Circuit board taking device

Abstract

The utility model relates to a circuit board material taking device which comprises a rack, a first material taking mechanism, a second material taking mechanism and a driving mechanism, and the first material taking mechanism, the second material taking mechanism and the driving mechanism are arranged on the rack. The first material taking mechanism and the second material taking mechanism each comprise a moving assembly movably connected with the rack, an adsorption assembly connected with the moving assembly and a clamping assembly connected with the adsorption assembly and used for clamping the plate. When the circuit board is taken by the adsorption assembly and the clamping assembly, the circuit board is clamped by the clamping assembly after the adsorption assembly adsorbs the circuit board, so that the stability of the circuit board in the moving process is ensured, a large number of suction nozzles and control valves do not need to be arranged, the weight of the device is reduced, the energy consumption is reduced, and the production cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a circuit board material taking device. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board in Chinese, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board. Circuit boards are essential components in the current electronics industry, and are used for electrical connections of electronic components. In the production and processing of circuit boards, multiple processes such as cutting, drilling, copper plating, image transfer, etching, and silk-screen printing are involved. During the operation, the circuit board needs to be transferred. In traditional operations, the transfer operation generally relies on manual labor. As production and processing gradually shift to automation, there are also transfer devices on the market that can transfer circuit boards. Existing transfer devices generally use suction nozzles to hold the circuit board and then transfer it. However, when this method transfers larger boards, it is easy to drop the board during the transfer process if the number of suction nozzles is small. Therefore, in order to ensure that the boards are firmly adsorbed, a large number of suction nozzles are required. A large number of suction nozzles means an increase in the number of connected pipes and control valves, and the overall weight of the device will also increase, and the corresponding energy consumption will also increase. This type of device is not only costly, but also very troublesome to connect and arrange the suction nozzles, pipes, and control valves during the production and assembly process. Utility Model Content

[0003] In order to solve the above problems, the utility model provides a circuit board picking device, which clamps the circuit board after sucking it, has strong stability in the transfer process, and reduces energy consumption and production costs.

[0004] A circuit board material taking device, comprising

[0005] frame;

[0006] A first material taking mechanism is arranged on the frame;

[0007] A second material taking mechanism is arranged on the frame;

[0008] A driving mechanism, disposed on the frame, for driving the first material taking mechanism and the second material taking mechanism to move closer to or away from each other;

[0009] The first material picking mechanism and the second material picking mechanism both include a moving component movably connected to the frame, an adsorption component connected to the moving component, and a clamping component connected to the adsorption component for clamping a plate.

[0010] Furthermore, the adsorption component includes a profile connected to the moving component and a suction cup arranged at the bottom of the profile.

[0011] Furthermore, the clamping assembly includes a clamping support frame connected to the adsorption assembly, a first clamping cylinder arranged on the clamping support frame, a fixed clamping member connected to the first clamping cylinder, a movable clamping member rotatably connected to the bottom of the first clamping cylinder, and a second clamping cylinder arranged on the clamping support frame for driving the first clamping cylinder to move in a vertical direction, and one end of the movable clamping member is connected to the output end of the first clamping cylinder.

[0012] Furthermore, the fixed clamping member is connected to the first clamping cylinder via a clamping bracket.

[0013] Furthermore, the fixed clamping member and the movable clamping member are both provided with buffer pads.

[0014] Furthermore, the driving mechanism includes a first screw assembly and a second screw assembly arranged on the frame, and a driving motor arranged on the frame, the driving motor and the first screw assembly are transmission-connected, and the driving motor and the second screw assembly are transmission-connected; the first screw assembly is connected to the first material picking mechanism, and the second screw assembly is connected to the second material picking mechanism.

[0015] Furthermore, the drive motor and the first screw assembly, and the drive motor and the second screw assembly are connected through a synchronous pulley set.

[0016] Furthermore, the frame includes a main frame body, a connecting frame arranged on the main frame body, and the driving mechanism, the first material taking mechanism, and the second material taking mechanism are connected to the main frame body.

[0017] Furthermore, a probe plate assembly is disposed on the second material picking mechanism, and the probe plate assembly includes a probe plate bracket connected to the first material picking mechanism, and a probe sensor disposed on the probe plate bracket.

