Cooling device and chip module assembly
By designing a cooling device with two non-connected cooling spaces, and combining an insulated cooling medium and retaining wall separation design, the problems of insufficient cooling and conductivity of automotive parts in the prior art are solved, and efficient heat exchange and cooling effects are achieved.
Patent Information
- Application Number
- CN202421671447.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing automotive parts cooling system cannot effectively cool the circuit board and chip module, and the cooling medium is likely to cause conductivity problems when it comes into direct contact with the components to be cooled, reducing the cooling effect.
A cooling device is designed to enhance the heat exchange capacity through the cooling space of the two non-connected and shared heat exchange surfaces of the cooling element, and to design the through-holes of the cooling chamber and the installation groove through the retaining wall, and to cooperate with the insulated cooling medium to avoid conductivity problems and achieve sufficient heat exchange.
It effectively enhances heat exchange capacity and improves cooling effect. It is suitable for special cooling scenarios such as target cooling components with exposed conductive materials, avoiding conductive problems.
Smart Images
Figure CN222867670U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automobile parts, in particular to a cooling device and a chip module assembly. Background Art
[0002] There are many scenarios where automotive parts need to be cooled. For example, the power module of the inverter generates heat during operation and needs to be cooled.
[0003] Currently, the cooling system in the car is usually implemented for the entire vehicle or a local system in the car, and cannot take into account automobile parts such as circuit boards and chip modules. Separately designed cooling components are needed to cool these automobile parts.
[0004] The existing cooling components have the problem of not being able to effectively exert cooling effects due to insufficient heat exchange. In addition, in order to avoid the conductive problem caused by cooling, the cooling medium passed into the cooling components is usually not in direct contact with the components to be cooled, which also reduces the cooling effect.
[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content
[0006] In view of this, the utility model provides a cooling device and a chip module assembly, which enhances the heat exchange capacity through two cooling spaces of the cooling member that are not connected and share a heat exchange surface; the cooling chamber is separated by a retaining wall, and the through hole of the mounting groove connects the inlet channel and the outlet channel of the cooling chamber. In conjunction with the introduction of an insulating cooling medium into the first cooling space, the conductive problem can be avoided and the cooling medium can fully contact the target cooling component to achieve effective cooling, and can adapt to special cooling scenarios such as the target cooling component with exposed conductive material.
[0007] According to one aspect of the utility model, a cooling device is provided, comprising: a cooling member, provided with a first cooling space and a second cooling space which are not connected and share a heat exchange surface; a flow guide member, sealed and assembled with the cooling member, the flow guide member being provided with a flow guide cavity and a mounting groove with a through hole; wherein the flow guide cavity and the first cooling space are provided with matching retaining walls, the retaining walls separate the cooling chamber formed by the flow guide cavity and the first cooling space into at least an inlet channel and an outlet channel, the inlet channel being connected to the outflow channel via the through hole.
[0008] In some embodiments, the retaining wall includes a first retaining wall disposed in the first cooling space and a second retaining wall disposed in the guide cavity, and the first retaining wall is sealed and spliced with the second retaining wall.
[0009] In some embodiments, the mounting grooves include a plurality of mounting grooves, and the through holes of each mounting groove are distributed on both sides of the second retaining wall; the inflow channel and the outflow channel extend to cover the plurality of mounting grooves respectively.
[0010] In some embodiments, the retaining wall further includes a partition, wherein the partition is located between a through hole of the mounting slot closest to the outlet of the outflow channel and the outlet.
[0011] In some embodiments, an insulating cooling medium is introduced into the first cooling space, and the cooling medium flowing in the second cooling space participates in an external circulation.
[0012] In some embodiments, heat dissipation protrusions are distributed in the first cooling space and the second cooling space; and / or, the heat exchange surface is provided with heat dissipation protrusions facing the first cooling space and the second cooling space respectively.
[0013] In some embodiments, the cooling member has a first surface and a second surface opposite to each other, the first cooling space is arranged on the first surface, the second cooling space is arranged on the second surface, and the inlet and outlet of the first cooling space and the inlet and outlet of the second cooling space are both arranged on the side wall of the cooling member.
[0014] In some embodiments, the guide member has a relative mounting surface and a guide surface, the mounting groove is arranged on the mounting surface, the through hole passes through the mounting surface and the guide surface, and the guide cavity is arranged on the guide surface.
