Copper deposition device for integrated circuit board

Abstract

The utility model relates to the technical field of integrated circuit board processing, in particular to an integrated circuit board copper deposition device which comprises a copper deposition box, placing sliding seats are arranged on two sides in the copper deposition box, a net rack is fixed between the placing sliding seats, a placing rack is arranged on one side of the net rack, a stirring moving mechanism is arranged in the copper deposition box, and the stirring moving mechanism is connected with the placing rack. A stirring moving assembly, a reset spring and a sliding way are arranged in the stirring moving mechanism, a dustproof filtering mechanism is arranged at the top of the copper deposition box, a dustproof filtering part and a second cover plate are arranged in the dustproof filtering mechanism, and a taking and placing mechanism is arranged between a placing sliding base and a placing frame. The pick-and-place mechanism is composed of a pick-and-place component and a positioning hole. According to the copper deposition device, the copper deposition effect is improved when the copper deposition device is used, the convenience degree of taking and placing an integrated circuit board by the copper deposition device is improved, and the processing quality is not easily influenced by more dust during stirring.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit board processing, in particular to an integrated circuit board copper deposition device. Background Art

[0002] The copper plating process in the production and processing of integrated circuit boards is as follows: first, a hole is opened on the integrated circuit board, and the integrated circuit board with the hole opened is immersed in a copper plating solution for copper plating. The copper plating solution will evenly cover the copper layer on the wall of the hole opened on the circuit board, making the circuit board conductive and the layers of the circuit board able to be connected to each other, so as to facilitate the subsequent processing of the integrated circuit board.

[0003] During the copper plating process, the copper plating liquid must maintain normal air stirring, but the integrated circuit board is not easy to move, so that it is in full contact with the liquid, which affects the copper plating effect when the copper plating device is used; when taking and placing the integrated circuit board, the copper plating device generally fixes the grid on which the integrated circuit board is placed by a clamping structure or screws, which is relatively cumbersome, thereby reducing the convenience of taking and placing the integrated circuit board by the copper plating device; the purpose of maintaining air stirring of the copper plating liquid is to oxidize cuprous ions in the tank liquid and copper powder in the copper plating liquid, so as to convert them into soluble divalent copper, but the copper plating liquid of the current copper plating device is generally directly exposed to the air. When ventilated, dust in the air will be brought into the copper plating liquid, thereby affecting the processing quality. Utility Model Content

[0004] The purpose of the present invention is to provide a copper deposition device for an integrated circuit board, so as to solve the problems raised in the above-mentioned background technology, such as poor copper deposition effect during use, inconvenience in taking and placing the integrated circuit board, and easy influence on processing quality due to dust entering the copper deposition liquid.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a copper deposition device for an integrated circuit board, comprising a copper deposition box, a control row of keys being installed on the surface of the copper deposition box, placement slides being provided on both sides of the interior of the copper deposition box, the placement slides having an L-shaped structure, a grid being fixed between the placement slides, a placement rack being provided on one side of the grid, a stirring and moving mechanism being provided inside the copper deposition box, the stirring and moving mechanism comprising a stirring and moving assembly, a return spring and a slide, a dust-proof filtering mechanism being provided on the top of the copper deposition box, the dust-proof filtering mechanism comprising a dust-proof filtering component and a second cover plate, a pick-up and placement mechanism being provided between the placement slide and the placement rack, the pick-up and placement mechanism being composed of a pick-up and placement component and a positioning hole.

[0006] Preferably, slides are fixed on both sides of the top position of the copper sink box, and the slides slide with each other. A return spring is fixed on the inner wall of one end of the slide, and one end of the return spring is fixedly connected to the surface of the slide. A stirring and moving component is provided on one side of the grid.

[0007] Preferably, the stirring and moving assembly is composed of a driving motor, a cam and a stirring blade. The internal rotation of the copper sink box is connected to the stirring blade, and the surface of the stirring blade is fixed with a cam, and one end of the cam is tightly fitted with the surface of the grid.

[0008] Preferably, a drive motor is installed on the surface of the copper sinking box, the input end of the drive motor is electrically connected to the output end of the control key, the output end of the drive motor is fixed with a rotating shaft through a coupling, and one end of the rotating shaft is fixedly connected to one end of the stirring blade.

[0009] Preferably, the top of the copper sink box is rotatably connected to a second cover plate, the second cover plate is located above the placement rack, and a dust filter component is provided on one side of the second cover plate.

[0010] Preferably, the interior of the dust-proof filtering component includes a first cover plate, an air vent, an activated carbon layer and a cover frame. The surface of the copper sink box is rotatably connected to the first cover plate, and the surface of the first cover plate is provided with an air vent.

