Whole-plate cover plate for crystal oscillator

Abstract

The utility model discloses a whole-plate cover plate for a crystal oscillator, which is made of ceramic materials and is provided with a pre-fracture line, and the crystal oscillator produced based on the whole-plate cover plate has the advantages of few working procedures, low processing difficulty, low processing cost and stable and reliable product quality.

Description

Technical Field

[0001] The present invention relates to the field of production and processing of electronic components, and specifically to a whole-plate cover for a crystal oscillator. Background Art

[0002] SMD quartz crystal resonators are commonly used electronic devices, and their usage is increasing with the development of digital technology. However, there are technical barriers to improving processing efficiency and quality in terms of device structure and processing technology. In addition, there are also environmental pollution problems in the processing technology.

[0003] The overall structure of a quartz crystal oscillator is that a quartz wafer with one end suspended in the air is provided in a chamber, and a conductive structure is provided. In order to ensure the working stability of the crystal oscillator, the chamber of the current quartz crystal oscillator is evacuated. In order to achieve vacuum in the chamber, the cover of the existing quartz crystal oscillator is a metal cover, and a metal Kovar ring is provided at the connection between the base and the cover. After the crystal oscillator is evacuated, the cover and the Kovar ring are laser welded in a vacuum environment to achieve the sealing of the cavity. Although the metal cover plate can facilitate vacuuming and sealing, it also has many disadvantages. For example, a metal kovar ring must be set on the upper surface of the base, and the kovar ring needs to be provided with conductive holes to achieve electrical connection with other conductive areas for unified electroplating operations, which increases the difficulty of base processing. At the same time, the metal cover plate may also contact the glue points connecting the two electrode points of the chip, causing the two electrodes of the chip to short-circuit. In addition, during the whole board processing process, adjacent metal cover plates need to remain connected to each other during the production process. After laser sealing, cutting is performed with the help of laser. Regardless of the sealing position or the cutting position, an additional anti-corrosion coating needs to be applied to avoid oxidation and rust at the welding and cutting positions, which increases the production process and production cost. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a whole plate cover for a crystal oscillator.

[0005] The specific technical solution of the utility model for solving the above technical problems is: a whole plate cover for crystal oscillator, the whole plate cover is made of ceramic, the whole plate cover is divided into a plurality of sub-covers arranged in a matrix, and pre-breaking lines are provided between adjacent sub-covers, and the pre-breaking lines are non-cutting pre-breaking lines.

[0006] Compared with the prior art, this solution uses ceramic material to make the cover plate. Since ceramic is insulating, even if the glue point connecting the two electrodes of the chip is too high and touches the cover plate, a short circuit will not occur. On the other hand, since it is made of ceramic material and uses colloid connection instead of laser welding, there is no need to set a kovar ring on the corresponding base, and there is no need to set a structure electrically connected to the kovar ring, which simplifies the structure of the crystal oscillator and reduces the difficulty of processing the quartz crystal oscillator. Finally, since ceramic is hard and brittle, it can be mechanically split using a splitting machine by setting a pre-breaking line, and the ceramic material itself has strong corrosion resistance. After splitting, there is no need to spray an anti-corrosion layer like a metal cover plate, which further simplifies the processing procedures of the crystal oscillator and reduces processing costs.

[0007] Furthermore, the pre-fracture line is a V-shaped groove.

[0008] The technical effect of adopting the above further technical solution is that, on the one hand, the V-shaped groove is easy to process and the processing cost is reduced; on the other hand, the stress of the V-shaped groove is concentrated at the bottom of the groove, which facilitates the splitting operation.

[0009] Furthermore, pre-breaking lines are provided on both the front and back sides of the whole cover plate.

[0010] The technical effect of adopting the above further technical solution is that pre-breaking lines are set at corresponding positions on both sides, and the breaking position is accurate when splitting, the breaking surface is neat, and the surface quality is good.

[0011] Furthermore, at least two measuring holes are provided on the whole plate cover.

[0012] The technical effect of adopting the above-mentioned further technical solution is that, especially when the two measuring holes are located at relatively far positions on the whole plate cover, such as at the two ends of the longer sides, or at the diagonal positions of the quadrilateral, based on measuring the distance between the two measuring holes and then converting it into the size of the adjacent sub-cover plate on the whole plate cover, the measurement error will be evenly dispersed and the measured size will be more accurate.

[0013] Furthermore, the measuring hole is a through hole, so that when taking a photo for measurement later, a background light can be turned on at the back of the cover plate to improve the recognition of the measuring hole in the photo.

[0014] Furthermore, the four corners of the sub-cover plate are provided with through holes, and the provision of the through holes reduces the overall stress, facilitates the splitting, and at the same time avoids sharp corners of the product after the splitting, thereby reducing the generation of micro-fragments.

[0015] Furthermore, the measuring holes are small through holes arranged at the four corners of the sub-cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a plan view of the whole cover plate of the utility model;

[0017] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0018] Figure 3 It is a three-dimensional schematic diagram of the whole plate cover of the utility model;

[0019] Figure 4 This is the cross-sectional view of the crystal oscillator;

[0020] In the accompanying drawings, the component names represented by the reference numerals are listed as follows:

[0021] 1. Sub-cover; 2. Pre-break line; 4. Positioning hole; 5. Through hole; 6. Glue dot; 7. Wafer; 8. Upper electrode glue dispensing station; 9. Lower electrode glue dispensing station; 10. Upper electrode; 11. Lower electrode. DETAILED DESCRIPTION

