Processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to processing equipment, which comprises a workbench, a cooling circulation channel, a vacuum adsorption channel and a mixing channel are respectively arranged on the workbench, the mixing channel is used for vacuumizing, purging or conveying cleaning media to holes on a porous ceramic plate, and the vacuum adsorption channel is communicated with the mixing channel. Therefore, the wafer processing requirement of processing equipment is met. And a cooling medium in the cooling circulation channel cools the bearing disc and the porous ceramic disc, so that thermal deformation in the machining process is avoided, and the machining precision is guaranteed. The bottom end disc is subjected to vacuum adsorption through the vacuum adsorption channel, it is guaranteed that no gap is generated between the bottom end disc and the base disc in the machining process, and the situation that the final wafer yield is reduced due to silicon powder accumulation is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a processing equipment. Background Art

[0002] The semiconductor industry manufactures semiconductor chips by manufacturing large-scale integrated circuits on the surface of semiconductor wafers. In order to thin the chips, a robot is usually used to place the wafer on the processing equipment, and the wafer is thinned to a specified thickness by grinding. In the prior art, a workbench is provided on the processing equipment, and the wafer is placed on the workbench. The workbench includes two parts, from top to bottom. The first part is a porous ceramic for absorbing the wafer, and the second part is a concave plate for supporting the porous ceramic. A large amount of heat will be generated in the process of grinding the wafer, and the efficiency of heat dissipation of the workbench is lower than the efficiency of heat generation during the processing. When a certain amount of wafers are processed continuously, the workbench will be deformed due to excessive heat accumulation, resulting in reduced precision of the wafer after processing, and the machine can only be forced to stop to dissipate heat to ensure the precision of the wafer after processing. In addition, when the workbench cleans the wafer after processing, the cleaning medium has a certain pressure. During this process, since the outer ring of the workbench is bolted to the outer ring of the base, there is a large tightening force. The center of the workbench and the center of the base cannot be fixed with any connectors, so there is almost no tightening force. Under the action of pressure, a slight gap will appear where the center of the workbench contacts the center of the base, and the gap disappears after the cleaning process. However, in the process from the generation of the slight gap to the disappearance of the gap, some silicon powder and fine debris generated by grinding will fall into the gap. As the number of processing increases, the silicon powder and fine debris accumulated in the gap gradually increase, and the parallelism between the workbench and the base gradually deteriorates, which ultimately leads to a decrease in the yield rate of processed wafers. Utility Model Content

[0003] The utility model aims to provide a processing device to solve the problem that the existing processing equipment is prone to overheating and deformation and there is a gap between the workbench and the base during the processing.

[0004] The utility model provides a processing device for processing wafers, comprising a grinding module, the grinding module is used for grinding wafers, and also comprises a workbench, the workbench is used for carrying wafers, the workbench comprises: a porous ceramic plate, a retaining plate, an intermediate plate, a bottom plate and a base plate, the porous ceramic plate, the retaining plate, the intermediate plate, the bottom plate and the base plate are connected in sequence from top to bottom, and the porous ceramic plate, the retaining plate and the intermediate plate are sealed and connected at their edges from top to bottom; the workbench also comprises:

[0005] A cooling circulation channel passes through the base plate, the bottom plate and the middle plate in sequence, and is used to transport a cooling medium to the middle plate, and the cooling medium is used to cool the support plate and the porous ceramic plate;

[0006] A vacuum adsorption channel is provided on the base plate to perform vacuum adsorption on the bottom plate;

[0007] The mixing channel passes through the base plate, the bottom plate, the middle plate, the support plate and the porous ceramic plate in sequence, and is used for vacuuming, purging or conveying cleaning medium to the holes on the porous ceramic plate.

[0008] As a preferred technical solution for the processing equipment, the middle disk is provided with a connected middle cooling inlet and a cooling medium flow channel, the bottom disk is provided with a bottom cooling inlet and a bottom cooling outlet, the bottom cooling inlet, the middle cooling inlet, the cooling medium flow channel and the bottom cooling outlet are connected in sequence to form a partial cooling circulation channel.