[0011] Preferably, the surface of the air guide port is covered with an activated carbon layer, the surface of the activated carbon layer is covered with a cover frame, and the cover frame is detachably connected to the first cover plate by screws.

[0012] Preferably, both sides of the bottom position of the placement slide are fixed with pick-up and placement components, and the corner positions of the placement rack surface are provided with pick-up and placement components.

[0013] Preferably, the interior of the taking and placing component includes a positioning column, a sleeve, a limit block and a stretching spring, and positioning columns are fixed on both sides of the bottom position of the placement slide, and the positioning columns are plugged into and matched with the positioning holes.

[0014] Preferably, the surface of the positioning column is inlaid with a sleeve along the circumferential direction, and a limiting block is provided inside the sleeve. The limiting block and the sleeve slide together, and the surface of the limiting block fits tightly with the surface on which the slide is placed. An extension spring is fixed on one side of the limiting block, and one end of the extension spring is fixedly connected to the inner wall of the sleeve.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the copper deposition device for integrated circuit boards not only improves the copper deposition effect during use, but also improves the convenience of taking and placing integrated circuit boards during use, and is less likely to affect processing quality due to the entry of a large amount of dust during stirring;

[0016] By providing a stirring and moving mechanism, operating a control row key, so that the control row key controls the driving motor to work, and the copper plating liquid inside the copper plating box is stirred under the action of the driving motor. At the same time, when the stirring blade rotates, the cam is driven to rotate. When one end of the cam is away from the stirring blade and approaches the grid frame, the cam gradually pushes the grid frame, so that the grid frame drives the placement slide to slide along the slide, driving the placement rack to rock, so that the circuit board is fully in contact with the copper plating liquid inside the copper plating box. When one end of the cam is close to the stirring blade and is located on one side of the grid frame, the cam and the grid frame no longer contact each other. At this time, the placement slide is reset under the action of the reset spring, so that the driving motor drives the stirring blade to rotate and drives the placement rack to do reciprocating motion at the same time, so that the circuit board is fully in contact with the copper plating liquid inside the copper plating box, so as to realize the stirring and moving function of the copper plating device, thereby improving the copper plating effect when the copper plating device is in use;

[0017] By providing a pick-and-place mechanism, the integrated circuits to be copper-plated are sequentially inserted into the placement rack, and then the second cover is opened, and the placement rack is placed inside the placement slide, so that the positioning hole is sleeved onto the surface of the positioning column, and then the placement rack is pressed, so that the positioning hole squeezes the limiting block, so that the limiting block shrinks into the sleeve. When the positioning hole passes through the limiting block, the limiting block loses pressure and resets under the action of the extension spring, thereby fixing the placement rack to the surface of the placement slide, thereby quickly fixing the placement rack, so that the copper plating device can easily take and place the placement rack, thereby improving the convenience of taking and placing the integrated circuit board in the copper plating device;

[0018] By providing a dust-proof filtering mechanism, since the stirring and moving mechanism will bring air into the copper immersion liquid during stirring, but the air often contains dust and impurities, after the placement rack is placed inside the copper immersion box, the second cover plate can be covered. At this time, the copper immersion box can be shielded by the action of the first cover plate and the second cover plate, and it is not easy for dust in the air to enter the copper immersion liquid inside the copper immersion box. At the same time, the air entering the copper immersion box needs to be filtered and purified through the activated carbon layer before entering along the air guide port to reduce the dust in the air. After a period of time, the screws on the surface of the cover frame can be loosened, the cover frame can be removed, and the activated carbon layer can be taken out for cleaning or replacement to realize the dust-proof filtering function of the copper immersion device, so that the processing quality is not easily affected by the entry of too much dust when the copper immersion device is stirred. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional appearance structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the top view of the appearance structure of the utility model;

[0021] Figure 3 This is a schematic diagram of a top-view cross-sectional structure of the utility model;

[0022] Figure 4 This is an enlarged schematic diagram of the main cross-section of the placement rack of the present invention.

