Magnetron sputtering forming device for coating target material

Abstract

The magnetron sputtering forming device comprises a magnetron sputtering coating machine, an operation bin, a magnetron sputtering target, a target material and a coating film convenient switching mechanism, an assembly bin is fixedly connected to the top of the inner side of the operation bin, a limiting head is fixedly connected to the bottom of the assembly bin, an open groove is formed in the eccentric position of the bottom of the assembly bin, and the magnetron sputtering target is arranged in the open groove. The driving assembly is installed at the top of the magnetron sputtering coating machine, the multiple sets of assembling assemblies are arranged and connected with the end of the driving assembly, and the multiple sets of assembling assemblies are installed in the assembling bin in a circumferential array mode. Therefore, the multiple wiping pads are embedded in the bottom of the inner side of the assembling bin in a circumferential array mode, and then the driving device is started to drive the multiple assembling assemblies to be switched and drive coated metal to be wiped through the multiple wiping pads at the same time, so that the situation that the coated metal needs to be additionally wiped and cleaned is avoided, and the working efficiency is improved. Therefore, the production cost can be reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetron sputtering coating, in particular to a coating target material magnetron sputtering forming device. Background Art

[0002] In modern surface engineering technology, magnetron sputtering is a widely used physical vapor deposition method. This technology can form uniform and dense films on various substrates. The core of this technology is to use magnetic fields to control the movement trajectory of charged particles (mainly ions and electrons), thereby increasing the deposition efficiency of target atoms or molecules to the substrate. In the magnetron sputtering coating process, the metal target is usually installed on a rotating shutter. The purpose of this design is to adjust the exposure area of ​​the target by rotating the shutter during the coating process, thereby controlling the speed and thickness of the coating.

[0003] However, due to the high kinetic energy of charged particles during the sputtering process, when the distance between the target and the substrate is close, these particles may hit the target surface and leave marks on the target surface. Therefore, it is also necessary to clean the target surface after coating to eliminate surface damage and unevenness. However, this treatment method increases production costs and time. Utility Model Content

[0004] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the purpose of the utility model is to propose a coating target magnetron sputtering forming device, which can coat metals in batches and synchronously wipe the coated metal surface during the metal switching process, thereby reducing production costs and improving production efficiency.

[0006] To achieve the above-mentioned purpose, the utility model proposes a coating target material magnetron sputtering forming device, comprising a magnetron sputtering coating machine, an operating chamber, a magnetron sputtering target, a target material and a convenient coating switching mechanism, wherein the operating chamber is opened on one side of the magnetron sputtering coating machine, the magnetron sputtering target is installed at the inner bottom of the operating chamber, and the target material is installed on the top of the magnetron sputtering target. The convenient coating switching mechanism comprises an assembly chamber, a limit head, a groove, a drive component and an assembly component, wherein the assembly chamber is fixedly connected to the inner top of the operating chamber, the limit head is fixedly connected to the bottom of the assembly chamber, the groove is opened at the eccentric bottom of the assembly chamber, the drive component is installed on the top of the magnetron sputtering coating machine, and the assembly component is provided with multiple groups and connected to the end of the drive component, and multiple groups of the assembly components are installed in a circular array inside the assembly chamber.

[0007] The utility model discloses a magnetron sputtering forming device for coating target materials, wherein one end of a plurality of connecting arms is fixedly connected to the outer wall of a driving rod in a circular array, and the other end of the connecting arm is connected to an assembly component, and a plurality of wiping pads are embedded in the inner bottom of the assembly bin in a circular array. Then, by starting the driving device, while it can drive the plurality of assembly components to switch, it can also drive the coated metal to be wiped by the plurality of wiping pads, thereby avoiding the need to wipe and clean the metal separately after coating, thereby reducing production costs and improving production efficiency.

[0008] In addition, the coating target magnetron sputtering forming device proposed in the utility model may also have the following additional technical features:

[0009] Specifically, the driving component includes a driving device, a driving rod, a connecting arm and a wiping pad, wherein the driving device is installed on the top of the magnetron sputtering coating machine, one end of the driving rod is rotatably connected to the top of the limit head, the other end of the driving rod is fixedly connected to the output end of the driving device, one end of a plurality of the connecting arms is fixedly connected to the outer wall of the driving rod in a circular array, the other end of the connecting arm is connected to an assembly component, and a plurality of the wiping pads are embedded in a circular array at the inner bottom of the assembly bin.