[0009] As a preferred technical solution for the processing equipment, the cooling circulation channel also includes a base cooling through hole arranged on the base plate, and the bottom cooling inlet is aligned and connected to the base cooling through hole.

[0010] As a preferred technical solution for the processing equipment, the outer side wall of the bottom plate is provided with a bottom drain port, which is connected to the bottom cooling outlet.

[0011] As a preferred technical solution of the processing equipment, the cooling medium flow channel extends in a curved manner on the intermediate disk.

[0012] As a preferred technical solution for the processing equipment, the vacuum adsorption channel includes a first vacuum supply channel, a second vacuum supply channel and a first vacuum diffusion channel. The lower surface of the base plate is provided with a first vacuum supply channel and a second vacuum supply channel which are independent of each other. The upper surface of the base plate is provided with a first vacuum diffusion channel. The first vacuum supply channel is connected to the first vacuum diffusion channel through a first vacuum inlet of the base, and the second vacuum supply channel is connected to the first vacuum diffusion channel through a second vacuum hole of the base. The first vacuum diffusion channel is an annular structure, and the first vacuum diffusion channel is used for vacuum adsorption of the bottom plate.

[0013] As a preferred technical solution for the processing equipment, the vacuum adsorption channel also includes a second vacuum diffusion channel. The upper surface of the base plate is provided with a second vacuum diffusion channel. The second vacuum supply channel is connected to the second vacuum diffusion channel through the third vacuum hole of the base. The second vacuum diffusion channel is located on the outside of the first vacuum diffusion channel. The second vacuum diffusion channel is used for vacuum adsorption of the bottom plate.

[0014] As a preferred technical solution for the processing equipment, two first sealing rings are arranged between the bottom plate and the base plate, one of which is located inside the first vacuum diffusion channel and the other is located outside the second vacuum diffusion channel.

[0015] As a preferred technical solution for the processing equipment, the mixing channel includes:

[0016] A through hole is provided on the retaining plate and communicated with the hole of the porous ceramic plate;

[0017] An intermediate mixing through hole is arranged on the intermediate disk and communicated with the through hole, and the intermediate mixing through hole is arranged away from the cooling circulation channel;

[0018] A bottom mixing tank is disposed on the bottom plate and is connected to the middle mixing through hole;

[0019] The mixing and diffusion channel is arranged on the base plate and communicated with the bottom mixing tank.

[0020] As a preferred technical solution for the processing equipment, the bottom mixing groove includes an inner ring groove, an outer ring groove and a bending groove for connecting the inner ring groove and the outer ring groove. Two second sealing rings are also arranged between the bottom plate and the middle plate. One of the second sealing rings is located on the outside of the outer ring groove, and the other second sealing ring is located on the inside of the inner ring groove and is provided with an avoidance hole for avoiding the cooling circulation channel.

[0021] The beneficial effects of the utility model are:

[0022] The utility model provides a processing equipment, on which a cooling circulation channel, a vacuum adsorption channel and a mixing channel are respectively arranged on a workbench, and the mixing channel is used to vacuum, purge or convey a cleaning medium to the holes on the porous ceramic disk to meet the processing requirements of the processing equipment for wafers. The cooling medium in the cooling circulation channel cools the support plate and the porous ceramic disk to avoid thermal deformation during the processing and ensure the processing accuracy. The bottom plate is vacuum adsorbed through the vacuum adsorption channel to ensure that no gap is generated between the bottom plate and the base plate during the processing, avoiding the accumulation of silicon powder and causing a decrease in the final wafer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of a workbench in an embodiment of the utility model;

[0024] Figure 2 It is a schematic diagram of the arrangement of various channels on the base plate in the embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the base plate in the embodiment of the utility model;

[0026] Figure 4 It is a schematic plan view of the bottom of the base plate in the embodiment of the utility model;

[0027] Figure 5 It is a schematic plan view of the bottom plate in the embodiment of the utility model;

[0028] Figure 6 This is a schematic plan view of the middle plate in the embodiment of the utility model;

[0029] Figure 7 It is a schematic diagram of the flow path of the cooling medium in the embodiment of the present utility model.

