Diamond wire cutting silicon wafer cooling liquid recovery equipment

Abstract

The utility model provides diamond wire cutting silicon wafer cooling liquid recovery equipment, which relates to the technical field of silicon wafer cutting, and comprises a cutting table and a mounting rack, the top of the cutting table is provided with a water storage tank, the inner wall of the water storage tank is fixedly connected with a partition plate, and the upper end and the lower end of the mounting rack are fixedly connected with a supporting table and a fixing seat respectively. A liquid storage box is fixedly mounted at the top of the mounting frame, a cooling box is fixedly mounted at the top of the liquid storage box, a first water pump is fixedly mounted at the top of the supporting table, a second water pump is fixedly mounted on one side of the fixing seat, a filter screen can separate chippings in cooling liquid, and a storage box can be taken out by lifting a pull rod upwards. Filtered chippings can be conveniently cleaned, a water storage tank stores the filtered cooling liquid, the cooling liquid can be pumped into a condensation pipe by starting a first water pump, cold water is added into a cooling box, the cooling liquid is cooled, and the cooling liquid can be immediately used.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a diamond wire cutting silicon slice cooling liquid recovery device. Background Art

[0002] Diamond wire slicers are widely used in the field of single crystal silicon because of their fast cutting speed. Diamond wire generates a lot of heat during the cutting process and requires the addition of coolant for cooling, thus generating a large amount of coolant.

[0003] The coolant contains a large amount of silicon powder and diamond powder. Direct discharge not only harms the environment, but also causes huge waste. In the prior art, when the coolant is processed and used, due to its high temperature, it cannot be used directly and needs to wait for it to cool down before it can be cooled and used, thereby reducing the practicality of the device. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that the direct discharge of the above-mentioned coolant not only harms the environment, but also causes huge waste, and when the coolant is processed and used, due to its high temperature, it cannot be used directly, and it is necessary to wait for it to cool down before it can be cooled and used, thereby reducing the practicality of the device. A diamond wire cutting silicon wafer coolant recovery device is proposed.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a diamond wire cutting silicon wafer coolant recovery device, comprising a cutting table and a mounting frame, one side of the mounting frame is fixedly connected to the outer wall of the cutting table, a water storage tank is opened on the top of the cutting table, a partition is fixedly connected to the inner wall of the water storage tank, and the partition is U-shaped, a cutting device is fixedly installed on the bottom of the mounting frame, a support table and a fixed seat are respectively fixedly connected at the upper and lower ends of the mounting frame, a liquid storage tank is fixedly installed on the top of the mounting frame, a cooling box is fixedly installed on the top of the liquid storage tank, a first water pump is fixedly installed on the top of the support table, and a second water pump is fixedly installed on one side of the fixed seat.

[0006] Preferably, a connecting pipe is fixedly connected to the bottom of the liquid storage tank, a water pumping end of the second water pump is fixedly connected to one end of the connecting pipe, and a nozzle is fixedly connected to the bottom of the connecting pipe.

[0007] Preferably, a filter is fixedly mounted on the side of the partition, an opening is provided on the top of the partition, limiting blocks are fixedly mounted on both sides of the inner wall of the opening, and a material storage box is movably placed inside the opening.

[0008] Preferably, a material receiving groove is provided on the top of the material storage box, a filter hole is provided on the top of the material receiving groove, a clamping block is fixedly connected to the front and rear ends of the material storage box, a pull rod is fixedly connected to the top of the material storage box, and the clamping block is located on the top of the limit block.

[0009] Preferably, a delivery pipe is provided at the inner bottom end of the water storage tank, and one surface end of the delivery pipe passes through the interior of the mounting frame.

[0010] Preferably, the water pumping end of the first water pump is fixedly connected to the top end of the delivery pipe, and the water outlet end of the first water pump is fixedly connected to a water guide pipe, and one end of the water guide pipe is located inside the cooling box.

[0011] Preferably, a condenser is provided inside the cooling box, the top end of the condenser is fixedly connected to one side of the water pipe, one end of the surface of the condenser passes through the bottom of the cooling box, and the bottom end of the condenser is located inside the liquid storage tank.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, by arranging filter screens at both ends of the partition, the debris in the coolant can be separated, and the filter screen is arranged by tilting, so that the debris on the top of the filter screen can roll down to the inside of the storage box for collection when being flushed by the coolant, and the blocks on both sides of the storage box are supported by the limit blocks and located inside the opening. The storage box can be taken out by lifting the pull rod upward, which is convenient for cleaning the filtered debris and avoiding accumulation on the top of the filter screen to cause blockage.

