Heat exchange structure and heating non-combustion device

Abstract

The utility model discloses a heat exchange structure and a heating non-combustion device. Belongs to the technical field of aerosol generating devices. In the heat exchange structure, the heating element is arranged on the outer side of the heat exchange core, and the glass glaze layer is arranged on the outer surface of the conductive substrate and used for electrically insulating the conductive substrate and the heating element, so that a stable electric insulation effect is achieved between the conductive substrate and the heating element, and short circuit of the heating element caused by electric connection between the heating element and the conductive substrate is avoided; and meanwhile, the heat conduction efficiency can be improved by utilizing the good heat conduction performance of the glass glaze, so that the conductive substrate more efficiently absorbs heat released by the heating element, and the gas flowing through the gas flow channel inside the conductive substrate is heated.

Description

Technical Field

[0001] The present application relates to the technical field of aerosol generating devices, and in particular to a heat exchange structure and a heating without combustion device. Background Art

[0002] The heat-not-burn device is a device that can heat and bake an aerosol-generating substrate to generate aerosol, and includes a heat exchange structure for heating the air entering the aerosol-generating substrate.

[0003] The heat exchange structure includes a heating element and a heat exchange core. The heating element is wrapped around the outside of the heat exchange core and heats the heat exchange core by resistive heating, so that the heat exchange core heats the gas flowing through it to form a hot air flow. The existing heat exchange core is made of aluminum alloy. Since aluminum alloy is conductive, the existing technology implements electrical insulation of the heating element by hard oxidation treatment of the heat exchange core to form an aluminum oxide film on the surface of the heat exchange core. However, since the aluminum oxide film is prone to cracks or even fall off, the electrical insulation between the heating element and the heat exchange core is prone to failure, resulting in a short circuit in the heating element. Utility Model Content

[0004] The main purpose of the present application is to provide a heat exchange structure and a heating without combustion device to solve the problem of easy failure of electrical insulation between the heat exchange core and the heating element in the prior art.

[0005] According to one aspect of the present application, a heat exchange structure is provided, including a heating element and a heat exchange core, wherein the heating element is arranged on the outside of the heat exchange core, and the heat exchange core includes a conductive substrate and a glass glaze layer, wherein the glass glaze layer is coated on the outer surface of the conductive substrate to electrically insulate the conductive substrate and the heating element, and the conductive substrate is structured to form an air flow channel, and the conductive substrate is configured to absorb heat released by the heating element to heat the gas flowing through the air flow channel.

[0006] Furthermore, the conductive substrate has a columnar structure, and the conductive substrate includes an air inlet end and an air outlet end relatively arranged, the air flow channel penetrates the conductive substrate along the direction from the air inlet end to the air outlet end, the glass glaze layer is plated on the outer surface of the conductive substrate along the direction from the air inlet end to the air outlet end, and the heating element is attached to the outside of the glass glaze layer.

[0007] Furthermore, the conductive substrate has a first flange and a second flange, the first flange is arranged close to the air inlet end, the second flange is arranged close to the air outlet end, and the first flange and the second flange are spaced apart and define a limiting groove, and the heating element is limited in the limiting groove.

[0008] Furthermore, the heating element is connected to two electrode pins, and the two electrode pins are respectively located on one side of the heating element close to the conductive substrate;

[0009] The conductive substrate is constructed to have two spaced-apart receiving spaces along the direction from the air inlet end to the air outlet end, the two receiving spaces are respectively connected to the limiting grooves, each of the receiving spaces is used to receive an electrode pin, and one end of each of the receiving spaces passes through the air inlet end so that the electrode pin received in the receiving space extends out of the conductive substrate from the air inlet end.

[0010] Further, each of the receiving spaces comprises a limiting groove, a receiving groove and a blind hole, the receiving groove is connected between the limiting groove and the blind hole, and is located between the first flange and the second flange, the limiting groove is located at the first flange, and one end of the limiting groove away from the receiving groove passes through the air inlet end;

[0011] Each of the electrode pins comprises a first section, a second section, a third section and a fourth section connected in sequence, the first section is inserted into the blind hole, the second section is received in the receiving groove, the third section is limited in the limiting groove, and the fourth section extends out of the conductive substrate.

