Automatic wafer splitting machine for chip production

Abstract

The utility model relates to the technical field of chip production, and discloses an automatic wafer splitting machine for chip production, which comprises a processing table, a support frame is fixedly mounted at the top of the processing table, a hydraulic push rod is fixedly mounted in the middle of the top of the support frame, and a mounting seat is fixedly mounted at the other end of the hydraulic push rod. And a continuous cutting mechanism is mounted in the mounting seat. The hydraulic push rod is driven to push the mounting seat to move downwards, so that a plurality of groups of splitting knives in the mounting seat can cut a wafer at the top of the processing strip, when an operator changes the cutting position of the wafer, the hydraulic push rod can slowly push the mounting seat to move upwards, and meanwhile, the motor positioned on one side of the mounting seat can drive the rotating rod to rotate; the splitting knife which is just cut is rotated towards the rear side and rubs with the interior of the knife sharpener, the used splitting knife is sharpened, it is guaranteed that after a wafer is cut by each group of splitting knives, the wafer is sharpened by the knife sharpener, and the splitting knives can continuously cut the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to an automatic wafer splitting machine for chip production. Background Art

[0002] At present, chip is a general term for semiconductor component products. In electronics, wafer / chip is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of semiconductor wafers.

[0003] Among them, the existing chip is split and split the whole chip during the processing process. The existing splitting method is usually through manual splitting, which reduces the splitting efficiency.

[0004] In order to improve the splitting efficiency, the market will use a splitting machine to split the wafer. However, due to the high hardness of the wafer, the splitting knife installed in the splitting machine will become blunt during continuous splitting of the wafer and need to be disassembled and replaced. Since it takes a long time to replace the knife, the wafer splitting efficiency is delayed. Therefore, a new technical solution needs to be designed to solve this problem. Utility Model Content

[0005] The utility model aims to provide an automatic wafer splitting machine for chip production, which solves the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an automatic wafer splitting machine for chip production, comprising a processing table, a support frame is fixedly installed on the top of the processing table, a hydraulic push rod is fixedly installed in the middle of the top of the support frame, a mounting seat is fixedly installed on the other end of the hydraulic push rod, and a continuous cutting mechanism is installed inside the mounting seat;

[0007] The continuous cutting mechanism includes a rotating rod rotatably installed inside the mounting seat, a plurality of equally spaced mounting frames fixedly installed on the rotating rod, four groups of equally spaced splitting knives fixedly installed on the outside of each group of mounting frames, and a plurality of equally spaced sharpeners fixedly installed on the inner wall of the mounting seat.

[0008] As an optional solution of the technical solution of the present application, the number of the knife sharpeners is consistent with the number of the mounting frames, and the knife sharpeners and the splitting knives correspond to each other.

[0009] As an optional solution of the technical solution of the present application, four groups of equidistantly distributed positioning members are fixedly installed on the outer wall of each group of the mounting frame, and each group of the positioning members is fixedly installed with the splitting knife by positioning bolts, so as to fix the splitting knife.

[0010] As an optional solution of the technical solution of the present application, a servo motor is fixedly installed on one side of the mounting seat, the driving output end of the servo motor is connected to the transmission shaft, and the other side of the transmission shaft is fixedly installed on one end of the rotating rod, which can drive the rotating rod to rotate.

[0011] As an optional solution of the technical solution of the present application, an angle sensor is fixedly installed on one side of the outer wall of the rotating rod to control the rotation angle of the rotating rod.

[0012] As an optional solution to the technical solution of the present application, limit holes are provided on both sides of the top of the support frame, and limit rods are movably installed in the two groups of limit holes. The bottoms of the two groups of limit rods are fixedly installed on the top of the mounting seat, so as to limit the mounting seat.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] 1. The technical solution of the present application drives the hydraulic push rod to push the mounting seat to move downward, so that multiple groups of splitting knives inside the mounting seat can cut the wafer on the top of the processing strip. When the operator changes the wafer cutting position, the hydraulic push rod will slowly push the mounting seat upward. At the same time, the motor located on one side of the mounting seat will drive the rotating rod to rotate, and the splitting knife that has just cut will be rotated to the rear side, and rub against the inside of the sharpener to sharpen the splitting knife after use, ensuring that each group of splitting knives is sharpened by the sharpener after cutting the wafer, so that the splitting knife can continue to cut the wafer.