[0023] In the figure: 1. Copper sink box; 101. Control row key; 102. Placement slide; 103. Placement rack; 104. Grid; 2. Stirring and moving mechanism; 201. Stirring and moving component; 2011. Driving motor; 2012. Cam; 2013. Stirring blade; 202. Return spring; 203. Slide; 3. Dust-proof and filtering mechanism; 301. Dust-proof and filtering component; 3011. First cover plate; 3012. Air guide port; 3013. Activated carbon layer; 3014. Cover frame; 302. Second cover plate; 4. Pick-up and placement mechanism; 401. Pick-up and placement component; 4011. Positioning column; 4012. Sleeve; 4013. Limiting block; 4014. Extension spring; 402. Positioning hole. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] The utility model provides an integrated circuit board copper deposition device with a structure as follows Figure 1 and Figure 3 As shown, it includes a copper sinking box 1, and a control key 101 is installed on the surface of the copper sinking box 1. The model of the control key 101 can be LA series. Placement slides 102 are provided on both sides of the inside of the copper sinking box 1. The structure of the placement slide 102 is an L-shaped structure. A grid 104 is fixed between the placement slides 102, and a placement rack 103 is provided on one side of the grid 104.

[0026] Further, if Figure 3As shown, the interior of the copper sink box 1 is provided with a stirring moving mechanism 2, and the interior of the stirring moving mechanism 2 includes a stirring moving component 201, a return spring 202 and a slide 203. The slides 203 are fixed on both sides of the top position of the copper sink box 1. The slides 203 and the placement slide 102 slide with each other. The inner wall of one end of the slide 203 is fixed with a return spring 202, and one end of the return spring 202 is fixedly connected to the surface of the placement slide 102. A stirring moving component 201 is provided on one side of the grid 104. The stirring moving component 201 is driven by a drive motor 2011 and a cam 202. 012 and a stirring blade 2013, the internal rotation of the copper immersion box 1 is connected to the stirring blade 2013, the surface of the stirring blade 2013 is fixed with a cam 2012, one end of the cam 2012 is tightly fitted with the surface of the grid 104, and the surface of the copper immersion box 1 is installed with a drive motor 2011, the model of the drive motor 2011 can be selected from the JO series, the input end of the drive motor 2011 is electrically connected to the output end of the control row key 101, and the output end of the drive motor 2011 is fixed with a rotating shaft through a coupling, and one end of the rotating shaft is fixedly connected to one end of the stirring blade 2013.

[0027] When in use, operate the control row key 101 to control the control row key 101 to control the driving motor 2011 to work, and under the action of the driving motor 2011, the copper sinking liquid inside the copper sinking box 1 is stirred. At the same time, the stirring blade 2013 rotates and drives the cam 2012 to rotate. When the end of the cam 2012 away from the stirring blade 2013 approaches the grid 104, the cam 2012 gradually pushes the grid 104, so that the grid 104 drives the placement slide 102 to slide along the slide 203, driving the placement rack 103 to shake. The circuit board is moved so as to fully contact the copper plating liquid inside the copper plating box 1. When the end of the cam 2012 close to the stirring blade 2013 is located on the side of the grid 104, the cam 2012 and the grid 104 are not in contact with each other. At this time, the placement slide 102 is reset under the action of the reset spring 202, so that the driving motor 2011 drives the stirring blade 2013 to rotate and drives the placement rack 103 to do reciprocating motion, so that the circuit board is fully in contact with the copper plating liquid inside the copper plating box 1, so as to realize the stirring and moving function of the copper plating device.

[0028] Further, if Figure 1 and Figure 2As shown, a dust-proof filtering mechanism 3 is provided on the top of the copper sink box 1, and the interior of the dust-proof filtering mechanism 3 includes a dust-proof filtering component 301 and a second cover plate 302. The top of the copper sink box 1 is rotatably connected to the second cover plate 302, and the second cover plate 302 is located above the placement rack 103. A dust-proof filtering component 301 is provided on one side of the second cover plate 302. The interior of the dust-proof filtering component 301 includes a first cover plate 3011, an air vent 3012, an activated carbon layer 3013 and a cover frame 3014. The surface of the copper sink box 1 is rotatably connected to the first cover plate 3011, and the surface of the first cover plate 3011 is provided with an air vent 3012. The surface of the air vent 3012 is covered with an activated carbon layer 3013. The surface of the activated carbon layer 3013 is covered with a cover frame 3014. The cover frame 3014 is detachably connected to the first cover plate 3011 by screws.

[0029] During use, since the stirring and moving mechanism 2 will bring air into the copper plating liquid during stirring, but the air often contains dust and impurities, after the placement rack 103 is placed inside the copper plating box 1, the second cover plate 302 can be covered. At this time, the copper plating box 1 can be shielded by the first cover plate 3011 and the second cover plate 302, and it is not easy for dust in the air to enter the copper plating liquid inside the copper plating box 1. At the same time, the air entering the copper plating box 1 needs to be filtered and purified through the activated carbon layer 3013 and then enter along the air guide port 3012 to reduce the dust in the air. After a period of time, the screws on the surface of the cover frame 3014 can be loosened, the cover frame 3014 can be removed, and then the activated carbon layer 3013 can be taken out for cleaning or replacement to realize the dust-proof filtering function of the copper plating device.