[0012] Further, the conductive substrate structure is formed with a first annular protrusion, the first annular protrusion is located at the gas outlet end and protrudes from the gas outlet end in a direction away from the gas inlet end, and the first annular protrusion and the gas outlet end define a convergence cavity;

[0013] The conductive substrate is structured to form a plurality of independent airflow channels along the air inlet end to the air outlet end, and the plurality of airflow channels are respectively connected to the converging cavity.

[0014] Furthermore, the heat exchange structure includes a mounting tube, and a second ring protrusion is formed radially inwardly at the middle position of the inner wall of the mounting tube, and the second ring protrusion divides the mounting tube into a first receiving cavity and a second receiving cavity that are interconnected, the conductive substrate is received in the first receiving cavity, and the first ring protrusion is located in the second ring protrusion and does not extend out of the second ring protrusion, and the second receiving cavity can be used to receive a matrix segment of an aerosol generating matrix.

[0015] Furthermore, the second ring protrusion includes a first ring end surface and a second ring end surface, the first ring end surface faces the first receiving cavity, and the second ring end surface faces the second receiving cavity;

[0016] The first annular protrusion is connected to the first end face of the second flange away from the first flange and has a third annular end face, and the diameter of the second flange is larger than the inner diameter of the second annular protrusion so that the first end face and the first annular end face abut against each other, and the third annular end face does not extend out of the second annular end face.

[0017] Furthermore, the first flange is located at the opening of the first receiving cavity, and the diameter of the first flange is smaller than the inner diameter of the corresponding opening of the first receiving cavity, so that there is a gap between the first flange and the mounting tube, and the gap is used to inject a curable filling layer into the first receiving cavity.

[0018] On the other hand, the present application also provides a heating without combustion device, which includes a shell, a power supply component and a heat exchange structure as described above, wherein the heat exchange structure is arranged in the shell, and the heat generating element of the heat exchange structure is electrically connected to the power supply component.

[0019] In the heat exchange structure of the present application, the heating element is arranged on the outside of the heat exchange core, and a glass glaze layer is provided on the outer surface of the conductive substrate to electrically insulate the conductive substrate and the heating element, so that a stable electrical insulation effect is achieved between the conductive substrate and the heating element to avoid electrical connection between the heating element and the conductive substrate causing a short circuit in the heating element. At the same time, the good thermal conductivity of the glass glaze can be utilized to improve the thermal conductivity efficiency, so that the conductive substrate can more efficiently absorb the heat released by the heating element and heat the gas in the air flow channel flowing through it. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0021] Figure 1 It is an overall schematic diagram of the heat exchange structure in one embodiment disclosed in the present application.

[0022] Figure 2 It is an exploded diagram of a heat exchange structure in an embodiment disclosed in the present application.

[0023] Figure 3 It is a cross-sectional view of a heat exchange structure in one embodiment disclosed in the present application.

[0024] Figure 4 It is a cross-sectional view from another perspective of the heat exchange structure in one embodiment disclosed in the present application.

[0025] Figure 5 It is a schematic diagram of a conductive substrate in an embodiment disclosed in the present application.

[0026] Figure 6 It is a cross-sectional view of a conductive substrate in one embodiment disclosed in the present application.

[0027] Figure 7 It is a cross-sectional view of a mounting tube in one embodiment disclosed in the present application.

[0028] Figure 8 Schematic diagram of a heat-not-burn device with an aerosol-generating substrate inserted in one embodiment disclosed in the present application.

[0029] Fig. 9 It is a cross-sectional view of a heat-not-burn device with an aerosol-generating substrate inserted in one embodiment disclosed in the present application.

[0030] Fig.10 It is a cross-sectional view of a heating without burning device in one embodiment disclosed in the present application.

[0031] The above drawings include the following reference numerals:

[0032] Heat exchange structure 100, heating element 10, electrode pin 11, first section 111, second section 112, third section 113, fourth section 114, heat exchange core 20, conductive substrate 21, air flow channel 211, air inlet end 212, air outlet end 213, central axis 214, first flange 215, second flange 216, second guide inclined surface 2161, limiting groove 217, receiving space 218, limiting groove 2181, receiving groove 218 2, blind hole 2183, first ring protrusion 219, converging cavity 2191, third ring end face 2192, glass glaze layer 22, mounting tube 30, second ring protrusion 31, first ring end face 311, second ring end face 312, inner ring surface 313, first receiving cavity 32, first guide slope 321, second receiving cavity 33, filling layer 40, heating without burning device 200, outer shell 210, power supply component 220, aerosol generating matrix 300. DETAILED DESCRIPTION

[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0035] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0036] See also Figure 1-7 As shown, the present application provides a heat exchange structure 100, which is used to heat air at room temperature to form a hot air flow for baking an aerosol generating substrate 300 to form an aerosol.