[0010] Specifically, the assembly component includes an assembly shell, a support sleeve, a support rod, a support spring and a clamping plate, wherein one end of the outer wall of the assembly shell is fixedly connected to the other end of the connecting arm, the support sleeve is symmetrically fixedly connected to both sides of the inner wall of the assembly shell, one end of the support rod slides through the end of the support sleeve and is fixedly connected to one end of the support spring, the other end of the support spring is fixedly connected to the inner wall end of the support sleeve, and one side of the clamping plate is fixedly connected to the other end of the support rod.

[0011] Specifically, the bottom opening of the assembly housing has the same size as the slot.

[0012] Specifically, a sealing window is rotatably installed on one side of the magnetron sputtering coating machine, and the sealing window can seal the opening of the operating chamber.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0015] Figure 1This is a schematic diagram of the magnetron sputtering forming device for coating target material of the utility model;

[0016] Figure 2 The structure of the assembly chamber of an embodiment of the utility model is shown in FIG. Figure 1 ;

[0017] Figure 3 The structure of the assembly chamber of an embodiment of the utility model is shown in FIG. Figure 2 ;

[0018] Figure 4 The figure is a schematic structural diagram of an assembly component of an embodiment of the utility model.

[0019] As shown in the figure:

[0020] 1. Magnetron sputtering coating machine; 11. Sealing window; 2. Operation chamber; 3. Magnetron sputtering target; 4. Target material;

[0021] 5. Convenient switching mechanism for coating; 51. Assembly chamber; 52. Limiting head; 53. Slotting; 54. Driving assembly; 541. Driving device; 542. Driving rod; 543. Connecting arm; 544. Wiping pad; 55. Assembly assembly; 551. Assembly shell; 552. Support sleeve; 553. Support rod; 554. Support spring; 555. Clamping plate. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the present invention include all changes, modifications, and equivalents that fall within the spirit and connotation of the appended claims.

[0023] The following describes the coating target material magnetron sputtering forming device according to the embodiment of the utility model in conjunction with the accompanying drawings.

[0024] like Figure 1-Figure 4 As shown, the coating target material magnetron sputtering forming device of the embodiment of the utility model may include a magnetron sputtering coating machine 1, an operating chamber 2, a magnetron sputtering target 3, a target material 4 and a convenient coating switching mechanism 5.

[0025] The operating chamber 2 is opened at one side of the magnetron sputtering coating machine 1 , the magnetron sputtering target 3 is installed at the inner bottom of the operating chamber 2 , and the target material 4 is installed on the top of the magnetron sputtering target 3 .

[0026] Furthermore, if Figure 1As shown, a sealing window 11 is rotatably installed on one side of the magnetron sputtering coating machine 1 , and the sealing window 11 can seal the opening of the operating chamber 2 .

[0027] It should be noted that the magnetron sputtering target 3 and target material 4 described in this embodiment are located at the inner bottom of the operating chamber 2 and close to the side wall of the operating chamber 2. At the same time, a handle is installed on the outer wall of the sealing window 11, and an observation window is installed on the sealing window 11.

[0028] The convenient switching mechanism for coating 5 comprises an assembly chamber 51 , a limiting head 52 , a slot 53 , a driving assembly 54 and an assembly assembly 55 .

[0029] The assembly bin 51 is fixedly connected to the inner top of the operation bin 2 , the limit head 52 is fixedly connected to the bottom of the assembly bin 51 , and the slot 53 is opened at an eccentric position of the bottom of the assembly bin 51 .

[0030] It should be noted that the slot 53 and the target material 4 described in this embodiment are located on the same vertical line.

[0031] The driving component 54 is installed on the top of the magnetron sputtering coating machine 1, and multiple groups of assembly components 55 are provided and connected to the end of the driving component 54, and the multiple groups of assembly components 55 are installed in a circular array inside the assembly chamber 51.

