Detachable heat dissipation structure for chip

Abstract

The utility model discloses a detachable heat dissipation structure for a chip, which is characterized in that a chip is fixedly arranged on a mainboard, four groups of mounting studs are fixedly arranged on the mainboard along the periphery of the chip, the tops of the four groups of mounting studs are fixedly connected with the same heat conduction assembly, and heat dissipation assemblies used for accelerating the flow velocity of air around the heat conduction assembly are fixedly arranged at the two ends of the mainboard. The heat dissipation assembly is fixedly connected with the main board through a rapid fixing assembly. Compared with the prior art, the heat dissipation assembly has the advantages that in order to adapt to mainboards of different sizes, the extension blocks are connected between the installation plates in the heat dissipation assembly in a sliding mode, the length of the installation plates penetrating into the extension blocks is adjusted so that the heat dissipation assembly can adapt to the mainboards of different lengths, and installation of a follow-up rapid fixing assembly is facilitated; the heat dissipation assembly and the mainboard are quickly and fixedly connected through the quick fixing assembly, or the fixing state of the heat dissipation assembly and the mainboard is quickly released, so that the heat dissipation assembly is simpler and more convenient to mount or dismount.

Description

Technical Field

[0001] The utility model relates to the field of chip heat dissipation, in particular to a detachable chip heat dissipation structure. Background Art

[0002] A chip is an integrated circuit whose circuit is manufactured on the surface of a semiconductor chip, also known as a thin film integrated circuit. Another type of thick film integrated circuit is a miniaturized circuit consisting of independent semiconductor devices and passive components integrated into a substrate or circuit board. As an integrated circuit, its internal transistors will generate heat during the switching process. When the transistor switches from the off state to the on state, a certain amount of charge will be redistributed inside it, and this process will consume some energy and dissipate it in the form of heat. Similarly, when the transistor switches from the on state to the off state, a certain amount of charge will be recombined inside it, and this process will also release some energy and dissipate it in the form of heat. Therefore, the chip is in a high temperature state when working, and the chip needs to be properly protected from heat dissipation to avoid damage to circuit components caused by high temperature.

[0003] The heat dissipation technology in the existing technology mostly adopts the method of installing a heat sink directly above the chip, and guides the heat generated by the chip when it is working to the surrounding air to reduce the temperature of the chip surface. However, when the heat sink guides too much heat outward, the air temperature around the chip rises significantly, causing the temperature difference around the chip to gradually decrease. In order to avoid high temperature burning the precision circuit on the chip, corresponding improvements are urgently needed in the existing technology. Utility Model Content

[0004] In view of the problems in the related art, the utility model proposes a detachable chip heat dissipation structure to overcome the above technical problems existing in the existing related art.

[0005] To this end, the specific technical solutions adopted by the utility model are as follows:

[0006] A heat dissipation structure for a detachable chip comprises a mainboard, on which a chip is fixedly mounted, on which four groups of mounting studs are fixedly mounted along the periphery of the chip, the tops of the four groups of mounting studs are fixedly connected to a same heat-conducting component, heat-dissipating components for accelerating the air flow rate around the heat-conducting component are fixedly mounted at both ends of the mainboard, and the heat-dissipating component is fixedly connected to the mainboard via a quick fixing component.

[0007] As a preferred solution of the utility model, the heat-conducting component includes a base plate fixedly connected to four groups of the mounting studs, a plurality of heat-dissipating fins are fixedly mounted on the base plate, first screws are mounted at four corners of the base plate, and the bottoms of the four first screws are respectively threadedly connected to the four mounting studs one by one, springs are sleeved on the outside of the first screws, and the two ends of the springs are respectively pressed against the top of the first screw and the upper surface of the base plate.

[0008] As a preferred solution of the utility model, the heat dissipation assembly includes four mounting plates fixedly mounted on the base plate, and the four mounting plates are grouped in pairs and distributed on both ends of the base plate in a mirror-symmetrical manner about the central axis of the chip, and a plurality of fans are fixedly mounted on two groups of the mounting plates, and the two groups of the mounting plates are slidably connected with the same extension block.

[0009] As a preferred scheme of the utility model, the quick fixing assembly includes the same limiting plate fixedly installed on two mounting plates located on the same side, two sets of connecting heads are opened on one side of the limiting plate, and the two connecting heads are threadedly connected with a second screw, the bottom of the second screw is threadedly connected with a right-angle plate, one end of the right-angle plate is tightly pressed against the lower surface of the main board, the limiting plate and the right-angle plate are threadedly connected by the second screw, and the limiting plate and the right-angle plate cooperate with each other to fix the two sets of mounting plates on the main board.