[0015] According to another aspect of the utility model, a chip module assembly is provided, comprising: a cooling device as described in any of the above embodiments; a chip module, sealed and assembled with the mounting groove of the guide member, the back of the chip module is provided with heat dissipation fins, and the heat dissipation fins are accommodated in the mounting groove.
[0016] In some embodiments, the chip module is a chip-embedded power module of the inverter, and the heat dissipation fins are metal fins; an insulating cooling medium is passed into the first cooling space, and a water-containing coolant is passed into the second cooling space, and the coolant participates in the circulation of the motor cooling system or the circulation of the vehicle cooling system.
[0017] Compared with the prior art, the beneficial effects of the present invention include at least:
[0018] The installation groove of the guide member is used for installation and accommodation of the target cooling component. The cooling member is provided with two cooling spaces which are not connected and share a heat exchange surface, wherein the first cooling space cools the component installed on the guide member, and the second cooling space cools the first cooling space, thereby achieving sufficient heat exchange between the cooling medium in the first cooling space and the target cooling component and between the cooling medium in the second cooling space and the cooling medium in the first cooling space, effectively enhancing the heat exchange capacity and improving the cooling effect of the cooling device. In addition, the design of separating the cooling chamber formed by the first cooling space and the guide cavity by a retaining wall, and connecting the inflow channel and the outflow channel of the cooling chamber by the through hole of the installation groove, combined with the introduction of an insulating cooling medium into the first cooling space, can avoid the problem of conductive conduction and allow the cooling medium to fully contact the target cooling component, thereby achieving effective cooling of the target cooling component, and can adapt to special cooling scenarios such as target cooling components with exposed conductive materials.
[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present utility model, and together with the specification, are used to explain the principles of the present utility model. Obviously, the accompanying drawings described below are only some embodiments of the present utility model, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.
[0021] Figure 1 A schematic diagram showing the structure of a cooling device in an embodiment of the utility model is shown;
[0022] Figure 2 and Figure 3 A schematic diagram showing the structure of a cooling element of a cooling device;
[0023] Figure 4 and Figure 5 A schematic diagram showing the structure of a flow guide member of a cooling device;
[0024] Figure 6 A schematic diagram showing the structure of a chip module assembly in an embodiment of the utility model is shown;
[0025] Figure 7 The back structure schematic diagram of the chip module in the embodiment of the utility model is shown. DETAILED DESCRIPTION
[0026] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments described herein. Instead, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art.
[0027] The accompanying drawings are only schematic illustrations of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings represent the same or similar parts, and thus their repeated description will be omitted.
[0028] The terms "first", "second" and similar words used in the specific description do not indicate any order, quantity or importance, but are only used to distinguish different components. The orientation or position relationship indicated by the terms "upper", "lower", "front", "back" and the like is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. The term "plurality" means two or more, unless otherwise clearly and specifically defined. In addition, in the description of the utility model, when it is said that a device is "connected" to another device, this includes not only the case of direct connection, but also the case of indirect connection through other elements.
[0029] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in different embodiments may be combined with each other.
[0030] Figure 1 The structure of the cooling device in the embodiment of the utility model is schematically shown. Figure 2 and Figure 3 The structure of the cooling element of the cooling device is schematically shown. Figure 4 and Figure 5 The structure of the guide member of the cooling device is schematically shown; Figures 1 to 5 As shown, the cooling device provided by the embodiment of the utility model includes:
[0031] The cooling element 10 is provided with a first cooling space 110 and a second cooling space 120 which are not connected and share a heat exchange surface 100;
[0032] The guide member 20 is sealed and assembled with the cooling member 10, and the guide member 20 is provided with a guide cavity 210 and a mounting groove 222 with a through hole 2220;
[0033] The guide cavity 210 and the first cooling space 110 are provided with matching retaining walls, which separate the cooling chamber formed by the guide cavity 210 and the first cooling space 110 into at least an inflow channel P1 and an outflow channel P2, and the inflow channel P1 is connected to the outflow channel P2 via the through hole 2220.