[0032] It should be noted that the driving assembly 54 described in this embodiment is provided with a driving end and a driven end, the driving end is installed on the top of the magnetron sputtering coating machine 1, and the driven end is installed inside the assembly chamber 51.

[0033] Specifically, when the coating target magnetron sputtering forming device is used, first, multiple metals to be coated are installed through multiple assembly components 55 respectively, and then because the assembly bin 51 is fixedly connected to the inner top of the operating bin 2, the limit head 52 is fixedly connected to the bottom of the assembly bin 51, and the slot 53 is opened at the eccentric bottom of the assembly bin 51, the driving component 54 is installed on the top of the magnetron sputtering coating machine 1, and multiple groups of assembly components 55 are provided and connected to the end of the driving component 54, and multiple groups of assembly components 55 are installed in the interior of the assembly bin 51 in a circular array, and then by starting the driving component 54, multiple assembly components 55 can be driven to be located on the slot 53 in turn, and then the metal on the slot 53 is sputtered and coated by the magnetron sputtering target 3 and the target material 4. After sputtering is completed, another assembly component 55 is conveniently switched through the driving component 54 to move it to the slot 53, thereby effectively improving the work efficiency.

[0034] In one embodiment of the present invention, Figure 1-Figure 4As shown, the driving component 54 includes a driving device 541, a driving rod 542, a connecting arm 543 and a wiping pad 544, wherein the driving device 541 is installed on the top of the magnetron sputtering coating machine 1, one end of the driving rod 542 is rotatably connected to the top of the limit head 52, and the other end of the driving rod 542 is fixedly connected to the output end of the driving device 541, one end of a plurality of connecting arms 543 is fixedly connected to the outer wall of the driving rod 542 in a circular array, and the other end of the connecting arm 543 is connected to the assembly component 55, and a plurality of wiping pads 544 are embedded in the inner bottom of the assembly bin 51 in a circular array.

[0035] It should be noted that the metal-plated surface of the assembly component 55 described in this embodiment and the inner bottom of the assembly chamber 51 are located on the same horizontal plane.

[0036] Specifically, in order to prevent any marks from remaining on the metal surface after coating, the driving device 541 is installed on the top of the magnetron sputtering coating machine 1, one end of the driving rod 542 is rotatably connected to the top of the limit head 52, and the other end of the driving rod 542 is fixedly connected to the output end of the driving device 541, and one end of a plurality of connecting arms 543 is fixedly connected to the outer wall of the driving rod 542 in a circular array, and the other end of the connecting arm 543 is connected to an assembly component 55, and a plurality of wiping pads 544 are embedded in the inner bottom of the assembly bin 51 in a circular array. Then, by starting the driving device 541, while it can drive the plurality of assembly components 55 to switch, it can also drive the coated metal to be wiped by the plurality of wiping pads 544, thereby avoiding the need to wipe and clean the metal after coating, thereby reducing production costs and improving production efficiency.

[0037] In one embodiment of the present invention, Figure 1-Figure 4 As shown, the assembly component 55 includes an assembly shell 551, a support sleeve 552, a support rod 553, a support spring 554 and a clamping plate 555, wherein one end of the outer wall of the assembly shell 551 is fixedly connected to the other end of the connecting arm 543, the support sleeve 552 is symmetrically fixedly connected to both sides of the inner wall of the assembly shell 551, one end of the support rod 553 slides through the end of the support sleeve 552, and is fixedly connected to one end of the support spring 554, the other end of the support spring 554 is fixedly connected to the inner wall end of the support sleeve 552, and one side of the clamping plate 555 is fixedly connected to the other end of the support rod 553.

[0038] Furthermore, if Figure 2 As shown, the bottom opening of the assembly housing 551 is the same size as the slot 53 .

