Cleaning device

Abstract

The utility model provides a cleaning device. The cleaning device comprises a cleaning chamber, an air inlet mechanism and an ionization mechanism. And the gas inlet mechanism introduces reaction gas into the reaction cavity of the cleaning chamber. The ionization mechanism comprises a radio frequency power supply, a communication electrode, a radio frequency electrode and a zero electrode. A cleaning area is formed in the area between the radio frequency electrode and the zero position electrode so that plasma can be used for cleaning the jig. According to the cleaning device, by arranging the radio-frequency power source, the communication electrode, the radio-frequency electrode, the zero electrode and other structures, efficient and stable transmission of radio-frequency signals from the power source to the electrodes is ensured, and therefore it is ensured that potential difference can be generated between the radio-frequency electrode and the zero electrode; therefore, the reaction gas can be ionized to generate plasma so as to clean the jig, the cleaning effect is improved, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of carrier cleaning, and in particular to a cleaning device. Background Art

[0002] In the current silicon cell production process, low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD) and other processes are widely used to deposit various process films. While depositing a film of a specific component on the surface of the silicon wafer, the surface of its supporting fixture (for example, graphite boat, etc.) will inevitably be deposited with a film of the same component. During repeated use, the film will be deposited thicker and thicker, which will affect the process production effect and the process quality of the deposited film. Therefore, after the silicon wafer supporting fixture has been used for a certain period of time, it needs to be cleaned to remove various byproduct films deposited on the surface. The current conventional cleaning process is to use a certain proportion (25% ± 5%) of HF solution for soaking, then rinse with deionized water, and finally dry in an oven. The time for each of these three steps is about 8±2 hours, that is, the time for complete wet cleaning of a carrier jig is about 24 hours, which is time-consuming and greatly reduces the circulation rate of the carrier jig, so more carrier jigs have to be purchased for transfer, which increases the cost. Utility Model Content

[0003] In view of this, the present application proposes a cleaning device capable of performing dry cleaning on a carrier jig, so as to increase the cleaning speed and efficiency and improve the cleaning effect.

[0004] One embodiment of the present application proposes a cleaning device, including a cleaning chamber, an air intake mechanism and an ionization mechanism. The cleaning chamber includes a cavity, and a reaction chamber is formed in the cavity. The air intake mechanism is connected to the reaction chamber to introduce reaction gas into the reaction chamber. The ionization mechanism is used to ionize the reaction gas to generate plasma, and the ionization mechanism includes a radio frequency power supply, a connecting electrode, a radio frequency electrode and two zero-position electrodes. The connecting electrode, the radio frequency electrode and the zero-position electrode are arranged in the reaction chamber. The connecting electrode is electrically connected to the radio frequency power supply, and the radio frequency electrode is electrically connected to the connecting electrode, and the radio frequency electrode and the zero-position electrode both extend along the length direction of the cleaning chamber. Along the width direction of the cleaning chamber, the two zero-position electrodes are respectively arranged on both sides of the radio frequency electrode, and the area between the radio frequency electrode and the zero-position electrode forms a cleaning area to use plasma to clean the fixture.

[0005] In one embodiment, the interconnecting electrode comprises an electrode rod, a first insulating member sleeved on a portion of the surface of the electrode rod, a shielding member sleeved on a portion of the surface of the first insulating member, and a second insulating member sleeved on a portion of the surface of the shielding member. The electrode rod has a first end and a second end that are arranged opposite to each other. The first end is connected to a radio frequency power source, and the second end extends from the second insulating member and extends into the reaction chamber.

[0006] In one embodiment, the first end of the electrode rod includes a first protrusion. The first insulating member has a third end and a fourth end that are arranged opposite to each other, the third end is close to the first end, the third end abuts against the first protrusion, and the third end includes a second protrusion. The shielding member includes a main body and an extension portion connected to the main body, the extension portion covers the third end of the first insulating member, and the second protrusion abuts against the end of the main body facing the extension portion.

[0007] In one embodiment, the second insulating member includes a first insulating portion and a second insulating portion arranged around an edge of the first insulating portion. The second insulating portion covers a portion of the surface of the main body, and the fourth end of the first insulating member and the end of the main body away from the extension portion abut against the first insulating portion. The first insulating portion has a through hole, and the second end of the electrode rod extends out of the through hole.

