Diamond grinding pad

Abstract

The utility model relates to the technical field of brittle and hard material grinding, in particular to a diamond grinding pad which comprises a circular-ring-shaped base plate, and the base plate is sequentially divided into a first circular ring area, a second circular ring area and a third circular ring area from inside to outside. A plurality of first grinding particles are uniformly distributed in the first circular ring area, the upper surfaces of the first grinding particles form a first grinding surface, and the first grinding surface smoothly rises from inside to outside; a plurality of second grinding particles are uniformly distributed in the second circular ring area, and the upper surfaces of the plurality of second grinding particles form a second grinding surface; a plurality of third grinding particles are evenly distributed in the third circular ring area, the upper surfaces of the third grinding particles form a third grinding face, and the third grinding face smoothly descends from inside to outside. The thickness difference among a plurality of hard and brittle materials ground and thinned by the diamond grinding pad is small, and the thickness consistency of the grinding and thinning process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding brittle and hard materials, in particular to a diamond grinding pad. Background Art

[0002] The thinning steps of brittle and hard materials such as silicon carbide, sapphire, silicon nitride, and gallium arsenide usually include wire cutting, rough grinding, fine grinding, polishing and other steps. And brittle and hard materials such as glass and quartz used in cover plates and window plates in the consumer electronics and industrial electronics industries also require rough grinding, thinning, fine grinding, polishing and other steps. In the rough grinding and fine grinding steps, a double-sided grinder is generally used to grind and thin the brittle and hard materials, and a diamond grinding pad is required in the grinding process. A diamond grinding pad is a tool used for precision grinding and polishing of hard and brittle materials. The diamond grinding pad is provided with a large number of abrasive particles, and the abrasive particles contain diamond micro-powder abrasives. The high hardness and high wear resistance of diamond powder abrasives are used to achieve efficient material removal and surface treatment. In the prior art, the surfaces of the abrasive particles on traditional diamond grinding pads are all flat.

[0003] When performing grinding and thinning, the operator will stick the diamond grinding pad into the double-sided grinder, and then place the carrier used to position and accommodate multiple hard and brittle materials between the two diamond grinding pads. Then start the double-sided grinder, and the output end of the double-sided grinder can drive the two diamond grinding pads and the carrier to rotate, so that the two diamond grinding pads can grind the surfaces of multiple hard and brittle materials on the carrier to achieve grinding and thinning of multiple hard and brittle materials. In the prior art, the diamond grinding pad rotates around the axis of the output end of the double-sided grinder, and the carrier rotates along its own axis while rotating around the axis of the output end of the double-sided grinder. This makes the grinding amount of hard and brittle materials near the edge of the carrier large, while the grinding amount of hard and brittle materials near the center of the carrier is small, resulting in a large difference in thickness between the multiple hard and brittle materials thinned by grinding, which is not conducive to improving the thickness consistency of the grinding and thinning process. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a diamond grinding pad, which can make the thickness of multiple hard and brittle materials ground and thinned to be consistent, thereby ensuring the thickness consistency of the multiple hard and brittle materials.

[0005] The diamond grinding pad according to the utility model comprises:

[0006] A substrate, the substrate is in a circular ring shape, and is divided into a first circular ring area, a second circular ring area and a third circular ring area from the inside to the outside;

[0007] A plurality of first abrasive particles are evenly distributed in the first annular region, and the upper surfaces of the plurality of first abrasive particles form a first abrasive surface, the first abrasive surface rises smoothly from the inside to the outside, and the first abrasive surface is used for grinding a plurality of hard and brittle materials;

[0008] A plurality of second abrasive particles are evenly distributed in the second annular region, and the upper surfaces of the plurality of second abrasive particles form a second abrasive surface, the second abrasive surface smoothly transitions with the first abrasive surface, the second abrasive surface is located above the first abrasive surface, and the second abrasive surface is used to grind a plurality of hard and brittle materials;

[0009] A plurality of third grinding particles are evenly distributed in the third annular area, and the upper surfaces of the plurality of third grinding particles constitute a third grinding surface. The third grinding surface smoothly descends from the inside to the outside, and the third grinding surface is located below the second grinding surface. The third grinding surface smoothly transitions with the second grinding surface, and the third grinding surface is used to grind a plurality of the hard and brittle materials.

