Monitoring device for diamond on grinding disc of chemical mechanical polishing equipment

Abstract

The utility model provides a monitoring device for diamonds on a grinding disc of chemical mechanical polishing equipment, which comprises a signal acquisition part arranged on a chemical mechanical polishing machine table or an external bracket, and a display and a processor which are electrically connected with the signal acquisition part, the signal collecting part collects diamond distribution state signals on the grinding disc before grinding and after grinding, the processor receives the diamond distribution state signals on the grinding disc before grinding and after grinding, and whether the diamond distribution state signals on the grinding disc before grinding and after grinding are within a preset range or not is analyzed. The monitoring module is used for monitoring whether diamonds on the ground grinding disc fall off or are broken or not; according to the monitoring device, the diamond on the grinding disc of the chemical mechanical polishing equipment can be monitored in real time so as to prevent the wafer from being processed under the condition that the diamond falls or is broken, so that the wafer can be prevented from being scratched by the falling or broken diamond, and the preparation yield of the wafer is further prevented from being reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical mechanical polishing, in particular to a monitoring device for diamonds on a grinding disc of chemical mechanical polishing equipment. Background Art

[0002] Chemical mechanical polishing (CMP) is an important means to achieve wafer surface flatness. During the grinding process, the grinding liquid flows on the grinding disc. On the one hand, the grinding disc needs to be used to adjust the flow field of the grinding liquid so that the grinding particles are evenly distributed. On the other hand, the grinding disc needs to be used to clean the grinding debris, derivatives, agglomerated grinding particles and other impurities remaining in the pores of the grinding disc during the grinding process. In this process, the diamonds on the grinding disc will have the risk of breaking and falling off, and due to the high hardness of diamonds, the falling diamonds will scratch the wafer, thereby affecting the preparation yield of the wafer. In order to solve the above problems, the utility model proposes a monitoring device for diamonds on the grinding disc of chemical mechanical polishing equipment. Utility Model Content

[0003] The utility model aims to provide a monitoring device for diamonds on a grinding disc of a chemical mechanical polishing device, which monitors the diamonds on the grinding disc of the chemical mechanical polishing device in real time to prevent the wafer from being processed when the diamonds fall off, thereby preventing the falling diamonds from scratching the wafer, thereby avoiding reducing the preparation yield of the wafer.

[0004] To achieve the above-mentioned purpose, the utility model provides a monitoring device for diamonds on a grinding disc of a chemical mechanical polishing device, comprising a signal acquisition unit arranged on a chemical mechanical polishing machine table or an external bracket, and a display and a processor electrically connected to the signal acquisition unit, wherein the signal acquisition unit acquires diamond distribution state signals on the grinding disc before and after grinding, the processor receives the diamond distribution state signals on the grinding disc before and after grinding, and monitors whether the diamonds on the grinding disc after grinding have fallen or broken by analyzing whether the diamond distribution state signals on the grinding disc before and after grinding are within a preset range, and the display is used to display the diamond distribution state diagrams on the grinding disc before and after grinding acquired by the signal acquisition unit.

[0005] Optionally, the signal collection part has a disc-shaped structure, and a diameter of the signal collection part is greater than a diameter of the grinding disc.

[0006] Optionally, it further includes a first positioning portion provided on the signal acquisition portion, and a second positioning portion provided on the grinding disc, and the first positioning portion is aligned with the second positioning portion for positioning the signal acquisition portion and the grinding disc.

[0007] Optionally, the first positioning portion and the second positioning portion may both be positioning notches, positioning blocks or positioners.

[0008] Optionally, it also includes a first driving unit connected to the grinding disc and / or the signal acquisition unit, and the first driving unit is used to drive the grinding disc and the signal acquisition unit to perform relative rotational motion to achieve alignment of the first positioning unit and the second positioning unit.

[0009] Optionally, the first driving part includes a vertically arranged connecting rod, the connecting rod having a first end and a second end opposite to each other, the first end of the connecting rod is connected to the driving end of the first motor, the first motor is fixedly connected to the chemical mechanical polishing machine or the external bracket, the second end of the connecting rod is connected to a clamping claw, and the clamping claw is used to clamp the signal acquisition part or the grinding disc.

[0010] Optionally, the signal acquisition unit is an optical sensor.

