Circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of circuit heat dissipation, in particular to a circuit board assembly and electronic equipment. The circuit board assembly comprises a substrate and an electromagnetic shielding cover. An electromagnetic unit is arranged on the base plate, and a heat conduction belt is arranged on the base plate and located on the periphery of the electromagnetic unit; the electromagnetic shielding cover is arranged on the electromagnetic unit through the heat conduction belt in a covering mode, fixedly connected with the substrate and used for conducting electromagnetic shielding on the electromagnetic unit and conducting heat of the substrate and the electromagnetic unit out through the heat conduction belt. Through the above mode, the embodiment of the utility model improves the heat dissipation effect on the basis of ensuring the electromagnetic shielding performance.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of circuit heat dissipation, and specifically to a circuit board assembly and an electronic device. Background Art

[0002] With the development of technology, electronic products are currently moving towards miniaturization, with requirements for smaller and smaller sizes and weights, and higher and higher requirements for heat dissipation performance of products.

[0003] Military electronic products have strict requirements on electromagnetic shielding performance due to their special application environment and functional requirements. Electromagnetic shielding performance refers to the ability of a product to resist external electromagnetic interference in an electromagnetic environment and to work normally without interfering with other equipment. At the same time, military electronic products require smaller and smaller product sizes and weights.

[0004] The inventors of the present application have discovered during their research that there is currently a lack of effective solutions that can ensure the anti-interference performance of electronic products while not affecting the heat dissipation efficiency of the electronic products. Utility Model Content

[0005] In view of the above problems, an embodiment of the present application provides a circuit board assembly and an electronic device, which are used to ensure that the electronic product has good heat dissipation effect while ensuring anti-interference performance.

[0006] According to one aspect of an embodiment of the present application, there is provided a circuit board assembly, including a substrate and an electromagnetic shielding cover;

[0007] An electromagnetic unit is arranged on the substrate, and a heat-conducting belt is arranged on the substrate at the edge of the electromagnetic unit;

[0008] The electromagnetic shielding cover is arranged on the electromagnetic unit through the thermal conductive belt cover and is fixedly connected to the substrate, and is used for electromagnetically shielding the electromagnetic unit and conducting heat from the substrate and the electromagnetic unit through the thermal conductive belt.

[0009] In some embodiments, a plurality of the electromagnetic units are disposed on the substrate; the electromagnetic shielding cover includes a plurality of electromagnetic shielding units, each of the electromagnetic shielding units is disposed corresponding to each of the electromagnetic units, and adjacent electromagnetic shielding units are disposed integrally.

[0010] Some embodiments further include a heat sink; the heat sink is fixedly connected to the substrate and connected to the thermal conductive tape to conduct heat from the substrate and the electromagnetic unit.

[0011] In some embodiments, the heat sink and the electromagnetic shielding unit are integrally provided.

[0012] In some embodiments, a heat sink is disposed on a surface of the electromagnetic shielding cover that is away from the substrate.

[0013] In some embodiments, the thermal conductive tape is a copper leakage area on the substrate.

[0014] In some embodiments, the electromagnetic shielding cover includes a rib, and the rib is in contact with the copper leakage area.

[0015] In some embodiments, the rib is fixedly connected to the copper leakage area by means of screws, conductive glue or conductive thermal grease material.

[0016] In some embodiments, a boss or a groove is provided on an inner wall of the electromagnetic shielding unit on a side facing the electromagnetic unit; the boss or the groove is coated with a thermal conductive gel and is in contact with the electromagnetic unit.

[0017] On the other hand, an embodiment of the present application further proposes an electronic device, comprising a circuit board assembly proposed in any of the above embodiments.

[0018] The embodiment of the present application arranges a heat-conducting tape on the substrate, and arranges the electromagnetic shielding cover on the substrate through the heat-conducting tape. On the one hand, the electromagnetic shielding cover can play a good electromagnetic shielding effect on the electromagnetic unit. At the same time, since the electromagnetic shielding cover is made of conductive material, it also has relatively good thermal conductivity, and it is directly connected to the substrate through the heat-conducting tape. The heat generated by the electromagnetic unit and the substrate will be conducted to the electromagnetic shielding cover through the heat-conducting tape. Since the electromagnetic shielding cover has a large heat dissipation area and has relatively good thermal conductivity, at this time, the electromagnetic shielding cover can conduct the heat generated by the electromagnetic unit and the substrate away, achieving a better heat dissipation effect. In this way, the electromagnetic shielding cover is also used as a way to dissipate heat, and there is no need to reserve a special setting position, which reduces the volume of the circuit board assembly and also improves the heat dissipation effect.