[0030] In the figure:

[0031] 1. Porous ceramic plate;

[0032] 2. Receive the plate;

[0033] 3. Intermediate plate; 31. Intermediate cooling inlet; 32. Cooling medium flow channel; 321. Intermediate cooling outlet; 33. Intermediate mixing through hole; 34. Intermediate connecting hole;

[0034] 4. Bottom plate; 41. Bottom cooling inlet; 42. Bottom mixing hole; 43. Bottom mixing tank; 44. Bottom cooling outlet; 45. Bottom drain outlet;

[0035] 5. Base plate; 510. Mixing supply channel; 511. Base mixing inlet; 512. Base mixing hole; 520. First vacuum supply channel; 521. First vacuum inlet of base; 522. First vacuum hole of base; 530. Second vacuum supply channel; 531. Second vacuum hole of base; 532. Third vacuum hole of base; 540. Mixing diffusion channel; 550. First vacuum diffusion channel; 560. Second vacuum diffusion channel; 570. Third vacuum diffusion channel; 580. Base cooling hole. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the present utility model, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0043] The semiconductor industry manufactures semiconductor chips by manufacturing large-scale integrated circuits on the surface of semiconductor wafers. In order to thin the chips, a robot is usually used to place the wafer on the processing equipment, and the wafer is thinned to a specified thickness by grinding. In the prior art, a workbench is provided on the processing equipment, and the wafer is placed on the workbench. The workbench includes two parts, from top to bottom. The first part is a porous ceramic for absorbing the wafer, and the second part is a concave plate for supporting the porous ceramic. A large amount of heat will be generated in the process of grinding the wafer, and the efficiency of heat dissipation of the workbench is lower than the efficiency of heat generation during the processing. When a certain amount of wafers are processed continuously, the workbench will be deformed due to excessive heat accumulation, resulting in reduced precision of the wafer after processing, and the machine can only be forced to stop to dissipate heat to ensure the precision of the wafer after processing. In addition, when the workbench cleans the wafer after processing, the cleaning medium has a certain pressure. During this process, since the outer ring of the workbench is bolted to the outer ring of the base, there is a large tightening force. The center of the workbench and the center of the base cannot be fixed with any connectors, so there is almost no tightening force. Under the action of pressure, a slight gap will appear where the center of the workbench contacts the center of the base, and the gap disappears after the cleaning process. However, in the process from the generation of the slight gap to the disappearance of the gap, some silicon powder and fine debris generated by grinding will fall into the gap. As the number of processing increases, the silicon powder and fine debris accumulated in the gap gradually increase, and the parallelism between the workbench and the base gradually deteriorates, which ultimately leads to a decrease in the yield rate of processed wafers.

[0044] In this regard, the present embodiment provides a processing equipment, which dissipates heat by arranging a cooling circulation channel on the workbench to avoid deformation of the workbench and resulting in reduced processing accuracy. At the same time, a vacuum adsorption channel is also arranged on the workbench. The adsorption of the vacuum adsorption channel ensures that no gaps are generated during the processing, thereby ensuring the processing accuracy and yield of the processing equipment while improving production capacity.

