Temperature transmitter used in high-temperature environment

Abstract

The utility model discloses a temperature transmitter used in a high temperature environment, comprising a circuit board placing housing, a tubular connecting piece and a temperature sensor placing housing, two ends of the tubular connecting piece are respectively fixedly connected with the circuit board placing housing and the temperature sensor placing housing; the diameter of the tubular connecting piece is smaller than the diameter of the circuit board placement shell and the diameter of the temperature sensor placement shell, a temperature sensor fixedly connected with the temperature sensor placement shell is arranged in the temperature sensor placement shell, and a circuit board is arranged in the circuit board placement shell. The end, away from the tubular connecting piece, of the circuit board containing shell is provided with an end cover connected with the circuit board containing shell, and the temperature sensor is connected with the circuit board through a wire harness.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical equipment, in particular to a temperature transmitter used in a high-temperature environment. Background Art

[0002] A temperature transmitter is a device that converts the signal of a temperature sensor into a current signal and displays the corresponding temperature on a display device. It is mainly used for measuring and controlling temperature parameters in industrial engineering.

[0003] In actual applications, depending on the different devices to be detected, temperature transmitters often need to release instruments with different temperatures, including some devices with extremely high surface temperatures. For example, when the detection object is an automobile engine, a high-temperature fan or a high-temperature bearing, the temperature of the detection object in the working state is much higher than that of general equipment (such as 80°C and above), and the conventional transmitter and detection circuit board (hereinafter referred to as the circuit board) shell adopts a cylindrical structure with upper and lower parts integrated, and the operating temperature of this type of transmitter is generally -20-60°C, and the circuit board exceeds 80°C. The following situation may occur: after the traditional transmitter is in contact with the detection object for a long time, part of the heat of the detection object will be directly transferred to the circuit board through the shell, causing the circuit board to be overheated, thereby causing damage to the components on the circuit board;

[0004] In view of this, there is an urgent need for a temperature transmitter for use in a high temperature environment that can solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a temperature transmitter used in a high temperature environment to solve the above problems.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solution: a temperature transmitter used in a high temperature environment, comprising:

[0007] A circuit board is placed in an outer shell, a tubular connector and a temperature sensor is placed in an outer shell, two ends of the tubular connector are fixedly connected to the circuit board housing and the temperature sensor housing respectively, and the diameter of the tubular connector is smaller than the diameter of the circuit board housing and the temperature sensor housing, a temperature sensor fixedly connected to the temperature sensor is arranged in the temperature sensor housing, a circuit board is arranged in the circuit board housing, and an end cover connected to the circuit board housing away from the tubular connector is arranged at one end, and the temperature sensor is connected to the circuit board through a wiring harness.

[0008] Preferably, a circuit board is placed in the circuit board placement housing and connected to the housing via a fixing column.

[0009] Preferably, epoxy resin is poured into the circuit board placement housing, the tubular connector and the temperature sensor placement housing.

[0010] Preferably, an annular groove is provided at one end of the temperature sensor housing away from the tubular connecting piece, and an annular magnet fixedly connected to the annular groove is provided in the annular groove.

[0011] Preferably, the temperature sensor housing is in the shape of an inclined frustum, and the diameter of the end of the temperature sensor housing away from the tubular connector is larger than the diameter of the end of the temperature sensor housing close to the tubular connector.

[0012] Preferably, the tubular connector is provided with a heat dissipation assembly matching it, and the heat dissipation assembly includes two groups of semicircular buckles and a plurality of extended heat sinks. The two groups of semicircular buckles are hinged at one end and mutually buckled and connected at the other end. The plurality of extended heat sinks are fixedly connected to the side walls of the semicircular buckles.

[0013] Preferably, the semicircular buckle ring and the extended heat sink are made of metal material.

[0014] Preferably, the diameter of the heat dissipation component is smaller than the diameter of the circuit board housing and the temperature sensor housing.

[0015] Preferably, a silicone grease coating is provided between the semicircular buckle and the tubular connecting piece.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] By using a tubular connector to connect the circuit board housing and the temperature sensor housing, the heat conducted from the temperature sensor housing to the circuit board housing is reduced. At the same time, heat dissipation is accelerated by adding heat dissipation components, expanding the heat dissipation area, and other methods, so that the circuit board can maintain a safe temperature of about 60°C in working environments with different temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the cross-sectional structure of a temperature transmitter used in a high temperature environment;

[0019] Figure 2 This is a schematic diagram of the bottom structure of the housing 3 where the temperature sensor is placed in the utility model;

[0020] Figure 3 This is a schematic cross-sectional structure diagram of a temperature transmitter used in a high temperature environment in a second embodiment of the present utility model;

[0021] Figure 4 This is a schematic cross-sectional structure diagram of a temperature transmitter used in a high temperature environment in Embodiment 3 of the present utility model;

[0022] Figure 5 It is a schematic cross-sectional structure diagram of the heat dissipation assembly in the third embodiment of the present utility model.