[0037] The heat exchange structure 100 includes a heating element 10 and a heat exchange core 20. The heating element 10 is disposed outside the heat exchange core 20, and the heat exchange core 20 is configured to absorb the heat generated by the heating element 10 when working to heat the air passing through it to a preset temperature to form the hot air flow.

[0038] Furthermore, the heat exchange core 20 includes a conductive substrate 21 and a glass glaze layer 22 , and the glass glaze layer 22 is coated on the outer surface of the conductive substrate 21 to electrically insulate the conductive substrate 21 and the heating element 10 .

[0039] The conductive substrate 21 is structured to form an air flow channel 211 , and the conductive substrate 21 is configured to absorb the heat released by the heating element 10 to heat the gas flowing through the air flow channel 211 .

[0040] The heat exchange structure 100 is made simpler by adopting the resistance heating method. And by providing the glass glaze layer 22 on the outer surface of the conductive substrate 21, not only can the stable electrical insulation effect between the heating element 10 and the conductive substrate 21 be achieved, but also the short circuit of the heating element 10 caused by the electrical connection between the heating element 10 and the conductive substrate 21 can be avoided. At the same time, the good thermal conductivity of the glass glaze can be used to improve the thermal conductivity efficiency, so that the conductive substrate 21 can absorb the heat released by the heating element 10 more efficiently, and heat the gas flowing through the air flow channel 211 to form the hot air flow.

[0041] Furthermore, the conductive substrate 21 is a columnar structure, and includes an air inlet end 212 and an air outlet end 213 that are oppositely arranged. The air flow channel 211 penetrates the conductive substrate 21 along the direction from the air inlet end 212 to the air outlet end 213 .

[0042] Preferably, the conductive substrate 21 is substantially cylindrical in structure, and the air flow channel 211 is arranged parallel to the central axis 214 of the conductive substrate 21 .

[0043] Furthermore, the glass glaze layer 22 is plated on the outer surface of the conductive substrate 21 along the direction from the air inlet end 212 to the air outlet end 213, and the heating element 10 is attached to the outer side of the glass glaze layer 22. Thus, the conductive substrate 21 and the heating element 10 are electrically insulated, and the heat conduction distance between the heating element 10 and the conductive substrate 21 is short, and the efficiency is high.

[0044] In some embodiments, the heating element 10 may be a resistive heating material such as a heating net, a heating sheet, etc. Preferably, the heating net or the heating sheet is coated on the outer side of the glass glaze layer 22 .

[0045] In some other embodiments, the heating element 10 may also be a resistance heating wire, and the resistance heating wire is wound around the outer side of the glass glaze layer 22 .

[0046] Preferably, the conductive substrate 21 is made of aluminum alloy material, and the thermal expansion coefficient of the glass glaze layer 22 is close to that of the conductive substrate 21. When the glass glaze layer 22 and the conductive substrate 21 absorb the heat emitted by the heating element 10, the generation of thermal stress can be effectively reduced, thereby reducing the risk of cracks in the glass glaze layer 22 and electrical insulation failure caused by thermal stress.

[0047] Furthermore, the glass glaze layer 22 is plated on the outer surface of the conductive substrate 21 and is sintered at a high temperature of more than 500 degrees Celsius.

[0048] Furthermore, the thickness of the glass glaze layer 22 is 20 μm-40 μm. By controlling the thickness of the glass glaze layer 22 within a range of tens of microns, its electrical insulation performance and thermal conductivity can be ensured.

[0049] In some embodiments, the thickness of the glass glaze layer 22 is 20 μm. In other embodiments, the thickness of the glass glaze layer 22 is 40 μm.

[0050] Furthermore, the conductive substrate 21 has a first flange 215 and a second flange 216. The first flange 215 is close to the air inlet end 212, the second flange 216 is close to the air outlet end 213, and the first flange 215 and the second flange 216 are spaced apart and define a limiting groove 217, and the heating element 10 is limited in the limiting groove 217.