[0030] Further, if Figure 3 and Figure 4 As shown, a pick-up and placement mechanism 4 is provided between the placement slide 102 and the placement rack 103. The pick-up and placement mechanism 4 is composed of a pick-up and placement component 401 and a positioning hole 402. The pick-up and placement components 401 are fixed on both sides of the bottom position of the placement slide 102. The pick-up and placement components 401 are opened at the corner positions of the surface of the placement rack 103. The interior of the pick-up and placement component 401 includes a positioning column 4011, a sleeve 4012, a limit block 4013 and a stretching spring 4014. The positioning holes 402 are fixed on both sides of the bottom position of the placement slide 102. Column 4011, the positioning column 4011 and the positioning hole 402 are plugged into each other, the surface of the positioning column 4011 is inlaid with a sleeve 4012 along the circumferential direction, and a limiting block 4013 is provided inside the sleeve 4012. The limiting block 4013 and the sleeve 4012 slide with each other, and the surface of the limiting block 4013 fits tightly with the surface of the slide 102. An extension spring 4014 is fixed on one side of the limiting block 4013, and one end of the extension spring 4014 is fixedly connected to the inner wall of the sleeve 4012.

[0031] When in use, the integrated circuits to be copper-plated are inserted into the placement rack 103 in turn, and then the second cover 302 is opened, and the placement rack 103 is placed on the inner side of the placement slide 102, so that the positioning hole 402 is sleeved on the surface of the positioning column 4011, and then the placement rack 103 is pressed, so that the positioning hole 402 squeezes the limiting block 4013, so that the limiting block 4013 shrinks to the inside of the sleeve 4012. When the positioning hole 402 passes through the limiting block 4013, the limiting block 4013 loses pressure and resets under the action of the extension spring 4014, thereby fixing the placement rack 103 on the surface of the placement slide 102, thereby quickly fixing the placement rack 103, so that the copper plating device can easily take and place the placement rack 103.

[0032] Working principle: When in use, first insert the integrated circuits to be copper-plated into the placement rack 103 in turn, then open the second cover 302, place the placement rack 103 on the inside of the placement slide 102, so that the positioning hole 402 is sleeved on the surface of the positioning column 4011, and then press the placement rack 103 to make the positioning hole 402 squeeze the limiting block 4013, so that the limiting block 4013 shrinks to the inside of the sleeve 4012. When the positioning hole 402 passes through the limiting block 4013, the limiting block 4013 loses pressure and resets under the action of the extension spring 4014, thereby fixing the placement rack 103 to the surface of the placement slide 102, thereby quickly fixing the placement rack 103, so that the copper plating device can easily take and place the placement rack 103, thereby improving the convenience of the copper plating device when taking and placing the integrated circuit board.

[0033] Then operate the control row key 101 to make the control row key 101 control the driving motor 2011 to work, and under the action of the driving motor 2011, the copper sinking liquid inside the copper sinking box 1 is stirred. At the same time, the stirring blade 2013 rotates and drives the cam 2012 to rotate. When the end of the cam 2012 away from the stirring blade 2013 approaches the grid 104, the cam 2012 gradually pushes the grid 104, so that the grid 104 drives the placement slide 102 to slide along the slide 203, and drives the placement rack 103 to shake, so that the circuit board is fully in contact with the sinking liquid. The copper plating liquid inside the copper box 1 is in contact with the copper plating liquid. When the end of the cam 2012 close to the stirring blade 2013 is located on the side of the grid 104, the cam 2012 and the grid 104 do not contact each other. At this time, the placement slide 102 is reset under the action of the reset spring 202, so that the driving motor 2011 drives the stirring blade 2013 to rotate and drives the placement rack 103 to do reciprocating motion, so that the circuit board is fully in contact with the copper plating liquid inside the copper plating box 1, so as to realize the stirring and moving function of the copper plating device, thereby improving the copper plating effect when the copper plating device is in use.

[0034] Since the stirring and moving mechanism 2 will bring air into the copper plating liquid during stirring, but the air often contains dust and impurities, after the placement rack 103 is placed inside the copper plating box 1, the second cover plate 302 can be covered. At this time, the copper plating box 1 can be shielded by the first cover plate 3011 and the second cover plate 302, so that dust in the air is not easily allowed to enter the copper plating liquid inside the copper plating box 1. At the same time, the air entering the copper plating box 1 needs to be filtered and purified through the activated carbon layer 3013 before entering along the air guide port 3012 to reduce dust in the air. After a period of time, the screws on the surface of the cover frame 3014 can be loosened, the cover frame 3014 can be removed, and the activated carbon layer 3013 can be taken out for cleaning or replacement to realize the dust-proof filtering function of the copper plating device, so that the copper plating device is not easily affected by the entry of more dust during stirring, and the use of the copper plating device is finally completed.