[0010] At least the following beneficial effects are achieved:

[0011] The first grinding surface rises smoothly from the inside to the outside, the third grinding surface descends smoothly from the inside to the outside, the first grinding surface and the second grinding surface transition smoothly, the second grinding surface and the third grinding surface transition smoothly, and the second grinding surface is located above the first grinding surface, and the third grinding surface is located below the second grinding surface, which makes the height of the first grinding surface smaller than the second grinding surface, and the height of the third grinding surface is smaller than the second grinding surface. Since the height of the second grinding surface is the highest, when multiple second grinding particles grind hard and brittle materials, they have a larger blade height and higher cutting efficiency, that is, the grinding effect of the second grinding particles is better than the grinding effects of the first and third grinding particles.

[0012] When multiple hard and brittle materials need to be ground and thinned, the operator can stick the diamond grinding pad to the upper and lower turntables, then place the carrier on the diamond grinding pad, and place multiple hard and brittle materials to be ground in multiple positioning holes on the carrier. Then start the double-sided grinder, and the upper and lower turntables can apply pressure. At this time, the diamond grinding pad will rotate around the sun gear, and the carrier will rotate around its own axis while rotating around the sun gear. Since the first annular area, the second annular area, and the third annular area are arranged in sequence from the inside to the outside, that is, multiple first abrasive particles and multiple third abrasive particles are respectively close to the inner ring and outer ring of the diamond grinding pad. Moreover, the grinding effect of the multiple second abrasive particles in the second circular ring area is better than the grinding effect of the multiple first abrasive particles in the first circular ring area, and the grinding effect of the multiple second abrasive particles in the second circular ring area is better than the grinding effect of the multiple third abrasive particles in the third circular ring area. This makes the grinding effect of the multiple first abrasive particles and the multiple third abrasive particles on the hard and brittle materials near the edge of the carrier lower than the grinding effect of the multiple second abrasive particles on the hard and brittle materials near the center of the carrier, which plays a grinding compensation role.

[0013] According to the diamond grinding pad of the utility model, the ring width of the first annular region is 25% to 35% of the ring width of the substrate, the ring width of the second annular region is 50% to 60% of the ring width of the substrate, and the ring width of the third annular region is 10% to 20% of the ring width of the substrate.

[0014] According to the diamond grinding pad of the utility model, the ring width of the first annular region is greater than the ring width of the third annular region.

[0015] According to the diamond grinding pad of the utility model, the ring width of the first annular region is 30% of the ring width of the substrate, the ring width of the second annular region is 55% of the ring width of the substrate, and the ring width of the third annular region is 15% of the ring width of the substrate.

[0016] According to the diamond polishing pad of the utility model, the average height of the plurality of second polishing particles is greater than the average height of the plurality of first polishing particles, the average height of the plurality of second polishing particles is greater than the average height of the plurality of third polishing particles, and the average height of the plurality of first polishing particles is greater than the average height of the plurality of third polishing particles.

[0017] According to the diamond polishing pad of the present invention, the difference between the average height of the second polishing particles and the average height of the first polishing particles is 20 microns, and the difference between the average height of the second polishing particles and the average height of the third polishing particles is 25 microns.

[0018] According to the diamond grinding pad of the utility model, the ratio of the radius of the outer circle of the substrate to the radius of the inner circle of the substrate is 1-3.

[0019] According to the diamond grinding pad of the utility model, an adhesive layer is provided on the lower surface of the substrate.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 It is a schematic diagram of the structure of a traditional diamond polishing pad;

[0023] Figure 2 for Figure 1 A schematic diagram of the local enlarged structure at point A in the middle;

[0024] Figure 3 It is a schematic diagram of the top view of the ring gear, sun gear and carrier;

[0025] Figure 4 is a schematic diagram of the structure of the vehicle;

[0026] Figure 5 Schematic diagram of the movement paths of points A and B on the carrier during the grinding and thinning process;

[0027] Figure 6 It is a schematic diagram of the substrate in the utility model being divided into a first circular ring area, a second circular ring area and a third circular ring area;

[0028] Figure 7 This is a schematic diagram of the structure of a diamond polishing pad according to an embodiment of the utility model;

[0029] Figure 8 for Figure 7 A schematic diagram of the local enlarged structure at B in the middle;

[0030] Fig. 9 It is a cross-sectional schematic diagram of a diamond polishing pad according to an embodiment of the utility model;

[0031] Reference numerals:

[0032] Substrate 100; first annular region 110; first abrasive particles 111; first abrasive surface 112; second annular region 120; second abrasive particles 121; second abrasive surface 122; third annular region 130; third abrasive particles 131; third abrasive surface 132;

[0033] Sun gear 200 ; ring gear 210 ; carrier 220 . DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0037] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0038] It needs further explanation that reference Figures 1 to 4 The double-sided grinding machine includes a gear ring 210, a lower turntable, a sun gear 200 and an upper turntable. The sun gear 200 is arranged on the lower turntable, and a circle of external teeth is arranged on the edge of the sun gear 200. Figure 3The shaded part in the middle is in the shape of a ring. A conventional diamond grinding pad is mounted on the sun gear 200 and affixed to the lower turntable, and a conventional diamond grinding pad is also affixed to the upper turntable. The carrier 220 is a positioning fixture for positioning and accommodating multiple hard and brittle materials. The carrier 220 is provided with multiple positioning holes, and multiple hard and brittle materials to be ground are placed in the multiple positioning holes respectively. A circle of external teeth is provided on the outer edge of the carrier 220. The carrier 220 is placed on the conventional diamond grinding pad on the lower turntable. The external teeth on the edge of the carrier 220 mesh with the internal teeth of the gear ring 210, and the external teeth on the edge of the carrier 220 mesh with the external teeth on the edge of the sun gear 200. The upper turntable is then pressed downward so that the traditional diamond grinding pad on the lower turntable is pressed against the lower surfaces of the multiple hard and brittle materials on the carrier 220, and the traditional diamond grinding pad on the upper turntable is pressed against the upper surfaces of the multiple hard and brittle materials on the carrier 220, that is, the traditional diamond grinding pad on the upper turntable is used to grind the upper surfaces of the multiple hard and brittle materials, and the traditional diamond grinding pad on the lower turntable is used to grind the lower surfaces of the multiple hard and brittle materials. Figure 3 The outer arrow in is the rotation direction of the ring gear 210. Figure 3 The inner arrow in the figure indicates the rotation direction of the sun gear 200, the lower turntable, the upper turntable and the conventional diamond grinding pad.

[0039] After the double-sided grinder is started, the lower turntable, the upper turntable and the sun gear 200 rotate together, and the ring gear 210 rotates in the opposite direction of the sun gear 200. The lower turntable and the upper turntable can respectively drive the corresponding traditional diamond grinding pad to rotate around the axis of the sun gear 200. Since the carrier 220 is meshed with the ring gear 210 and the sun gear 200, the carrier 220 is driven by the ring gear 210 and the sun gear 200, while rotating along the sun gear 200, it also rotates around its own axis, so that the traditional diamond grinding pad can generate relative motion with the multiple hard and brittle materials on the carrier 220, and then the traditional diamond grinding pad can grind multiple hard and brittle materials to complete the grinding and thinning of multiple hard and brittle materials.

[0040] refer to Figures 3 to 5 For the convenience of explanation, Figure 4 Point A is the center point of the vehicle 220. Figure 4 Point B is any point on the carrier 220 close to the edge of the carrier 220. Figure 5 The shaded area is a conventional diamond polishing pad. Since the carrier 220 rotates along the sun gear 200 and also rotates around its own axis, the trajectory of point A is as follows: Figure 5 As shown by the dotted line in Figure 5As shown by the solid line in . It is not difficult to see that the path of point B near the edge of the carrier 220 is longer and more complex, while the path of point A at the center of the carrier 220 is shorter and simpler, which will result in the path of the point closer to the edge of the carrier 220 being longer and more complex, while the path of the point closer to the center of the carrier 220 being shorter and simpler. Further, point B near the edge of the carrier 220 will move back and forth between the outer ring and the inner ring of the traditional diamond polishing pad, while point A near the center of the carrier 220 will move concentratedly in the middle of the traditional diamond polishing pad. In other words, the abrasive particles near the outer ring and the inner ring of the traditional diamond polishing pad are more used to grind part of the hard and brittle materials near the edge of the carrier 220, while the other part of the hard and brittle materials near the center of the carrier 220 are more ground by the abrasive particles in the middle of the traditional diamond polishing pad. The surfaces of the multiple abrasive particles on the traditional diamond polishing pad are flat and uniform, that is, the multiple abrasive particles on the traditional diamond polishing pad have the same grinding effect on multiple hard and brittle materials.