[0008] In one embodiment, the radio frequency electrode includes an electrode block, a first electrode plate and a first insulating plate. The electrode block is fixedly connected to the second end of the electrode rod, and the first electrode plate is connected to the electrode block and extends along the length direction of the cleaning chamber. The first insulating plate includes a first plate, a second plate, a third plate and a fourth plate, the first plate and the second plate are respectively arranged on two surfaces of the first electrode plate that are opposite to each other along its height direction, and the third plate and the fourth plate are respectively arranged on two surfaces of the first electrode plate that are opposite to each other along its length direction.

[0009] In one embodiment, the cavity includes a bottom wall and a plurality of side walls connected to the bottom wall. A second insulating plate is provided on the inner surface of the bottom wall, and a third insulating plate is provided on the inner surface of each side wall. Each zero-position electrode includes a second electrode plate, two adapter plates, and two fixed plates. The second electrode plate extends along the length direction of the cleaning chamber, and two ends of the second electrode plate are fixed to the adapter plates in a one-to-one correspondence. The adapter plate is configured to be movable on the fixed plate, and the fixed plate is fixed to the second insulating plate.

[0010] In one embodiment, the adapter plate includes a first portion and a second portion connected vertically. The first portion is fixed to the second electrode plate, and the second portion is provided with a first opening. The fixed plate is provided with a plurality of second openings arranged along the width direction of the cleaning chamber, and the first opening is configured to be aligned with different second openings, so that the second portion can be fixed to the fixed plate.

[0011] In one embodiment, two surfaces of the radio frequency electrode facing the two zero-position electrodes are provided with a plurality of through pores, and two surfaces of the two zero-position electrodes facing the radio frequency electrode are provided with a plurality of through pores.

[0012] In one embodiment, the cavity is provided with an air inlet and an air outlet. The air inlet and the air outlet are respectively located at the two ends of the length direction of the cleaning chamber, the air inlet is located on the side of a zero-position electrode away from the radio frequency electrode, and the air outlet is located on the side of another zero-position electrode away from the radio frequency electrode. The air inlet is used to connect the air inlet mechanism, and the air outlet is used to extract gas.

[0013] In one embodiment, the cleaning chamber further comprises a cover plate, which is used to seal the reaction chamber. A fourth insulating plate is provided on the surface of the cover plate facing the reaction chamber, and both the cover plate and the chamber are provided with observation windows. The cleaning device further comprises a vacuum pumping mechanism. The vacuum pumping mechanism comprises a vacuum pump and a vacuum gauge, and both the vacuum pump and the vacuum gauge are connected to the reaction chamber.

[0014] The cleaning device of the present application ensures efficient and stable transmission of the RF signal from the power supply to the electrode by setting structures such as the RF power supply, the interconnecting electrode, the RF electrode and the zero-position electrode, thereby ensuring that a potential difference can be generated between the RF electrode and the zero-position electrode, and then the reaction gas can be ionized to generate plasma to clean the fixture, thereby improving the cleaning effect. In addition, one RF electrode corresponds to two zero-position electrodes, and both sides of the RF electrode can discharge at the same time, increasing the cleaning position of the fixture, thereby improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a cleaning device according to one embodiment of the present application.

[0016] Figure 2 for Figure 1 A top view of the cleaning device shown.

[0017] Figure 3 for Figure 1 The schematic diagram of the partial structure of the cleaning device after removing the cover plate is shown.

[0018] Figure 4 for Figure 3 Top view of the structure shown.

[0019] Figure 5 for Figure 3 A cross-sectional view of the connected electrodes of the cleaning device shown.

[0020] Figure 6 for Figure 3 A cross-sectional view of the connecting electrode and the radio frequency electrode of the cleaning device shown.

[0021] Figure 7 for Figure 3 Enlarged schematic diagram of position VII in the figure.

[0022] Figure 8 for Figure 3 Enlarged schematic diagram of position VIII in the figure.

