Novel double-groove cutting wheel of diamond wire guillotine shear

Abstract

The utility model relates to the technical field of semiconductors, in particular to a novel double-groove cutting wheel of a diamond wire guillotine shear. The cutting wheel comprises an inner wheel and an outer wheel which are fixedly connected, two wire grooves are formed in the position, close to the outer edge, of the outer wheel, the upper surface area of each wire groove is larger than the lower surface area of each wire groove, the section of each wire groove is arranged in an inverted isosceles triangle shape, a boss is arranged on the outer side of the inner wheel, and the outer wheel is composed of two semicircular rings. Grooves matched with the bosses are formed in the inner sides of the semicircular rings. The device solves the problem that sample collection can be achieved only through two times of cutting.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a novel double-groove cutting wheel for a diamond wire cutting machine. Background Art

[0002] The diamond wire cutting machine in the semiconductor industry is mainly used for removing head pieces and taking samples of semiconductor materials. Currently, the main machine used is a single-slot cutting wheel. A diamond wire is installed on the single slot of two single-slot cutting wheels. The single-slot cutting wheel drives the diamond wire downward to cut the semiconductor material for a single cut to take a single piece. Due to the irregular shape of the crystal, the TTV deviation of the head piece is large and it is often treated as waste. Continuing to cut to obtain the sample can be used for product sampling. The TTV of the sample is required to be ≤30um. The current single-slot cutting wheel requires two cuts to achieve sample collection, which takes twice the time. Utility Model Content

[0003] In order to solve the problems in the related art, the utility model provides a novel double-groove cutting wheel for a diamond wire cutting machine, which solves the problem that sample collection can only be achieved after two cuts.

[0004] In order to solve the above problems, the following technical solutions are provided:

[0005] The utility model discloses a new double-groove cutting wheel for a diamond wire cutting machine, comprising a cutting wheel, wherein the cutting wheel comprises an inner wheel and an outer wheel, wherein the inner wheel is fixedly connected to the outer wheel, and two wire grooves are provided near the outer edge of the outer wheel, wherein the upper surface area of ​​the wire grooves is greater than the lower surface area of ​​the wire grooves, and the cross-section of the wire grooves is arranged in an inverted isosceles triangle.

[0006] In the above scheme, two diamond wires are respectively installed in the two wire grooves on the two cutting wheels. The cutting wheels drive the diamond wires to cut and take slices, thereby achieving the dual functions of removing the head slice and taking the sample slice in one cutting, saving time and improving efficiency, thereby solving the problem of requiring two cuttings to achieve sample collection.

[0007] The outer side of the inner wheel is provided with a boss, and the outer wheel is composed of two semicircular rings, and the inner sides of the semicircular rings are provided with grooves matched with the boss.

[0008] In the above scheme, the boss and the convex teeth are matched, the outer wheel is easy to wear during use, and the outer wheel is easy to replace.

[0009] The runout accuracy of the wire trough is within 0.02 mm, and the coaxiality of the bottom and top of the wire trough is within 0.03 mm.

[0010] In the above scheme, strict requirements on accuracy are implemented to achieve cutting sample parameters that meet the requirement of TTV≤30um.

[0011] A polyurethane coating layer is arranged on the outer surfaces of the inner wheel and the outer wheel, and the hardness of the polyurethane coating layer is HA95-99.

[0012] The above scheme adopts a polyurethane coating layer, which is a special material for diamond wire and improves the wear resistance of the cutting wheel.

[0013] The above solution has the following advantages:

[0014] 1. The double-groove cutting wheel of the new diamond wire cutting machine of the utility model includes a cutting wheel, which includes an inner wheel and an outer wheel, the inner wheel is fixedly connected to the outer wheel, and two wire grooves are provided near the outer edge of the outer wheel, the upper surface area of ​​the wire grooves is larger than the lower surface area of ​​the wire grooves, and the cross-section of the wire grooves is arranged in an inverted isosceles triangle. Two diamond wires are respectively installed in the two wire grooves on the two cutting wheels, and the cutting wheels drive the diamond wires to cut and take slices, thereby realizing the dual functions of obtaining head removal slices and sampling slices in one cutting, reducing the time for secondary cutting and sampling, and improving equipment efficiency.