[0041] It is not difficult to understand that the carrier 220 can position and accommodate multiple hard and brittle materials, which will cause some hard and brittle materials to be close to the edge of the carrier 220, while other hard and brittle materials are close to the center of the carrier 220. When the carrier 220 rotates along the sun gear 200 and also rotates around its own axis, the relative movement distance between some hard and brittle materials close to the edge of the carrier 220 and the traditional diamond grinding pad is longer, while the relative movement distance between other hard and brittle materials close to the center of the carrier 220 and the traditional diamond grinding pad is shorter. In addition, the linear speed of the outer ring of the traditional diamond grinding pad is relatively high, which makes the grinding amount of some hard and brittle materials with a longer moving path greater than that of other hard and brittle materials with a shorter moving path, thereby increasing the difference in grinding amount between some hard and brittle materials and other hard and brittle materials, and thus resulting in a larger difference in thickness between the multiple hard and brittle materials thinned by grinding.

[0042] refer to Figures 6 to 9 The diamond grinding pad of the utility model embodiment comprises:

[0043] The substrate 100 is in a circular ring shape, and is divided into a first circular ring area 110, a second circular ring area 120 and a third circular ring area 130 from the inside to the outside.

[0044] A plurality of first abrasive particles 111 are evenly distributed in the first annular region 110, and the upper surfaces of the plurality of first abrasive particles 111 form a first abrasive surface 112. The first abrasive surface 112 rises smoothly from the inside to the outside, and the first abrasive surface 112 is used to grind a plurality of hard and brittle materials;

[0045] A plurality of second abrasive particles 121 are evenly distributed in the second annular region 120. The upper surfaces of the plurality of second abrasive particles 121 form a second abrasive surface 122. The second abrasive surface 122 smoothly transitions with the first abrasive surface 112. The second abrasive surface 122 is located above the first abrasive surface 112. The second abrasive surface 122 is used to grind a plurality of hard and brittle materials.

[0046] A plurality of third grinding particles 131 are evenly distributed in the third annular area 130, and the upper surfaces of the plurality of third grinding particles 131 constitute a third grinding surface 132. The third grinding surface 132 smoothly descends from the inside to the outside, and the third grinding surface 132 is located below the second grinding surface 122. The third grinding surface 132 smoothly transitions with the second grinding surface 122, and the third grinding surface 132 is used for grinding multiple hard and brittle materials.

[0047] It can be understood that the first grinding surface 112 rises smoothly from the inside to the outside, the third grinding surface 132 descends smoothly from the inside to the outside, the first grinding surface 112 and the second grinding surface 122 transition smoothly, the second grinding surface 122 and the third grinding surface 132 transition smoothly, and the second grinding surface 122 is located above the first grinding surface 112, and the third grinding surface 132 is located below the second grinding surface 122, which makes the height of the first grinding surface 112 smaller than the second grinding surface 122, and the height of the third grinding surface 132 is smaller than the second grinding surface 122. Since the height of the second grinding surface 122 is the highest, the multiple second grinding particles 121 have a larger blade height and higher cutting efficiency when grinding hard and brittle materials, that is, the grinding effect of the second grinding particles 121 is better than the grinding effects of the first grinding particles 111 and the third grinding particles 131.

[0048] When multiple hard and brittle materials need to be ground and thinned, the operator can stick the two diamond grinding pads to the upper and lower turntables respectively, then place the carrier 220 on the diamond grinding pad, and place multiple hard and brittle materials to be ground in multiple positioning holes on the carrier 220 respectively. Then start the double-sided grinder, and the upper and lower turntables can apply pressure. At this time, the diamond grinding pad will rotate around the sun gear 200, and the carrier 220 will rotate around its own axis while rotating around the sun gear 200. Since the first annular area 110, the second annular area 120 and the third annular area 130 are arranged in sequence from the inside to the outside, that is, the multiple first grinding particles 111 and the multiple third grinding particles 131 are respectively close to the inner ring and the outer ring of the diamond grinding pad. Moreover, the grinding effect of the multiple second abrasive particles 121 in the second annular area 120 is better than the grinding effect of the multiple first abrasive particles 111 in the first annular area 110, and the grinding effect of the multiple second abrasive particles 121 in the second annular area 120 is better than the grinding effect of the multiple third abrasive particles 131 in the third annular area 130. This makes the grinding effect of the multiple first abrasive particles 111 and the multiple third abrasive particles 131 on the hard and brittle materials near the edge of the carrier 220 lower than the grinding effect of the multiple second abrasive particles 121 on the hard and brittle materials near the center of the carrier 220, which plays a grinding compensation role.

