Carrier plate feeding device for die bonding equipment

By designing a loading device for solid crystal equipment, including a workbench, a transfer plate, a box, a conveyor belt, a moving plate, a support block, a push plate and a transport component, the problems of low loading efficiency and high operating strength of the existing solid crystal board are solved, and efficient loading and solidification operation of the carrier board are achieved, which improves working efficiency and reduces operating strength.

CN222867630UActive Publication Date: 2025-05-13GUANGYIN INTELLIGENT TECHNOLOGY (HUZHOU) CO LTD
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Patent Information

Application Number
CN202421549852.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-02
Publication Date
2025-05-13
Estimated Expiration
2034-07-02

AI Technical Summary

Technical Problem

When loading the carrier plate of the existing crystal solidifier, the carrier plate is in a sheet-shaped shape and stacked layer by layer. The material pushing device is pushed into the feed track one by one. After taking the carrier plate, the no-load sheet box needs to be manually removed and re-placed, which affects the working efficiency and increases the operating strength.

Method used

A loading device for solid crystal equipment is designed, including a workbench, a material transfer plate, a material box, a conveyor belt, a moving plate, a supporting block, a push plate and a transport assembly. Through the conveyor belt conveyor box, the transport component transfers the material box to the transfer plate, the push plate pushes into the carrier plate to the external stage for crystal solid operation, and the conveyor belt conveys the solid solid material box.

Benefits of technology

It realizes efficient feeding and crystal-fixing operation of the carrier plate, reduces the working intensity of the operator and improves work efficiency. The position change and conveying process of the material box are simplified by the design of the transfer plate and the transfer assembly.

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Abstract

A carrier plate feeding device for die bonding equipment is used for solving the problems that in the prior art, during feeding of carrier plates of a die bonder in the prior art, the carrier plates are in a sheet shape and stacked in a material box layer by layer, a material pushing device pushes the carrier plates into a feeding rail one by one, an operator needs to take down a no-load plate material box where the carrier plates are taken and place the material box loaded with the carrier plates again, and operation is inconvenient. The technical problems that the working efficiency is affected, and the working intensity of operators is further improved are solved, a material moving plate is arranged on the working table in a sliding mode, two material boxes used for containing carrier plates are arranged on the material moving plate, and a conveying belt used for conveying the material boxes is arranged on the working table. A movable plate is arranged on the workbench in a sliding mode, a supporting block is arranged on the movable plate in a sliding mode, a pushing plate used for pushing the carrier plate is fixedly arranged on the supporting block, and a transferring assembly used for transferring the material box to the conveying belt is arranged on the supporting block.
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Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding, in particular to a plate loading device for crystal bonding equipment. Background Art

[0002] The die bonder is used to achieve electrical connection between semiconductor devices and substrates. The die bonder can bond semiconductor devices to the substrate using conductive silver paste or non-conductive glue, and then perform a baking process to solidify the semiconductor devices bonded with the conductive silver paste or non-conductive glue. Finally, under the action of hot pressing and ultrasound, the substrate and the semiconductor device are connected through a gold wire (copper wire or silver alloy wire) through a wire bonding machine to achieve electrical connectivity between the semiconductor device and the substrate.

[0003] When loading the carrier of the existing crystal bonding machine, the carrier is in sheet form and is stacked layer by layer in the material box. The pushing device pushes the carriers into the feed track one by one. After the empty carrier material box is taken out of the carrier, the operator needs to remove it and replace the material box with the carrier. This operation method not only affects its work efficiency, but also increases the work intensity of the operator. Utility Model Content

[0004] The utility model aims to address the deficiencies in the prior art and proposes a plate loading device for a crystal bonding equipment, which is used to solve the technical problem mentioned in the background technology that when the plate loading of the prior art crystal bonding machine is performed, the plate is in sheet form and is stacked layer by layer in a material box, and a pushing device pushes the plate into a feed track one by one, and an operator needs to remove the empty plate material box after taking out the plate and replace the material box with the plate, and this operation mode not only affects its work efficiency, but also increases the work intensity of the operator.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] A plate carrier feeding device for a crystal bonding device comprises a workbench, a material transfer plate is slidably provided on the workbench, two material boxes for placing the carrier plates are provided on the material transfer plate, a conveyor belt for conveying the material boxes is provided on the workbench, a movable plate is slidably provided on the workbench, a support block is slidably provided on the movable plate, a pushing plate for pushing the carrier plate is fixed on the support block, and a transfer component for transferring the material boxes to the conveyor belt is provided on the support block.