[0010] As a preferred solution of the utility model, a vent is provided at the center of the extension block, and two sets of fans are fixedly installed on the top of the extension block, and a slideway for the installation plate to slide is provided on the side wall of the extension block.

[0011] As a preferred solution of the utility model, a straight plate is fixedly installed at the bottom of the limiting plate, a mounting groove is opened at the bottom end of each mounting plate, and the straight plate is clamped in two groups of the mounting grooves.

[0012] The beneficial effects of the utility model are as follows: in order to adapt to motherboards of different sizes, extension blocks are slidably connected between the mounting plates in the heat dissipation assembly, and the length of the mounting plates inserted into the extension blocks is adjusted to adapt to motherboards of different lengths, thereby facilitating the subsequent installation of quick fixing components. The heat dissipation assembly is quickly fixedly connected to the motherboard through the quick fixing components, or its fixed state is quickly released, making the installation or disassembly of the heat dissipation assembly simpler and more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the heat conduction component in the utility model;

[0016] Figure 3 for Figure 2 A is a schematic diagram of the enlarged structure of the middle part;

[0017] Figure 4 It is a schematic diagram of the heat dissipation component in the utility model;

[0018] Figure 5 for Figure 4 Schematic diagram of the enlarged structure of B;

[0019] Figure 6 It is an exploded view of the quick fixing assembly in the utility model;

[0020] Figure 7 It is a schematic diagram of the extension block in the utility model.

[0021] In the figure: 1. Main board; 2. Chip; 3. Mounting studs; 4. Thermal conductive component; 41. Bottom plate; 42. Heat sink fins; 43. First screw; 44. Spring; 5. Heat dissipation component; 51. Mounting plate; 52. Fan; 53. Extension block; 54. Ventilation port; 55. Slide; 6. Quick fixing component; 61. Mounting slot; 62. Limiting plate; 621. Connector; 63. Straight plate; 64. Second screw; 65. Right-angle plate. DETAILED DESCRIPTION

[0022] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0023] Embodiment 1

[0024] Combination Figures 1 to 7A heat dissipation structure for a detachable chip 2 is shown, comprising a mainboard 1, on which a chip 2 is fixedly mounted, on which four groups of mounting studs 3 are fixedly mounted along the periphery of the chip 2, and the tops of the four groups of mounting studs 3 are fixedly connected to the same heat-conducting component 4, and heat dissipation components 5 for accelerating the air flow rate around the heat-conducting component 4 are fixedly mounted at both ends of the mainboard 1, and the heat dissipation component 5 is fixedly connected to the mainboard 1 via a quick fixing component 6.

[0025] As a preferred solution of the utility model, the heat-conducting component 4 includes a base plate 41 fixedly connected to the four groups of mounting studs 3, a plurality of heat dissipation fins 42 are fixedly mounted on the base plate 41, first screws 43 are mounted at the four corners of the base plate 41, and the bottoms of the four first screws 43 are respectively threadedly connected to the four mounting studs 3 one by one, the outside of the first screws 43 are respectively sleeved with springs 44, and the two ends of the springs 44 are respectively pressed against the top of the first screw 43 and the upper surface of the base plate 41.

[0026] As a preferred solution of the utility model, the heat dissipation assembly 5 includes four mounting plates 51 fixedly mounted on the base plate 41, and the four mounting plates 51 are grouped in pairs and distributed at both ends of the base plate 41 in a mirror-symmetrical manner with the central axis of the chip 2, and a plurality of fans 52 are fixedly mounted on two groups of the mounting plates 51, and the two groups of the mounting plates 51 are slidably connected with the same extension block 53.

[0027] As a preferred solution of the utility model, the quick fixing assembly 6 includes the same limiting plate 62 fixedly installed on the two mounting plates 51 located on the same side, two sets of connecting heads 621 are opened on one side of the limiting plate 62, and the two connecting heads 621 are threadedly connected with a second screw 64, and the bottom of the second screw 64 is threadedly connected with a right-angle plate 65, one end of the right-angle plate 65 is tightly pressed against the lower surface of the main board 1, the limiting plate 62 and the right-angle plate 65 are threadedly connected by the second screw 64, and the limiting plate 62 and the right-angle plate 65 cooperate with each other to fix the two sets of mounting plates 51 on the main board 1.

[0028] As a preferred solution of the utility model, a vent 54 is provided at the center of the extension block 53, and two sets of fans 52 are fixedly installed on the top of the extension block 53. A slideway 55 is provided on the side wall of the extension block 53 for the mounting plate 51 to slide.

[0029] As a preferred solution of the utility model, a straight plate 63 is fixedly installed at the bottom of the limiting plate 62 , and a mounting groove 61 is opened at the bottom of each mounting plate 51 , and the straight plate 63 is clamped in two groups of the mounting grooves 61 .

