When the chip is peeled off, the ejector pin will approach and lift up the chip to separate the chip from the blue film. Then, the pick-up head picks up the chip through vacuum. During the contact stage of the ejector pin, if the pressure applied by the ejector pin is too large, the ejector pin will exert too much force on the chip, which may cause the chip to break during the peeling process; if the ejector pin speed is too low, it cannot effectively get rid of the adhesive force of the glue, and the chip cannot be separated from the blue film well. Therefore, there is a problem that the ejector pin device cannot stably lift the chip off the blue film. Utility Model Content
[0003] In order to remove the chip more stably, the present application provides a ejector device suitable for removing the blue film chip.
[0004] The present application provides a pin device suitable for removing chips from a blue film, which adopts the following technical solution: a pin device suitable for removing chips from a blue film, comprising a moving seat, on which two groups of pins are arranged, including a first pin for contacting the middle of a blue film and a second pin for contacting the peripheral side of the blue film. The contact area of the first pin with the blue film is larger than that of the second pin, so a plurality of lifting blocks corresponding to the first pin or the second pin are movably arranged on the moving seat; a pressure sensor is arranged on the lifting block, and a spring body is provided on the side of the first pin and the second pin away from the blue film, and one end of the spring body is connected to the pressure sensor.
[0005] By adopting the above technical solution, during the working process, the second ejector pin is firstly brought close to the peripheral side of the blue film. During the contact process, the cooperation between the spring body and the pressure sensor can enable the second ejector pin to apply a smaller pressure, thereby loosening the contact between the peripheral side of the chip and the blue film, thereby reducing the adhesion of the blue film in advance. Then, the first ejector pin is brought close to the blue film and contacts the blue film with a greater pressure. Due to the action of the second ejector pin, although the pressure of the first ejector pin is large, it will not be large enough to damage the blue film and the chip, thereby achieving the purpose of removing the chip more stably.
[0006] Preferably, the first ejector pin and the second ejector pin have a connecting tube on the side away from the blue film, the spring body is located in the connecting tube, and the lifting block is provided with a connecting seat slidably connected to the connecting tube.
[0007] Preferably, the connecting seat is circumferentially limited to the connecting tube.
[0008] Preferably, the outer wall of the connecting tube has a receiving groove arranged along the axial direction, and the connecting seat has a limiting column inserted into the receiving groove.
[0009] Preferably, an avoidance groove for inserting the end of the connecting tube is provided in the axial direction on the lifting block.
[0010] Preferably, the first ejector pin and / or the second ejector pin is provided with a processing end.
[0011] Preferably, the lifting block is provided with a processing end, and the lifting block is provided with a processing sleeve, and the processing end is located at the end of the processing sleeve close to the blue film.
[0012] Preferably, the processing end is a temperature-controlled heating part or a light-emitting part.
[0013] By adopting the above technical solution, for blue films whose viscosity is related to temperature, the viscosity of the blue films can be reduced by applying heat. For some blue films whose viscosity is reduced by irradiation with light, the viscosity of the blue films can be reduced by irradiating with special light.
[0014] Preferably, a transition seat is fixed to the end of the spring body, and the transition seat is rotatably connected to a resistance piece.
[0015] Preferably, the pressure sensor housing has a positioning circular groove for the abutment sheet to be embedded in.
[0016] In summary, the present application includes at least one of the following beneficial technical effects:
[0017] 1. The second ejector pin is brought close to the peripheral side of the blue film. During the contact process, the spring body and the pressure sensor cooperate to enable the second ejector pin to apply a smaller pressure, thereby loosening the contact between the peripheral side of the chip and the blue film, reducing the adhesion of the blue film in advance, and then the first ejector pin is brought close to the blue film to contact the blue film with a greater pressure. Due to the action of the second ejector pin, although the pressure of the first ejector pin is large, it will not be large enough to damage the blue film and the chip, thereby achieving the purpose of more stable chip removal;
[0018] 2. For blue films with different characteristics, the processing end can be used to influence them, thereby reducing the viscosity of the blue film and facilitating operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic diagram of the structure of Example 1 of the present application;
[0020] Figure 2 is a partial cross-sectional view of Example 1 of the present application;
[0021] Figure 3 is a schematic structural diagram of the first ejector pin in Example 2 of the present application;
[0022] Figure 4 It is a schematic diagram of the structure in which the processing end is a columnar body in other embodiments.
