Miniature PCB automatic welding equipment

Abstract

The utility model relates to the technical field of automatic welding equipment, in particular to miniature PCB automatic welding equipment which comprises a tray feeding channel and a PCB feeding channel, a first clamping device is arranged between the tray feeding channel and the PCB feeding channel, a welding device is arranged on the side of the PCB feeding channel, and a second clamping device is arranged on the side of the PCB feeding channel. A second clamping device and a finished product detection device are arranged at the tail end of the PCB feeding channel, a feeding bin frame and a feeding position are arranged at the front end of the material disc feeding channel, and a material receiving position and a material receiving bin frame are arranged at the tail end of the material disc feeding channel. According to the utility model, a plurality of processes such as automatic feeding, conveying, welding, finished product detection and receiving of the miniature PCBs can be realized, the welding efficiency is improved, the welded products are completely detected, the yield is ensured, and meanwhile, parameters during operation are stored so as to be convenient for later traceability.

Description

Technical Field

[0001] The utility model relates to the technical field of automatic welding equipment, in particular to a micro PCB board automatic welding equipment. Background Art

[0002] The PCB board welding process is the most important link in the PCB board processing technology. Its welding accuracy and welding quality are directly related to the yield rate of the PCB board. At present, the more common welding methods include manual welding. With the huge market of consumer electronic products, the demand for micro PCB boards is increasing. Generally, manual welding has low efficiency, low welding accuracy and quality, which seriously affects the quality of shipment.

[0003] Therefore, a kind of micro PCB board automatic welding equipment is badly needed. Utility Model Content

[0004] The purpose of the utility model is to provide a micro PCB board automatic welding equipment to address the deficiencies of the prior art. The utility model can realize multiple processes of automatic loading, material transfer, welding, finished product detection and material collection of micro PCB boards, improve welding efficiency, conduct 100% detection of welding products, ensure the yield rate, and save the parameters during operation for later traceability.

[0005] The utility model is realized through the following technical scheme: a micro PCB board automatic welding device, comprising a tray feeding channel and a PCB board feeding channel, a first clamping device is arranged between the tray feeding channel and the PCB board feeding channel, a welding device is arranged on the side of the PCB board feeding channel, a second clamping device and a finished product detection device are arranged at the end of the PCB board feeding channel, a loading bin rack and a loading position are arranged at the front end of the tray feeding channel, and a receiving position and a receiving bin rack are arranged at the end of the tray feeding channel.

[0006] Preferably, the first clamping device includes a first movable plate, a first driving mechanism for driving the first movable plate to rise and fall along the Z axis, and a second driving mechanism for driving the first movable plate to move along the Y axis. A first fixed plate is provided at the lower end of the first movable plate, and the first fixed plate is provided with a plurality of suction cups.

[0007] Preferably, the first movable plate is also provided with a CCD positioning camera.

[0008] Preferably, the welding device includes a precision welder, a third driving mechanism for driving the precision welder to rise and fall along the Z-axis, and a fourth driving mechanism for driving the precision welder to move along the Y-axis. A tin wire pay-off mechanism is provided at the rear end of the precision welder, and the tin wire pay-off mechanism includes a pay-off wheel, and a cam actuator assembly, a wire transmission wheel assembly and a wire cutter are provided below the pay-off wheel.

[0009] Preferably, the second clamping device includes a second movable plate, a fifth driving mechanism for driving the second movable plate to rise and fall along the Z axis, and a sixth driving mechanism for driving the second movable plate to move along the Y axis. A second fixed plate is provided at the lower end of the second movable plate, and the second fixed plate is provided with a plurality of suction cups.

[0010] Preferably, the finished product detection device comprises a detection carrier and a seventh driving mechanism for driving the detection carrier to move along the X-axis, and a CCD detection module and a resistance detection module are arranged beside the detection carrier.

[0011] Preferably, the PCB board feeding channel includes a feeding conveying track, a first feeding carrier lifting mechanism is arranged at the front end of the feeding conveying track, a second feeding carrier lifting mechanism is arranged at the end of the feeding conveying track, and a carrier return conveying track is arranged directly below the feeding conveying track.

[0012] The beneficial effects of the utility model are as follows: the material tray feeding channel and the PCB board feeding channel are arranged in parallel, and the material tray filled with micro PCB boards is manually placed in the upper bin rack, and the material tray at the bottom of the upper bin rack will flow to the loading position, at which time the first clamping device will grab the micro PCB board in the material tray and put it into the carrier of the PCB board feeding channel, and the micro PCB board will begin to be sent to the welding device for welding, at which time, the empty material tray on the material tray feeding channel flows to the receiving position at the end; after the welding is completed, the micro PCB board is conveyed to the second clamping device, and the first clamping device is used to hold the micro PCB board in the material tray. The second clamping device clamps the micro PCB board to the finished product detection device for good product detection. After the detection is completed, the second clamping device clamps the good micro PCB board to the empty material tray on the receiving position, and then the material tray flows into the receiving bin rack and is stacked into a stack. After the receiving bin rack is full, the material tray is taken away manually. The utility model can realize multiple processes of automatic loading, material transfer, welding, finished product detection and receiving of micro PCB boards, improve welding efficiency, 100% detect welding products, ensure the yield rate, and save the parameters during operation for easy traceability in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0014] Figure 2 It is a schematic diagram of the three-dimensional structure of the first clamping device of the utility model.