[0045] like Figure 1-Figure 7As shown, the utility model provides a processing device for processing wafers. The processing device includes a grinding module, the grinding module is used for grinding wafers, and the workbench is used for carrying wafers. The workbench includes a porous ceramic disk 1, a receiving disk 2, an intermediate disk 3, a bottom disk 4 and a base disk 5. The porous ceramic disk 1, the receiving disk 2, the intermediate disk 3, the bottom disk 4 and the base disk 5 are connected in sequence from top to bottom, and the porous ceramic disk 1, the receiving disk 2 and the intermediate disk 3 are sealed and connected at the edges from top to bottom. The intermediate disk 3 is connected to the bottom disk 4 through an intermediate connecting hole 34, and a cooling circulation channel, a vacuum adsorption channel and a mixing channel are arranged on the workbench. The cooling circulation channel passes through the base disk 5, the bottom disk 4 and the intermediate disk 3 in sequence, and extends on the intermediate disk 3, and is used to transport a cooling medium to the intermediate disk 3, and the cooling medium is used to cool the receiving disk 2 and the porous ceramic disk 1. The vacuum adsorption channel passes through the base disk 5 and extends on the base disk 5 to vacuum adsorb the bottom disk 4. The mixing channel passes through the base plate 5, the bottom plate 4, the middle plate 3, the support plate 2 and the porous ceramic plate 1 in sequence, and is used to evacuate, purge or convey a cleaning medium to the holes on the porous ceramic plate 1. The mixing channel is used to evacuate, purge or convey a cleaning medium to the holes on the porous ceramic plate 1 to meet the processing requirements of the processing equipment for the wafer. The cooling medium in the cooling circulation channel cools the support plate 2 and the porous ceramic plate 1 to avoid thermal deformation during the processing process and ensure processing accuracy. The bottom plate 4 is vacuum adsorbed through the vacuum adsorption channel to ensure that no gap is generated between the bottom plate 4 and the base plate 5 during the processing process, thereby avoiding the accumulation of silicon powder and causing a decrease in the final wafer yield.

[0046] Furthermore, if Figure 1-Figure 7 As shown, the intermediate disk 3 is provided with an intermediate cooling inlet 31 and a cooling medium flow channel 32 which are connected to each other. The cooling medium flow channel 32 is bent and extended on the intermediate disk 3. Figure 6 As shown, the cooling medium flow channel 32 is arranged on the upper surface of the intermediate disk 3, and its length is greater than the radius of the intermediate disk 3, and it is preferably arranged in a serpentine shape. There are multiple cooling medium flow channels 32, and the multiple cooling medium flow channels 32 are evenly distributed along the circumference of the intermediate disk 3, and the multiple cooling medium flow channels 32 are interconnected near the center of the intermediate disk 3. The cooling inlet is arranged in the area where the multiple cooling medium flow channels 32 are connected in the middle of the intermediate disk 3, so that the cooling medium enters each cooling medium flow channel 32 from the cooling inlet and diffuses in the cooling medium flow channel 32, thereby cooling the support plate 2 and the porous ceramic disk 1 above the intermediate disk 3. Please refer to the flow path of the cooling medium in the cooling medium flow channel 32 Figure 6 In this embodiment, the cooling medium is antifreeze or cooling water. Figure 5 As shown, combined with Figure 6, a bottom cooling inlet 41 and a bottom cooling outlet 44 are provided on the bottom plate 4, and the bottom cooling inlet 41, the intermediate cooling inlet 31, the cooling medium flow channel 32 and the bottom cooling outlet 44 are connected in sequence to form a partial cooling circulation channel. The intermediate cooling inlet 31 is aligned with the bottom cooling inlet 41, so that the cooling medium can enter the cooling medium flow channel 32 through the bottom cooling inlet 41 and the intermediate cooling inlet 31. An intermediate cooling outlet 321 is provided at the end of the cooling medium flow channel 32, that is, the cooling medium flow channel 32 is far away from the cooling inlet, and the intermediate cooling outlet 321 is aligned with the bottom cooling outlet 44, so that the cooling medium flow channel 32 is connected with the bottom cooling outlet 44 through the intermediate cooling outlet 321, so as to realize the circulation of the cooling medium and continuously cool down the support plate 2 and the porous ceramic plate 1.