[0015] 2. A boss is arranged on the outer side of the inner wheel, and the outer wheel is composed of two semicircular rings. The inner sides of the semicircular rings are provided with grooves matching the boss. The outer wheel is easy to wear during use, so it is convenient to replace the outer wheel. Through strict requirements on accuracy, the cutting sample parameters can meet the requirements of TTV≤30um. A polyurethane coating layer is arranged on the outer surfaces of the inner wheel and the outer wheel. The hardness of the polyurethane coating layer is HA95-99. The polyurethane coating layer is a special material for diamond wire to improve the wear resistance of the cutting wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the double-groove cutting wheel of the new diamond wire cutting machine;

[0017] Figure 2 It is a cross-sectional view of the double-groove cutting wheel of a new diamond wire cutting machine;

[0018] Figure 3 This is an enlarged schematic diagram of part A of the double-groove cutting wheel of the new diamond wire cutting machine;

[0019] Explanation of the accompanying drawings: 1. inner wheel; 2. outer wheel; 3. wire groove; 4. boss; 5. groove; 6. groove bottom; 7. groove top. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figures 1 to 3 As shown, the new double-groove cutting wheel of the diamond wire cutting machine of the utility model includes a cutting wheel, the cutting wheel includes an inner wheel 1 and an outer wheel 2, the inner wheel 1 is fixedly connected to the outer wheel 2, two wire grooves 3 are provided near the outer edge of the outer wheel 2, the upper surface area of ​​the wire groove 3 is larger than the lower surface area of ​​the wire groove 3, and the cross-section of the wire groove 3 is arranged in an inverted isosceles triangle.

[0022] A boss 4 is provided on the outer side of the inner wheel 1, and a groove 5 matched with the boss 4 is provided on the inner side of the outer wheel 2. The outer wheel 2 is composed of two semicircular rings, and the inner surfaces of the two semicircular rings are against the outer surface of the inner wheel 1. The two semicircular rings are installed on the outer side of the inner wheel 1 to facilitate the replacement of the outer wheel 2.

[0023] The runout accuracy of the wire slot 3 is within 0.02mm, the coaxiality of the bottom 6 and top 7 of the wire slot 3 is within 0.03mm, the end surface flatness is required to be within 0.02mm, and the verticality and parallelism of the processing surface and each basic surface are also required to be within 0.02mm. The cutting wheel is subjected to a dynamic balancing test with an accuracy of 1.5gmm / kg. Through strict requirements on accuracy, the cutting sample parameters meet the requirements of TTV≤30um. The specific processing methods and testing processes are all existing technologies and will not be repeated here.

[0024] A polyurethane coating layer is provided on the outer surface of the inner wheel 1 and the outer wheel 2. The hardness of the polyurethane coating layer is HA95-99. The polyurethane coating layer is a special material for diamond wire, which improves the wear resistance of the cutting wheel.

[0025] Two diamond wires are installed in the wire grooves 3 on the two cutting wheels to form two parallel cutting lines. The cutting wheels move downward to drive the diamond wires to cut the semiconductor material. One cutting can obtain a head piece and a sample piece. By selecting the sample piece, sample collection can be achieved.

[0026] In the description of the present utility model, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be a direct connection, or it can be an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. The new double groove cutting wheel of diamond wire cutting machine is characterized by: The invention comprises a cutting wheel, wherein the cutting wheel comprises an inner wheel (1) and an outer wheel (2), wherein the inner wheel (1) is fixedly connected to the outer wheel (2), and two wire grooves (3) are provided at positions near the outer edge of the outer wheel (2), wherein the upper surface area of ​​the wire grooves (3) is larger than the lower surface area of ​​the wire grooves (3), and the cross section of the wire grooves (3) is arranged in the shape of an inverted isosceles triangle.

2. The novel double groove cutting wheel for diamond wire cutting machine as claimed in claim 1, characterized in that: The outer side of the inner wheel (1) is provided with a boss (4), and the outer wheel (2) is composed of two semicircular rings, and the inner sides of the semicircular rings are provided with grooves (5) that match the boss (4).

3. The novel double groove cutting wheel for diamond wire cutting machine as claimed in claim 1, characterized in that: The runout accuracy of the wire groove (3) is within 0.02 mm, and the coaxiality of the groove bottom (6) and the groove top (7) of the wire groove (3) is within 0.03 mm.

4. The novel double groove cutting wheel for diamond wire cutting machine as claimed in claim 1, characterized in that: A polyurethane coating layer is provided on the outer surfaces of the inner wheel (1) and the outer wheel (2).

5. The novel double groove cutting wheel for diamond wire cutting machine as claimed in claim 4, characterized in that: The hardness of the polyurethane coating layer is HA95-99.

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