[0019] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0021] Figure 1 A schematic diagram of the structure of a circuit board substrate provided in an embodiment of the present application is shown;

[0022] Figure 2 A schematic diagram of the structure of the electromagnetic shielding cover of a circuit board provided in an embodiment of the present application is shown;

[0023] Figure 3 A schematic diagram of assembling a circuit board assembly provided in an embodiment of the present application is shown;

[0024] Figure 4 An overall schematic diagram of a circuit board assembly provided in an embodiment of the present application is shown;

[0025] Figure 5 A schematic diagram of the back structure of a circuit board assembly provided in an embodiment of the present application is shown.

[0026] The reference numerals in the specific implementation manner are as follows:

[0027] 10. Circuit board assembly; 100. Base plate; 110. Electromagnetic unit; 111. First electromagnetic unit; 112. Second electromagnetic unit; 120. Thermal conductive belt; 121. First thermal conductive belt; 122. Second thermal conductive belt; 123. Third thermal conductive belt; 200. Electromagnetic shielding cover; 210. Electromagnetic shielding unit; 211. First electromagnetic shielding unit; 212. Second electromagnetic shielding unit; 220. Rib position; 221. First rib position; 222. Second rib position; 223. Third rib position; 230. Heat sink; 231. Heat sink; 240. Threaded hole; 251. Groove; 252. Boss. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0033] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0034] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0035] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] The shielding performance requirements of military electronic products are to ensure that they have high electromagnetic compatibility (EMC), strong shielding effectiveness and effective electrostatic discharge (ESD) protection in complex electromagnetic environments. These requirements together constitute the basic standards that military electronic products must meet during the design and manufacturing process to ensure their stability, reliability and safety in modern battlefield environments. By adopting efficient shielding materials, advanced manufacturing processes and innovative design methods, military electronic products can resist external electromagnetic interference while reducing electromagnetic radiation to other equipment, meet strict national and military standards, and adapt to the ever-changing electromagnetic environment and combat needs.

[0037] With the development of technology and the improvement of requirements, existing military electronic products also require products to be smaller and smaller. This not only puts forward requirements on the electromagnetic shielding performance of electronic products, but also puts forward higher requirements on the heat dissipation performance and integration of electronic products. Existing military electronic products usually adopt the method of adding an electromagnetic shielding cover to the circuit board for the electromagnetic unit to shield the impact of electromagnetic interference on product performance, and use a separate radiator to dissipate heat for electronic products. In this case, since the electromagnetic shielding cover is often covered on the circuit board, the setting position of the radiator is limited. The radiator cannot be directly set together with the heating element, but can only be set in an area without an electromagnetic shielding cover, or set outside the circuit board for heat dissipation. Although this method can achieve a good electromagnetic shielding effect, it will result in a relatively poor heat dissipation effect of the radiator. Moreover, since the radiator and the electromagnetic shielding cover are independent of each other, the volume of the electronic product is also relatively large.

[0038] In view of this, the inventor of the present application has proposed a circuit board assembly and an electronic device for solving the technical problems existing in the prior art. The circuit board assembly and the electronic device proposed in the present application are provided with a thermal conductive tape on the circuit board, and the electromagnetic shielding cover is provided on the circuit board through the thermal conductive tape, so that the electromagnetic shielding cover has the function of heat dissipation. The electromagnetic shielding cover can shield electromagnetic interference while directly covering the electromagnetic unit and directly contacting the circuit board through the thermal conductive tape, so that the electromagnetic unit and the heat generating unit on the circuit board can be directly cooled. Compared with the prior art which only performs indirect heat dissipation through a radiator, the embodiment proposed in the present application directly cools the electromagnetic unit on the circuit board without affecting the electromagnetic shielding effect, and at the same time increases the heat dissipation area of ​​the circuit board, greatly improving the heat dissipation effect of the circuit board.

[0039] The circuit board assembly proposed in this application can be applied to various electronic devices, such as anti-UAV equipment, electromagnetic wave transmitting guns, etc.