[0023] Main component symbols

[0024] 100: cleaning device; 10: cleaning chamber; 20: air inlet mechanism; 30: ionization mechanism; 40: vacuum mechanism; 11: chamber; 12: cover plate; 13: observation window; 110: reaction chamber; 111: bottom wall; 112: side wall; 113: second insulating plate; 114: third insulating plate; 115: air inlet hole; 116: air outlet hole; 1121: first side wall; 1122: second side wall; 31: RF power supply; 32: connecting electrode; 33: RF electrode; 34: zero position electrode; 321: electrode rod; 322: first insulating member; 323: shielding member; 324: second insulating member; 3211: first end; 3212: second end; 3213: first edge; 3214: first protrusion; 3221: third end; 3222: fourth end; 3223: second protrusion; 3231: main body; 3232: extension; 3241: first insulating portion; 3242: second insulating portion; 3243: through hole; 330: groove; 331: electrode block; 332: first electrode plate; 333: first insulating plate; 3320: air hole; 3331: first plate; 3332: second plate; 3333: third plate; 3334: fourth plate; 334: mounting portion; 335: first mounting hole; 341: second electrode plate; 342: adapter plate; 343: fixing plate; 3421: first part; 3422: second part; 3423: third mounting hole; 3424: first opening; 3411: fourth mounting hole; 3412: air hole; 3430: second opening; 41: vacuum pump; 42: vacuum gauge; X: length direction; Y: width direction; Z: height direction.

[0025] The following specific implementation manner will further illustrate the embodiments of the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present application embodiments. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application embodiments. The raw materials, reagents or instruments used without indicating the manufacturer are conventional products that can be purchased commercially.

[0027] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may be present therebetween. Conversely, when a layer is referred to as being "directly on" another layer, there are no intervening layers. When a component is referred to as being "fixed to," "mounted to," or "disposed on" another component, it can be directly on the other component or an intervening component may also be present.

[0029] Here, the embodiments of the present application are described with reference to the cross-sectional views, which are schematic diagrams of the idealized embodiments (and intermediate configurations) of the present application. Thus, it is foreseeable that the shapes of the diagrams are different due to manufacturing processes and / or tolerances. Therefore, the embodiments of the present application should not be interpreted as being limited to the specific shapes of the regions illustrated here, but should include deviations in shapes such as those produced due to manufacturing. The regions shown in the figures are themselves only schematic, and their shapes are not used to illustrate the actual shapes of the devices, and are not used to limit the scope of the present application.

[0030] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0031] See also Figures 1 to 3 The present application provides a cleaning device 100, which can remove the process film (byproduct) on the surface of a fixture (not shown). The fixture can be, but is not limited to, a graphite boat, a quartz boat, a silicon carbide boat, a metal product, etc. The cleaning device 100 includes a cleaning chamber 10, an air intake mechanism 20, and an ionization mechanism 30.

[0032] like Figure 1 and Figure 2 As shown, the cleaning chamber 10 includes a cavity 11. The cavity 11 can be roughly a rectangular parallelepiped or a cube structure. Figure 3 As shown, the cavity 11 is hollow inside, and a reaction chamber 110 is formed therein. The tool to be cleaned is placed in the reaction chamber 110 to perform a cleaning process.

[0033] like Figure 1 and Figure 3 As shown, the gas inlet mechanism 20 is connected to the reaction chamber 110 to introduce the reaction gas into the reaction chamber 110. The reaction gas may include a fluorine-containing gas, such as nitrogen trifluoride (NF 3 ), carbon tetrafluoride (CF 4) etc. The reaction gas can be ionized to generate plasma, which reacts with the process film on the surface of the fixture to form gaseous compounds that are blown away, thereby achieving the purpose of cleaning the surface of the fixture.

[0034] like Figure 3 and Figure 4 As shown, the ionization mechanism 30 includes a radio frequency power supply 31, a connecting electrode 32, a radio frequency electrode 33 and two zero-position electrodes 34. The ionization mechanism 30 is used to ionize the reaction gas in the reaction chamber 110 to generate plasma. The radio frequency power supply 31 is arranged outside the reaction chamber 110, and the radio frequency power supply 31 is used to generate a radio frequency (RF) signal. The connecting electrode 32 is arranged in the reaction chamber 110 and is electrically connected to the radio frequency power supply 31. The connecting electrode 32 transmits the radio frequency signal output by the radio frequency power supply 31. The radio frequency electrode 33 is arranged in the reaction chamber 110 and is electrically connected to the connecting electrode 32. The connecting electrode 32 can thus transmit the radio frequency signal to the radio frequency electrode 33. The connecting electrode 32 and the radio frequency electrode 33 extend in the reaction chamber 110 along the length direction X of the cleaning chamber 10. The two zero-position electrodes 34 are both arranged in the reaction chamber 110, and along the width direction Y of the cleaning chamber, the two zero-position electrodes 34 are respectively arranged on both sides of the radio frequency electrode 33. The zero-position electrode 34 is arranged substantially parallel to the RF electrode 33, and the area between the RF electrode 33 and the zero-position electrode 34 forms a cleaning area for placing the jig to be cleaned. After the RF power supply 31 is turned on, a potential difference is generated between the RF electrode 33 and the zero-position electrode 34, which excites the reaction gas between the RF electrode 33 and the zero-position electrode 34 to ionize and generate plasma, thereby cleaning the jig.