[0007] Working principle:

[0008] First, the operator places the carrier plate in the material box, and then the operator places the material box with the carrier plate on the conveyor belt, the conveyor belt transports the material box to the bottom of the transfer assembly, and then the operator slides the movable plate, the movable plate drives the support block and the transfer assembly on the support block to move toward the material box, and then the material box is transferred to the material moving plate through the transfer assembly, and then the operator slides the support block and the movable plate to move the push plate to the end of the carrier plate, and then the operator slides the support block, and the push plate on the support block pushes the carrier plate onto the external carrier for crystal bonding operation, when the carrier plate is bonded and placed in the material box, the operator can drive the movable plate to drive the support block and the transfer assembly to move toward the material box, and the material box with the carrier plate bonded is placed back on the conveyor belt through the transfer assembly for external transportation.

[0009] Compared with the prior art, the utility model has the following beneficial effects:

[0010] First, a material shifting plate is provided, which can change the positions of the two material boxes, so that the transfer component can take out the empty material box and the material box with the carrier plate bonded, and place the material box on the conveyor belt for external transportation.

[0011] Second, a transfer component is provided, which can transfer the material box on the material transfer plate from the conveyor belt to the material transfer plate or transfer the material box from the material transfer plate to the conveyor belt.

[0012] Third, a push plate is provided, which can push the unbonded carrier in the material box onto the external carrier, so as to facilitate the bonding operation of the carrier by the bonding machine.

[0013] Fourthly, a conveyor belt is provided, and the conveyor belt can transport the material box with the carrier plate or the material box with the carrier plate bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of an embodiment of the utility model;

[0015] Figure 2 It is a schematic diagram of the assembly structure of the hollow column and the movable plate;

[0016] Figure 3 Schematic diagram of the assembly structure of the lifting block and the material box

[0017] Explanation of the accompanying drawings: workbench 1, material transfer plate 2, material box 3, conveyor belt 4, movable plate 5, support block 6, push plate 7, first guide rail 8, first screw 9, first slider 10, first motor 11, hollow column 12, second screw 13, second guide rod 14, through groove 15, second motor 16, third screw 17, slide groove 18, third motor 19, lifting groove 20, first cylinder 21, lifting block 22, positioning block 24, second cylinder 25, clamping plate 26. DETAILED DESCRIPTION

[0018] The technical solution of the present utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Example:

[0020] like Figure 1 As shown, a plate loading device for a crystal bonding device comprises a workbench 1, on which a material moving plate 2 is slidably provided, and a positioning block 24 for positioning a material box 3 is fixedly provided on the material moving plate 2, and the positioning block 24 can facilitate the positioning of the material box 3 on the material moving plate 2, and facilitate the subsequent pushing of the carrier plate in the material box 3 by the pushing plate 7, and two second cylinders 25 are fixedly provided on the material moving plate 2, and clamping plates 26 are fixedly provided on the telescopic ends of the two second cylinders 25, and the two clamping plates 26 respectively push the two material boxes 3 to abut against the positioning block 24, and the material box 3 can be fixed between the clamping plate 26 and the positioning block 24 by the second cylinder 25 to reduce the shaking of the material box 3.

[0021] like Figure 1 and Figure 2 As shown, the workbench 1 is fixedly provided with a first guide rail 8, a first screw 9 is rotatably provided in the first guide rail 8, a first slider 10 is slidably provided in the first guide rail 8 and the first slider 10 is threadedly connected to the first screw 9, the material moving plate 2 is fixedly provided on the first slider 10, a first motor 11 is fixedly provided on the workbench 1 and the output end of the first motor 11 is fixedly connected to the first screw 9, the first screw 9 is driven to rotate by the first motor 11 and the first slider 10 is driven to move, and when the first slider 10 moves, it will further drive the material moving plate 2 to move, thereby adjusting the position of the material box 3.