[0018] Furthermore, a material sensor for sensing the circuit board is provided on the bottom surface of the frame.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] When the adsorption component and the clamping component of the utility model are used to pick up the circuit board, the adsorption component adsorbs the circuit board and then clamps the circuit board through the clamping component, which ensures the stability of the circuit board during the moving process. There is no need to set a large number of suction nozzles and control valves, which reduces the weight of the device, reduces energy consumption, and saves production costs. At the same time, with the cooperation of the driving mechanism, the spacing between the first picking mechanism and the second picking mechanism can be flexibly adjusted, which can adapt to the picking operation of circuit boards of different specifications and has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The utility model provides a schematic structural diagram of a circuit board material taking device.

[0022] Figure 2 It is a schematic diagram of the clamping component part of the utility model.

[0023] Figure 3 It is the front view of the utility model.

[0024] Figure 4 This is a schematic diagram of the bottom perspective of the present invention.

[0025] The figure includes:

[0026] Frame 1, main frame 11, connecting frame 12, first material picking mechanism 2, moving component 21, adsorption component 22, profile 221, suction cup 222, clamping component 23, clamping support frame 231, first clamping cylinder 232, fixed clamping member 233, movable clamping member 234, second clamping cylinder 235, clamping bracket 236, buffer pad 237, second material picking mechanism 3, driving mechanism 4, first screw assembly 41, second screw assembly 42, driving motor 43, synchronous pulley group 44, probe plate assembly 5, probe plate bracket 51, probe sensor 52, material sensor 6. DETAILED DESCRIPTION

[0027] In order to facilitate those skilled in the art to understand the present invention, the present invention will be further described in detail below in conjunction with specific embodiments and drawings.

[0028] Reference Figures 1 to 4 The utility model provides a circuit board material picking device, comprising a frame 1, a first material picking mechanism 2, a second material picking mechanism 3, and a driving mechanism 4. The first material picking mechanism 2 is arranged on the frame 1, the second material picking mechanism 3 is arranged on the frame 1, and the driving mechanism 4 is arranged on the frame 1. The driving mechanism 4 is used to drive the first material picking mechanism 2 and the second material picking mechanism 3 to move closer to or away from each other, that is, the driving mechanism 4 can adjust the distance between the first material picking mechanism 2 and the second material picking mechanism 3, so as to adapt to circuit boards of different sizes. In this embodiment, the first material picking mechanism 2 and the second material picking mechanism 3 are arranged substantially symmetrically.

[0029] The first material-retrieving mechanism 2 and the second material-retrieving mechanism 3 each include a moving component 21 movably connected to the frame 1, a suction component 22 connected to the moving component 21, and a clamping component 23 for clamping a plate connected to the suction component 22. The suction component 22 can suck up the circuit board, and the clamping component 23 can clamp the circuit board from the edge of the circuit board after the suction component 22 sucks the circuit board. Compared with the traditional method of arranging a large number of suction nozzles, it not only ensures the stability of the circuit board during the moving process, but also saves more energy.

[0030] The adsorption component 22 includes a profile 221 connected to the moving component 21, and a suction cup 222 arranged at the bottom of the profile 221. The profile 221 is long and has an air passage inside. At the same time, a plurality of air holes are evenly arranged on the bottom surface of the profile 221. The air holes are connected to the air passage inside the profile 221. The air passage of the profile 221 is connected to a vacuum pump. The suction cup 222 is connected to the bottom surface of the profile 221, and corresponding holes are also arranged at the positions of the suction cup 222 corresponding to the air holes. In this embodiment, the suction cup 222 uses a sponge suction cup 222, which can play a role in buffering and protecting the board when contacting the circuit board.