[0035] By setting up the structures such as the RF power supply 31, the interconnecting electrode 32, the RF electrode 33 and the two zero-position electrodes 34, the efficient and stable transmission of the RF signal from the power supply to the electrode is ensured, thereby ensuring that a potential difference can be generated between the RF electrode 33 and the zero-position electrode 34, and then the reaction gas can be ionized to generate plasma to clean the fixture, thereby improving the cleaning effect. In addition, one RF electrode 33 is set corresponding to two zero-position electrodes 34, and both sides of the RF electrode 33 can discharge at the same time, which increases the cleaning position of the fixture, thereby improving the cleaning efficiency.

[0036] In some embodiments, the electrode plate of the nulling electrode 34 may be grounded to achieve a zero or low potential potential of the nulling electrode 34. Figure 1As shown, the RF power supply 31 has only one output end (single output end), which is electrically connected to the communication electrode 32, and the electrode plate of the null electrode 34 is grounded. The frequency of the RF power supply 31 with a single output end can be 13.56MHz, and the power can be 1000w. In other embodiments, the RF power supply 31 has two output ends, one of which is electrically connected to the communication electrode 32, and the other is electrically connected to the null electrode 34, and the null electrode 34 is grounded. The frequency of the RF power supply 31 with dual output ends can be 40KHz.

[0037] In some embodiments, Figure 3 and Figure 5 As shown, the interconnecting electrode 32 includes an electrode rod 321, a first insulating member 322 sleeved on a portion of the surface of the electrode rod 321, a shielding member 323 sleeved on the surface of the first insulating member 322, and a second insulating member 324 sleeved on a portion of the surface of the shielding member 323. The electrode rod 321 is roughly cylindrical or rectangular, and the electrode rod 321 extends along the length direction X of the cleaning chamber 10. Along the length direction X of the cleaning chamber 10, the electrode rod 321 has a first end 3211 and a second end 3212 that are oppositely arranged, the first end 3211 is electrically connected to the RF power supply 31, and the second end 3212 extends from the second insulating member 324 and extends into the reaction chamber 110. The first insulating member 322 covers a portion of the surface of the electrode rod 321, and the first end 3211 and the second end 3212 can be exposed from the first insulating member 322. The first insulating member 322 is used to insulate the electrode rod 321 from the outside. The "end" in this application refers to an area extending inward from the edge by approximately 10%. For example, the first end 3211 of the electrode rod 321 has a first edge 3213 , and the first end 3211 of the electrode rod 321 refers to a region extending within 10% from the first edge 3213 to the inside of the electrode rod 321 .

[0038] In some embodiments, Figure 5 As shown, the first end 3211 of the electrode plate 321 includes a first protrusion 3214. The first protrusion 3214 can be formed by extending a portion of the surface of the first end 3211 along the height direction Z of the cleaning chamber 10. Along the length direction X of the cleaning chamber 10, the first insulating member 322 has a third end 3221 and a fourth end 3222 that are relatively arranged. The third end 3221 is close to the first end 3211, and the fourth end 3222 is close to the second end 3212. The third end 3221 abuts against the first protrusion 3214. In this application, the term "abut" means that the two parts are in contact with each other and there is a thrust force between the two. That is, the third end 3221 is in contact with the first protrusion 3214 and there is a thrust force. The third end 3221 includes a second protrusion 3223, and the second protrusion 3223 can be formed by extending a portion of the surface of the third end 3221 along the height direction Z of the cleaning chamber 10.

[0039] In some embodiments, Figure 5 As shown, the shielding member 323 covers the surface of the first insulating member 322, and the shielding member 323 is used to shield electromagnetic. The shielding member 323 includes a main body 3231 and an extension portion 3232 connected to the main body 3231. The main body 3231 and the extension portion 3232 partially overlap, and the connection between the main body 3231 and the extension portion 3232 can be an inverted "L" shape. The extension portion 3232 covers and exceeds the third end 3221 of the first insulating member 322, and can extend to cover the first end 3211 of the electrode rod 321. The main body 3231 can cover the remaining surface of the first insulating member 322 except the third end 3221, and the edge of the main body 3231 away from the extension portion 3232 can be flush with the edge of the fourth end 3222 of the first insulating member 322. The second protrusion 3223 of the first insulating member 322 abuts against the end of the main body 3231 toward the extension portion 3232 , and the third end 3221 of the first insulating member 322 abuts against the first protrusion 3214 , so that one end of the first insulating member 322 can be firmly fixed between the electrode rod 321 and the shielding member 323 .