[0040] like Figure 1 , Figure 2 and Figure 3As shown, a circuit board assembly 10 proposed in an embodiment of the present application is provided, and the circuit board assembly 10 includes a substrate 100 and an electromagnetic shielding cover 200; an electromagnetic unit 110 is arranged on the substrate 100, and a thermal conductive tape 120 is arranged on the substrate 100 at the edge of the electromagnetic unit 110; the electromagnetic shielding cover 200 is arranged on the electromagnetic unit 110 through the thermal conductive tape 120, and is fixedly connected to the substrate 100, for electromagnetically shielding the electromagnetic unit 110, and conducting the heat of the substrate 100 and the electromagnetic unit 110 out through the thermal conductive tape 120.

[0041] Continue to refer Figure 1 In this application, the substrate generally refers to a PCB board, which can be a single-layer PCB board or a multi-layer PCB board. Usually, FR-4 material with good insulation performance and mechanical strength can be selected as the substrate. A variety of electronic components and housings can be arranged on the substrate, such as Figure 1 As shown, the substrate may be provided with a control chip, an interface circuit or a power supply circuit, and the electronic components on the substrate may be arranged in a stacking manner, and the shape of the substrate may be set according to actual needs, such as Figure 1 As shown, it can be set to an L shape, etc., which is not limited in this application.

[0042] Continue to refer Figure 1 The electromagnetic unit 110 refers to a circuit unit composed of one or more electronic components that are susceptible to electromagnetic interference and require electromagnetic shielding, such as a controller unit, a radio frequency transmitting unit, and a memory. There may be one or more electromagnetic units on a circuit board. One or more electromagnetic units can realize circuit control functions alone or in cooperation with each other, which is not limited in this application. Figure 1 As shown, in the embodiment of the present application, the area surrounded by the heat conductive belt 120 can be regarded as an electromagnetic unit. Figure 1 In the embodiment, for example, the first electromagnetic unit 111 and the second electromagnetic unit 112 may be included, the first conductive belt 121 and the second conductive belt 122 are arranged at the edge of the first electromagnetic unit 111; the second conductive belt 122 and the third conductive belt 123 are arranged at the edge of the second electromagnetic unit 112; wherein the first conductive belt 121 and the second conductive belt 122 may be connected front to back to form an enclosed space to enclose the first electromagnetic unit 111; the first conductive belt 121 and the second conductive belt 122 may also be unconnected and only be arranged on a certain edge of the first electromagnetic unit 111. Similarly, the conductive belt around the second electromagnetic unit 112 may also be arranged in the above manner. Figure 1In the figure, it can be seen that the periphery of the first electromagnetic unit 111 and the second electromagnetic unit 112 are surrounded by the heat conductive belt, wherein the first electromagnetic unit 111 and the second electromagnetic unit 112 also share the second heat conductive belt 122. In the embodiment of the present application, the specific configuration of the heat conductive belt 120 can be various and is not specifically limited here.

[0043] In military products and circuit designs with high requirements for anti-interference performance, electromagnetic shielding is an indispensable component. It helps to improve the stability and reliability of electronic equipment in strong electromagnetic interference environments and is an important component used to improve electromagnetic compatibility in electronic equipment design. Figure 2 As shown, the electromagnetic shielding cover 200 is usually made of conductive materials, such as stainless steel, nickel silver or aluminum, etc., which can provide protection for sensitive circuits in electronic devices to prevent them from being affected by external electromagnetic fields, and also prevent the electromagnetic interference generated by the device itself from affecting other devices. The electromagnetic shielding cover 200 can be designed in different shapes and sizes to meet different application requirements. The conductive material used in the electromagnetic shielding cover 200 can not only play the role of electromagnetic shielding, but also has relatively good thermal conductivity. Figure 2 As shown, a first electromagnetic shielding unit 211 and a second electromagnetic shielding unit 212 are provided at positions on the electromagnetic shielding cover 200 corresponding to the first electromagnetic unit 111 and the second electromagnetic unit 112 on the substrate 100, and a first rib position 221 and a second rib position 222 are provided around the first electromagnetic shielding unit 211, wherein the rib position 220 is a metal raised partition, which is used to enclose the electromagnetic unit on all sides for electromagnetic shielding, and a third rib position 223 is provided around the second electromagnetic shielding unit 212, and the rib position 220 is used to abut against the thermal conductive belt 120 on the substrate 100.