[0023] In the figure: 1. Circuit board placement housing; 10. Circuit board; 11. Fixing column; 12. Wiring harness; 13. Epoxy resin; 2. Tubular connector; 3. Temperature sensor placement housing; 30. Temperature sensor; 31. Annular groove; 32. Annular magnet; 4. End cover; 5. Heat dissipation assembly; 50. Semicircular buckle; 51. Extended heat sink. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Embodiment 1

[0026] Please see attached Figure 1-2 , a temperature transmitter used in a high temperature environment, comprising:

[0027] A circuit board placement shell 1, a tubular connector 2 and a temperature sensor placement shell 3, wherein both ends of the tubular connector 2 are fixedly connected to the circuit board placement shell 1 and the temperature sensor placement shell 3 respectively, and the diameter of the tubular connector 2 is smaller than the diameter of the circuit board placement shell 1 and the diameter of the temperature sensor placement shell 3, a temperature sensor 30 fixedly connected thereto is provided in the temperature sensor placement shell 3, a circuit board 10 is provided in the circuit board placement shell 1, and an end cover 4 connected thereto is provided at one end of the circuit board placement shell 1 away from the tubular connector 2, and the temperature sensor 30 is connected to the circuit board 10 via a wiring harness 12.

[0028] The circuit board housing 1 and the temperature sensor housing 3 are connected by a tubular connector 2. At the same time, the diameter of the tubular connector 2 is set to be smaller than the diameter of the temperature sensor housing 3 and the circuit board housing 1, so that the transmitter is in an "I" shape as a whole. This shape can not only effectively reduce the rate of heat conduction from the temperature sensor housing 3 to the circuit board housing 1, but also, compared with the cylindrical transmitter in the traditional technology, the "I"-shaped structure has a larger surface area exposed on the outside and a stronger heat dissipation capacity, which can adapt to the working temperature of 60-160°C;

[0029] It should be noted that the end cover 4 is provided with an external electrical interface of the temperature transmitter, such as an aviation plug with more than 2 cores.

[0030] Specifically, a circuit board 10 connected to the circuit board housing 1 via a fixing column 11 is placed in the circuit board housing 1 .

[0031] Specifically, an annular groove 31 is provided at one end of the temperature sensor housing 3 away from the tubular connecting member 2 , and an annular magnet 32 ​​fixedly connected to the annular groove 31 is provided in the annular groove 31 .

[0032] Specifically, the circuit board placement housing 1, the tubular connector 2 and the temperature sensor placement housing 3 are poured with epoxy resin 13;

[0033] The use of the fixing column 11 and the epoxy resin 13 can fix the position of the circuit board 10 and prevent the vibration of the detected part from having an adverse effect on the circuit board 10. The provision of the annular magnet 32 ​​not only facilitates the installation of the temperature sensor housing 3, but also facilitates the connection with the detected part (the detected part has a steel structure). The annular groove 31 at the bottom of the temperature sensor housing 3 and the use of the annular magnet 32 ​​make the installation of the transmitter faster and simpler.

[0034] Embodiment 2

[0035] Please see attached Figure 3

[0036] Specifically, the temperature sensor housing 3 is in the shape of an inclined frustum, and the diameter of the end of the temperature sensor housing 3 away from the tubular connector 2 is larger than the diameter of the end of the temperature sensor housing 3 close to the tubular connector 2;

[0037] Compared with the first embodiment, the temperature sensor placement housing 3 adopts a beveled frustum-shaped design. Compared with the temperature sensor placement housing 3 with a columnar design, the temperature sensor placement housing 3 with this design has a larger curved side wall area, which means that when heat is conducted from the detection object to the temperature sensor placement housing 3, the diffusion speed into the air is faster, which indirectly reduces the heat conducted to the circuit board placement housing 1, and its operating temperature can reach up to 200°C.