[0040] In some embodiments, Figure 5 As shown, the second insulating member 324 covers part of the surface of the shielding member 323, and the second insulating member 324 is used to insulate the connection electrode 32 from the cavity 11. The second insulating member 324 includes a first insulating portion 3241 and a second insulating portion 3242 arranged around the edge of the first insulating portion 3241. The electrode rod 321, the first insulating member 322 and the shielding member 323 can be partially accommodated in the accommodation space surrounded by the first insulating portion 3241 and the second insulating portion 3242. The second insulating portion 3241 covers part of the surface of the main body 3231 of the shielding member 323. The fourth end 3222 of the first insulating member 322 and the end of the main body 3231 away from the extension portion 3232 abut against the inner surface of the first insulating portion 3242. The first insulating portion 3241 has a through hole 3243 that penetrates the first insulating portion 3241 in the extended thickness direction, and the second end 3212 of the electrode rod 321 extends out of the through hole 3243. The above structure of the interconnecting electrodes 32 can ensure that the radio frequency electricity flows smoothly and is stably transmitted in each electrode. Furthermore, the electrode rod 321 is made of a conductive material, and commonly used conductive materials include metals (such as copper, iron, titanium, etc.), carbon, conductive polymers, etc. The materials of the first insulating member 322 and the second insulating member 324 can be polytetrafluoroethylene (PTFE, also known as Teflon, Teflon), epoxy resin, etc. The shielding member 323 can be made of a metal material.

[0041] In some embodiments, Figure 6As shown, the RF electrode 33 includes an electrode block 331, a first electrode plate 332 and a first insulating plate 333. The electrode block 331 is fixedly connected to the second end 3212 of the electrode rod 321, and the second end 3212 can extend into the electrode block 331. The first electrode plate 332 is connected to the electrode block 331 and extends along the length direction X, and the RF electricity is introduced into the first electrode plate 332 through the electrode block 331. Along the length direction X, the surface portion of the first electrode plate 332 close to the second end 3212 is recessed in a direction away from the electrode rod 321 to form a groove 330, and the electrode block 331 is fixed in the groove 330 so that the electrode block 331 is connected to the first electrode plate 332.

[0042] Furthermore, if Figure 3 and Figure 6 As shown, the first insulating plate 333 is arranged on the surface of the first electrode plate 332. The first insulating plate 333 may include a first plate 3331, a second plate 3332, a third plate 3333 and a fourth plate 3334, wherein the first plate 3331 and the second plate 3332 are respectively arranged on two surfaces of the first electrode plate 332 that are oppositely arranged along the height direction Z (for example, the first plate 3331 may be arranged on the upper surface of the first electrode plate 332, and the second plate 3332 may be arranged on the lower surface of the first electrode plate 332), and the third plate 3333 and the fourth plate 3334 are respectively arranged on two surfaces that are oppositely arranged along the length direction X (for example, the third plate 3333 may be arranged on the left surface of the first electrode plate 332, and the fourth plate 3334 may be arranged on the right surface of the first electrode plate 332). The first insulating plate 333 is not arranged on the two surfaces of the first electrode plate 332 that face the two zero-position electrodes 34, respectively. The first insulating plate 333 can ensure insulation between the RF electrode 33 and the reaction chamber 110 , and the first insulating plate 333 can be made of polytetrafluoroethylene or the like.

[0043] In some embodiments, Figure 1 and Figure 3 As shown, the cavity 11 includes a bottom wall 111 and a plurality of side walls 112 connected to the bottom wall 111, and the cavity 11 can be grounded. In this embodiment, the cavity 11 is a rectangular parallelepiped structure, which has a bottom wall 111 and four side walls 112. A second insulating plate 113 is provided on the inner surface of the bottom wall 111 (the surface facing the reaction chamber 110), and a third insulating plate 114 is provided on the inner surface of each side wall 112 (the surface facing the reaction chamber 110), so that the communication electrode 32 and the radio frequency electrode 33 are isolated from the reaction chamber 110 to prevent relative discharge. The second insulating plate 113 and the third insulating plate 114 can be made of polytetrafluoroethylene or the like.