[0014] 2. In the utility model, the water storage tank can collect and store the coolant after filtration, and the bottom end of the delivery pipe is located inside the water outlet tank. The coolant can be pumped into the condenser by starting the first water pump, and the coolant is cooled by adding cold water into the cooling box. The coolant can be used immediately without waiting for the coolant to cool down by itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model provides a schematic diagram of the three-dimensional structure of a cutting table of a diamond wire cutting silicon wafer coolant recovery device;

[0016] Figure 2 The utility model provides a schematic diagram of the installation structure of a storage box of a diamond wire cutting silicon wafer coolant recovery device;

[0017] Figure 3 The utility model provides a schematic cross-sectional structure diagram of a cutting table of a diamond wire-cut silicon wafer coolant recovery device;

[0018] Figure 4The utility model provides a schematic cross-sectional structure diagram of a cooling box of a diamond wire-cut silicon wafer coolant recovery device.

[0019] Legend: 1. Cutting table; 101. Water storage tank; 11. Partition; 111. Opening; 12. Filter; 13. Limit block; 14. Delivery pipe; 2. Mounting frame; 21. Cutting device; 22. Support table; 23. Fixed seat; 3. Liquid storage tank; 31. Connecting pipe; 32. Nozzle; 4. Cooling box; 5. First water pump; 51. Water guide pipe; 52. Condenser; 6. Second water pump; 7. Material storage box; 701. Material receiving trough; 702. Filter hole; 71. Block; 72. Pull rod. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] Example 1

[0023] like Figure 1-Figure 4 As shown, the utility model provides a technical solution: a diamond wire cutting silicon wafer coolant recovery device, comprising a cutting table 1 and a mounting frame 2, one side of the mounting frame 2 is fixedly connected to the outer wall of the cutting table 1, a water storage tank 101 is provided on the top of the cutting table 1, a partition 11 is fixedly connected to the inner wall of the water storage tank 101, and the partition 11 is U-shaped, a cutting device 21 is fixedly installed on the bottom of the mounting frame 2, a support table 22 and a fixing seat 23 are fixedly connected to the upper and lower ends of the mounting frame 2, a liquid storage tank 3 is fixedly installed on the top of the mounting frame 2, a connecting pipe 31 is fixedly installed on the surface of the liquid storage tank 3, a cooling box 4 is fixedly installed on the top of the liquid storage tank 3, and a first fixedly installed on the top of the support table 22 A water pump 5, a second water pump 6 is fixedly installed on one side of the fixed seat 23, the water pumping end of the second water pump 6 is fixedly connected to one end of the connecting pipe 31, the bottom of the connecting pipe 31 is fixedly connected to a nozzle 32, the side of the partition 11 is fixedly installed with a filter screen 12, the top of the partition 11 is provided with an opening 111, and both sides of the inner wall of the opening 111 are fixedly installed with limiting blocks 13, the inner side of the opening 111 is movably placed with a material storage box 7, the top of the material storage box 7 is provided with a material receiving groove 701, and the top of the material receiving groove 701 is provided with a filtering hole 702, the front and rear ends of the material storage box 7 are fixedly connected with a clamping block 71, the top of the material storage box 7 is fixedly connected with a pull rod 72, and the clamping block 71 is located at the top of the limiting block 13.

[0024] In this embodiment, coolant is added to the liquid storage tank 3, and the second water pump 6 is started to pump the coolant out through the nozzle 32 and spray it on the surface of the silicon wafer to cool the silicon wafer. The cooled waste liquid falls into the water storage tank 101, and the filter screen 12 on the side of the partition 11 filters and separates the debris in the coolant. At the same time, the debris is washed to the top of the storage box 7 under the impact of the water flow, and the excess coolant flows into the water storage tank 101 from the filter hole 702. The debris is located in the receiving groove 701, and the block 71 is supported by the limit block 13 to make it stable in the opening 111. The storage box 7 can be taken out upward by lifting the pull rod 72, so that the debris on the top of the storage box 7 can be cleaned conveniently.

[0025] Example 2

[0026] like Figure 1-Figure 4 As shown, a delivery pipe 14 is provided at the bottom end of the water storage tank 101, and one end of the surface of the delivery pipe 14 passes through the interior of the mounting frame 2. The water pumping end of the first water pump 5 is fixedly connected to the top end of the delivery pipe 14, and the water outlet end of the first water pump 5 is fixedly connected to a water pipe 51, and one end of the water pipe 51 is located inside the cooling box 4. A condenser 52 is provided inside the cooling box 4, and the top end of the condenser 52 is fixedly connected to one side of the water pipe 51, and one end of the surface of the condenser 52 passes through the bottom of the cooling box 4, and the bottom end of the condenser 52 is located inside the liquid storage tank 3.