[0015] 2. The technical solution of the present application is to open limit holes on both sides of the top of the support frame, and limit rods are movably installed in the two sets of limit holes. When the hydraulic push rod is driven to push the mounting seat up and down, the limit rods in the limit holes can be used to ensure that the mounting seat moves up and down in the vertical direction, so that the multiple sets of splitting knives inside the mounting seat can accurately cut the lenses on the processing table. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of an automatic wafer splitting machine for chip production according to the utility model;

[0018] Figure 2 This is a schematic diagram of the internal structure of a mounting base of an automatic wafer splitting machine for chip production according to the utility model;

[0019] Figure 3 The utility model is a schematic diagram of the installation structure of a splitting knife of an automatic wafer splitting machine for chip production.

[0020] In the figure: 1. processing table; 11. support frame; 12. hydraulic push rod; 2. mounting seat; 21. rotating rod; 22. mounting frame; 23. splitting knife; 24. knife sharpener; 3. positioning piece; 31. servo motor; 32. limit hole; 33. limit rod; 34. angle sensor. DETAILED DESCRIPTION

[0021] See also Figure 1-3 The utility model provides a technical solution: an automatic wafer splitting machine for chip production, comprising a processing table 1, a support frame 11 is fixedly installed on the top of the processing table 1, a hydraulic push rod 12 is fixedly installed in the middle of the top of the support frame 11, a mounting seat 2 is fixedly installed on the other end of the hydraulic push rod 12, and a continuous cutting mechanism is installed inside the mounting seat 2;

[0022] The continuous cutting mechanism includes a rotating rod 21 rotatably installed inside the mounting seat 2, a plurality of equally spaced mounting frames 22 fixedly installed on the rotating rod 21, four equally spaced splitting knives 23 fixedly installed on the outside of each mounting frame 22, and a plurality of equally spaced sharpeners 24 fixedly installed on the inner wall of the mounting seat 2, the number of the sharpeners 24 is consistent with the number of the mounting frames 22, and the sharpeners 24 correspond to the splitting knives 23.

[0023] In this technical solution, by driving the hydraulic push rod 12 to push the mounting seat 2 to move downward, the multiple groups of splitting knives 23 inside the mounting seat 2 can cut the wafer at the top of the processing strip. When the operator changes the wafer cutting position, the hydraulic push rod 12 will slowly push the mounting seat 2 upward. At the same time, the motor located on one side of the mounting seat 2 will drive the rotating rod 21 to rotate, and the splitting knife 23 that has just been cut will be rotated backward, and rubbed against the inside of the sharpener 24 to sharpen the splitting knife 23 after use, ensuring that each group of splitting knives 23 is sharpened by the sharpener 24 after cutting the wafer, so that the splitting knife 23 can continue to cut the wafer.

[0024] In some technical solutions, limiting holes 32 are opened on both sides of the top of the support frame 11, and limiting rods 33 are movably installed in the two groups of limiting holes 32. The bottoms of the two groups of limiting rods 33 are fixedly installed on the top of the mounting seat 2, which can limit the mounting seat 2.

[0025] In this technical solution, when the hydraulic push rod 12 is driven to push the mounting seat 2 up and down, the limiting rod 33 in the limiting hole 32 can ensure that the mounting seat 2 moves up and down in the vertical direction, so that the multiple groups of splitting knives 23 inside the mounting seat 2 can accurately cut the lens on the processing table 1.

[0026] In some technical solutions, a servo motor 31 is fixedly installed on one side of the mounting base 2, and the driving output end of the servo motor 31 is connected to the transmission shaft, and the other side of the transmission shaft is fixedly installed on one end of the rotating rod 21, which can drive the rotating rod 21 to rotate. An angle sensor 34 is fixedly installed on one side of the outer wall of the rotating rod 21, which can control the rotation angle of the rotating rod 21.

[0027] In this technical solution, after the servo motor 31 is driven to drive the rotating rod 21 to rotate, the angle of rotation of the rotating rod 21 can be controlled in conjunction with the angle sensor 34 to ensure that each group of rotation angles of the rotating rod 21 is at forty-five degrees.