[0023] Explanation of the reference numerals: 100, moving seat; 111, lifting block; 112, first ejector pin; 113, second ejector pin; 114, connecting tube; 115, spring body; 116, pressure sensor; 117, transition seat; 118, abutment sheet; 119, positioning circular groove; 120, connecting seat; 121, accommodating groove; 122, limiting column; 123, avoidance groove; 130, processing end; 131, processing sleeve. DETAILED DESCRIPTION
[0024] The present application is further described in detail below in conjunction with the accompanying drawings.
[0025] Example 1: Reference Figure 1 The embodiment of the present application discloses a pin device suitable for blue film chip removal, including a moving seat 100, on which a plurality of lifting blocks 111 are provided for lifting. The lifting blocks 111 are connected to the moving seat 100 through a lead screw, and can also be connected through a cylinder. The specific driving method needs to be determined according to the actual working conditions.
[0026] Two groups of ejectors are arranged on the motion seat 100, including a first ejector 112 for contacting the middle of the blue film and a second ejector 113 for contacting the peripheral side of the blue film. The contact area of the first ejector 112 with the blue film is larger than that of the second ejector 113. Generally, the ratio of the first ejector 112 to the second ejector 113 is 1:4, for example, there is one first ejector 112 in the middle and four ejectors around. Both the first ejector 112 and the second ejector 113 are individually connected to a lifting block 111, and the lifting block 111 will rise and fall independently.
[0027] Reference Figure 1 , Figure 2 A connecting tube 114 is provided on the side of the first ejector pin 112 or the second ejector pin 113 away from the blue film, a spring body 115 is provided in the connecting tube 114, and a pressure sensor 116 is embedded in the lifting block 111. In this embodiment, a housing is provided outside the pressure sensor 116.
[0028] The two ends of the spring body 115 have transition seats 117. Specifically, the transition seat 117 is also rotatably provided with a contact piece 118. The housing of the pressure sensor 116 is provided with a positioning circular groove 119 for the contact piece 118 to be embedded, so that positioning can be achieved. At the same time, the torsion of the spring body 115 during the compression process will not affect the pressure sensor 116. The part exposed at the bottom of the positioning circular groove 119 is the part of the pressure sensor 116 that can be directly subjected to force.
[0029] Specifically, a connecting seat 120 is provided on the lifting block 111, and the connecting tube 114 is sleeved on the outside of the connecting seat 120. The outer wall of the connecting tube 114 has a receiving groove 121 arranged along the axial direction. At the same time, the outer wall of the connecting seat 120 has a limiting column 122 inserted into the receiving groove 121. One end of the contact piece 118 at both ends of the spring body 115 will be pressed against the positioning circular groove 119, and the other end will be pressed against the inner wall of the connecting tube 114. The sleeve relationship between the connecting tube 114 and the connecting seat 120 can realize the limitation of the deformation direction of the spring body 115. At the same time, during the pressing process, the limiting column 122 and the receiving groove 121 form a circumferential limit.
[0030] During the pressing process, taking the second ejector pin 113 as an example, the movement of the lifting block 111 will cause the end of the second ejector pin 113 to contact the blue film, and the pressure sensor 116 will generate a pressure value. During the pressing process, the connecting tube 114 and the connecting seat 120 will slide relative to each other. In order to form the relative sliding, an escape groove 123 for the end of the connecting tube 114 to be inserted is provided axially on the lifting block 111. At the same time, the spring body 115 will be compressed, and the value of the pressure sensor 116 will further increase. When it increases to a predetermined value, it will stop moving, that is, under the predetermined pressure, the blue film will be pressed.
[0031] In this embodiment, the ends of the first ejector pin 112 and the second ejector pin 113 have a processing end 130. Specifically, the processing end 130 can be a temperature-controlled heating part or a light-emitting part. For blue films whose viscosity is related to temperature, heat can be applied to reduce the viscosity of the blue film. For some blue films whose viscosity is reduced by light irradiation, the viscosity of the blue film can be reduced by irradiating special light.