[0015] Figure 3 It is a three-dimensional structural schematic diagram of the welding device of the utility model.

[0016] Figure 4 for Figure 3 Schematic diagram of the enlarged structure at point A in the middle.

[0017] Figure 5It is a schematic diagram of the three-dimensional structure of the second clamping device of the utility model.

[0018] Figure 6 It is a three-dimensional structural schematic diagram of the finished product detection device of the utility model.

[0019] Figure 7 It is a three-dimensional structural schematic diagram of the PCB board feeding channel of the utility model. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1 To Attachment Figure 7 , and specific implementation methods are further described to further illustrate the utility model.

[0021] like Figure 1 As shown, a micro PCB board automatic welding equipment comprises a tray feeding channel 1 and a PCB board feeding channel 2, a first clamping device 3 is arranged between the tray feeding channel 1 and the PCB board feeding channel 2, a welding device 4 is arranged beside the PCB board feeding channel 2, a second clamping device 5 and a finished product detection device 6 are arranged at the end of the PCB board feeding channel 2, a loading bin rack 11 and a loading position 12 are arranged at the front end of the tray feeding channel 1, and a receiving position 13 and a receiving bin rack 14 are arranged at the end of the tray feeding channel 1.

[0022] In this embodiment, the tray feeding channel 1 and the PCB board feeding channel 2 are arranged in parallel. The tray filled with micro PCB boards is manually placed in the upper bin rack 11. The bottom tray in the upper bin rack 11 will flow to the loading position 12. At this time, the first clamping device 3 will grab the micro PCB board in the tray and put it into the carrier of the PCB board feeding channel 2. The micro PCB board begins to be sent to the welding device welding device 4 for welding. At this time, the empty tray on the tray feeding channel 1 flows to the receiving position 13 at the end; after the welding is completed, the micro PCB board is conveyed to the second clamping device 5, and the second The clamping device 5 clamps the micro PCB board to the finished product detection device 6 for good product detection. After the detection is completed, the second clamping device 5 clamps the good micro PCB board to the empty material tray on the receiving position 13, and then the material tray flows into the receiving bin rack 14 and is stacked into a stack. After the receiving bin rack 14 is full, the material tray is taken away manually. The utility model can realize multiple processes of automatic loading, transferring, welding, finished product detection and receiving of micro PCB boards, improve welding efficiency, 100% detect welding products, ensure the yield rate, and save the parameters during operation for easy traceability later.

[0023] like Figure 2As shown, in this embodiment, the first clamping device 3 includes a first movable plate 31, a first driving mechanism 32 for driving the first movable plate 31 to rise and fall along the Z axis, and a second driving mechanism 33 for driving the first movable plate 31 to move along the Y axis. A first fixed plate 34 is provided at the lower end of the first movable plate 31. The first fixed plate 34 is provided with a plurality of suction cups 7. The suction cups 7 of the first fixed plate 34 are positioned by the first driving mechanism 32 and the second driving mechanism 33, and the micro PCB board is grabbed into the carrier of the PCB board feeding channel 2; the first driving mechanism 32 and the second driving mechanism 33 of the utility model are linear transmission mechanisms such as screw transmission or linear cylinder transmission.

[0024] In this embodiment, the first movable plate 31 is further provided with a CCD positioning camera 35 for locating the position of the carrier on the PCB board feeding channel 2 to ensure that the micro PCB board can be accurately placed in the carrier.

[0025] like Figure 3 to Figure 4 As shown, in this embodiment, the welding device 4 includes a precision welder 41, a third driving mechanism 42 for driving the precision welder 41 to rise and fall along the Z axis, and a fourth driving mechanism 43 for driving the precision welder 41 to move along the Y axis. A tin wire pay-off mechanism 44 is provided at the rear end of the precision welder 41. The tin wire pay-off mechanism 44 includes a pay-off wheel 441. A cam actuator component 442, a wire transfer wheel component 444 and a wire cutter 443 are provided below the pay-off wheel 441. When the micro PCB board is transferred to the welding device 4, the pay-off wheel 441 starts to pay off the wire, and the cam actuator component 442 performs pressing, loosening, and clamping on the tin wire. Wire action; the wire transfer wheel assembly 444 performs the wire transfer action, which can ensure the positioning accuracy of the wire feeding and shorten the cycle time; then, the precision welder 41 accurately positions the solder joint through the third drive mechanism 42 and the fourth drive mechanism 43, and solders the tin wire to the micro PCB board, and then the wire cutter 443 cuts the tin wire. The internal welding head of the precision welder 41 of the utility model can achieve precise temperature control, rapid temperature recovery, and real-time feedback of the temperature of the welding point to ensure that the welding effect can meet customer needs; the third drive mechanism 42 and the fourth drive mechanism 43 of the utility model are linear drive mechanisms such as screw drive or linear cylinder drive.