[0051] Furthermore, the heating element 10 is connected to two electrode pins 11, and the two electrode pins 11 are respectively located on one side of the heating element 10 close to the conductive substrate 21. The conductive substrate 21 is structured to form two spaced accommodation spaces 218 along the direction from the air inlet end 212 to the air outlet end 213, and the two accommodation spaces 218 are respectively connected to the limiting groove 217.

[0052] Furthermore, each of the receiving spaces 218 is used to receive an electrode pin 11, and one end of each of the receiving spaces 218 passes through the air inlet end 212, so that the electrode pin 11 received in the receiving space 218 can extend from the air inlet end 212 to the conductive substrate 21 and be connected to the power supply element.

[0053] By providing the accommodation space 218 on the conductive substrate 21 for accommodating the electrode pin 11, the electrode pin 11 can be built into the side of the heating element 10 close to the conductive substrate 21 and hidden in the conductive substrate 21, thereby accommodating and positioning the electrode pin 11, and at the same time, the electrical connection part between the electrode pin 11 and the heating element 10 can be effectively protected to improve the stability of the electrical connection.

[0054] Furthermore, each of the receiving spaces 218 respectively includes a limiting groove 2181, a receiving groove 2182 and a blind hole 2183, and the receiving groove 2182 is connected between the limiting groove 2181 and the blind hole 2183, and is located between the first flange 215 and the second flange 216, so that the receiving groove 2182 is connected with the limiting groove 217, thereby facilitating the electrical connection between the electrode pin 11 and the heating element 10.

[0055] The limiting groove 2181 is located at the first flange 215, and one end of the limiting groove 2181 away from the receiving groove 2182 passes through the air inlet end 212. When the electrode pin 11 is disposed in the receiving space, the portion of the electrode pin 11 corresponding to the limiting groove 2181 is limited in the limiting groove 2181, so that the electrode pin 11 cannot be separated from the limiting groove 2181 outwardly along the radial direction of the conductive substrate 21.

[0056] The blind hole 2183 is located at the second flange 216 , and one end of the electrode pin 11 can be inserted into the blind hole 2183 to limit the end of the electrode pin 11 inserted into the conductive substrate 21 .

[0057] Further, each of the electrode pins 11 includes a first section 111, a second section 112, a third section 113 and a fourth section 114 connected in sequence. The first section 111 is inserted into the blind hole 2183, the second section 112 is received in the receiving groove 2182, the third section 113 is limited in the limiting groove 2181, and the fourth section 114 extends out of the conductive substrate 21. Therefore, the first section 111 is limited by the blind hole 2183 and the third section 113 is limited by the limiting groove 2181 so that the electrode pin 11 is limited in the receiving space 218.

[0058] Furthermore, the conductive substrate 21 is structured to form a plurality of independent airflow channels 211 from the air inlet end 212 to the air outlet end 213. The conductive substrate 21 is structured to form a first annular protrusion 219, which is located at the air outlet end 213 and protrudes from the air outlet end 213 in a direction away from the air inlet end 212, and the first annular protrusion 219 and the air outlet end 213 define a convergence cavity 2191.

[0059] The plurality of airflow channels 211 are respectively connected to the converging chamber 2191 so that the hot airflow formed by heating in each of the airflow channels 211 converges in the converging chamber 2191 and then moves toward the aerosol generating substrate 300 .

[0060] By setting the first ring protrusion 219, not only can the hot air flow be converged, so that the converged hot air flow can evenly move toward the entrance end of the aerosol generating matrix 300 and enter the aerosol generating matrix 300, and thereby the matrix part in the aerosol generating matrix 300 can be evenly baked by hot air flow; the end face of the first ring protrusion 219 away from the air inlet end 212 can also be used to limit the end face of the entrance end of the aerosol generating matrix 300, so as to avoid the end face of the entrance end of the aerosol generating matrix 300 blocking the air outlet ends 213 corresponding to each of the multiple airflow channels 211, resulting in the hot air flow being difficult to smoothly and evenly enter the aerosol generating matrix 300.