[0035] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An integrated circuit board copper deposition device, comprising a copper deposition box (1), characterized in that: A control row of keys (101) is installed on the surface of the copper sink box (1), and placement slides (102) are arranged on both sides of the copper sink box (1). The structure of the placement slides (102) is an L-shaped structure. A grid (104) is fixed between the placement slides (102), and a placement rack (103) is arranged on one side of the grid (104). A stirring movement mechanism (2) is arranged inside the copper sink box (1), and the stirring movement mechanism (2) includes a stirring movement component (201), a return spring (202) and a slideway (203). A dustproof filtering mechanism (3) is arranged on the top of the copper sink box (1), and the dustproof filtering mechanism (3) includes a dustproof filtering component (301) and a second cover plate (302). A pick-up and placement mechanism (4) is arranged between the placement slide (102) and the placement rack (103), and the pick-up and placement mechanism (4) is composed of a pick-up and placement component (401) and a positioning hole (402).

2. The copper deposition device for integrated circuit board according to claim 1, characterized in that: Slideways (203) are fixed on both sides of the top of the copper sink box (1), and the slideways (203) and the placement slide seat (102) are slidably matched with each other. A return spring (202) is fixed to the inner wall of one end of the slideway (203), and one end of the return spring (202) is fixedly connected to the surface of the placement slide seat (102). A stirring moving component (201) is provided on one side of the grid frame (104).

3. The copper deposition device for integrated circuit board according to claim 2, characterized in that: The stirring moving component (201) is composed of a driving motor (2011), a cam (2012) and a stirring blade (2013); the stirring blade (2013) is rotatably connected to the inside of the copper sink box (1); the surface of the stirring blade (2013) is fixed with a cam (2012); one end of the cam (2012) is tightly fitted with the surface of the grid (104).

4. The copper deposition device for integrated circuit board according to claim 3, characterized in that: A driving motor (2011) is installed on the surface of the copper sinking box (1), the input end of the driving motor (2011) is electrically connected to the output end of the control row key (101), the output end of the driving motor (2011) is fixed with a rotating shaft via a coupling, and one end of the rotating shaft is fixedly connected to one end of the stirring blade (2013).

5. The copper deposition device for integrated circuit board according to claim 1, characterized in that: A second cover plate (302) is rotatably connected to the top of the copper sink box (1); the second cover plate (302) is located above the placement rack (103); and a dustproof filter component (301) is provided on one side of the second cover plate (302).

6. The copper deposition device for integrated circuit board according to claim 5, characterized in that: The dustproof filtering component (301) comprises a first cover plate (3011), an air guide port (3012), an activated carbon layer (3013) and a cover frame (3014); the surface of the copper sink box (1) is rotatably connected to the first cover plate (3011); and the surface of the first cover plate (3011) is provided with an air guide port (3012).

7. The copper deposition device for integrated circuit board according to claim 6, characterized in that: The surface of the air guide opening (3012) is covered with an activated carbon layer (3013), and the surface of the activated carbon layer (3013) is covered with a cover frame (3014), and the cover frame (3014) is detachably connected to the first cover plate (3011) via screws.

8. The copper deposition device for integrated circuit board according to claim 1, characterized in that: Pick-up and placement components (401) are fixed on both sides of the bottom of the placement slide (102), and pick-up and placement components (401) are provided at the corners of the surface of the placement rack (103).

9. The copper deposition device for integrated circuit board according to claim 8, characterized in that: The interior of the pick-and-place component (401) includes a positioning column (4011), a sleeve (4012), a limit block (4013) and an extension spring (4014); positioning columns (4011) are fixed on both sides of the bottom of the placement slide (102); and the positioning columns (4011) and the positioning holes (402) are plugged into each other.

10. The copper deposition device for integrated circuit board according to claim 9, characterized in that: The surface of the positioning column (4011) is inlaid with a sleeve (4012) along the circumferential direction, and a limit block (4013) is arranged inside the sleeve (4012). The limit block (4013) and the sleeve (4012) are slidably matched with each other, and the surface of the limit block (4013) is tightly fitted with the surface of the slide seat (102). An extension spring (4014) is fixed to one side of the limit block (4013), and one end of the extension spring (4014) is fixedly connected to the inner wall of the sleeve (4012).

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