[0011] Optionally, the signal acquisition unit is a pressure sensor.

[0012] Optionally, a second driving unit is further included, which is arranged between the clamping claw and the connecting rod and is used to connect the clamping claw and the connecting rod to drive the grinding disc to move closer to or away from the signal acquisition unit in a vertical direction.

[0013] Optionally, the second driving part includes a driving cylinder and a driving arm connected to the driving end of the driving cylinder, the driving cylinder is connected to the connecting rod, and one end of the driving arm away from the driving cylinder is connected to the clamping claw.

[0014] The beneficial effects of the utility model are as follows:

[0015] The monitoring device in the utility model can monitor the diamonds on the grinding disc of the chemical mechanical polishing equipment in real time to prevent the wafer from being processed when the diamonds fall or break, thereby avoiding scratches on the wafer caused by the fallen or broken diamonds, thereby avoiding reducing the preparation yield of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the first positioning part and the second positioning part in the utility model;

[0018] Figure 3 It is a structural schematic diagram of a second example of the first positioning portion and the second positioning portion in the utility model;

[0019] Figure 4 It is a structural schematic diagram of a third example of the first positioning portion and the second positioning portion in the utility model;

[0020] Figure 5 It is a structural schematic diagram of an example of setting the first position of the first driving part in the utility model;

[0021] Figure 6 It is a structural schematic diagram of an example of setting the second position of the first driving part in the utility model;

[0022] Figure 7 It is a structural schematic diagram of an example of the third position setting of the first driving part in the utility model;

[0023] Figure 8 This is a schematic diagram of a first exemplary structure of the second driving unit in the utility model;

[0024] Fig. 9 This is a schematic diagram of a second exemplary structure of the second driving unit in the present utility model.

[0025] Reference numerals

[0026] 1. Signal acquisition department;

[0027] 2. Display;

[0028] 3. A first positioning portion;

[0029] 4. A second positioning portion;

[0030] 5. first driving part; 51. connecting rod; 511. first end; 512. second end; 52. first motor; 53. clamping grip;

[0031] 6. Second driving part; 61. Driving cylinder; 62. Driving arm; 63. Second motor; 64. Support rod; 65. External spiral tube; 66. Internal spiral tube; 67. Support limit assembly; 671. Support limit rod; 672. Support limit cylinder; 673. Support limit spring;

[0032] 7. Grinding disc. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0034] In view of the problems existing in the prior art, an embodiment of the utility model provides a monitoring device for diamonds on a grinding disc 7 of a chemical mechanical polishing device. The monitoring device in the utility model can monitor the diamonds on the grinding disc 7 of the chemical mechanical polishing device in real time to prevent the wafer from being processed when the diamonds fall or break, thereby preventing the wafer from being scratched by the fallen or broken diamonds, thereby avoiding reducing the preparation yield of the wafer.

[0035] In one embodiment, if Figure 1 and Figure 2 As shown, the monitoring device for diamonds on the grinding disc 7 of the chemical mechanical polishing equipment includes a signal acquisition unit 1 arranged on a chemical mechanical polishing machine or an external bracket, and a display 2 and a processor electrically connected to the signal acquisition unit 1 (preferably, the display 2 and the processor are arranged on the chemical mechanical polishing machine or the external bracket), wherein the signal acquisition unit 1 acquires diamond distribution state signals on the grinding disc 7 before and after grinding, the processor receives the diamond distribution state signals on the grinding disc 7 before and after grinding, and monitors whether the diamonds on the grinding disc 7 after grinding are dropped or broken by analyzing whether the diamond distribution state signals on the grinding disc 7 before and after grinding are within a preset range, and the display 2 is used to display the diamond distribution state diagram on the grinding disc 7 before and after grinding acquired by the signal acquisition unit 1.

[0036] Specifically, the chemical mechanical polishing machine and the peripheral bracket belong to the same device, or the chemical mechanical polishing machine and the peripheral bracket belong to different devices. The specific device to be used can be selected according to the specific situation, which will not be repeated here. Preferably, in one example, the signal acquisition unit 1 is fixedly arranged on the chemical mechanical polishing machine; in another example, the signal acquisition unit 1 is fixedly arranged on the peripheral bracket.