[0028] In some technical solutions, four groups of equally spaced positioning members 3 are fixedly mounted on the outer wall of each group of mounting frames 22 , and each group of positioning members 3 is fixedly mounted to the splitting knife 23 via positioning bolts, so that the splitting knife 23 can be fixed.

[0029] In this technical solution, when the splitting knife 23 is being installed, the splitting knife 23 can be firmly locked by cooperating with the positioning piece 3 threadedly connected on the mounting frame 22.

[0030] When an automatic wafer splitting machine for chip production is used, it should be noted that the utility model is an automatic wafer splitting machine for chip production, and each component is a universal standard part or a component known to technical personnel in this field, and its structure and principle can be known to technical personnel through technical manuals or through conventional experimental methods.

[0031] When in use, the wafer to be cut is first clamped on the top of the processing table 1, and then the hydraulic push rod 12 is driven to push the mounting seat 2 to move downward, so that the multiple groups of splitting knives 23 inside the mounting seat 2 can cut the wafer on the top of the processing strip. When the operator changes the wafer cutting position, the hydraulic push rod 12 will slowly push the mounting seat 2 to move upward, and at the same time, the motor located on one side of the mounting seat 2 will drive the rotating rod 21 to rotate, so that the splitting knife 23 that has just been cut is rotated to the rear side, and rubs against the inside of the sharpener 24 to sharpen the splitting knife 23 after use. The knife ensures that each group of splitting knives 23 is sharpened by the knife sharpener 24 after cutting the wafer, so that the splitting knives 23 can continue to cut the wafer. At the same time, limiting holes 32 are provided on both sides of the top of the support frame 11, and limiting rods 33 are movably installed in the two groups of limiting holes 32. When the hydraulic push rod 12 is driven to push the mounting seat 2 to move up and down, the limiting rods 33 in the limiting holes 32 can be used to ensure that the mounting seat 2 moves up and down in the vertical direction, so that the multiple groups of splitting knives 23 inside the mounting seat 2 can accurately cut the lens on the processing table 1.

Claims

1. An automatic wafer splitting machine for chip production, comprising a processing table (1), characterized in that: A support frame (11) is fixedly mounted on the top of the processing table (1), a hydraulic push rod (12) is fixedly mounted in the middle of the top of the support frame (11), a mounting seat (2) is fixedly mounted on the other end of the hydraulic push rod (12), and a continuous cutting mechanism is mounted inside the mounting seat (2); The continuous cutting mechanism comprises a rotating rod (21) rotatably mounted inside the mounting seat (2), a plurality of groups of equally spaced mounting frames (22) fixedly mounted on the rotating rod (21), four groups of equally spaced splitting knives (23) fixedly mounted on the outside of each group of the mounting frames (22), and a plurality of groups of equally spaced knife sharpeners (24) fixedly mounted on the inner wall of the mounting seat (2).

2. The automatic wafer splitting machine for chip production according to claim 1, characterized in that: The number of the knife sharpeners (24) is consistent with the number of the mounting frames (22), and the knife sharpeners (24) and the splitting knives (23) correspond to each other.

3. The automatic wafer splitting machine for chip production according to claim 1, characterized in that: Four groups of equally spaced positioning members (3) are fixedly mounted on the outer wall of each group of the mounting frames (22), and each group of the positioning members (3) is fixedly mounted on the splitting knife (23) via positioning bolts.

4. The automatic wafer splitting machine for chip production according to claim 1, characterized in that: A servo motor (31) is fixedly mounted on one side of the mounting seat (2); a driving output end of the servo motor (31) is transmission-connected to a transmission shaft, and the other side of the transmission shaft is fixedly mounted to one end of a rotating rod (21).

5. The automatic wafer splitting machine for chip production according to claim 1, characterized in that: An angle sensor (34) is fixedly mounted on one side of the outer wall of the rotating rod (21).

6. The automatic wafer splitting machine for chip production according to claim 1, characterized in that: Limiting holes (32) are provided on both sides of the top of the support frame (11), and limiting rods (33) are movably installed in the two groups of limiting holes (32), and the bottoms of the two groups of limiting rods (33) are fixedly installed on the top of the mounting seat (2).

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