[0031] The clamping assembly 23 includes a clamping support frame 231 connected to the adsorption assembly 22, a first clamping cylinder 232 disposed on the clamping support frame 231, a fixed clamping member 233 connected to the first clamping cylinder 232, a movable clamping member 234 rotatably connected to the bottom of the first clamping cylinder 232, and a second clamping cylinder 235 disposed on the clamping support frame 231 for driving the first clamping cylinder 232 to move in the vertical direction, one end of the movable clamping member 234 is connected to the output end of the first clamping cylinder 232. The clamping support frame 231 is connected to the top of the profile 221, the first clamping cylinder 232 and the clamping support frame 231 are connected by a lifting bracket, and a guide rod is connected between the lifting bracket and the clamping support frame 231. Specifically, the movable clamping member 234 is rotatably connected to the bottom of the first clamping cylinder 232. A connecting frame can be set at the bottom of the first clamping cylinder 232, and the movable clamping member 234 is connected to the connecting frame. The output end of the first clamping cylinder 232 is connected to one end of the movable clamping member 234. When the output end of the first clamping cylinder 232 is extended, the movable clamping member 234 rotates counterclockwise and approaches the fixed clamping member 233. After the adsorption component 22 adsorbs the circuit board, the second clamping cylinder 235 drives the clamping support frame 231 to move downward, so that the fixed clamping member 233 contacts the upper surface of the circuit board. Then, the first clamping cylinder 232 drives the movable clamping member 234 to rotate, so that the movable clamping member 234 contacts the lower surface of the circuit board, so that the fixed clamping member 233 and the movable clamping member 234 cooperate to clamp the circuit board (the initial position state and the clamping state of the movable clamping member 234 are simultaneously shown in the attached figure). Specifically, the movable clamping member 234 is at an angle greater than or equal to 90 degrees to the fixed clamping member 233 in the initial state (within this angle range, the movable clamping member 234 will not cause motion interference). When performing the clamping action, the clamping assembly 23 of the first material picking mechanism 2 and the clamping assembly 23 of the second material picking mechanism 3 clamp the circuit board on both sides of the circuit board respectively.

[0032] The fixed clamping member 233 is connected to the first clamping cylinder 232 via a clamping bracket 236. The height of the fixed clamping member 233 needs to be such that it can just touch the upper surface of the adsorbed circuit board when the output end of the second clamping cylinder 235 is extended.

[0033] The fixed clamping member 233 and the movable clamping member 234 are both provided with a buffer pad 237. When the fixed clamping member 233 and the movable clamping member 234 clamp the circuit board, the buffer pad 237 contacts the circuit board to avoid damaging the surface of the circuit board.

[0034] The driving mechanism 4 includes a first screw assembly 41 and a second screw assembly 42 arranged on the frame 1, and a driving motor 43 arranged on the frame 1. The driving motor 43 is connected to the first screw assembly 41 in a transmission connection, and the driving motor 43 is connected to the second screw assembly 42 in a transmission connection. The first screw assembly 41 is connected to the first material picking mechanism 2, and the second screw assembly 42 is connected to the second material picking mechanism 3. The driving directions of the first screw assembly 41 and the second screw assembly 42 are opposite, that is, the first material picking mechanism 2 and the second material picking mechanism 3 can be driven to approach or move away from each other respectively. When the driving motor 43 is started, the first screw assembly 41 and the second screw assembly 42 rotate simultaneously to adjust the spacing between the first material picking mechanism 2 and the second material picking mechanism 3, so as to adapt to the material picking operation of circuit boards of different sizes.

[0035] The driving motor 43 and the first screw assembly 41, and the driving motor 43 and the second screw assembly 42 are all connected by a synchronous pulley assembly 44. In specific implementation, other types of transmission assemblies such as gear assemblies can also be used according to requirements.

[0036] The frame 1 includes a main frame 11, a connecting frame 12 arranged on the main frame 11, and the driving mechanism 4, the first material taking mechanism 2, and the second material taking mechanism 3 are connected to the main frame 11. The connecting frame 12 is used to connect the manipulator, so that the circuit board taking device can move under the drive of the manipulator to carry out the transportation of the circuit board.

[0037] The second material picking mechanism is provided with a probe plate assembly 5, the probe plate assembly 5 includes a probe plate bracket 51 connected to the second material picking mechanism, a probe sensor 52 provided on the probe plate bracket 51, and the probe plate bracket 51 is connected to the profile 221. After the robot drives the circuit board picking device to reach above the circuit board, it continues to drive the circuit board picking device downward to approach the circuit board, and the probe sensor 52 of the probe plate assembly 5 contacts the circuit board, and a feedback signal is fed back after sensing in place, and the robot stops moving, waiting for the circuit board picking device to absorb and clamp the circuit board.

[0038] The bottom surface of the frame 1 is provided with a material sensor 6 for sensing the circuit board. The material sensor 6 is used to sense whether there is a circuit board below. The type of the material sensor 6 can be flexibly selected according to the needs of the specific implementation, such as a photoelectric sensor, a distance sensor, etc.