[0037] During operation, the diamond distribution state diagram on the grinding disc 7 collected by the signal collection unit 1 before grinding is regarded as the first distribution state diagram, and the diamond distribution state diagram on the grinding disc 7 collected by the signal collection unit 1 after grinding is regarded as the second distribution state diagram. After collecting the first distribution state diagram and the second distribution state diagram, the processor is used to analyze and compare. If the first distribution state diagram and the second distribution state diagram are within a preset range, it is proved that the diamonds on the grinding disc 7 after grinding do not have the problem of falling or breaking; if the first distribution state diagram and the second distribution state diagram are not within the preset range, it is proved that the diamonds on the grinding disc 7 after grinding have fallen, or the diamonds on the grinding disc 7 after grinding have broken. When it is monitored that the diamonds on the grinding disc 7 after grinding have not fallen or broken, the device can continue to be used to process the wafer; when it is monitored that the diamonds on the grinding disc 7 after grinding have fallen or broken, the device cannot continue to process the wafer, and the fallen or broken diamonds need to be cleaned to prevent the fallen or broken diamonds from scratching the wafer, thereby affecting the yield of wafer preparation. Only after the fallen or broken diamonds are cleaned can the wafer be processed by the device.

[0038] In one example, Figure 1 As shown, the signal acquisition unit 1 is a disc-shaped structure, and the diameter of the signal acquisition unit 1 is greater than the diameter of the grinding disc 7. Of course, in other examples, the diameter of the signal acquisition unit 1 may also be equal to the diameter of the grinding disc 7. The setting of this example can make the acquisition area of ​​the signal acquisition unit 1 completely cover the grinding disc 7 (specifically cover the side of the grinding disc 7 containing diamonds), so that the distribution state of diamonds on the grinding disc 7 can be more completely collected, making the monitoring result more accurate.

[0039] In order to better ensure that the acquisition area of ​​the signal acquisition unit 1 can completely cover the grinding disc 7, during the acquisition process of the signal acquisition unit 1, when the signal acquisition unit 1 and the grinding disc 7 are placed, the grinding disc 7 and the signal acquisition unit 1 are coaxially arranged in the vertical direction (the axis shown here can be understood as the central axis of the grinding disc 7 and the central axis of the signal acquisition unit 1), as shown in FIG. Figure 1 shown.

[0040] It should be understood that, in the example where the diameter of the signal acquisition part 1 is larger than the diameter of the grinding disc 7, the grinding disc 7 and the signal acquisition part 1 may not be coaxially arranged in the vertical direction. Of course, in order to fully acquire the distribution state of diamonds on the grinding disc 7 through the signal acquisition part 1, it is only necessary to ensure that the acquisition area of ​​the signal acquisition part 1 covers the grinding disc 7.

[0041] In one embodiment, if Figure 2 As shown, the monitoring device for diamonds on the grinding disc 7 of the chemical mechanical polishing equipment further includes a first positioning portion 3 provided on the signal acquisition portion 1, and a second positioning portion 4 provided on the grinding disc 7, and the alignment of the first positioning portion 3 and the second positioning portion 4 is used for positioning the signal acquisition portion 1 and the grinding disc 7. The arrangement of the first positioning portion 3 and the second positioning portion 4 ensures that when monitoring the distribution state of diamonds on the grinding disc 7 before and after grinding, both monitoring processes can be monitored from the same position, so that the diamond distribution state diagrams formed by monitoring in the two processes have an overlapping phenomenon, and according to the overlapping diagrams, it can be more clearly and accurately judged whether the diamond distribution state diagrams in the two processes are within the preset range, making the judgment process simpler and more convenient.

[0042] Preferably, the first positioning portion 3 and the second positioning portion 4 can both be positioning notches, positioning blocks or positioners. Figure 2 As shown, the first positioning portion 3 and the second positioning portion 4 are both positioning notches; in the second example, as Figure 3 As shown, the first positioning portion 3 is a positioning notch, and the second positioning portion 4 is a positioning block (the positioning block is made of a special material, and the special material can be used in a chemical mechanical polishing device) or a positioner; in the third example, as Figure 4 As shown, the first positioning portion 3 is a positioning block or a positioner, and the second positioning portion 4 is a positioning notch; in a fourth example, both the first positioning portion 3 and the second positioning portion 4 are positioning blocks or positioners.