[0027] In this embodiment, the filtered coolant is collected inside the water storage tank 101 and has a relatively high temperature. The coolant is pumped into the delivery pipe 14 by starting the first water pump 5, and then flows into the condenser 52 through the water conduit 51. By adding cold water into the cooling box 4, the cold water exchanges heat and cools down the coolant inside the condenser 52, thereby preventing the coolant temperature from being too high and affecting the cooling effect.

[0028] The working principle of this embodiment is as follows: the silicon wafer to be cut is placed on the top of the cutting table 1, the cutting device 21 is started to cut the silicon wafer, coolant is added into the liquid storage tank 3, the second water pump 6 is started to pump out the coolant and spray it on the surface of the silicon wafer through the nozzle 32 to cool the silicon wafer, and the waste liquid falls into the water storage tank 101, the filter screen 12 filters and separates the debris in the coolant, and at the same time, the debris is rushed to the top of the material storage box 7 under the impact of the water flow, and the material storage box 7 can be taken out upward by lifting the pull rod 72 upward, so as to facilitate the cleaning of the debris on the top of the material storage box 7, and then the first water pump 5 is started to pump the coolant into the conveying pipe 14, and then flow into the condenser 52 through the water guide pipe 51, and cold water is added to the cooling box 4. The cold water exchanges heat and cools the coolant in the condenser 52, and the cooled coolant flows into the liquid storage tank 3 to circulate the coolant.

[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A diamond wire sawing silicon wafer coolant recovery device, comprising a cutting table (1) and a mounting frame (2), characterized in that: One side of the mounting frame (2) is fixedly connected to the outer wall of the cutting table (1); a water storage tank (101) is provided on the top of the cutting table (1); a partition (11) is fixedly connected to the inner wall of the water storage tank (101); the partition (11) is U-shaped; a cutting device (21) is fixedly installed on the bottom of the mounting frame (2); a support platform (22) and a fixing seat (23) are fixedly connected at the upper and lower ends of the mounting frame (2); a liquid storage tank (3) is fixedly installed on the top of the mounting frame (2); a cooling box (4) is fixedly installed on the top of the liquid storage tank (3); a first water pump (5) is fixedly installed on the top of the support platform (22); and a second water pump (6) is fixedly installed on one side of the fixing seat (23).

2. The diamond wire sawing silicon wafer coolant recovery device according to claim 1, characterized in that: The bottom of the liquid storage tank (3) is fixedly connected to a connecting pipe (31), the water pumping end of the second water pump (6) is fixedly connected to one end of the connecting pipe (31), and the bottom of the connecting pipe (31) is fixedly connected to a spray head (32).

3. The diamond wire sawing silicon wafer coolant recovery device according to claim 1, characterized in that: A filter screen (12) is fixedly mounted on the side of the partition (11), an opening (111) is provided on the top of the partition (11), limiting blocks (13) are fixedly mounted on both sides of the inner wall of the opening (111), and a material storage box (7) is movably placed inside the opening (111).

4. The diamond wire sawing silicon wafer coolant recovery device according to claim 3, characterized in that: The top of the material storage box (7) is provided with a material receiving groove (701), the top of the material receiving groove (701) is provided with a filtering hole (702), the front and rear ends of the material storage box (7) are fixedly connected with a clamping block (71), the top of the material storage box (7) is fixedly connected with a pull rod (72), and the clamping block (71) is located on the top of the limit block (13).

5. The diamond wire sawing silicon wafer coolant recovery device according to claim 1, characterized in that: A delivery pipe (14) is provided at the inner bottom end of the water storage tank (101), and one end of the surface of the delivery pipe (14) penetrates the interior of the mounting frame (2).

6. The diamond wire sawing silicon wafer coolant recovery device according to claim 1, characterized in that: The water pumping end of the first water pump (5) is fixedly connected to the top end of the delivery pipe (14), and the water outlet end of the first water pump (5) is fixedly connected to a water guide pipe (51), one end of which is located inside the cooling box (4).

7. The diamond wire sawing silicon wafer coolant recovery device according to claim 1, characterized in that: A condenser (52) is provided inside the cooling box (4), the top end of the condenser (52) is fixedly connected to one side of the water pipe (51), one end of the surface of the condenser (52) passes through the bottom of the cooling box (4), and the bottom end of the condenser (52) is located inside the liquid storage tank (3).

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