[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0023] like Figure 1 As shown, a whole plate cover for a crystal oscillator is made of ceramics, and the whole plate cover is divided into a plurality of sub-covers 1 arranged in a matrix, and a pre-break line 2 is provided between adjacent sub-covers 1, and the pre-break line 2 is a non-through V-shaped groove. Figure 3 As shown, the front and back sides of the whole cover plate are provided with pre-fracture lines 2, and the pre-fracture lines on both sides are on the preset fracture surface. Figure 1 From the perspective (looking down), the projection of the pre-fracture line on the upper surface and the pre-fracture line on the lower surface completely overlap, so that the stress on the upper and lower surfaces can be concentrated during the splitting, making it easy to split, and the fracture surface of the sub-cover plate obtained after the splitting is smooth. When producing the whole cover plate, it is necessary to first carve the pre-fracture line 2 on the raw embryo of the whole cover plate, and then fire it, because the hardness of the ceramic is very high after firing, and the pre-fracture line 2 can no longer be carved.

[0024] The edge of the whole plate cover can be provided with a plurality of positioning holes 4, which can also be used as measuring holes at the same time. When measuring, the measuring holes on the whole plate cover that are far apart are generally used, so that the measurement error can be apportioned to each sub-cover, and the measurement error is small;

[0025] Each sub-cover is provided with a through hole 5 at the four corners. In this example, the four through holes 5 at the four corners of the whole cover are actually used as measuring holes. The whole cover is photographed with a fixed focus and distance based on the camera system. The size of the whole cover can be accurately calculated based on the number of pixels between the through holes 5 located at the four vertices in the obtained photo, and the average size of each sub-cover can be further calculated. When the distance between the farthest measuring holes on the whole cover is converted into the size of adjacent sub-covers on the whole cover, the measurement error will be evenly dispersed, the measured size will be more accurate, and it is beneficial to the control of subsequent processing technology.

[0026] For example, in this example, a 5020 specification crystal oscillator is produced. The total length of the entire cover is 5 cm, and there is a 3.1 mm frame around it. The inside of the frame is the sub-cover area. The entire sub-cover area is divided into 22 sub-covers in the length direction and 7 sub-covers in the width direction. The two measuring holes in the length direction are located at the two ends of the length direction. The measured value is 43.67 mm. The actual width of each sub-cover is calculated to be 1.98 mm.

[0027] When SMD quartz crystal oscillators are produced based on the whole plate cover, there is no need to set a kovar ring on the corresponding ceramic base, and there is no need to set a structure electrically connected to the kovar ring, which simplifies the structure of the crystal oscillator base and reduces the difficulty of processing the quartz crystal oscillator base. Of course, it also means that the processing difficulty of the crystal oscillator itself is reduced and the processing cost is reduced.

[0028] The basic structure of a crystal oscillator is as follows: Figure 4 As shown, the glue point 6 on the upper electrode dispensing station 8 is conductively connected to the upper electrode 10 of the wafer 7, and the glue point 6 on the lower electrode dispensing station 9 is conductively connected to the lower electrode 11 of the wafer 7. If the height of the glue point 6 is too high, it will cause the following Figure 4 The two glue spots 6 shown are in contact with the upper cover. If it is a conventional metal cover, the upper electrode 10 and the lower electrode 11 of the chip 7 will be short-circuited, resulting in product failure. However, for the crystal oscillator produced based on this solution, even if the height of the glue spot 6 is too high and abuts against the sub-cover 1 in subsequent production, because the ceramic material is insulating, the upper electrode 10 and the lower electrode 11 of the chip will not be short-circuited, and the performance of the product will not be affected.

[0029] Compared with the prior art, this solution uses ceramic material to make the cover plate. Since ceramic is insulating, even if the glue point connecting the two electrodes of the chip is too high and touches the cover plate, a short circuit will not occur. Moreover, even if the glue point connecting the two electrodes of the chip is so high that it touches the cover plate, the cover plate will play an additional auxiliary role in fixing the chip, so that the scrapped products in the traditional process are turned into high-quality products in this process. On the other hand, since it is a ceramic material, colloid connection is used instead of laser welding, which reduces energy consumption. Finally, since ceramic is hard and brittle, it can be mechanically split using a splitting machine by setting a pre-breaking line. In addition, the ceramic material itself has strong corrosion resistance, so there is no need to spray an anti-corrosion layer after splitting like a metal cover plate, which further simplifies the processing procedures of the crystal oscillator and reduces processing costs.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A whole plate cover for a crystal oscillator, characterized in that: The whole cover plate is made of ceramics and is divided into a plurality of sub-cover plates arranged in a matrix. Pre-fracture lines are arranged between adjacent sub-cover plates, and the pre-fracture lines are non-through-cut pre-fracture lines.

2. The whole plate cover for crystal oscillator according to claim 1, characterized in that: The pre-fracture line is a V-shaped groove.

3. The whole plate cover for crystal oscillator according to claim 1 or 2, characterized in that: Pre-breaking lines are arranged on both the front and back sides of the whole cover plate.

4. The whole plate cover for crystal oscillator according to claim 1 or 2, characterized in that: At least two measuring holes are arranged on the whole plate cover.

5. The whole plate cover for crystal oscillator according to claim 4, characterized in that: The measuring hole also serves as a positioning hole.

6. The whole plate cover for crystal oscillator according to any one of claims 1, 2 and 5, characterized in that: The four corners of the sub-cover plate are provided with through holes.

7. The whole plate cover for crystal oscillator according to claim 4, characterized in that: The measuring holes are small through holes arranged at the four corners of the sub-cover plate.

8. The whole plate cover for crystal oscillator according to claim 3, characterized in that: The projections of the pre-fracture lines on the front and back sides of the whole cover plate on the top view of the whole cover plate completely overlap.

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