[0039] The utility model can realize the transfer of circuit boards after picking up materials with the cooperation of the manipulator. When the circuit board is picked up, the manipulator first drives the circuit board picking device to reach the top of the circuit board, and then the manipulator drives the circuit board picking device to move downward until the suction cup 222 of the adsorption component 22 contacts the circuit board and sucks up the circuit board. After the adsorption component 22 sucks up the circuit board, the fixed clamping member 233 of the clamping component 23 moves downward under the drive of the second clamping cylinder 235 and contacts the upper surface of the circuit board. Subsequently, the first clamping cylinder 232 drives the movable clamping member 234 to rotate and cooperate with the fixed clamping member 233 to clamp the circuit board. The manipulator drives the circuit board picking device to transfer the circuit board to a predetermined position, the suction cup 222 breaks the vacuum, and the movable clamping member 234 is reset, and the circuit board can be put down.

[0040] When the adsorption component 22 and the clamping component 23 of the utility model are used to pick up the circuit board, the adsorption component 22 adsorbs the circuit board and then clamps the circuit board through the clamping component 23, which ensures the stability of the circuit board during movement. There is no need to set a large number of suction nozzles and control valves, which reduces the weight of the device, reduces energy consumption, and saves production costs. At the same time, with the cooperation of the driving mechanism 4, the spacing between the first picking mechanism 2 and the second picking mechanism 3 can be flexibly adjusted, which can adapt to the picking operation of circuit boards of different specifications and has strong versatility.

[0041] In the description of the present invention, it is necessary to understand that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0042] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes according to the above content. Therefore, all such substitutions, improvements and changes are included in the scope of the appended claims.

Claims

1. A circuit board material removal device, characterized in that: include frame; A first material taking mechanism is arranged on the frame; A second material taking mechanism is arranged on the frame; A driving mechanism, disposed on the frame, for driving the first material taking mechanism and the second material taking mechanism to move closer to or away from each other; The first material picking mechanism and the second material picking mechanism both include a moving component movably connected to the frame, an adsorption component connected to the moving component, and a clamping component connected to the adsorption component for clamping a plate.

2. The circuit board material taking device according to claim 1, characterized in that: The adsorption component comprises a profile connected to the moving component and a suction cup arranged at the bottom of the profile.

3. The circuit board material taking device according to claim 1, characterized in that: The clamping assembly includes a clamping support frame connected to the adsorption assembly, a first clamping cylinder arranged on the clamping support frame, a fixed clamping member connected to the first clamping cylinder, a movable clamping member rotatably connected to the bottom of the first clamping cylinder, and a second clamping cylinder arranged on the clamping support frame for driving the first clamping cylinder to move in a vertical direction, and one end of the movable clamping member is connected to the output end of the first clamping cylinder.

4. The circuit board material taking device according to claim 3, characterized in that: The fixed clamping member is connected to the first clamping cylinder via a clamping bracket.

5. The circuit board material taking device according to claim 3, characterized in that: The fixed clamping member and the movable clamping member are both provided with buffer pads.

6. The circuit board material taking device according to claim 1, characterized in that: The driving mechanism includes a first screw assembly and a second screw assembly arranged on the frame, and a driving motor arranged on the frame, the driving motor and the first screw assembly are transmission-connected, and the driving motor and the second screw assembly are transmission-connected; the first screw assembly is connected to the first material picking mechanism, and the second screw assembly is connected to the second material picking mechanism.

7. The circuit board material taking device according to claim 6, characterized in that: The drive motor and the first screw assembly, and the drive motor and the second screw assembly are both connected through a synchronous pulley set.

8. The circuit board material taking device according to claim 1, characterized in that: The frame comprises a main frame body, a connecting frame arranged on the main frame body, and the driving mechanism, the first material taking mechanism and the second material taking mechanism are connected to the main frame body.

9. The circuit board material taking device according to claim 8, characterized in that: The second material-retrieving mechanism is provided with a probe plate assembly, and the probe plate assembly comprises a probe plate bracket connected with the first material-retrieving mechanism, and a probe sensor arranged on the probe plate bracket.

10. The circuit board material taking device according to claim 1, characterized in that: The bottom surface of the frame is provided with a material sensor for sensing the circuit board.

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