[0034] The installation groove 222 of the guide member 20 is used for installation and accommodation of the target cooling component. The cooling member 10 is provided with two cooling spaces that are not connected and share the heat exchange surface 100, wherein the first cooling space 110 cools the components installed on the guide member 20, and the second cooling space 120 cools the first cooling space 110, so as to achieve sufficient heat exchange between the cooling medium in the first cooling space 110 and the target cooling component and between the cooling medium in the second cooling space 120 and the cooling medium in the first cooling space 110, effectively enhancing the heat exchange capacity and improving the cooling effect of the cooling device. In addition, the cooling chamber formed by the first cooling space 110 and the guide cavity 210 is separated by a retaining wall, and the through hole 2220 of the installation groove 222 connects the inflow channel P1 and the outflow channel P2 of the cooling chamber. With the insulating cooling medium introduced into the first cooling space 110, the conductive problem can be avoided and the cooling medium can fully contact the target cooling component, thereby achieving effective cooling of the target cooling component, and can adapt to special cooling scenarios such as the target cooling component with exposed conductive materials.
[0035] Among them, the target cooling components with exposed conductive materials are, for example, chip modules with exposed metal fin pins, circuit boards with exposed conductive contacts, etc. By cooperating with the cooling member 10 and the guide member 20, and introducing an insulating cooling medium into the first cooling space 110, effective cooling of the target cooling components with exposed conductive materials is achieved. Of course, the cooling device of the utility model is also suitable for conventional cooling scenarios such as target cooling components without exposed conductive materials. For example, for a chip module covered with an insulating protective layer, the cooling member 10 and the guide member 20 can also be used to cooperate to achieve effective cooling of the target cooling components.
[0036] The cooling member 10 may be an aluminum member to take into account both structural strength and lightweight design, but the invention is not limited thereto. The flow guide member 20 may be a plastic member to facilitate processing and forming structures such as the mounting groove 222 and the retaining wall, but the invention is not limited thereto.
[0037] In some embodiments, the retaining wall includes a first retaining wall 111 disposed in the first cooling space 110 and a second retaining wall 211 disposed in the flow guiding cavity 210 , and the first retaining wall 111 and the second retaining wall 211 are sealed and spliced.
[0038] The distribution of the first retaining wall 111 and the second retaining wall 211 corresponds to each other. When the guide member 20 and the cooling member 10 are sealed and assembled, the first retaining wall 111 and the second retaining wall 211 are sealed and spliced to separate the cooling chamber formed by the guide cavity 210 and the first cooling space 110 into an inlet channel P1 and an outlet channel P2.
[0039] The utility model Figure 2 and Figure 5In the figure, it is shown that the first retaining wall 111 and the second retaining wall 211 divide the first cooling space 110 into an inflow channel P1 and an outflow channel P2, thus taking into account both cooling effect and simple structural design. In other embodiments, according to cooling and design requirements, the first cooling space 110 can be divided into an inflow channel P1 → one or more intermediate channels → an outflow channel P2 by a plurality of retaining wall structures, wherein two adjacent channels are connected through the through hole 2220 of the mounting groove 222.
[0040] In addition, the utility model Figure 2 and Figure 5 In the figure, it is shown that the inflow channel P1 is located at the outer circle of the cooling member 10 and the flow guide member 20, and the outflow channel P2 is located at the inner circle of the cooling member 10 and the flow guide member 20, but it is not limited to this.
[0041] In some embodiments, the mounting groove 222 includes a plurality of mounting grooves 222 , and the through holes 2220 of each mounting groove 222 are distributed on both sides of the second retaining wall 211 ; the inflow channel P1 and the outflow channel P2 extend to cover the plurality of mounting grooves 222 , respectively.
[0042] The through holes 2220 of the mounting groove 222 are distributed on both sides of the second retaining wall 211, realizing the structural design in which the inflow channel P1 is connected to the outflow channel P2 via the through holes 2220; the inflow channel P1 and the outflow channel P2 are arranged around the contour of the guide member 20, and extend to cover multiple mounting grooves 222 respectively, thereby realizing sufficient and effective cooling of the target cooling components installed in the mounting grooves 222.
[0043] According to the components to be cooled, the position, quantity, distribution, etc. of the installation grooves 222 of the guide member 20 can be adjusted as needed; correspondingly, the structure, position, distribution, etc. of the first retaining wall 111 of the cooling member 10 and the second retaining wall 211 of the guide member 20 are adjusted accordingly to achieve effective cooling of the target cooling components.
[0044] In some embodiments, the retaining wall further includes a partition 102 , and the partition 102 is located between the through hole 2220 of the mounting groove 222 closest to the outlet 110 b of the outflow channel P2 and the outlet 110 b .