[0026] like Figure 5 As shown, in this embodiment, the second clamping device 5 includes a second movable plate 51, a fifth driving mechanism 52 for driving the second movable plate 51 to rise and fall along the Z axis, and a sixth driving mechanism 53 for driving the second movable plate 51 to move along the Y axis. A second fixed plate 54 is provided at the lower end of the second movable plate 51, and the second fixed plate 54 is provided with a plurality of suction cups 7. The second clamping device 5 of this embodiment has the same operating principle as the first clamping device 3.

[0027] like Figure 6 As shown, in this embodiment, the finished product inspection device 6 includes an inspection carrier 61 and a seventh driving mechanism 62 for driving the inspection carrier 61 to move along the X-axis. A CCD inspection module 63 and a resistance inspection module 64 are arranged on the side of the inspection carrier 61. The welding appearance and the position of the solder joint are inspected by the CCD inspection module 63, and the resistance after welding is inspected by the resistance inspection module 64. The products that pass the inspection are captured by the second clamping device 5 and put into the material tray, and the defective products are captured into the waste box.

[0028] like Figure 7 As shown, in this embodiment, the PCB board feeding channel 2 includes a feeding conveying track 21, a first feeding carrier lifting mechanism 22 is provided at the front end of the feeding conveying track 21, a second feeding carrier lifting mechanism 23 is provided at the end of the feeding conveying track 21, and a carrier return conveying track 24 is provided directly below the feeding conveying track 21. First, the first feeding carrier lifting mechanism 22 lifts the carrier to the material conveying track 21 to wait for loading the micro PCB board. After the first clamping device 3 clamps the micro PCB board onto the carrier, the material conveying track 21 starts to convey the material. After the welding is completed, the second clamping device 5 clamps the micro PCB board away, and the empty carrier moves to the second feeding carrier lifting mechanism 23, descends to the carrier return conveying track 24 through the second feeding carrier lifting mechanism 23, and then moves to the first feeding carrier lifting mechanism 22 through the carrier return conveying track 24, waiting for loading again, forming a cycle of carrier discharge and collection, thereby improving the efficiency of automatic material transmission.

[0029] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A micro PCB board automatic welding equipment, characterized by: It includes a tray feeding channel and a PCB board feeding channel, a first clamping device is arranged between the tray feeding channel and the PCB board feeding channel, a welding device is arranged beside the PCB board feeding channel, a second clamping device and a finished product detection device are arranged at the end of the PCB board feeding channel, a loading bin rack and a loading position are arranged at the front end of the tray feeding channel, and a receiving position and a receiving bin rack are arranged at the end of the tray feeding channel.

2. The micro PCB automatic welding equipment according to claim 1 is characterized in that: The first clamping device includes a first movable plate, a first driving mechanism for driving the first movable plate to rise and fall along the Z axis, and a second driving mechanism for driving the first movable plate to move along the Y axis. A first fixed plate is provided at the lower end of the first movable plate, and the first fixed plate is provided with a plurality of suction cups.

3. The micro PCB automatic welding equipment according to claim 2 is characterized in that: The first movable plate is also provided with a CCD positioning camera.

4. The micro PCB automatic soldering equipment according to claim 1, characterized in that: The welding device includes a precision welder, a third driving mechanism for driving the precision welder to rise and fall along the Z axis, and a fourth driving mechanism for driving the precision welder to move along the Y axis. A tin wire pay-off mechanism is provided at the rear end of the precision welder. The tin wire pay-off mechanism includes a pay-off wheel, and a cam actuator assembly, a wire transmission wheel assembly and a wire cutter are provided below the pay-off wheel.

5. The micro PCB automatic soldering equipment according to claim 1 is characterized in that: The second clamping device includes a second movable plate, a fifth driving mechanism for driving the second movable plate to rise and fall along the Z axis, and a sixth driving mechanism for driving the second movable plate to move along the Y axis. A second fixed plate is arranged at the lower end of the second movable plate, and the second fixed plate is provided with a plurality of suction cups.

6. The micro PCB automatic soldering equipment according to claim 1, characterized in that: The finished product detection device includes a detection carrier and a seventh driving mechanism for driving the detection carrier to move along the X-axis. A CCD detection module and a resistance detection module are arranged on the side of the detection carrier.

7. The micro PCB automatic soldering equipment according to claim 1, characterized in that: The PCB board feeding channel includes a feeding conveying track, a first feeding carrier lifting mechanism is arranged at the front end of the feeding conveying track, a second feeding carrier lifting mechanism is arranged at the end of the feeding conveying track, and a carrier return conveying track is arranged directly below the feeding conveying track.

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