[0061] Furthermore, in one embodiment, the heat exchange structure 100 includes a mounting tube 30, and a second annular protrusion 31 is formed radially inwardly at the middle of the inner side wall of the mounting tube 30. The second annular protrusion 31 divides the mounting tube 30 into a first receiving cavity 32 and a second receiving cavity 33 that are interconnected.

[0062] The conductive substrate 21 is received in the first receiving cavity 32, and the first annular protrusion 219 is located in the second annular protrusion 31 and does not extend out of the second annular protrusion 31. The second receiving cavity 33 can be used to receive the substrate segment of the aerosol generating substrate 300. The first annular protrusion 219 can cooperate with the second annular protrusion 31 to limit the end surface of the substrate segment.

[0063] Furthermore, the second ring protrusion 31 includes a first ring end face 311, a second ring end face 312 and an inner ring surface 313, the first ring end face 311 faces the first receiving cavity 32, the second ring end face 312 faces the second receiving cavity 33, the inner ring surface 313 is between the first ring end face 311 and the second ring end face 312, and the first ring protrusion 219 is received in the second ring protrusion 31 corresponding to the inner ring surface 313.

[0064] The first ring protrusion 219 is connected to a first end surface of the second flange 216 away from the first flange 215 and has a third ring end surface 2192 . The third ring end surface 2192 does not extend out of the second ring end surface 312 .

[0065] The diameter of the second flange 216 is larger than the inner diameter of the second ring protrusion 31 so that the first end face and the first ring end face 311 abut against each other, so that when the heat exchange core 20 is arranged in the first receiving cavity 32, the first end face and the first ring end face 311 can be limited by the mutual abutment.

[0066] Furthermore, the first flange 215 is located at the opening of the first receiving cavity 32, and the diameter of the first flange 215 is smaller than the inner diameter of the corresponding opening of the first receiving cavity 32, so that there is a gap between the first flange 215 and the inner wall corresponding to the mounting tube 30, and the gap is used to inject a curable filling layer 40 into the first receiving cavity 32.

[0067] Furthermore, the curable filling layer 40 has an insulating property, so as to achieve insulation between the heating element 10 and the mounting tube 30. For example, the curable filling layer 40 may be made of ceramic glue or silica gel.

[0068] Preferably, the curable filling layer 40 is ceramic glue, which is injected into the first receiving cavity 32 through the gap in a fluid state and fills the limiting groove 217, and adheres to the inner wall of the mounting tube 30 corresponding to the first receiving cavity 32, so that the heating element 10 can be further fixed in the limiting groove 217 after the ceramic glue is cured, and the heat generated by the heating element 10 during operation can be effectively blocked, so that the heat generated by the heating element 10 during operation can be more conducted toward the conductive substrate 21.

[0069] Furthermore, in the first embodiment, the second flange 216 and the inner wall of the first receiving cavity 32 can be sealed and connected via the filling layer 40 .

[0070] Preferably, in the second embodiment, the second flange 216 is interference-connected with the corresponding inner wall of the first receiving cavity 32 .

[0071] Further, the inner wall of the first receiving cavity 32 near the second annular protrusion 31 is formed with an annular first guide bevel 321 corresponding to the outer wall structure of the second flange 216, and the inner diameter of the inner wall of the first receiving cavity 32 between the first guide bevel 321 and the second annular protrusion 31 is smaller than the diameter of the second flange 216. So that the conductive substrate 21 is installed on the first and second flanges 216, an annular second guide bevel 2161 is provided corresponding to the first guide bevel 321. The first guide bevel 321 and the second guide bevel 2161 are provided to facilitate interference connection between the second flange 216 and the first receiving cavity 32.

[0072] On the other hand, see Figure 8-10 Combined with Figure 1-7 As shown, the present application also provides a heating without burning device 200, which includes a housing 210, a power supply assembly 220, and any one of the above-mentioned heat exchange structures 100. Therefore, the heating without burning device 200 has the beneficial effects of any one of the above-mentioned heat exchange structures 100, which will not be repeated here.

[0073] Furthermore, the heat exchange structure 100 is disposed inside the housing 210, and the heating element 10 of the heat exchange structure 100 is electrically connected to the power supply assembly 220, and the power supply assembly 220 is used to provide electrical energy to the heating element 10 so that the heating element 10 works and generates heat.