[0047] Specifically, Figure 2-Figure 5 As shown, the cooling circulation channel also includes a base cooling through hole 580 disposed on the base plate 5, the bottom cooling inlet 41 is aligned and connected with the base cooling through hole 580, and the cooling medium enters the bottom cooling inlet 41 through the base cooling through hole 580. Figure 5 As shown, a bottom drain port 45 is provided on the outer wall of the bottom plate 4, and the bottom drain port 45 is connected to the bottom cooling outlet 44. In this embodiment, there are multiple cooling medium flow channels 32, that is, there are multiple intermediate cooling outlets 321. Correspondingly, the number and position of the bottom cooling outlet 44 and the bottom drain port 45 correspond to the number and position of the multiple intermediate cooling outlets 321. Please refer to Figure 7 As shown in the dashed line B, the dashed line B represents the path of the cooling medium entering the middle plate 3. Specifically, the cooling medium enters the bottom cooling inlet 41 from the base cooling through hole 580, and enters the middle cooling inlet 31 from the bottom cooling inlet 41. Then, it diffuses in the cooling medium flow channel 32 to cool down. Please refer to Figure 7 The dotted line A shows the path of the cooling medium discharged from the middle plate 3, specifically, entering the bottom cooling outlet 44 through the middle cooling outlet 321, and finally discharged from the bottom drain port 45. Please refer to the flow path of the cooling medium discharged from the bottom plate 4. Figure 5 As shown in path S2.

[0048] Furthermore, if Figure 1-Figure 4As shown, the vacuum adsorption channel includes a first vacuum supply channel 520, a second vacuum supply channel 530 and a first vacuum diffusion channel 550. The first vacuum supply channel 520 and the second vacuum supply channel 530 are independent of each other and extend radially on the lower surface of the base plate 5, that is, the first vacuum supply channel 520 and the second vacuum supply channel 530 do not intersect on the base plate 5. The first vacuum diffusion channel 550 is arranged on the upper surface of the base plate 5, and the first vacuum diffusion channel 550 is arranged as a concave annular structure. The first vacuum supply channel 520 is connected to the first vacuum diffusion channel 550 through the first vacuum inlet 521 of the base, and the second vacuum supply channel 530 is connected to the first vacuum diffusion channel 550 through the second vacuum hole 531 of the base. The first vacuum supply channel 520 and the second vacuum supply channel 530 are both connected to an external vacuum pumping device, and the first vacuum diffusion channel 550 is used to vacuum adsorb the bottom plate 4. After the bottom plate 4 is fixedly connected to the base plate 5, the bottom wall of the bottom plate 4 and the first vacuum diffusion channel 550 form a closed cavity. At this time, the first vacuum diffusion channel 550 is evacuated to adsorb the bottom plate 4 on the base plate 5. During the processing, a gap is avoided between the bottom plate 4 and the base plate 5, thereby ensuring the yield rate of the processed wafers.

[0049] To further enhance the adsorption effect of the base plate 5 on the bottom plate 4, please continue to refer to Figure 1-Figure 4As shown, the vacuum adsorption channel also includes a second vacuum diffusion channel, and a second vacuum diffusion channel 560 and a third vacuum diffusion channel 570 are also provided on the upper surface of the base plate 5. The second vacuum diffusion channel and the third vacuum diffusion channel 570 are also provided as a concave annular structure, and the first vacuum diffusion channel 550, the second vacuum diffusion channel 560 and the third vacuum diffusion channel 570 are coaxial, the second vacuum diffusion channel 560 is located outside the first vacuum diffusion channel 550, and the third vacuum diffusion channel 570 is located outside the second vacuum diffusion channel 560. The second vacuum supply channel 530 is connected with the second vacuum diffusion channel 560 through the third vacuum hole 532 of the base, and the third vacuum diffusion channel 570 is connected with the second vacuum diffusion channel 560 through the keyway on the base plate 5. The second vacuum diffusion channel 560 and the third vacuum diffusion channel 570 are both used for vacuum adsorption of the bottom plate 4. After the bottom plate 4 is fixedly connected to the base plate 5, the bottom wall of the bottom plate 4 and the second vacuum diffusion channel 560 and the third vacuum diffusion channel 570 respectively form a closed cavity, and at this time, the first vacuum diffusion channel 550, the second vacuum diffusion channel 560 and the third vacuum diffusion channel 570 are simultaneously evacuated to further ensure that the bottom plate 4 is reliably adsorbed on the base plate 5. In addition, a first base vacuum hole 522 is also provided on the base plate 5, and the first base vacuum hole 522 is connected to the first vacuum supply channel 520. The first base vacuum hole 522 is provided between the first base vacuum diffusion channel 550 and the second base diffusion channel. After the bottom plate 4 is fixedly connected to the base plate 5, the first base vacuum hole 522 directly adsorbs the bottom wall of the bottom plate 4, thereby continuing to strengthen the local vacuum adsorption effect.