[0044] In some embodiments, Figure 3 , Figure 6 and Figure 7As shown, the second plate 3332 arranged near the bottom wall 111 along the height direction Z has a mounting portion 334 at one end away from the electrode block 331. The mounting portion 334 can protrude from the surface of the fourth plate 3334 and is roughly in the shape of a square. The mounting portion 334 is provided with a first mounting hole 335, and the bottom wall 111 is provided with a second mounting hole (not shown) adapted to the first mounting hole 335. It can be understood that the bottom wall 111 is provided with a second insulating plate 113, and the second mounting hole passes through the second insulating plate 113 and a part of the bottom wall 111. Bolts (not shown) can be used to screw into the first mounting hole 335 and the second mounting hole, so as to fix the first electrode plate 33 to the bottom wall 111, and the structure is simple and reliable.

[0045] In some embodiments, Figure 3 and Figure 8 As shown, each zero-position electrode 34 includes a second electrode plate 341, two adapter plates 342 and two fixed plates 343. The second electrode plate 341 extends along the length direction X of the cleaning chamber 10, and the second electrode plate 341 is arranged substantially parallel to the first electrode plate 332. The two ends of the second electrode plate 341 along the length direction X are fixed to the two adapter plates 342 in a one-to-one correspondence, and each adapter plate 342 can move on the corresponding fixed plate 343, and the two fixed plates 343 are fixed to the second insulating plate 113 on the bottom wall 111. The zero-position electrode 34 is connected to the cavity 11 through its adapter plate 342, and the cavity 11 is grounded, so the potential of the zero-position electrode 34 is zero or has a low potential.

[0046] Furthermore, if Figure 3 and Figure 8As shown, the adapter plate 342 includes a first part 3421 and a second part 3422 that are vertically connected. The second part 3422 is located on the surface of the fixing plate 343, and the first part 3421 can be formed by extending a part of the surface of the second part 3422 along the height direction Z. The first part 3421 is provided with a third mounting hole 3423, and the second electrode plate 341 is provided with a fourth mounting hole 3411. Bolts (not shown) can be used to screw into the third mounting hole 3423 and the fourth mounting hole 3411, so as to fix the second electrode plate 341 with the first part 3421, and the structure is simple and reliable. The second part 3422 is provided with a first opening 3424, and a plurality of first openings 3424 can be arranged along the width direction Y of the cleaning chamber 10. The first opening 3424 can be a waist-shaped hole, and the two arcs of the waist-shaped hole are arranged along the width direction Y of the cleaning chamber 10. The fixing plate 343 is provided with a plurality of second openings 3430 arranged along the width direction Y of the cleaning chamber 10, and the second portion 3422 can move along the width direction Y, so that the first opening 3424 can be aligned with different second openings 3430, thereby adjusting the distance between the second electrode plate 341 and the first electrode plate 332. Bolts (not shown) can be screwed into the first opening 3424 and the second opening 3430 to fix the second portion 3422 to the fixing plate 343.

[0047] It can be understood that the second portion 3422 is provided with a plurality of first openings 3424 along the length direction X of the cleaning chamber 10, and the fixing plate 343 is provided with the same number of rows of second openings 3430 along the length direction X (each row is provided with a plurality of second openings 3430 along the width direction Y) corresponding to the first openings 3424. Figure 8 As shown, the second portion 3422 is provided with two first openings 3424 along the length direction X of the cleaning chamber 10, and the fixing plate 343 is provided with two rows of second openings 3430 along the length direction X (each row is provided with a plurality of second openings 3430 along the width direction Y) corresponding thereto.

[0048] In some embodiments, Figure 3 As shown, the first electrode plate 332 of the RF electrode 33 has a plurality of through pores 3320 on its two surfaces facing the two zero-position electrodes 34. The second electrode plates 341 of the two zero-position electrodes 34 have a plurality of through pores 3412 on their surfaces facing the RF electrode 33. In this way, the gas (e.g., reaction gas) in the cavity 11 can be distributed more evenly, and the reaction gas can be ionized more easily.