[0022] like Figure 1 and Figure 2 As shown, the material shifting plate 2 is provided with two material boxes 3 for placing carriers, the workbench 1 is provided with a conveyor belt 4 for conveying the material boxes 3, and the conveyor belt 4 can convey the material boxes 3 with unbonded carriers or the material boxes 3 with bonded carriers, a moving plate 5 is slidably provided on the workbench 1, and two hollow columns 12 are fixed on the workbench 1, and second screws 13 and second guide rods 14 parallel to each other are respectively provided in the two hollow columns 12, and through grooves 15 are opened on opposite sides of the two hollow columns 12. The two ends of the movable plate 5 slide through the two through grooves 15 respectively, one end of the movable plate 5 is threadedly connected to the second screw rod 13 and the other end is slidably connected to the second guide rod 14, one of the hollow columns 12 is fixedly provided with a second motor 16 and the output end of the second motor 16 is fixedly connected to the second screw rod 13, the second motor 16 drives the second screw rod 13, so that the second screw 13 drives the movable plate 5 to move on the second guide rod 14 and the through groove 15, thereby changing the position of the support block 6 by driving the movable plate 5.

[0023] like Figure 1 and Figure 2As shown, a support block 6 is slidably provided on the movable plate 5, and a pushing plate 7 for pushing the carrier plate is fixed on the support block 6. A third screw rod 17 is rotatably provided on the movable plate 5, and a slide groove 18 parallel to the axial direction of the third screw rod 17 is opened on the movable plate 5. The support block 6 is threadedly connected to the third screw rod 17 and the support block 6 is slidably connected to the slide groove 18. A third motor 19 is fixed on the movable plate 5 and the output end of the third motor 19 is fixedly connected to the third screw rod 17. The third screw rod 17 is driven by the third motor 19, so that the third screw 17 drives the support block 6 to move in the slide groove 18, thereby changing the position of the support block 6 on the movable plate 5, and then changing the position of the pushing plate 7 by changing the position of the support block 6, so that the pushing plate 7 pushes the carrier plate.

[0024] like Figure 1 and Figure 2 and Figure 3 As shown, the support block 6 is provided with a transfer component for transferring the material box 3 to the conveyor belt 4, and the transfer component includes a first cylinder 21 and two lifting blocks 22, the first cylinder 21 is fixed on the support block 6, and the two lifting blocks 22 are relatively arranged and respectively fixed on the support block 6 and the telescopic end of the first cylinder 21, one of the lifting blocks 22 moves toward the other lifting block 22 with the telescopic movement of the first cylinder 21, and the two lifting blocks 22 are used to cooperate with and clamp the lifting groove 20, and the lifting groove 20 is opened on the top of the material box 3. The first cylinder 21 can make one of the lifting blocks 22 approach or move away from the lifting groove 20 on the material box 3, thereby completing the clamping and releasing of the material box 3.

[0025] Working principle:

[0026] First, the operator places the material box 3 with the unbonded carrier plate on the conveyor belt 4, and then the operator conveys the material box 3 to the bottom of the two lifting blocks 22 through the conveyor belt 4, and then the operator starts the second motor 16, the second motor 16 drives the second screw 13, and the second screw 13 drives the movable plate 5 to move on the second guide rod 14 and the through groove 15, so that the movable plate 5 drives the support block 6 to gradually approach the material box 3, when the lifting groove 20 of the material box 3 is located between the two lifting blocks 22, the operator starts the first cylinder 21, and the telescopic end of the first cylinder 21 drives one of the lifting blocks 22 to approach, so that the two lifting blocks 22 complete the clamping of the material box 3, and then the operator starts the third motor 19, the third motor 19 drives the third screw 17, and the third screw 17 drives the support block 6 to move toward the material moving plate 2, thereby moving the material box 3 onto the material moving plate 2, and making the material box 3 is close to the positioning block 24, and then the operator starts the second cylinder 25, which drives the clamping plate 26 to move, so as to fix the material box 3 between the positioning block 24 and the clamping plate 26. After the operator fixes an empty material box 3 and a material box 3 with a carrier plate on the material transfer plate 2, the operator adjusts the position of the support block 6 so that the push plate 7 and the carrier plate in the material box 3 are at the same height, and then drives the push plate 7 to push the carrier plate to the external crystal bonding stage by moving the support block 6. The carrier plate with completed crystal bonding is pushed into the empty material box 3 by the external crystal bonding device. When the carrier plate in the material box 3 is completed in crystal bonding, the operator pulls the material box 3 with the carrier plate with completed crystal bonding back to the conveyor belt 4 for external transportation, and pulls the remaining empty material box 3 to another position on the material transfer plate 2. Then the operator conveys the material box 3 with the carrier plate without crystal bonding again through the conveyor belt 4 and pulls it to the material transfer plate 2.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A substrate loading device for a die bonding device, characterized in that: The invention comprises a workbench (1), a material shifting plate (2) is slidably provided on the workbench (1), two material boxes (3) for placing carrier plates are provided on the material shifting plate (2), a conveyor belt (4) for conveying the material boxes (3) is provided on the workbench (1), a movable plate (5) is slidably provided on the workbench (1), a support block (6) is slidably provided on the movable plate (5), a pushing plate (7) for pushing the carrier plate is fixedly provided on the support block (6), and a transfer component for transferring the material box (3) to the conveyor belt (4) is provided on the support block (6).

2. A substrate loading device for a die bonding device according to claim 1, characterized in that: A first guide rail (8) is fixedly provided on the workbench (1), a first screw rod (9) is rotatably provided in the first guide rail (8), a first slider (10) is slidably provided in the first guide rail (8), and the first slider (10) is threadedly connected to the first screw rod (9), the material transfer plate (2) is fixedly provided on the first slider (10), a first motor (11) is fixedly provided on the workbench (1), and an output end of the first motor (11) is fixedly connected to the first screw rod (9).

3. The substrate loading device for a die bonding device according to claim 1, characterized in that: Two hollow columns (12) are fixedly arranged on the workbench (1), and second screw rods (13) and second guide rods (14) are respectively arranged in the two hollow columns (12), and through grooves (15) are opened on opposite sides of the two hollow columns (12), and two ends of the movable plate (5) slide through the two through grooves (15) respectively, and one end of the movable plate (5) is threadedly connected to the second screw rod (13) and the other end is slidably connected to the second guide rod (14), and a second motor (16) is fixedly arranged on one of the hollow columns (12), and the output end of the second motor (16) is fixedly connected to the second screw rod (13).

4. A substrate loading device for a die bonding device according to claim 3, characterized in that: A third screw rod (17) is rotatably provided on the movable plate (5), a slide groove (18) parallel to the axial direction of the third screw rod (17) is provided on the movable plate (5), the support block (6) is threadedly connected to the third screw rod (17), and the support block (6) is slidably connected to the slide groove (18), and a third motor (19) is fixedly provided on the movable plate (5), and an output end of the third motor (19) is fixedly connected to the third screw rod (17).

5. The substrate loading device for a die bonding device according to claim 1, characterized in that: The top of the material box (3) is provided with a lifting groove (20).

6. A substrate loading device for a die bonding device according to claim 5, characterized in that: The transfer assembly comprises a first cylinder (21) and two lifting blocks (22), wherein the first cylinder (21) is fixedly mounted on a support block (6), and the two lifting blocks (22) are arranged opposite to each other and are respectively fixedly mounted on the support block (6) and the telescopic end of the first cylinder (21), wherein one of the lifting blocks (22) moves toward the other lifting block (22) as the first cylinder (21) is extended or retracted, and the two lifting blocks (22) are used to cooperate with and clamp the lifting groove (20).

7. The substrate loading device for a die bonding device according to claim 1, characterized in that: A positioning block (24) for positioning the material box (3) is fixedly provided on the material moving plate (2), and two second cylinders (25) are fixedly provided on the material moving plate (2). A clamping plate (26) is fixedly provided on the telescopic end of the two second cylinders (25). The two clamping plates (26) respectively push the two material boxes (3) to abut against the positioning block (24).