Heat insulation type circuit board

Abstract

The utility model discloses a heat insulation type circuit board which comprises a circuit board body, and a heat insulation structure is arranged on the outer side of the circuit board body. The heat insulation structure comprises a heat insulation inner frame and a heat insulation outer frame, a heat insulation gap is formed between the heat insulation inner frame and the heat insulation outer frame, and the heat insulation gap is filled with a heat insulation foam layer; limiting protrusions are arranged on the inner wall of the heat insulation inner frame, and terminal connecting channels are arranged on the heat insulation inner frame and the heat insulation outer frame. The circuit board body is located in the heat insulation inner frame, the edge of the circuit board body abuts against the limiting protrusion for limiting, and the external connecting terminal extends into the heat insulation inner frame through the terminal connecting channel and is electrically connected with the circuit board body. According to the utility model, the structure arrangement is reasonable, when the circuit board body encounters a high temperature, the surrounding high temperature is effectively isolated outside the circuit board body, the circuit board body in the heat insulation inner frame is not influenced, the circuit and electronic components of the circuit board body can be protected, the circuit and electronic components are prevented from being damaged in a high-temperature environment, and the service life of the circuit board is prolonged. The heat insulation performance is favorably improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a heat-insulating circuit board. Background Art

[0002] In the manufacturing process of electronic products, in order to save wiring workload and reduce production costs, it is necessary to use circuit boards to replace traditional wiring work. Although the circuit boards of the prior art can meet the general usage requirements, they do not have heat insulation function. When encountering a high temperature environment, the closer the temperature is to the heating element, the higher the temperature. High temperature can easily cause heating damage to the circuits or electronic components on the circuit board, thereby affecting its stability and reliability in use. Utility Model Content

[0003] The utility model aims to provide a heat-insulating circuit board with reasonable structural arrangement and conducive to improving heat-insulating performance.

[0004] The technical solution for achieving the purpose of the utility model is a heat-insulating circuit board, comprising a circuit board body, wherein a heat-insulating structure is arranged on the outer side of the circuit board body;

[0005] The heat insulation structure comprises a heat insulation inner frame and a heat insulation outer frame, a heat insulation gap is provided between the heat insulation inner frame and the heat insulation outer frame, and the heat insulation gap is filled with a heat insulation foam layer;

[0006] A limiting protrusion is provided on the inner wall of the heat-insulating inner frame, and terminal connection channels are provided on the heat-insulating inner frame and the heat-insulating outer frame;

[0007] The circuit board body is located in the heat-insulating inner frame, and the edge of the circuit board body is positioned against the upper limit of the limiting protrusion, and the external connection terminal extends into the heat-insulating inner frame through the terminal connection channel and is electrically connected to the circuit board body.

[0008] It is further preferred that: a clamping spring is provided on the inner wall of the heat-insulating inner frame;

[0009] The clamping spring piece is located above the limiting protrusion, the edge of the circuit board body is pressed against the limiting protrusion, and the clamping spring piece is pressed against the edge top of the circuit board body for positioning.

[0010] It is further preferred that: the heat-insulating inner frame and the heat-insulating outer frame are both epoxy resin frames or glass fiber frames.

[0011] It is further preferred that the thickness of the heat insulating foam layer matches the thickness of the heat insulating inner frame.

[0012] It is further preferred that: the width of the heat-insulating inner frame matches the width of the circuit board body, and the length of the heat-insulating inner frame is greater than the length of the circuit board body.

[0013] The utility model has positive effects: the utility model has a reasonable structure. By setting a heat-insulating outer frame and a heat-insulating inner frame, and setting a heat-insulating foam layer between the two, when the circuit board body encounters high temperature, the surrounding high temperature can be effectively isolated on the outside of the circuit board body, and the top of the heat-insulating inner frame will be far away from the heat source, so the temperature will gradually drop, and will not affect the circuit board body in the heat-insulating inner frame, which is beneficial to protecting the circuits and electronic components of the circuit board body, preventing them from being damaged in a high-temperature environment, and is beneficial to improving the service life and the heat-insulating performance;

[0014] In addition, it is provided with a heat-insulating outer frame and a heat-insulating inner frame, which can also prevent the internal circuit board body from being damaged by touching, and is conducive to improving the stability of the circuit board body in use;

[0015] At the same time, a limiting protrusion is provided on the inner wall of the heat-insulating inner frame to cooperate with the clamping spring piece. The edge of the circuit board body is clamped and positioned by the limiting protrusion and the clamping spring piece, which improves the convenience and stability of installation, and is also convenient for disassembly, assembly and maintenance operations, and is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the content of the utility model easier to understand, the utility model is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein:

[0017] Figure 1 It is a structural schematic diagram of the utility model;

[0018] Figure 2 It is a schematic diagram of the specific structure of the heat-insulating inner frame in the utility model.

[0019] Reference numerals: circuit board body 1 , heat insulation structure 2 , heat insulation inner frame 21 , heat insulation outer frame 22 , heat insulation foam layer 23 , limiting protrusion 3 , terminal connection channel 4 , clamping spring 5 . DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Example

[0022] See Figure 1 and Figure 2As shown, a heat-insulating circuit board includes a circuit board body 1, and a heat-insulating structure 2 is arranged on the outer side of the circuit board body; in this embodiment, the circuit board body is a hard circuit board or a soft circuit board, which can be arranged as needed.