[0049] In some embodiments, Figure 1 and Figure 3As shown, the cavity 11 is provided with an air inlet 115 and an air outlet 116, and the air inlet 115 and the air outlet 116 are respectively located at the two ends of the length direction X of the cleaning chamber 10. The air inlet 115 is located on the side of a zero-position electrode 34 away from the RF electrode 33, and the air outlet 116 is located on the side of another zero-position electrode 34 away from the RF electrode 33. The air inlet 115 is used to connect to the air inlet mechanism 20, and the air outlet 116 is used to extract gas. The side wall 112 of the cavity 11 includes a first side wall 1121 and a second side wall 1122 that are relatively arranged along the length direction X of the cleaning chamber 10, and the first side wall 1121 is closer to the RF power source 31 than the second side wall 1122. Further, in this embodiment, the air outlet 116 is arranged on the first side wall 1121 and communicated with the reaction chamber 110, and the air inlet 116 is arranged on the second side wall 1122 and communicated with the reaction chamber 110. The gas outlet holes 116 and the gas inlet holes 115 are respectively arranged on the two opposite side walls 112 , which helps to evenly distribute the gas after entering the reaction chamber 110 .

[0050] In some embodiments, Figure 1 and Figure 2 As shown, the cleaning chamber 10 also includes a cover plate 12, which is used to seal the reaction chamber 110. The connection between the cover plate 12 and the chamber body 11 can be hinged or detachably connected. A fourth insulating plate (not shown) is provided on the surface of the cover plate 12 facing the reaction chamber 110 to prevent the cover plate 12 from discharging relative to the electrode. An observation window 13 may be provided on the cover plate 12, and an observation window 14 may also be provided on the side wall 112 of the chamber body 11 to observe the situation in the reaction chamber 110.

[0051] In some embodiments, Figure 1 and Figure 2 As shown, the cleaning device 100 further includes a vacuum pumping mechanism 40. The vacuum pumping mechanism 40 may include a vacuum pump 41 and a vacuum gauge 42. The vacuum pump 41 is connected to the reaction chamber 110 through the air outlet 116, and the vacuum gauge 42 is connected to the reaction chamber 110. The vacuum pump 41 is used to evacuate the reaction chamber 110 to maintain a certain vacuum degree, and the vacuum gauge 42 can read the real-time pressure data in the reaction chamber 110.

[0052] When in use, place the jig to be cleaned (the jig does not contact the electrodes), such as a graphite boat, quartz boat or silicon carbide boat after coating, in the area between the RF electrode 33 and the zero-position electrode 34 in the cavity 11. Then close the cover 12 and check the cleaning device 100 to ensure that the sealing of each connection structure is intact. Start the vacuum pump 41 and read the pressure data of the reaction chamber 110 from the vacuum gauge 42. After the vacuum pressure value reaches a specific value, open the air intake mechanism 20 and introduce the reaction gas into the reaction chamber 110. After the pressure stabilizes, start the RF power supply 31 and start cleaning. The cleaning time can be shortened from 24 hours for wet cleaning to less than 1 hour, which greatly improves the cleaning speed and efficiency, is more energy-efficient, and can also improve the circulation efficiency of jigs such as graphite boats and quartz boats.

[0053] The cleaning device 100 of the present application, by providing structures such as a radio frequency power supply 31, a connecting electrode 32, a radio frequency electrode 33 and a zero position electrode 34, ensures efficient and stable transmission of radio frequency signals from the power supply to the electrode, thereby ensuring that a potential difference can be generated between the radio frequency electrode 33 and the zero position electrode 34, and then the reaction gas can be ionized to generate plasma to clean the fixture, thereby improving the cleaning effect. In addition, one radio frequency electrode 33 is provided corresponding to two zero position electrodes 34, and both sides of the radio frequency electrode 33 can discharge at the same time, increasing the cleaning position of the fixture, thereby improving the cleaning efficiency. Compared with wet cleaning (which requires a large amount of chemical reagents), the energy consumption of the cleaning device 100 of the present application is mainly radio frequency power supply and reaction gas, and the pollution to the environment is smaller. The cleaning device 100 of the present application has a simple structure, is easy to operate, occupies a small space, and has a good cleaning effect.

[0054] The above descriptions are some specific implementations of the present application, but they are not limited to these implementations in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A cleaning device, characterized in that: include: The cleaning chamber comprises a cavity, wherein a reaction chamber is formed in the cavity; an air intake mechanism, connected to the reaction chamber, so as to introduce reaction gas into the reaction chamber; and An ionization mechanism is used to ionize the reaction gas to generate plasma, the ionization mechanism includes a radio frequency power supply, a connecting electrode, a radio frequency electrode and two zero-position electrodes, the connecting electrode, the radio frequency electrode and the zero-position electrode are arranged in the reaction chamber; the connecting electrode is electrically connected to the radio frequency power supply, and the radio frequency electrode is electrically connected to the connecting electrode; the radio frequency electrode and the zero-position electrode both extend along the length direction of the cleaning chamber; along the width direction of the cleaning chamber, two zero-position electrodes are respectively arranged on both sides of the radio frequency electrode, and the area between the radio frequency electrode and the zero-position electrode forms a cleaning area, so as to use the plasma to clean the tool.