[0044] like Figure 3 As shown, it is a schematic diagram of the assembly of the substrate 100 and the electromagnetic shielding cover 200, the electromagnetic unit 110 is arranged on the substrate 100 of the circuit board, and the electromagnetic shielding cover 200 is covered on the electromagnetic unit 110 through the conductive belt 120, which is used to electromagnetically shield the electromagnetic unit, and the electromagnetic shielding cover 200 is connected to the substrate 100 through the conductive belt 120, which can be arranged on the substrate by screws, clamping, welding or gluing, so as to electromagnetically shield the electromagnetic unit. The conductive belt 120 can conduct the heat generated by the substrate 100 and the electromagnetic unit 110 to the electromagnetic shielding cover 200, and dissipate the heat through the electromagnetic shielding cover 200.

[0045] Continue to refer Figure 3The electromagnetic shielding cover 200 covers the substrate 100. The electromagnetic shielding cover 200 can be divided inside according to the specific shape and number of the electromagnetic units on the substrate 100, and electromagnetic shielding and heat dissipation are performed on different electromagnetic units respectively. Ribs 220 are arranged at positions corresponding to the heat-conducting belts around the electromagnetic units 110 inside the electromagnetic shielding cover 200. When the electromagnetic shielding cover 200 covers the substrate, the ribs 220 are arranged corresponding to the heat-conducting belts 120 and abut against each other, so that the heat generated by the substrate 100 and the electromagnetic units 110 is conducted to the electromagnetic shielding cover 200 through the heat-conducting belts 120 and dissipated. Figure 4 This is a general structural diagram of the circuit board assembly 10 formed after the substrate 100 and the electromagnetic shielding cover 200 are assembled together. It can be seen that the assembled circuit board assembly 10 has a very compact structure.

[0046] As can be seen from the above, the embodiment of the present application sets the conductive belt 120 on the substrate 100, and sets the electromagnetic shielding cover 200 on the substrate 100 through the conductive belt 120. On the one hand, the electromagnetic shielding cover 200 can play a good electromagnetic shielding effect on the electromagnetic unit 110. At the same time, since the electromagnetic shielding cover is made of conductive material, it also has relatively good thermal conductivity, and it is directly connected to the substrate through the conductive belt. The heat generated by the electromagnetic unit and the substrate will be conducted to the electromagnetic shielding cover through the conductive belt. Since the electromagnetic shielding cover has a large heat dissipation area and has relatively good thermal conductivity, at this time, the electromagnetic shielding cover can conduct the heat generated by the electromagnetic unit and the substrate, achieving a better heat dissipation effect. In this way, the electromagnetic shielding cover is also used as a way to dissipate heat, and there is no need to reserve a special setting position, which reduces the volume of the circuit board assembly and also improves the heat dissipation effect.

[0047] In some embodiments, in order to reduce the volume of the circuit board and improve the integration, continue to refer to Figure 1 , Figure 2 and Figure 3 , a plurality of the electromagnetic units 110 are arranged on the substrate 100; the electromagnetic shielding cover 200 includes a plurality of electromagnetic shielding units 210, each of the electromagnetic shielding units 210 is arranged corresponding to each of the electromagnetic units 110, and adjacent electromagnetic shielding units are arranged in one piece.

[0048] Continue to refer to Figure 1, a plurality of electromagnetic units 110 are arranged on the substrate 100, such as a first electromagnetic unit 111 and a second electromagnetic unit 112, the first electromagnetic unit 111 and the second electromagnetic unit 112 are arranged adjacent to each other, and of course, a plurality of other electromagnetic units may also be included. Among them, on the substrate, the division of electromagnetic units is generally based on functions or device characteristics, for example: electronic devices with the same function that are more easily interfered by other units are divided together as one electromagnetic unit; electronic devices with the same function that are more likely to interfere with other units may also be divided together as one electromagnetic unit.