[0045] If no partition 102 is provided at the through hole 2220 of the installation groove 222 closest to the outlet 110b, the cooling medium flows into the outflow channel P2 through the through hole 2220 of the installation groove 222 and then flows out through the outlet 110b immediately, and the cooling medium that has not yet fully absorbed heat cannot be fully utilized; by providing the partition 102, the cooling capacity of the cooling medium can be fully utilized, thereby improving the overall cooling effect of the cooling device.
[0046] In some embodiments, an insulating cooling medium is introduced into the first cooling space 110 , and the cooling medium flowing in the second cooling space 120 participates in an external circulation.
[0047] The cooling medium introduced into the first cooling space 110 and the cooling medium introduced into the second cooling space 120 can be determined according to factors such as the target cooling component to which the cooling device is applied, the vehicle condition environment in which it is installed, etc. For example, cooling oil can be introduced into the first cooling space 110, and cooling water can be introduced into the second cooling space 120, but it is not limited thereto. According to design requirements, the cooling medium in the first cooling space 110 can participate in the external circulation or not, and the cooling medium in the second cooling space 120 participates in the external circulation, so as to achieve sufficient cooling of the cooling medium in the first cooling space 110 through heat exchange with the external refrigerant.
[0048] In addition, the flow direction of the cooling medium in the first cooling space 110 and the flow direction of the cooling medium in the second cooling space 120 may be the same as or different from each other.
[0049] In some embodiments, heat dissipation protrusions 130 are distributed in the first cooling space 110 and the second cooling space 120. The heat dissipation protrusions 130 increase the contact area with the cooling medium, enhance the heat exchange capacity, and improve the cooling effect.
[0050] In some embodiments, heat dissipation protrusions may be formed on the heat exchange surface 100 , that is, the heat exchange surface 100 is provided with heat dissipation protrusions facing the first cooling space 110 and the second cooling space 120 , respectively, thereby effectively improving the heat exchange capacity of the heat exchange surface 100 .
[0051] In some embodiments, the cooling member 10 has a first surface and a second surface opposite to each other, the first cooling space 110 is arranged on the first surface, the second cooling space 120 is arranged on the second surface, and the inlet 110a and the outlet 110b of the first cooling space 110 and the inlet 120a and the outlet 12b of the second cooling space 120 are all arranged on the side wall of the cooling member 10. In other embodiments, according to cooling and design requirements, other cooling spaces for heat exchange with the first cooling space 110 and / or the second cooling space 120 may be formed in the cooling member 10 to improve the cooling effect.
[0052] Furthermore, in some embodiments, the guide member 20 has a relative mounting surface 22 and a guide surface, the mounting groove 222 is provided on the mounting surface 22, the through hole 2220 passes through the mounting surface 22 and the guide surface, and the guide cavity 210 is provided on the guide surface.
[0053] The side wall of the mounting groove 222 can be formed into a supporting frame structure to facilitate the installation of the target cooling component; the through hole 2220 is arranged on the bottom wall of the mounting groove 222 to facilitate the cooling medium flowing into the channel P1 to flow into the mounting groove 222 through the through hole 2220, and then flow into the outflow channel P2 after fully contacting the target cooling component.
[0054] The embodiment of the utility model also provides a chip module assembly. Figure 6 The structure of the chip module assembly is shown in FIG. Figure 7 The back structure of the chip module is shown; Figures 1 to 7 As shown, the chip module assembly provided by the embodiment of the utility model includes:
[0055] A cooling device as described in any of the above embodiments;
[0056] The chip module 30 is sealed and assembled with the mounting groove 222 of the guide member 20 . The back of the chip module 30 is provided with heat dissipation fins 33 , which are accommodated in the mounting groove 222 .
[0057] The chip module 30 and the mounting groove 222 can be sealed by means of sealants, sealing gaskets, etc. The chip module 30 can be mounted on a circuit board (not specifically shown in the figure), and the circuit board is mounted on the mounting surface 22 of the guide member 20. The chip module assembly adopts the above-mentioned cooling device, which can achieve sufficient and effective cooling of the chip module 30 through the cooperation of the cooling member 10 and the guide member 20. Among them, the cooling medium in the first cooling space 110 flows into the mounting groove 222 from the inflow channel P1 through the through hole 2220, fully contacts the heat dissipation fins 33 of the chip module 30 to take away the heat of the chip module 30, and then flows into the outflow channel P2, gradually filling the entire cooling chamber formed by the first cooling space 110 and the guide cavity 210; the cooling medium in the second cooling space 120 fully cools the cooling medium in the first cooling space 110 to ensure the cooling capacity of the first cooling space 110.