[0030] Specifically, in the present embodiment, a heat dissipation component 5 is mounted above the heat-conducting component 4 to guide the heat released by the chip 2 when it is working to the surrounding air, mainly through the heat conduction of the heat dissipation fins 42. The heat dissipation fins 42 are conventional technical means and will not be described in detail. When the heat dissipation fins 42 release heat to the surrounding air, the air flow around the heat dissipation fins 42 is accelerated by multiple fans 52 on the heat dissipation component 5, so as to ensure that the heat guided outward by the heat dissipation fins 42 will not accumulate, thereby affecting the temperature around the chip 2. In addition, in order to adapt to motherboards 1 of different sizes, an extension block 53 is slidably connected between the mounting plates 51 in the heat dissipation component 5. By adjusting the length of the mounting plate 51 deep into the extension block 53, motherboards 1 of different lengths can be adapted to facilitate the subsequent installation of the quick fixing component 6. The heat dissipation component 5 and the motherboard 1 are quickly fixedly connected or quickly released from their fixed state by the quick fixing component 6, so that the installation or disassembly of the heat dissipation component 5 is simpler and more convenient.

[0031] Embodiment 2

[0032] As another embodiment of the present invention, except for the heat dissipation component 5, the other components have the same structure as the above components. The heat dissipation component 5 includes two mounting plates 51 fixedly mounted on the base plate 41, and a plurality of fans 52 are fixedly mounted between the two mounting plates 51.

[0033] Specifically, in this embodiment, two mounting plates 51 are fixedly installed directly above the heat-conducting component 4, and multiple sets of fans 52 are set between the two mounting plates 51. The two mounting plates 51 are integrally formed, which has better stability and is convenient for long-term installation and use.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure for a detachable chip, comprising a mainboard (1), characterized in that: A chip (2) is fixedly mounted on the mainboard (1), four groups of mounting studs (3) are fixedly mounted on the mainboard (1) along the periphery of the chip (2), the tops of the four groups of mounting studs (3) are fixedly connected to a same heat-conducting component (4), heat-dissipating components (5) for accelerating the air flow rate around the heat-conducting component (4) are fixedly mounted at both ends of the mainboard (1), and the heat-dissipating component (5) is fixedly connected to the mainboard (1) via a quick fixing component (6).

2. The heat dissipation structure for a detachable chip according to claim 1, characterized in that: The heat-conducting component (4) comprises a base plate (41) fixedly connected to four groups of the mounting studs (3), a plurality of heat-dissipating fins (42) being fixedly mounted on the base plate (41), first screw rods (43) being mounted at four corners of the base plate (41), and the bottoms of the four first screw rods (43) are respectively threadedly connected to the four mounting studs (3) in a one-to-one correspondence, and springs (44) are sleeved on the outside of the first screw rods (43), and the two ends of the springs (44) are respectively pressed against the top of the first screw rods (43) and the upper surface of the base plate (41).

3. The heat dissipation structure for a detachable chip according to claim 2, characterized in that: The heat dissipation assembly (5) comprises four mounting plates (51) fixedly mounted on the base plate (41), and the four mounting plates (51) are grouped in pairs and distributed at both ends of the base plate (41) in a mirror-symmetrical manner about the central axis of the chip, and a plurality of fans (52) are fixedly mounted on two groups of the mounting plates (51), and the two groups of the mounting plates (51) are slidably connected to a common extension block (53).

4. The heat dissipation structure for a detachable chip according to claim 3, characterized in that: The quick fixing assembly (6) comprises a same limiting plate (62) fixedly mounted on two mounting plates (51) located on the same side; two sets of connecting heads (621) are provided on one side of the limiting plate (62); and the two connecting heads (621) are both threadedly connected with a second screw rod (64); the bottom of the second screw rod (64) is both threadedly connected with a right-angle plate (65); one end of the right-angle plate (65) is tightly pressed against the lower surface of the main board (1); the limiting plate (62) and the right-angle plate (65) are threadedly connected via the second screw rod (64); and the limiting plate (62) and the right-angle plate (65) cooperate with each other to fix the two sets of mounting plates (51) on the main board (1).

5. The heat dissipation structure for a detachable chip according to claim 3, characterized in that: A vent (54) is provided at the centre of the extension block (53), two sets of fans (52) are fixedly mounted on the top of the extension block (53), and a slideway (55) is provided on the side wall of the extension block (53) for the mounting plate (51) to slide.

6. The heat dissipation structure for a detachable chip according to claim 4, characterized in that: A straight plate (63) is fixedly mounted on the bottom of the limiting plate (62), a mounting groove (61) is provided at the bottom of each mounting plate (51), and the straight plate (63) is clamped in two groups of the mounting grooves (61).

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