[0049] Furthermore, because the plurality of first abrasive particles 111 and the plurality of third abrasive particles 131 are more used to grind part of the hard and brittle material near the edge of the carrier 220, and another part of the hard and brittle material near the center of the carrier 220 is more ground by the plurality of second abrasive particles 121, the grinding amount of the hard and brittle material near the edge of the carrier 220 is reduced compared with the hard and brittle material near the center of the carrier 220, thereby reducing the difference in grinding amount between the hard and brittle material near the edge of the carrier 220 and the hard and brittle material near the center of the carrier 220, thereby making the thickness difference between the multiple pieces of hard and brittle materials ground and thinned by the diamond grinding pad smaller, thereby improving the thickness consistency of the grinding and thinning process.

[0050] It should be explained that in the embodiment of the present invention, the diamond micro-powder abrasive is an abrasive composed of a large number of diamond abrasive grains. The diamond grinding pad in the present invention is loaded into the double-sided grinder in the same way as the traditional diamond grinding pad, which will not be further described here. In the present invention, the grinding effect refers to the ability to remove material. The better the grinding effect, that is, the stronger the ability to remove material per unit time, the more the amount of material removed, which will not be further described here.

[0051] As an embodiment of the utility model, the ring width of the first annular region 110 is 25% to 35% of the ring width of the substrate 100, the ring width of the second annular region 120 is 50% to 60% of the ring width of the substrate 100, and the ring width of the third annular region 130 is 10% to 20% of the ring width of the substrate 100. The ring width of the first annular region 110 is greater than the ring width of the third annular region 130. Preferably, the ring width of the first annular region 110 is 30% of the ring width of the substrate 100, the ring width of the second annular region 120 is 55% of the ring width of the substrate 100, and the ring width of the third annular region 130 is 15% of the ring width of the substrate 100.

[0052] In the embodiment of the utility model, the ring width of the first annular region 110 is 30% of the ring width of the substrate 100, the ring width of the second annular region 120 is 55% of the ring width of the substrate 100, and the ring width of the third annular region 130 is 15% of the ring width of the substrate 100, that is, the ring width of the second annular region 120 is the largest, the ring width of the first annular region 110 is the second largest, and the ring width of the third annular region 130 is the smallest. Since the second annular region 120 is located in the middle of the substrate 100, the rotational linear speeds of the plurality of second abrasive particles 121 in the second annular region 120 are relatively balanced, that is, the grinding efficiency of the plurality of second abrasive particles 121 is relatively balanced, and the ring width of the second annular region 120 is the largest, which enables the plurality of hard and brittle materials on the carrier 220 to be ground more frequently by the plurality of second abrasive particles 121 in the second annular region 120. Since the third annular region 130 is close to the outer circle of the substrate 100, the rotational linear velocity of the plurality of third abrasive particles 131 in the third annular region 130 is the largest, that is, the grinding efficiency of the plurality of third abrasive particles 131 is the highest, and the ring width of the third annular region 130 is the smallest, so that the plurality of hard and brittle materials on the carrier 220 will not be frequently ground by the plurality of third abrasive particles 131 in the third annular region 130. Since the first annular region 110 is close to the inner circle of the substrate 100, the rotational linear velocity of the plurality of first abrasive particles 111 in the first annular region 110 is the smallest, that is, the grinding efficiency of the plurality of first abrasive particles 111 is the lowest, and the ring width of the first annular region 110 is smaller than the ring width of the second annular region 120, so that the plurality of hard and brittle materials on the carrier 220 will not be frequently ground by the plurality of first abrasive particles 111 in the first annular region 110. During the grinding and thinning process, multiple pieces of hard and brittle materials can be ground more frequently by the multiple second grinding particles 121 in the second annular area 120, avoiding multiple pieces of hard and brittle materials being in areas with higher or lower grinding rates for a long time, which is beneficial to improving the thickness consistency of the grinding and thinning process.