[0058] In some embodiments, the chip module 30 is a chip-embedded power module of the inverter, and the heat dissipation fins 33 are metal fins; an insulating cooling medium is passed into the first cooling space 110, and an aqueous coolant is passed into the second cooling space 120, and the coolant participates in the circulation of the motor cooling system or the circulation of the vehicle cooling system.
[0059] A chip-inlay power module refers to a semiconductor chip (e.g., an IGBT chip, a SiC chip, etc.) embedded in a circuit board. The front of the chip-inlay power module exposes the electrodes of the semiconductor chip, and the back is provided with a heat dissipation fin 33 made of metal material, which is used to conduct the heat generated when the semiconductor chip is working. During installation, the chip-inlay power module is assembled in the mounting groove 222 with the front side facing up, and the heat dissipation fin 33 is accommodated in the mounting groove 222. The insulating cooling medium is in contact with the heat dissipation fin 33 made of metal material to achieve cooling while avoiding the problem of conductive conduction. The insulating cooling medium can be cooling oil or other suitable insulating medium. The coolant introduced into the second cooling space 120 participates in the circulation of the motor cooling system or the circulation of the vehicle cooling system, and the motor cooling system or the vehicle cooling system is used to achieve heat exchange, thereby continuously cooling the insulating cooling medium in the first cooling space 110, ensuring the cooling effect of the chip module assembly, and making full use of the cooling conditions in the vehicle.
[0060] The chip module 30 may also be a non-chip embedded traditional power module, or a chip module realizing other functions, and can also realize sufficient and effective cooling of the chip module 30 through the cooperation of the cooling member 10 and the guide member 20 of the cooling device of the utility model.
[0061] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.
Claims
1. A cooling device, characterized in that: include: A cooling element is provided with a first cooling space and a second cooling space which are not connected and share a heat exchange surface; A flow guide member, sealed and assembled with the cooling member, the flow guide member being provided with a flow guide cavity and a mounting groove with a through hole; The guide cavity and the first cooling space are provided with matching retaining walls, and the retaining walls separate the cooling chamber formed by the guide cavity and the first cooling space into at least an inlet channel and an outlet channel, and the inlet channel is connected to the outlet channel via the through hole.
2. The cooling device according to claim 1, characterized in that The retaining wall comprises a first retaining wall arranged in the first cooling space and a second retaining wall arranged in the flow guide cavity, and the first retaining wall is sealed and spliced with the second retaining wall.
3. The cooling device according to claim 2, characterized in that: The installation grooves include a plurality of through holes of each installation groove distributed on both sides of the second retaining wall; The inflow channel and the outflow channel extend to cover the plurality of mounting grooves respectively.
4. The cooling device according to claim 3, characterized in that The retaining wall further includes a partition, and the partition is located between the through hole of the mounting slot closest to the outlet of the outflow channel and the outlet.
5. The cooling device according to claim 1, characterized in that: An insulating cooling medium is introduced into the first cooling space, and the cooling medium flowing in the second cooling space participates in external circulation.
6. The cooling device according to claim 1, characterized in that: Heat dissipation protrusions are distributed in the first cooling space and the second cooling space; and / or The heat exchange surface is provided with heat dissipation protrusions facing the first cooling space and the second cooling space respectively.
7. The cooling device according to claim 1, characterized in that: The cooling member has a first surface and a second surface opposite to each other, the first cooling space is arranged on the first surface, the second cooling space is arranged on the second surface, and the inlet and outlet of the first cooling space and the inlet and outlet of the second cooling space are both arranged on the side wall of the cooling member.
8. The cooling device according to claim 1, characterized in that: The flow guide member has a mounting surface and a flow guide surface opposite to each other, the mounting groove is arranged on the mounting surface, the through hole passes through the mounting surface and the flow guide surface, and the flow guide cavity is arranged on the flow guide surface.
9. A chip module assembly, characterized in that: include: The cooling device according to any one of claims 1 to 8; The chip module is sealed and assembled with the mounting groove of the guide member. The back of the chip module is provided with heat dissipation fin pins, and the heat dissipation fin pins are accommodated in the mounting groove.
10. The chip module assembly according to claim 9, characterized in that: The chip module is a chip embedded power module of the inverter, and the heat dissipation fin pins are metal fin pins; An insulating cooling medium is introduced into the first cooling space, and a water-containing coolant is introduced into the second cooling space. The coolant participates in the circulation of the motor cooling system or the circulation of the vehicle cooling system.