[0043] In one embodiment, the monitoring device for diamonds on the grinding disc 7 of the chemical mechanical polishing equipment also includes a first driving unit 5 connected to the grinding disc 7 and / or the signal acquisition unit 1, and the first driving unit 5 is used to drive the grinding disc 7 and the signal acquisition unit 1 to perform relative rotational motion to achieve alignment of the first positioning unit 3 and the second positioning unit 4.

[0044] In the example of the first driving part 5 being arranged at the first position, the first driving part 5 is arranged on the grinding disc 7. Figure 5 As shown; in the example of the second position setting of the first driving unit 5, the first driving unit 5 is arranged on the signal acquisition unit 1, such as Figure 6 As shown; in the example of the third position setting of the first driving unit 5, the first driving unit 5 is provided on both the grinding disc 7 and the signal acquisition unit 1, such as Figure 7 As shown; in the first two examples, both are single-sided control, and in the third example, it is double-sided control. Thus, compared with the previous two examples, the third example can achieve higher work efficiency through double-sided control, and can quickly realize the alignment of the first positioning part 3 and the second positioning part 4.

[0045] Preferably, if Figure 5 As shown, the first driving part 5 includes a vertically arranged connecting rod 51, the connecting rod 51 has a first end 511 and a second end 512 opposite to each other, the first end 511 of the connecting rod 51 is connected to the driving end of the first motor 52, the first motor 52 is fixedly connected to the chemical mechanical polishing machine or the peripheral bracket, and the second end 512 of the connecting rod 51 is connected to the clamping claw 53, and the clamping claw 53 is used to grasp the signal acquisition part 1 or the grinding disc 7. It should be understood that the structure for grasping the signal acquisition part 1 or the grinding disc 7 is not limited to the clamping claw 53. The structural design of the first driving part 5 is simple and reasonable, and when driving the signal acquisition part 1 or the grinding disc 7 to work, the effect of convenient operation and high-efficiency operation can be achieved.

[0046] In one embodiment, the signal acquisition unit 1 is an optical sensor.

[0047] In one embodiment, the signal acquisition unit 1 is a pressure sensor.

[0048] In one embodiment, the monitoring device for diamonds on the grinding disc 7 of the chemical mechanical polishing equipment further includes a second driving unit 6, which is disposed between the clamping claw 53 and the connecting rod 51 and is used to connect the clamping claw 53 with the connecting rod 51 to drive the grinding disc 7 to move closer to or away from the signal acquisition unit 1 in the vertical direction. In this embodiment, the signal acquisition unit 1 is a pressure sensor, and the first driving unit 5 is disposed on the grinding disc 7.

[0049] In the first example, if Figure 8 As shown, the second driving part 6 includes a driving cylinder 61 and a driving arm 62 connected to the driving end of the driving cylinder 61. The driving cylinder 61 is connected to the connecting rod 51, and the end of the driving arm 62 away from the driving cylinder 61 is connected to the clamping grip 53.

[0050] In the second example, if Fig. 9As shown, the second driving part 6 includes a second motor 63, which is fixedly connected to the connecting rod 51, and a support rod 64 fixedly connected to the driving end of the second motor 63, and an outer spiral tube 65 is fixedly sleeved on the support rod 64, and the outer spiral tube 65 is threadedly inserted in the inner spiral tube 66, and the inner spiral tube 66 is fixedly connected to the clamping grip 53. When the second motor 63 works, the outer spiral tube 65 is rotated by the support rod 64. Since the outer spiral tube 65 is threadedly inserted in the inner spiral tube 66, the rotation of the outer spiral tube 65 causes the inner spiral tube 66 to move in the vertical direction. The movement of the inner spiral tube 66 in the vertical direction causes the grinding disc 7 to move closer to or away from the signal acquisition part 1. When the grinding disc 7 moves closer, the signal acquisition part 1 is given pressure by the grinding disc 7, so that the signal acquisition part 1 collects the diamond distribution state signal on the grinding disc 7.