[0074] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0075] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0076] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat exchange structure, characterized in that: It includes a heating element and a heat exchange core, the heating element is arranged on the outside of the heat exchange core, the heat exchange core includes a conductive substrate and a glass glaze layer, the glass glaze layer is coated on the outer surface of the conductive substrate to electrically insulate the conductive substrate and the heating element, the conductive substrate is structured to form an air flow channel, and the conductive substrate is configured to absorb heat released by the heating element to heat the gas flowing through the air flow channel.

2. The heat exchange structure according to claim 1, characterized in that: The conductive substrate has a columnar structure, and the conductive substrate includes an air inlet end and an air outlet end relatively arranged, the air flow channel penetrates the conductive substrate along the direction from the air inlet end to the air outlet end, the glass glaze layer is plated on the outer surface of the conductive substrate along the direction from the air inlet end to the air outlet end, and the heating element is attached to the outside of the glass glaze layer.

3. The heat exchange structure according to claim 2, characterized in that: The conductive substrate has a first flange and a second flange, the first flange is arranged close to the air inlet end, the second flange is arranged close to the air outlet end, and the first flange and the second flange are spaced apart and define a limiting groove, and the heating element is limited in the limiting groove.

4. The heat exchange structure according to claim 3, characterized in that: The heating element is connected to two electrode pins, and the two electrode pins are respectively located on one side of the heating element close to the conductive substrate; The conductive substrate is constructed to have two spaced-apart receiving spaces along the direction from the air inlet end to the air outlet end, the two receiving spaces are respectively connected to the limiting grooves, each of the receiving spaces is used to receive an electrode pin, and one end of each of the receiving spaces passes through the air inlet end so that the electrode pin received in the receiving space extends out of the conductive substrate from the air inlet end.

5. The heat exchange structure according to claim 4, characterized in that: Each of the receiving spaces comprises a limiting groove, a receiving groove and a blind hole, the receiving groove is connected between the limiting groove and the blind hole, and is located between the first flange and the second flange, the limiting groove is located at the first flange, and one end of the limiting groove away from the receiving groove passes through the air inlet end; Each of the electrode pins comprises a first section, a second section, a third section and a fourth section connected in sequence, the first section is inserted into the blind hole, the second section is received in the receiving groove, the third section is limited in the limiting groove, and the fourth section extends out of the conductive substrate.

6. The heat exchange structure according to any one of claims 3 to 5, characterized in that: The conductive substrate is structured to form a first annular protrusion, the first annular protrusion is located at the gas outlet end and protrudes from the gas outlet end in a direction away from the gas inlet end, and the first annular protrusion and the gas outlet end define a convergence cavity; The conductive substrate is structured to form a plurality of independent airflow channels along the air inlet end to the air outlet end, and the plurality of airflow channels are respectively connected to the converging cavity.

7. The heat exchange structure according to claim 6, characterized in that: The heat exchange structure includes a mounting tube, and a second ring protrusion is formed radially inward at the middle position of the inner wall of the mounting tube. The second ring protrusion divides the mounting tube into a first receiving cavity and a second receiving cavity that are interconnected. The conductive substrate is received in the first receiving cavity, and the first ring protrusion is located in the second ring protrusion and does not extend out of the second ring protrusion. The second receiving cavity can be used to receive a matrix segment of an aerosol generating matrix.

8. The heat exchange structure according to claim 7, characterized in that: The second ring protrusion includes a first ring end surface and a second ring end surface, the first ring end surface faces the first receiving cavity, and the second ring end surface faces the second receiving cavity; The first annular protrusion is connected to the first end face of the second flange away from the first flange and has a third annular end face, and the diameter of the second flange is larger than the inner diameter of the second annular protrusion so that the first end face and the first annular end face abut against each other, and the third annular end face does not extend out of the second annular end face.

9. The heat exchange structure according to claim 7, characterized in that: The first flange is located at the opening of the first receiving cavity, and the diameter of the first flange is smaller than the inner diameter of the corresponding opening of the first receiving cavity, so that there is a gap between the first flange and the mounting tube, and the gap is used to inject a curable filling layer into the first receiving cavity.

10. A heat-not-burn device, characterized in that: It comprises a shell, a power supply component and the heat exchange structure according to any one of claims 1 to 9, wherein the heat exchange structure is arranged in the shell, and the heat generating element of the heat exchange structure is electrically connected to the power supply component.

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