[0049] When a plurality of electromagnetic units 110 are disposed on the substrate 100, a plurality of electromagnetic shielding units 210 are also disposed on the electromagnetic shielding cover 200 accordingly. Figure 2 As shown, the first electromagnetic shielding unit 211 and the second electromagnetic shielding unit 212 are arranged at positions on the electromagnetic shielding cover 200 corresponding to the first electromagnetic unit 111 and the second electromagnetic unit 112 on the substrate, and the first rib position 221 and the second rib position 222 are arranged at the edge of the first electromagnetic shielding unit 211, wherein the rib position is a metal protrusion partition, which is used to enclose the four sides of the electromagnetic unit for electromagnetic shielding; the second rib position 222 and the third rib position 223 are arranged around the second electromagnetic shielding unit 212. Since the first electromagnetic shielding unit 211 and the second electromagnetic shielding unit 212 are adjacent, the same second rib position 222 can be set for them. Therefore, in practice, in order to improve the integration of the electromagnetic shielding cover 200 and reduce the volume of the circuit board, the adjacent electromagnetic shielding units can be set as a whole by sharing rib positions.

[0050] In some embodiments, in order to further improve the heat dissipation effect of the circuit board, such as Figure 2 and Figure 3 As shown, a heat sink 230 is separately provided on the circuit board assembly 10 . The heat sink 230 is fixedly connected to the substrate 100 and connected to the thermal conductive tape 120 , and is used to conduct heat from the substrate 100 and the electromagnetic unit 110 .

[0051] In the above embodiment, on the basis of heat dissipation through the electromagnetic shielding cover 200, a heat sink 230 may be provided on the substrate 100, and heat dissipation may continue to be performed through the heat sink 230. Figure 2 As shown, the heat sink 230 is arranged at a position on the substrate 100 where there is no electromagnetic unit, such as an L-shaped substrate. The heat sink 230 is arranged on the L-shaped edge of the substrate 100. The heat sink 230 is fixedly connected to the substrate 100 through the heat conducting belt 120, and can well conduct the heat of the substrate 100 and the electromagnetic unit 110. In this embodiment, heat is dissipated by the heat sink and the electromagnetic shielding cover at the same time, which greatly improves the heat dissipation effect of the circuit board assembly.

[0052] Furthermore, in some embodiments, Figure 2 As shown, the heat sink 230 can be integrally provided with the electromagnetic shielding unit 210. That is, the heat sink 230 and the electromagnetic shielding cover 200 are integrally formed to form a whole. When in use, the heat sink 230 and the electromagnetic shielding cover 200 can be simultaneously covered on the substrate 100. On the one hand, the installation is more convenient, which improves the integration of the electromagnetic shielding cover 200. On the other hand, the heat sink 230 and the electromagnetic shielding cover 200 are integrally formed, which also improves the heat dissipation effect.

[0053] Further, in order to improve the heat dissipation effect of the circuit board assembly, as Figure 5 As shown, a heat sink 231 is provided on the surface of the electromagnetic shielding cover 200 away from the substrate 100. That is, the heat sink 231 is provided on the other side of the electromagnetic shielding cover 200 covering the substrate 100. When the heat sink 230 and the electromagnetic shielding cover 200 are integrally formed, the heat sink 231 is spread over the surface of the heat sink 230 and the electromagnetic shielding cover 200. The heat sink 231 can further improve the heat dissipation effect of the electromagnetic shielding cover 200 and the heat sink 230.

[0054] In some embodiments of the present application, in order to reduce the production process of the circuit board assembly, the heat-conducting tape 120 is a copper-leaking area on the substrate. That is, during production and processing, the edge of the electromagnetic unit may not be coated with an insulating layer, and the copper in the substrate may be directly exposed as a heat-conducting tape. In this way, the production process of the circuit board is reduced, and there is no need to apply an additional heat-conducting tape on the surface of the substrate, thereby reducing the processing cost.

[0055] When the electromagnetic shielding cover 200 and the substrate 100 are assembled, the ribs are directly brought into contact with the copper leakage area. Threaded holes 240 may be provided on the substrate 100 and the electromagnetic shielding cover 200. Figure 2 As shown, the ribs can be fixed to the heat-conducting belt on the substrate by screws. Of course, in addition to being fixed by screws, conductive glue or conductive thermal grease can also be used to fix the copper leakage area, as long as the ribs can be tightly combined with the heat-conducting belt to transfer heat.