[0039] Specifically, in order to improve the effect of sputtering coating, one end of the outer wall of the assembly shell 551 is fixedly connected to the other end of the connecting arm 543, the support sleeve 552 is symmetrically fixedly connected to the two sides of the inner wall of the assembly shell 551, one end of the support rod 553 slides through the end of the support sleeve 552, and is fixedly connected to one end of the support spring 554, the other end of the support spring 554 is fixedly connected to the inner wall end of the support sleeve 552, one side of the clamping plate 555 is fixedly connected to the other end of the support rod 553, and then multiple metals are assembled through multiple assembly shells 551, so that sputtering coating operations can be carried out in batches, thereby effectively improving production efficiency.

[0040] It should be understood that when the assembly shell 551 is located above the slot 53 , the bottom opening of the assembly shell 551 and the top opening of the slot 53 overlap with each other.

[0041] In summary, in the magnetron sputtering forming device for coating target materials of the embodiment of the utility model, one end of a plurality of connecting arms 543 is fixedly connected to the outer wall of the driving rod 542 in a circular array, the other end of the connecting arm 543 is connected to the assembly component 55, and a plurality of wiping pads 544 are embedded in the inner bottom of the assembly bin 51 in a circular array. Then, by starting the driving device 541, while it can drive the plurality of assembly components 55 to switch, it can also drive the coated metal to be wiped by the plurality of wiping pads 544, thereby avoiding the need to wipe and clean the metal after coating, thereby reducing production costs and improving production efficiency.

[0042] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A coating target magnetron sputtering forming device, characterized in that: The invention comprises a magnetron sputtering coating machine (1), an operating chamber (2), a magnetron sputtering target (3), a target material (4) and a convenient coating switching mechanism (5), wherein: The operating chamber (2) is opened on one side of the magnetron sputtering coating machine (1), the magnetron sputtering target (3) is installed on the inner bottom of the operating chamber (2), and the target material (4) is installed on the top of the magnetron sputtering target (3); The coating convenient switching mechanism (5) comprises an assembly bin (51), a limit head (52), a slot (53), a driving assembly (54) and an assembly assembly (55), wherein: The assembly bin (51) is fixedly connected to the inner top of the operation bin (2), and the limit head (52) is fixedly connected to the bottom of the assembly bin (51); The slot (53) is provided at an eccentric position of the bottom of the assembly bin (51); The driving component (54) is installed on the top of the magnetron sputtering coating machine (1), and the assembly components (55) are provided in multiple groups and connected to the ends of the driving components (54), and the multiple groups of the assembly components (55) are installed in a circular array inside the assembly bin (51).

2. The coating target material magnetron sputtering forming device according to claim 1, characterized in that: The driving assembly (54) comprises a driving device (541), a driving rod (542), a connecting arm (543) and a wiping pad (544), wherein: The driving device (541) is installed on the top of the magnetron sputtering coating machine (1), one end of the driving rod (542) is rotatably connected to the top of the limit head (52), and the other end of the driving rod (542) is fixedly connected to the output end of the driving device (541); One end of the plurality of connecting arms (543) is fixedly connected to the outer wall of the driving rod (542) in a circular array, and the other end of the connecting arm (543) is connected to an assembly component (55); The plurality of wiping pads (544) are embedded in the inner bottom of the assembly bin (51) in a circular array.

3. The coating target material magnetron sputtering forming device according to claim 2, characterized in that: The assembly component (55) comprises an assembly housing (551), a support sleeve (552), a support rod (553), a support spring (554) and a clamping plate (555), wherein: One end of the outer wall of the assembly shell (551) is fixedly connected to the other end of the connecting arm (543), the support sleeve (552) is symmetrically fixedly connected to both sides of the inner wall of the assembly shell (551), one end of the support rod (553) slides through the end of the support sleeve (552) and is fixedly connected to one end of the support spring (554), and the other end of the support spring (554) is fixedly connected to the inner wall end of the support sleeve (552); One side of the clamping plate (555) is fixedly connected to the other end of the support rod (553).

4. The coating target material magnetron sputtering forming device according to claim 3, characterized in that: The bottom opening of the assembly housing (551) has the same size as the slot (53).

5. The coating target material magnetron sputtering forming device according to claim 1, characterized in that: A sealing window (11) is rotatably mounted on one side of the magnetron sputtering coating machine (1), and the sealing window (11) can seal the opening of the operating chamber (2).

Images