[0032] The implementation principle of Example 1 of the present application is as follows: first, the lifting block 111 corresponding to the second ejector pin 113 is moved, and the second ejector pin 113 is close to the peripheral side of the blue film. During the contact process, the cooperation of the spring body 115 and the pressure sensor 116 can enable the second ejector pin 113 to apply a smaller pressure, thereby loosening the contact between the peripheral side of the chip and the blue film, thereby reducing the adhesion of the blue film in advance, and then the first ejector pin 112 is close to the blue film, and contacts the blue film with a greater pressure. Due to the action of the second ejector pin 113, although the pressure of the first ejector pin 112 is large, it will not be relatively large enough to damage the blue film and the chip, thereby achieving the purpose of removing the chip more stably.
[0033] Embodiment 2: The difference from Embodiment 1 is that, referring to Figure 3A processing sleeve 131 is also provided on the lifting block 111 and outside the connecting tube 114, and the processing end 130 will be located at the end of the processing sleeve 131, so that the first ejector pin 112 and the second ejector pin 113 can directly contact the blue film, and the processing end 130 will process near the blue film.
[0034] Reference Figure 4 Of course, in other embodiments, the processing end 130 may also be a plurality of cylindrical bodies, which are evenly distributed around the connecting tube 114 along the circumferential direction.
[0035] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A pin ejector device suitable for removing chips from a blue film, comprising a moving seat (100), characterized in that: The moving seat (100) is provided with two groups of ejector pins, including a first ejector pin (112) for contacting the middle of the blue film and a second ejector pin (113) for contacting the peripheral side of the blue film. The contact area between the first ejector pin (112) and the blue film is larger than that between the second ejector pin (113). Therefore, the moving seat (100) is movably provided with a plurality of lifting blocks (111) corresponding to the first ejector pin (112) or the second ejector pin (113). A pressure sensor (116) is provided on the lifting block (111); a spring body (115) is provided on the side of the first ejector pin (112) and the second ejector pin (113) away from the blue film; one end of the spring body (115) is connected to the pressure sensor (116).
2. The ejector device for removing chips from a blue film according to claim 1, characterized in that: The first ejector pin (112) and the second ejector pin (113) have a connecting tube (114) on the side away from the blue film, the spring body (115) is located in the connecting tube (114), and the lifting block (111) is provided with a connecting seat (120) that is slidably connected to the connecting tube (114).
3. The ejector device for removing chips from a blue film according to claim 2, characterized in that: The connection seat (120) is circumferentially limited to the connection tube (114).
4. The ejector device for removing chips from a blue film according to claim 3, characterized in that: The outer wall of the connecting tube (114) has a containing groove (121) arranged along the axial direction, and the connecting seat (120) has a limiting column (122) inserted into the containing groove (121).
5. The ejector device for removing chips from a blue film according to claim 4, characterized in that: The lifting block (111) is provided with an avoidance groove (123) along the axial direction for the end of the connecting tube (114) to be inserted.
6. The ejector device for removing chips from a blue film according to claim 1, characterized in that: The first ejector pin (112) and / or the second ejector pin (113) is provided with a processing end (130).
7. The ejector device for removing chips from a blue film according to claim 1, characterized in that: The lifting block (111) is provided with a processing end (130), and the lifting block (111) is provided with a processing sleeve (131), and the processing end (130) is located at an end of the processing sleeve (131) close to the blue film.
8. The ejector device for removing chips from a blue film according to claim 6 or 7, characterized in that: The processing end (130) is a temperature-controlled heating part or a light-emitting part.
9. The ejector device for removing chips from a blue film according to claim 2, characterized in that: A transition seat (117) is fixed to the end of the spring body (115), and the transition seat (117) is rotatably connected to a resisting piece (118).
10. The ejector device for removing chips from a blue film according to claim 9, characterized in that: The housing of the pressure sensor (116) has a positioning circular groove (119) for the abutment sheet (118) to be embedded.