[0038] Embodiment 3

[0039] Please see attached Figure 4-5

[0040] Specifically, the tubular connector 2 is provided with a heat dissipation assembly 5 matched therewith, and the heat dissipation assembly 5 includes two groups of semicircular buckles 50 and a plurality of extended heat dissipation fins 51, one end of the two groups of semicircular buckles 50 is hinged, and the other end is buckled and connected to each other, and the plurality of extended heat dissipation fins 51 are fixedly connected to the side walls of the semicircular buckles 50;

[0041] Compared with the first embodiment, in order to further enhance the heat dissipation effect of the transmitter, a heat dissipation component 5 is provided at the tubular connector 2 to directly conduct the heat of the tubular connector 2 to the extended heat sink 51 through the semicircular buckle 50, thereby indirectly increasing the heat dissipation efficiency of the tubular connector 2.

[0042] Specifically, the semicircular buckle 50 and the extended heat sink 51 are made of metal material; in order to enhance the heat dissipation efficiency of the heat dissipation component 5, a metal material with good thermal conductivity is used, wherein copper material is preferably selected in consideration of thermal conductivity and manufacturing cost.

[0043] Specifically, the diameter of the heat dissipation component 5 is smaller than the diameter of the circuit board placement shell 1 and the temperature sensor placement shell 3; considering that the heat dissipation component 5 is located between the circuit board placement shell 1 and the temperature sensor placement shell 3, in order to avoid the heat dissipation component 5 affecting the normal operation of the object to be detected, the overall diameter of the heat dissipation component 5 is smaller than the diameter of the circuit board placement shell 1 and the temperature sensor placement shell 3.

[0044] Preferably, a silicone grease coating is provided between the semicircular buckle 50 and the tubular connector 2. Considering the problem of a gap between the tubular connector 2 and the heat dissipation component 5, a silicone grease coating with good thermal conductivity is used as a heat conduction layer;

[0045] It should be noted that the second embodiment and the third embodiment can be used alone or in combination. In the combined state, the working temperature can reach up to 250°C.

[0046] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A temperature transmitter used in a high temperature environment, characterized in that: include: A circuit board placement shell (1), a tubular connector (2) and a temperature sensor placement shell (3), wherein two ends of the tubular connector (2) are fixedly connected to the circuit board placement shell (1) and the temperature sensor placement shell (3), respectively, and the diameter of the tubular connector (2) is smaller than the diameter of the circuit board placement shell (1) and the diameter of the temperature sensor placement shell (3), a temperature sensor (30) fixedly connected thereto is provided in the temperature sensor placement shell (3), a circuit board (10) is provided in the circuit board placement shell (1), and an end cap (4) connected thereto is provided at one end of the circuit board placement shell (1) away from the tubular connector (2), and the temperature sensor (30) is connected to the circuit board (10) via a wiring harness (12).

2. The temperature transmitter used in a high temperature environment according to claim 1, characterized in that: A circuit board (10) connected to the circuit board housing (1) via a fixing column (11) is placed inside the circuit board housing (1).

3. The temperature transmitter used in a high temperature environment according to claim 1, characterized in that: Epoxy resin (13) is poured into the circuit board housing (1), the tubular connecting piece (2) and the temperature sensor housing (3).

4. The temperature transmitter used in a high temperature environment according to claim 1, characterized in that: An annular groove (31) is provided at one end of the temperature sensor placement housing (3) away from the tubular connecting piece (2), and an annular magnet (32) fixedly connected thereto is provided in the annular groove (31).

5. The temperature transmitter used in a high temperature environment according to claim 1, characterized in that: The temperature sensor placement shell (3) is in the shape of an inclined frustum, and the diameter of the end of the temperature sensor placement shell (3) away from the tubular connecting piece (2) is larger than the diameter of the end of the temperature sensor placement shell (3) close to the tubular connecting piece (2).

6. The temperature transmitter used in a high temperature environment according to claim 4, characterized in that: The tubular connector (2) is provided with a heat dissipation assembly (5) matched therewith, the heat dissipation assembly (5) comprising two groups of semicircular buckle rings (50) and a plurality of extended heat dissipation fins (51), one end of the two groups of semicircular buckle rings (50) being hinged and the other ends being mutually buckled and connected, the plurality of extended heat dissipation fins (51) being fixedly connected to the side walls of the semicircular buckle rings (50), and a gap being left between the heat dissipation assembly (5) and the circuit board placement housing (1).

7. The temperature transmitter used in a high temperature environment according to claim 6, characterized in that: The semicircular buckle ring (50) and the extended heat sink (51) are made of metal material.

8. The temperature transmitter used in a high temperature environment according to claim 7, characterized in that: The diameter of the heat dissipation component (5) is smaller than the diameter of the circuit board housing (1) and the temperature sensor housing (3).

9. The temperature transmitter used in a high temperature environment according to claim 6, characterized in that: A silicone grease coating is provided between the semicircular buckle ring (50) and the tubular connecting piece (2).

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