[0050] Optionally, in order to ensure good airtightness between the bottom plate 4 and the base plate 5 during vacuum adsorption, two first sealing rings are further provided between the bottom plate 4 and the base plate 5, wherein one first sealing ring is located inside the first vacuum diffusion channel 550, and the other first sealing ring is located outside the third vacuum diffusion channel 570, and the sealing ring located inside the first vacuum diffusion channel 550 does not interfere with the base cooling through hole 580 and the bottom cooling inlet 41 after the bottom plate 4 and the base plate 5 are installed, so as to avoid affecting the flow of the cooling medium in the cooling circulation channel. In addition, a mounting slot or groove for the first sealing ring is provided at a corresponding position of the bottom plate 4 or the base plate 5, and the specific structure is not limited here.

[0051] Further, please refer to Figure 1-Figure 6As shown, the mixing channel includes a through hole provided on the retaining plate 2, an intermediate mixing through hole 33 provided on the intermediate plate 3, a bottom mixing groove provided on the bottom plate 4, and a mixing diffusion channel provided on the base plate 5. The retaining plate 2 is provided with a plurality of through holes for communicating with the porous ceramic plate 1, and the intermediate plate 3 is provided with a plurality of intermediate mixing through holes 33 for communicating with the through holes on the retaining plate 2, and the plurality of intermediate mixing through holes 33 are provided away from the cooling circulation channel on the workbench. A raised portion is formed between the cooling medium flow channels 32 on the intermediate plate 3, and the plurality of intermediate mixing through holes 33 are arranged on the raised portion formed between the cooling medium flow channels 32, so as to avoid mutual interference between the mixing channel and the cooling circulation channel. Please refer to Figure 5 As shown, a bottom mixing groove 43 is provided on the bottom plate 4, and a plurality of intermediate mixing holes 33 are connected to the bottom mixing groove 43. The bottom mixing groove 43 is not connected to the bottom cooling inlet 41 and the bottom cooling outlet 44, so as to avoid mutual interference between the mixing channel and the cooling circulation channel. Figure 2-Figure 4 As shown, two interconnected mixing supply channels 510 are provided at the bottom of the base plate 5, and a base mixing inlet 511 is provided at the connection position of the two mixing supply channels 510. A base mixing hole 512 and a mixing diffusion channel 540 are provided on the base plate 5. The mixing diffusion channel 540 is connected to the mixing supply channel 510 through the base mixing hole 512, and the bottom mixing groove 43 is connected to the mixing diffusion channel 540 through the bottom mixing hole 42. The base mixing hole 512 is used to evacuate, purge or transport the cleaning medium to the mixing diffusion channel 540. The mixing diffusion channel 540 is set as a concave annular structure and is located on the inner side of the first vacuum diffusion channel 550. The corresponding sealing ring set on the inner side of the first vacuum diffusion channel 550 is located on the protrusion formed between the mixing diffusion channel 540 and the first vacuum diffusion channel 550, so as to avoid interference between the vacuum adsorption channel and the mixing channel. A circular protrusion is formed on the inner side of the mixing diffusion channel 540, and the base cooling through hole 580 is arranged on the circular protrusion. In order to avoid interference between the mixing channel and the cooling circulation channel, a sealing ring is also arranged on the inner side of the mixing diffusion channel 540, and an avoidance hole is arranged at a position corresponding to the base cooling through hole 580 on the sealing ring. While achieving sealing, it is ensured that the coolant can smoothly pass through the base cooling through hole 580 to avoid affecting the cooling circulation channel.