[0051] In order to make the inner spiral tube 66 move only in the vertical direction relative to the connecting rod 51 without rotating, in this embodiment, the second driving part 6 further includes a support and limit assembly 67, one end of which is fixedly connected to the side wall of the inner spiral tube 66, and the other end of which is fixedly connected to the connecting rod 51. Fig. 9 As shown, the support and limit assembly 67 includes a support and limit rod 671, a support and limit cylinder 672 and a support and limit spring 673. The support and limit rod 671 is movably inserted in the support and limit cylinder 672, and the support and limit spring 673 is wound around the support and limit rod 671. The two ends of the support and limit spring 673 are respectively fixedly connected to the side wall of the support and limit rod 671 and the outer side wall of the support and limit cylinder 672. The structural design of the support and limit assembly 67 is reasonable, which can not only limit the inner spiral tube 66 to move in the vertical direction relative to the connecting rod 51 but not to rotate, but also can be used in the

[0052] The beneficial effects of the utility model are as follows:

[0053] The monitoring device in the utility model can monitor the diamonds on the grinding disc 7 of the chemical mechanical polishing equipment in real time to prevent the wafer from being processed when the diamonds fall or break, thereby avoiding scratches on the wafer caused by the fallen or broken diamonds, thereby avoiding reducing the preparation yield of the wafer.

[0054] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A monitoring device for diamonds on a grinding disc (7) of a chemical mechanical polishing device, characterized in that: The invention comprises a signal acquisition unit (1) arranged on a chemical mechanical polishing machine or an external bracket, and a display (2) and a processor electrically connected to the signal acquisition unit (1), wherein the signal acquisition unit (1) acquires diamond distribution state signals on a grinding disc (7) before and after grinding, the processor receives the diamond distribution state signals on the grinding disc (7) before and after grinding, and monitors whether the diamonds on the grinding disc (7) after grinding have fallen or broken by analyzing whether the diamond distribution state signals on the grinding disc (7) before and after grinding are within a preset range, and the display (2) is used to display the diamond distribution state diagram on the grinding disc (7) before and after grinding acquired by the signal acquisition unit (1).

2. The monitoring device according to claim 1, characterized in that: The signal collection part (1) is in a disc-shaped structure, and the diameter of the signal collection part (1) is greater than the diameter of the grinding disc (7).

3. The monitoring device according to claim 1, characterized in that: It also comprises a first positioning portion (3) provided on the signal acquisition portion (1), and a second positioning portion (4) provided on the grinding disc (7), wherein the first positioning portion (3) is aligned with the second positioning portion (4) for positioning the signal acquisition portion (1) and the grinding disc (7).

4. The monitoring device according to claim 3, characterized in that: The first positioning portion (3) and the second positioning portion (4) may both be positioning notches, positioning blocks or positioners.

5. The monitoring device according to claim 3, characterized in that: It also comprises a first driving part (5) connected to the grinding disc (7) and / or the signal collecting part (1), wherein the first driving part (5) is used to drive the grinding disc (7) and the signal collecting part (1) to perform relative rotational movement, so as to achieve alignment of the first positioning part (3) with the second positioning part (4).

6. The monitoring device according to claim 5, characterized in that: The first driving part (5) comprises a vertically arranged connecting rod (51), wherein the connecting rod (51) has a first end (511) and a second end (512) opposite to each other, wherein the first end (511) of the connecting rod (51) is connected to a driving end of a first motor (52), wherein the first motor (52) is fixedly connected to the chemical mechanical polishing machine or an external bracket, and the second end (512) of the connecting rod (51) is connected to a clamping claw (53), wherein the clamping claw (53) is used to clamp the signal acquisition part (1) or the grinding disc (7).

7. The monitoring device according to claim 6, characterized in that: The signal collection unit (1) is an optical sensor.

8. The monitoring device according to claim 6, characterized in that: The signal acquisition unit (1) is a pressure sensor.

9. The monitoring device according to claim 8, characterized in that: The invention also comprises a second driving part (6), which is arranged between the clamping claw (53) and the connecting rod (51) and is used for connecting the clamping claw (53) and the connecting rod (51) so as to drive the grinding disc (7) to move closer to or farther from the signal collecting part (1) in the vertical direction.

10. The monitoring device according to claim 9, characterized in that: The second driving part (6) comprises a driving cylinder (61) and a driving arm (62) connected to the driving end of the driving cylinder (61), wherein the driving cylinder (61) is connected to the connecting rod (51), and an end of the driving arm (62) away from the driving cylinder (61) is connected to the clamping claw (53).

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