[0023] The thermal insulation structure 2 includes a thermal insulation inner frame 21 and a thermal insulation outer frame 22, an insulation gap is provided between the thermal insulation inner frame and the thermal insulation outer frame, and the thermal insulation gap is filled with a thermal insulation foam layer 23; in this embodiment, the width of the thermal insulation inner frame matches the width of the circuit board body, and the length of the thermal insulation inner frame is greater than the length of the circuit board body. The thermal insulation inner frame and the thermal insulation outer frame are both epoxy resin frames or glass fiber frames. The thickness of the thermal insulation foam layer matches the thickness of the thermal insulation inner frame. In this embodiment, the thermal insulation inner frame is matched with the thermal insulation outer frame and the thermal insulation foam layer to insulate the high temperature around, thereby preventing the high temperature from causing damage to the circuit board body, and the top of the thermal insulation inner frame is far away from the heat source, and the temperature will be lower at a place far away from the heat source, so that it will not affect the internal circuit board.

[0024] At the same time, in order to facilitate the installation and positioning of the circuit board body, a limit protrusion 3 is provided on the inner wall of the heat-insulating inner frame, and a terminal connection channel 4 is provided on the heat-insulating inner frame and the heat-insulating outer frame; the circuit board body is in the heat-insulating inner frame, and the edge of the circuit board body is positioned at the upper limit of the limit protrusion, and the external connection terminal extends into the heat-insulating inner frame through the terminal connection channel and is electrically connected to the circuit board body. The terminal connection channel passes through the heat-insulating foam layer, and when the external connection terminal passes through the terminal connection channel, the gap between the terminal connection channel and the external connection terminal is small, so a large amount of heat will not enter, and thus the stability and reliability of the heat insulation will not be affected.

[0025] In actual application, a clamping spring 5 is provided on the inner wall of the heat-insulating inner frame; the clamping spring is located above the limiting protrusion, the edge of the circuit board body is pressed against the limiting protrusion, and the clamping spring is pressed against the edge of the circuit board body for positioning. The clamping spring is made of the same material as the heat-insulating inner frame, and can be integrally formed or fixed by adhesive. It mainly cooperates with the limiting protrusion to complete the clamping and positioning of the edge of the circuit board body, thereby improving the convenience of disassembly and assembly and the stability of use.

[0026] The utility model has positive effects: the utility model has a reasonable structure. By setting a heat-insulating outer frame and a heat-insulating inner frame, and setting a heat-insulating foam layer between the two, when the circuit board body encounters high temperature, the surrounding high temperature can be effectively isolated on the outside of the circuit board body, and the top of the heat-insulating inner frame will be far away from the heat source, so the temperature will gradually drop, and will not affect the circuit board body in the heat-insulating inner frame, which is beneficial to protecting the circuits and electronic components of the circuit board body, preventing them from being damaged in a high-temperature environment, and is beneficial to improving the service life and the heat-insulating performance;

[0027] In addition, it is provided with a heat-insulating outer frame and a heat-insulating inner frame, which can also prevent the internal circuit board body from being damaged by touching, and is conducive to improving the stability of the circuit board body in use;

[0028] At the same time, a limiting protrusion is provided on the inner wall of the heat-insulating inner frame to cooperate with the clamping spring piece. The edge of the circuit board body is clamped and positioned by the limiting protrusion and the clamping spring piece, which improves the convenience and stability of installation, and is also convenient for disassembly, assembly and maintenance operations, and is highly practical.

[0029] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification can also be directly processed according to existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.

[0030] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still belong to the protection scope of the present invention.

Claims

1. A heat-insulating circuit board, comprising a circuit board body, characterized in that: A heat insulation structure is arranged on the outer side of the circuit board body; The heat insulation structure comprises a heat insulation inner frame and a heat insulation outer frame, a heat insulation gap is provided between the heat insulation inner frame and the heat insulation outer frame, and the heat insulation gap is filled with a heat insulation foam layer; A limiting protrusion is provided on the inner wall of the heat-insulating inner frame, and terminal connection channels are provided on the heat-insulating inner frame and the heat-insulating outer frame; The circuit board body is located in the heat-insulating inner frame, and the edge of the circuit board body is positioned against the upper limit of the limiting protrusion, and the external connection terminal extends into the heat-insulating inner frame through the terminal connection channel and is electrically connected to the circuit board body.

2. A heat-insulating circuit board according to claim 1, characterized in that: A clamping spring is provided on the inner wall of the heat-insulating inner frame; The clamping spring piece is located above the limiting protrusion, the edge of the circuit board body is pressed against the limiting protrusion, and the clamping spring piece is pressed against the edge top of the circuit board body for positioning.

3. A heat-insulating circuit board according to claim 2, characterized in that: The heat-insulating inner frame and the heat-insulating outer frame are both epoxy resin frames or glass fiber frames.

4. The heat-insulating circuit board according to claim 1, characterized in that: The thickness of the heat-insulating foam layer matches the thickness of the heat-insulating inner frame.

5. The heat-insulating circuit board according to claim 1, characterized in that: The width of the heat-insulating inner frame matches the width of the circuit board body, and the length of the heat-insulating inner frame is greater than the length of the circuit board body.

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