[0052] For details, please refer to Figure 5As shown, the bottom mixing groove 43 includes an inner ring groove, an outer ring groove, and a bending groove for connecting the inner ring groove and the outer ring groove. The bending groove is bent and extended along the radial direction of the bottom disk 4, and its two ends are respectively connected with the inner ring groove and the outer ring groove. On the bottom disk 4, a circular protrusion is formed on the inner side of the inner ring groove, and the bottom cooling inlet 41 is arranged on the circular protrusion; a circular ring protrusion is formed on the outer side of the outer ring groove, and the bottom cooling outlet 44 is arranged on the circular ring protrusion, so as to avoid the mixing channel on the bottom disk 4 and the cooling circulation channel from interfering with each other.

[0053] Optionally, in order to ensure the airtightness between the mixing channel and the cooling circulation channel, two second sealing rings are further arranged between the bottom plate 4 and the middle plate 3, one of the second sealing rings is located on the outside of the outer ring groove and on the inside of the bottom cooling outlet 44, and the other second sealing ring is located on the inside of the inner ring groove and is provided with an avoidance hole for avoiding the bottom cooling inlet 41 of the cooling circulation channel.

[0054] Exemplarily, one of the negative pressure machine, the compressed air source and the cleaning liquid pump is selectively connected at the base mixing inlet 511, so as to realize vacuuming, purging or conveying the cleaning medium of the porous ceramic disk 1. Taking the connection of the base mixing inlet 511 to the negative pressure machine as an example, the negative pressure enters the mixing supply channel 510 through the base mixing inlet 511, enters the mixing diffusion channel 540 through the base mixing hole 512, enters the bottom mixing tank 43 through the bottom mixing hole 42 of the bottom plate 4, and flows along the path S1 in the bottom mixing tank 43. Then it enters the through hole at the bottom of the support plate 2 through the middle mixing through hole 33 of the middle plate 3, and finally realizes vacuuming of the holes of the porous ceramic disk 1, and realizes vacuum adsorption of the wafer. When the base mixing inlet 511 is connected to the compressed air source or the cleaning liquid pump, the corresponding compressed gas and cleaning liquid delivery process is consistent with the vacuum delivery process when the negative pressure machine is connected, and it will not be repeated here. It should be pointed out that the structure and method of selectively connecting different devices and switching the same channel are all prior art. For example, those skilled in the art can achieve this by setting a solenoid valve. One end of the solenoid valve is connected to the compressed air source, the cleaning liquid pump and the negative pressure machine, and the other end is connected to the base mixing inlet 511. The access of different media is achieved by changing the valve core position of the solenoid valve. The specific structure and method are all existing technologies in this field and will not be described in detail here.

[0055] The processing equipment provided by the utility model is provided with a mixing channel, while meeting the functions of the traditional workbench structure, and also provides a cooling circulation channel and a vacuum adsorption channel. Through structural design, the cooling circulation channel, the vacuum adsorption channel and the mixing channel are guaranteed to be independent of each other to avoid mutual influence during the processing. On the premise of meeting the processing requirements, the problems of insufficient processing accuracy, low yield rate and poor production continuity caused by heat deformation and dust accumulation during the processing are effectively solved.

[0056] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A processing device for processing a wafer, comprising a grinding module, wherein the grinding module is used to grind the wafer, characterized in that: It also includes a workbench, which is used to carry the wafer, and includes: a porous ceramic plate (1), a receiving plate (2), an intermediate plate (3), a bottom plate (4) and a base plate (5), wherein the porous ceramic plate (1), the receiving plate (2), the intermediate plate (3), the bottom plate (4) and the base plate (5) are sequentially connected from top to bottom, and the porous ceramic plate (1), the receiving plate (2) and the intermediate plate (3) are sealed and connected at their edges from top to bottom; the workbench also includes: A cooling circulation channel, which passes through the base plate (5), the bottom plate (4) and the middle plate (3) in sequence, and is used to transport a cooling medium to the middle plate (3), wherein the cooling medium is used to cool the support plate (2) and the porous ceramic plate (1); A vacuum adsorption channel is provided on the base plate (5) to perform vacuum adsorption on the bottom plate (4); A mixing channel passes through the base plate (5), the bottom plate (4), the middle plate (3), the support plate (2) and the porous ceramic plate (1) in sequence, and is used to evacuate, purge or transport cleaning medium to the holes on the porous ceramic plate (1).