[0053] In the present invention, the average height of the plurality of second abrasive particles 121 is greater than the average height of the plurality of first abrasive particles 111, the average height of the plurality of second abrasive particles 121 is greater than the average height of the plurality of third abrasive particles 131, and the average height of the plurality of first abrasive particles 111 is greater than the average height of the plurality of third abrasive particles 131. Preferably, the difference between the average height of the plurality of second abrasive particles 121 and the average height of the plurality of first abrasive particles 111 is 20 microns, and the difference between the average height of the plurality of second abrasive particles 121 and the average height of the plurality of third abrasive particles 131 is 25 microns. It can be understood that, similarly, the rotation linear speed of the plurality of third abrasive particles 131 is the largest, while the rotation linear speed of the plurality of first abrasive particles 111 is the smallest, so that the average height of the plurality of second abrasive particles 121 is greater than the average height of the plurality of third abrasive particles 131, which can compensate for the grinding effect of the plurality of first abrasive particles 111 to a certain extent, avoid the grinding effect difference between the first abrasive particles 111 and the third abrasive particles 131 is too large, and is conducive to improving the thickness consistency of the grinding and thinning process.

[0054] In this utility model, reference is made to Fig. 9 The first grinding surface 112, the second grinding surface 122 and the third grinding surface 132 together form a smooth grinding curved surface. The grinding surface formed by the grinding particles on the traditional diamond grinding pad is a plane. The operator can grind and shape the grinding particles on the traditional diamond grinding pad by a grinding stone so that the upper surface of the grinding particles on the traditional diamond grinding pad forms a grinding curved surface, thereby obtaining the diamond grinding pad of the embodiment of the utility model.

[0055] As an embodiment of the present invention, the ratio of the radius of the outer circle of the substrate 100 to the radius of the inner circle of the substrate 100 is 1 to 3. As an embodiment of the present invention, an adhesive layer is provided on the lower surface of the substrate 100. It is understood that the substrate 100 can be attached to a flat machine platform through the adhesive layer.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] Of course, the present invention is not limited to the above-mentioned embodiments, and technicians familiar with the field may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A diamond polishing pad, characterized in that: include: A substrate, the substrate is in a circular ring shape, and is divided into a first circular ring area, a second circular ring area and a third circular ring area from the inside to the outside; A plurality of first abrasive particles are evenly distributed in the first annular region, and the upper surfaces of the plurality of first abrasive particles form a first abrasive surface, the first abrasive surface rises smoothly from the inside to the outside, and the first abrasive surface is used for grinding a plurality of hard and brittle materials; A plurality of second abrasive particles are evenly distributed in the second annular region, and the upper surfaces of the plurality of second abrasive particles form a second abrasive surface, the second abrasive surface smoothly transitions with the first abrasive surface, the second abrasive surface is located above the first abrasive surface, and the second abrasive surface is used to grind a plurality of hard and brittle materials; A plurality of third grinding particles are evenly distributed in the third annular area, and the upper surfaces of the plurality of third grinding particles constitute a third grinding surface. The third grinding surface smoothly descends from the inside to the outside, and the third grinding surface is located below the second grinding surface. The third grinding surface smoothly transitions with the second grinding surface, and the third grinding surface is used to grind a plurality of the hard and brittle materials.

2. The diamond polishing pad according to claim 1, characterized in that: The ring width of the first annular region is 25% to 35% of the ring width of the substrate, the ring width of the second annular region is 50% to 60% of the ring width of the substrate, and the ring width of the third annular region is 10% to 20% of the ring width of the substrate.

3. The diamond polishing pad according to claim 2, characterized in that: The ring width of the first circular ring area is greater than the ring width of the third circular ring area.

4. The diamond polishing pad according to claim 3, characterized in that: The ring width of the first annular region is 30% of the ring width of the substrate, the ring width of the second annular region is 55% of the ring width of the substrate, and the ring width of the third annular region is 15% of the ring width of the substrate.

5. The diamond polishing pad according to claim 1, characterized in that: The average height of the plurality of second abrasive particles is greater than the average height of the plurality of first abrasive particles, the average height of the plurality of second abrasive particles is greater than the average height of the plurality of third abrasive particles, and the average height of the plurality of first abrasive particles is greater than the average height of the plurality of third abrasive particles.

6. The diamond polishing pad according to claim 5, characterized in that: The difference between the average height of the second abrasive particles and the average height of the first abrasive particles is 20 micrometers, and the difference between the average height of the second abrasive particles and the average height of the third abrasive particles is 25 micrometers.

7. The diamond polishing pad according to claim 1, characterized in that: The ratio of the radius of the outer circle of the substrate to the radius of the inner circle of the substrate is 1-3.

8. The diamond polishing pad according to claim 1, characterized in that: An adhesive layer is provided on the lower surface of the substrate.

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