2. The cleaning device according to claim 1, characterized in that: The interconnecting electrode comprises an electrode rod, a first insulating member sleeved on a portion of the surface of the electrode rod, a shielding member sleeved on a surface of the first insulating member, and a second insulating member sleeved on a portion of the surface of the shielding member; the electrode rod has a first end and a second end arranged opposite to each other, the first end is connected to the radio frequency power supply, and the second end extends from the second insulating member and extends into the reaction chamber.

3. The cleaning device according to claim 2, characterized in that: The first end of the electrode rod includes a first protrusion; the first insulating member has a third end and a fourth end that are arranged opposite to each other, the third end is close to the first end, the third end abuts against the first protrusion, and the third end includes a second protrusion; the shielding member includes a main body and an extension portion connected to the main body, the extension portion covers the third end of the first insulating member, and the second protrusion abuts against the end of the main body facing the extension portion.

4. The cleaning device according to claim 3, characterized in that: The second insulating member includes a first insulating portion and a second insulating portion arranged around the edge of the first insulating portion, the second insulating portion covers a portion of the surface of the main body, the fourth end of the first insulating member and the end of the main body away from the extension portion abut against the first insulating portion, the first insulating portion has a through hole, and the second end of the electrode rod extends out of the through hole.

5. The cleaning device according to claim 2, characterized in that: The RF electrode includes an electrode block, a first electrode plate and a first insulating plate. The electrode block is fixedly connected to the second end of the electrode rod. The first electrode plate is connected to the electrode block and extends along the length direction of the cleaning chamber. The first insulating plate includes a first plate, a second plate, a third plate and a fourth plate. The first plate and the second plate are respectively arranged on two surfaces of the first electrode plate that are opposite to each other along its height direction. The third plate and the fourth plate are respectively arranged on two surfaces of the first electrode plate that are opposite to each other along its length direction.

6. The cleaning device according to claim 1, characterized in that: The cavity includes a bottom wall and a plurality of side walls connected to the bottom wall, the inner surface of the bottom wall is provided with a second insulating plate, and the inner surface of each of the side walls is provided with a third insulating plate; each of the zero-position electrodes includes a second electrode plate, two adapter plates and two fixed plates, the second electrode plate extends along the length direction of the cleaning chamber, the two ends of the second electrode plate are respectively fixed to the two adapter plates in a one-to-one correspondence, the adapter plate is configured to be movable on the fixed plate, and the fixed plate is fixed to the second insulating plate.

7. The cleaning device according to claim 6, characterized in that: The adapter plate includes a first part and a second part which are vertically connected, the first part is fixed to the second electrode plate, the second part is provided with a first opening, the fixed plate is provided with a plurality of second openings arranged along the width direction of the cleaning chamber, the first opening is configured to be aligned with different second openings, so that the second part can be fixed to the fixed plate.

8. The cleaning device according to claim 1, characterized in that: The two surfaces of the radio frequency electrode facing the two null-position electrodes are provided with a plurality of through air holes, and the surfaces of the two null-position electrodes facing the radio frequency electrode are provided with a plurality of through air holes.

9. The cleaning device according to claim 8, characterized in that: The cavity is provided with an air inlet and an air outlet, and the air inlet and the air outlet are respectively located at two ends of the length direction of the cleaning chamber, the air inlet is located on the side of one of the zero-position electrodes away from the RF electrode, and the air outlet is located on the side of the other zero-position electrode away from the RF electrode, the air inlet is used to connect with the air inlet mechanism, and the air outlet is used to extract gas.

10. The cleaning device according to claim 1, characterized in that: The cleaning chamber further comprises a cover plate, the cover plate is used to seal the reaction chamber, a fourth insulating plate is provided on the surface of the cover plate facing the reaction chamber, and both the cover plate and the chamber body are provided with observation windows; And / or, the cleaning device further comprises a vacuum pumping mechanism, the vacuum pumping mechanism comprises a vacuum pump and a vacuum gauge, and both the vacuum pump and the vacuum gauge are connected to the reaction chamber.

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