Buffering jig for installing flexible circuit board on display panel
By designing a buffer fixture with an inclined surface and body part, the problem of crushing COF when manually plugging the flexible circuit board is solved, and the effect of reducing the defect rate and improving production efficiency is achieved.
Patent Information
- Application Number
- CN202420728909.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-09
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-04-09
AI Technical Summary
During the production process of display panels, it is easy to crush the covered crystal film (COF) when manually plugging the flexible circuit board, resulting in an increase in the defective rate of the panel main product and reducing production efficiency.
A buffering fixture is designed, which has a body part and an inclined surface, which is used to raise the driving circuit board, which is convenient for installing a flexible circuit board. At the same time, the inclined surface is equipped with COF to serve as a support and buffering function.
By using this fixture, the risk of operators encountering COF when plugging in flexible circuit boards is reduced, the COF is damaged is avoided, the defect rate of the panel body product is reduced, and the production efficiency is improved.
Smart Images
Figure CN222869162U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of mechanical jigs, in particular to a buffer jig capable of smoothly installing a flexible circuit board on a driving circuit board connected to a chip-on-film (COF) of a panel body. Background Art
[0002] In the structure of the display panel, the driver circuit board (PCB) is generally connected to the panel body through a chip-on-film (hereinafter referred to as COF), and the driver circuit boards are electrically connected by inserting a flexible printed circuit (FPC) into the connector on the driver circuit board. In the production process of the display panel, the method of plugging the flexible circuit board is mainly manual work, and the operator manually inserts the flexible circuit board into the connector on the driver circuit board.
[0003] like Figure 1 and Figure 2 As shown, in the current technology, during the production process of the panel, the panel body 11 is placed flat on a production carrier 1. When the operator manually plugs the flexible circuit board 14 into the connector 15 on the driving circuit board 13, the operator's hand is likely to press the COF 12, thereby causing damage to the COF 12. This can easily lead to an increase in the defective rate of the panel body product and reduce production efficiency. Utility Model Content
[0004] The utility model aims to provide a buffering fixture which is not easy to crush the COF when the panel body is plugged into the flexible circuit board.
[0005] In order to solve the above technical problems, the COF fixture for the panel body of the present application specifically adopts the following technical solutions:
[0006] A buffering jig for installing a flexible circuit board on a display panel, the display panel comprising a panel body, a chip-on-chip film, a driving circuit board, a connector and the flexible circuit board, the driving circuit board being connected to the panel body via the chip-on-chip film, the connector being arranged on the upper surface of the driving circuit board, the flexible circuit board being plugged into the connector, the jig being characterized in that: the jig has a body portion and an inclined surface formed on one side of the body portion, the body portion being used to raise the driving circuit board to facilitate installation of the flexible circuit board on the driving circuit board, and the chip-on-chip film being mounted on the inclined surface.
[0007] The jig for the COF of the panel body involved in the utility model makes a height difference between the panel body and the driving circuit board through the structural design of the jig body, thereby reducing the risk of the operator touching the COF when inserting the flexible circuit board. In addition, because the jig is made of flexible plastic, its inclined surface can play a buffering role while supporting the COF, so that even if the operator touches the COF, it can avoid the COF from being crushed. Therefore, the jig provided by the utility model can reduce the defective rate of the panel body product and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0009] Figure 1 It is a schematic diagram of the connection relationship between the COF of the panel body and the flexible printed circuit board (FPC) and the driving printed circuit board (PCB) in the prior art.
[0010] Figure 2 It is a cross-sectional schematic diagram of the state of COF when fixing FPC in the prior art.
[0011] Figure 3 It is an enlarged schematic diagram of the fixture involved in the utility model.
[0012] Figure 4 It is a cross-sectional schematic diagram of the fixture involved in the utility model in a use state.
[0013] Main component symbols
[0014]
[0015] DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0017] See also Figure 3The buffering jig 21 provided by the utility model is used to play a role of padding and buffering when installing the flexible circuit board 26 of the display panel, so as to facilitate the operation and prevent the chip on film (COF; Chip On Film) 23 of the panel body from being crushed. The display panel includes a panel body 22, a chip on film (abbreviated as COF in this specification) 23, a driver circuit board (PCB) 24, a connector 25 and a flexible circuit board 26. The driver circuit board 24 is connected to the panel body 22 through the chip on film 23, the connector 25 is arranged on the upper surface of the driver circuit board 24, and the flexible circuit board 26 is plugged into the connector 25.
[0018] The buffer jig 21 includes a loading portion 210 and a main body 213. The loading portion 210 is used to carry the panel body 22, and the main body 213 is used to raise and carry the driving circuit board 24. An inclined surface 211 is formed on one side of the main body 213 close to the panel body 22. The main body 213 is generally block-shaped. The inclined surface 211 is inclined in a manner that the distance between the top surface of the main body 213 and the bottom surface of the main body 213 gradually decreases.
[0019] In this embodiment, the buffer jig 21 is formed of a material such as soft rubber or foam material, and has a certain buffering property. For example, the material of the buffer jig 21 can be EVA (ethylene-vinyl acetate copolymer), EPE (polyethylene foam cotton; pearl cotton) or other foam materials. The buffer jig 21 can be a complete long strip, or it can be divided into multiple sections (usually three sections) for setting. The overall length of the buffer jig 21 matches the length of the side of the panel body 22. When divided into multiple sections for setting, the length of each section matches the driving circuit board 24 carried on its upper surface. In addition, the thickness of the buffer jig 21 (the height from the upper surface to the bottom surface) is not particularly limited, as long as a height difference can be made between the body of the panel body 22 and the driving circuit board 24, and then the COF23 can be tilted and mounted on its inclined surface 211. Preferably, the angle between the inclined surface 211 and the upper surface of the mounting portion 210 is less than 45°. When the COF 23 is mounted on the inclined surface 211 , the angle formed between the COF 23 and the mounting portion 210 is also less than 45°. In this way, the end of the COF 23 connected to the panel body 22 can be prevented from being damaged or broken.