2. The processing equipment according to claim 1, characterized in that: The intermediate disk (3) is provided with an intermediate cooling inlet (31) and a cooling medium flow channel (32) which are connected to each other, and the bottom disk (4) is provided with a bottom cooling inlet (41) and a bottom cooling outlet (44); the bottom cooling inlet (41), the intermediate cooling inlet (31), the cooling medium flow channel (32) and the bottom cooling outlet (44) are connected in sequence to form part of the cooling circulation channel.

3. The processing equipment according to claim 2, characterized in that: The cooling circulation channel also includes a base cooling through hole (580) arranged on the base plate (5), and the bottom cooling inlet (41) is aligned and communicated with the base cooling through hole (580).

4. The processing equipment according to claim 3, characterized in that: The outer side wall of the bottom plate (4) is provided with a bottom drainage port (45), and the bottom drainage port (45) is in communication with the bottom cooling outlet (44).

5. The processing equipment according to claim 2, characterized in that: The cooling medium flow channel (32) extends in a curved manner on the intermediate disk (3).

6. The processing equipment according to claim 1, characterized in that: The vacuum adsorption channel comprises a first vacuum supply channel (520), a second vacuum supply channel (530) and a first vacuum diffusion channel (550); the lower surface of the base plate (5) is provided with the first vacuum supply channel (520) and the second vacuum supply channel (530) which are independent of each other; the upper surface of the base plate (5) is provided with the first vacuum diffusion channel (550); the first vacuum supply channel (520) is connected to the first vacuum diffusion channel (550) through a first vacuum inlet (521) of the base; the second vacuum supply channel (530) is connected to the first vacuum diffusion channel (550) through a second vacuum hole (531) of the base; the first vacuum diffusion channel (550) is an annular structure; and the first vacuum diffusion channel (550) is used for vacuum adsorption of the bottom plate (4).

7. The processing equipment according to claim 6, characterized in that The vacuum adsorption channel also includes a second vacuum diffusion channel (560). The second vacuum diffusion channel (560) is provided on the upper surface of the base plate (5). The second vacuum supply channel (530) is connected to the second vacuum diffusion channel (560) through a third vacuum hole (532) of the base. The second vacuum diffusion channel (560) is located outside the first vacuum diffusion channel (550). The second vacuum diffusion channel (560) is used to perform vacuum adsorption on the bottom plate (4).

8. The processing equipment according to claim 7, characterized in that: Two first sealing rings are arranged between the bottom plate (4) and the base plate (5), one of the first sealing rings is located on the inner side of the first vacuum diffusion channel (550), and the other first sealing ring is located on the outer side of the second vacuum diffusion channel (560).

9. The processing equipment according to claim 1, characterized in that: The mixing channel comprises: A through hole, which is arranged on the retaining plate (2) and is connected with the hole of the porous ceramic plate (1); An intermediate mixing through hole (33) is arranged on the intermediate disk (3) and is connected to the through hole, and the intermediate mixing through hole (33) is arranged away from the cooling circulation channel; A bottom mixing tank (43) is disposed on the bottom plate (4) and is connected to the middle mixing through hole (33); A mixing and diffusion channel (540) is arranged on the base plate (5) and is in communication with the bottom mixing tank (43).

10. The processing equipment according to claim 9, characterized in that The bottom mixing groove (43) comprises an inner ring groove, an outer ring groove and a bending groove for connecting the inner ring groove and the outer ring groove. Two second sealing rings are also arranged between the bottom plate (4) and the middle plate (3), one of the second sealing rings is located on the outside of the outer ring groove, and the other second sealing ring is located on the inside of the inner ring groove and is provided with an avoidance hole for avoiding the cooling circulation channel.

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