[0056] Furthermore, in order to improve the heat dissipation effect of the circuit board assembly, as Figure 2 and Figure 3 As shown, a boss 252 or a groove 251 is provided on the inner wall of the electromagnetic shielding unit 210 facing the electromagnetic unit 110 ; the boss 252 or the groove 251 is coated with thermal conductive gel and is in contact with the electromagnetic unit 110 .

[0057] In practical applications, since the shapes, sizes and heights of the electromagnetic units 110 arranged on the substrate 100 are not the same, for some electromagnetic units with higher heights, the corresponding electromagnetic shielding units need to be recessed toward the inner wall of the electromagnetic shielding cover to form a corresponding accommodation space; for some electromagnetic units with lower heights, the inner wall of the electromagnetic shielding unit corresponding to them needs to be raised toward the electromagnetic unit to form a corresponding boss; in order to improve the heat dissipation effect, the surface of the groove or boss needs to be in contact with the inner wall of the electromagnetic shielding unit, so as to improve the heat transfer effect. Therefore, in the embodiment of the present application, in order to improve the heat transfer effect, a thermal conductive gel can be coated on the boss 252 or the groove 251, and contact with the electromagnetic unit 110.

[0058] In summary, the embodiment of the present application sets a heat-conducting belt on the substrate, and sets the electromagnetic shielding cover on the substrate through the heat-conducting belt. On the one hand, the electromagnetic shielding cover can play a good electromagnetic shielding effect on the electromagnetic unit. On the other hand, because the electromagnetic shielding cover has a large heat dissipation area and has relatively good thermal conductivity, the electromagnetic shielding cover can conduct the heat generated by the electromagnetic unit and the substrate to achieve a better heat dissipation effect. On the third hand, by using the electromagnetic shielding cover as a way of heat dissipation, there is no need to reserve a special setting position, which reduces the volume of the circuit board assembly and improves the heat dissipation effect. At the same time, the heat dissipation effect of the circuit board assembly is further improved by setting a radiator, setting a heat sink on the surface of the electromagnetic shielding cover, and coating a thermal conductive gel in the boss or groove.

[0059] Furthermore, an embodiment of the present application also proposes an electronic device, which includes any circuit board assembly proposed in the above embodiments. The electronic device can be an anti-UAV device, an electromagnetic wave transmitting gun, or other electronic device that has high requirements for electromagnetic shielding and heat dissipation.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A circuit board assembly, characterized in that: including a substrate and an electromagnetic shield; An electromagnetic unit is arranged on the substrate, and a heat-conducting belt is arranged on the substrate at the edge of the electromagnetic unit; The electromagnetic shielding cover is arranged on the electromagnetic unit through the thermal conductive belt cover and is fixedly connected to the substrate, and is used for electromagnetically shielding the electromagnetic unit and conducting heat from the substrate and the electromagnetic unit through the thermal conductive belt.

2. The circuit board assembly according to claim 1, wherein: A plurality of the electromagnetic units are arranged on the substrate; the electromagnetic shielding cover includes a plurality of electromagnetic shielding units, each of the electromagnetic shielding units is arranged corresponding to each of the electromagnetic units, and adjacent electromagnetic shielding units are arranged in one piece.

3. The circuit board assembly according to claim 2, wherein: Also includes radiator; The heat sink is fixedly connected to the substrate and connected to the heat-conducting belt, and is used for conducting heat from the substrate and the electromagnetic unit.

4. The circuit board assembly according to claim 3, wherein: The heat sink is integrally arranged with the electromagnetic shielding unit.

5. The circuit board assembly according to claim 4, wherein: A heat sink is arranged on a surface of the electromagnetic shielding cover which is away from the substrate.

6. The circuit board assembly according to claim 1, wherein: The thermal conductive zone is a copper leakage area on the substrate.

7. The circuit board assembly according to claim 6, wherein: The electromagnetic shielding cover comprises a rib, and the rib is in contact with the copper leakage area.

8. The circuit board assembly according to claim 7, wherein: The rib is fixedly connected to the copper leakage area by means of screws, conductive glue or conductive thermal silicone grease material.

9. The circuit board assembly according to claim 2, wherein: A boss or a slot is arranged on the inner wall of the electromagnetic shielding unit on one side facing the electromagnetic unit; the boss or the slot is coated with a thermal conductive gel and is in contact with the electromagnetic unit.

10. An electronic device, characterized in that: Comprising a circuit board assembly as claimed in any one of claims 1 to 9.

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