[0020] COF23 is a soft additional circuit board without a packaged chip. It is a grain soft film assembly technology used to fix the integrated circuit (IC) on the flexible circuit board (FPC) 26. The soft additional circuit board is used as a package chip carrier to combine the chip with the soft substrate circuit. COF23 is very suitable for liquid crystal module products with small-sized panels such as mobile phones or PDAs. In addition to the function of connecting panels, COF23 can also carry active and passive components to make the product thinner and lighter. COF23 can be summarized as follows: reduced size, thinner and lighter; the chip is facing down, and the line spacing is refined (35μm pitch), which can increase reliability; regional reflow soldering can be performed on the substrate; high bending strength; passive components can be added.
[0021] See also Figure 4 , Figure 4 It is a cross-sectional schematic diagram of the buffer jig 21 involved in the utility model in the use state. When in use, the main body 213 of the buffer jig 21 is placed flat on the upper surface of the loading portion 210, and an inclined surface 211 is formed on one side thereof. One end of the main body 213 provided with the inclined surface 211 is placed adjacent to the panel body 22. The panel body 22 is also carried on the upper surface of the loading portion 210. The upper surface of the loading portion 210 is a flat surface. One end of the COF 23 is connected to a side edge of the panel body 22, and the other end of the COF 23 is connected to a driving circuit board (PCB) 24. The entirety of the COF 23 is mounted on the inclined surface 211 of the buffer jig 21. The inclined surface 211 supports and buffers the COF 23. A connector 25 is provided on the upper surface of the driving circuit board 24. One end of the flexible circuit board 26 is inserted into the connector 25 on the driving circuit board 24, and the other end of the flexible circuit board 26 is plugged into the connector of other driving circuit boards adjacent to the driving circuit board 24 to achieve electrical connection between adjacent driving circuit boards.
[0022] When in use, the buffer jig 21 is located below the driving circuit board 24 to raise the driving circuit board 24, thereby creating a height difference between the driving circuit board 24 and the panel body 22. COF23 is flexible, and it may or may not contact the inclined surface 211 of the buffer jig 21. When plugging in the flexible circuit board 26, since the connector 25 together with the driving circuit board 24 is raised by the buffer jig 21, the plugging operation is more convenient. In addition, COF23 is tilted on the inclined surface 211 of the buffer jig 21, so it is not easy for the operator's hands and arms to touch COF23. Even if the operator accidentally touches COF23, since the jig 1 is made of flexible material, it can also buffer COF23 and prevent COF23 from being crushed. In other words, the buffer jig 21 can assist in inserting the flexible circuit board 26 into the connector 25.
[0023] There are three main connection technologies between the chip and the driver circuit board 24 used in COF23: The first is the gold-tin eutectic connection process. This process uses the gold bumps on the IC chip and the tin-plated FPC internal leads to form a gold-tin eutectic on the contact surface through heating and pressurization to achieve the purpose of connection. The second is the anisotropic conductive film (ACF) connection process. Specifically, after the ACF is attached between the IC bump and the substrate circuit, the appropriate pressure, temperature and time are used to make the resin begin to flow and the conductive particles contact the bump and the substrate circuit to achieve electrical conduction. The third is the non-conductive adhesive connection (NCA) process. The NCA bonding method mainly relies on direct contact between the electrodes on both sides of the chip and the substrate to achieve electrical conduction.
[0024] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A buffering jig for mounting a flexible circuit board on a display panel, the display panel comprising a panel body, a chip-on-film, a driving circuit board, a connector and the flexible circuit board, the driving circuit board being connected to the panel body via the chip-on-film, the connector being disposed on the upper surface of the driving circuit board, the flexible circuit board being plugged into the connector, the jig being characterized in that: The jig comprises a main body and an inclined surface formed on one side of the main body. The main body is used to raise the driving circuit board to facilitate the installation of the flexible circuit board on the driving circuit board. The flip chip film is mounted on the inclined surface.
2. The buffer jig according to claim 1, characterized in that: The jig is placed under the driving circuit board and is used to raise the driving circuit board, so that a height difference appears between the driving circuit board and the panel body.
3. The buffer jig according to claim 1, characterized in that: The jig is made of soft rubber or foam material.
4. The buffer jig according to claim 2, characterized in that: The jig is a complete long strip or segmented, and the length of the jig matches the length of the driving circuit board carried on the upper surface of the main body of the jig.
5. The buffer jig according to claim 1, characterized in that: The inclined surface is formed at one side of the main body and is inclined in a manner that a distance between a top surface of the main body and a bottom surface of the main body gradually decreases.
6. The buffer jig according to claim 1, characterized in that: The fixture further includes a loading portion, and the loading portion is used to load the panel body.
7. The buffer jig according to claim 6, characterized in that: An angle between the inclined surface and an upper surface of the mounting portion is less than 45 degrees.
8. The buffer jig according to claim 7, characterized in that: When the chip-on-film is mounted on the inclined surface, an angle formed between the chip-on-film and the mounting portion is less than 45°.