Temperature sensing device and liquid heater

Abstract

The utility model relates to a temperature sensing device, namely a liquid heater, comprising an upper substrate provided with a first temperature sensing chip; the lower substrate is provided with a second temperature sensing chip; the base is arranged between the upper substrate and the lower substrate; the wire is connected with the lower substrate, and the wire is further connected with a computing device; wherein the upper substrate, the lower substrate and the base are provided with circuits, and the wires are connected with the first temperature sensing chip and the second temperature sensing chip through the circuits; a through hole is formed in the base, and the upper substrate and the lower substrate are exposed through the through hole; the first temperature sensing chip is arranged on the face, away from the through hole, of the upper substrate, and the second temperature sensing chip is arranged in the through hole. The liquid temperature measuring device indirectly measures the temperature of liquid. The temperature sensing device does not need to enter the container, the risk that the temperature sensing device pollutes liquid is avoided, meanwhile, the temperature sensing device does not make contact with the liquid, and the phenomenon that the service life of the temperature sensing device is affected by the liquid is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heating containers, in particular to a temperature sensing device and a liquid heater. Background Art

[0002] Liquid heating containers can boil water, make tea and keep liquids warm, and they play a very important role in our lives, especially in the kitchen.

[0003] During the use of liquid heating containers, if the liquid temperature is too high, it may cause the liquid to boil or overflow, while if the liquid temperature is too low, it may affect the heating effect. Therefore, monitoring the liquid temperature and promptly discovering and correcting temperature anomalies are very important for the stability and controllability of the liquid heating process. In order to ensure the accuracy of liquid temperature measurement, the probe of the temperature sensing device of the liquid heating container will be extended into the container, which will affect the service life of the probe and there is a risk of contaminating the liquid.

[0004] The Chinese invention patent with document number CN117053936A discloses a method, system, medium and equipment for indirectly measuring water temperature. This application is used to implement the method for indirectly measuring water temperature of the above invention patent.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a temperature sensing device and a liquid heater to indirectly measure the temperature of the liquid inside the container.

[0007] The technical solution of the utility model is as follows:

[0008] A temperature sensing device, comprising: an upper substrate, provided with a first temperature sensing chip; a lower substrate, provided with a second temperature sensing chip; a base, provided between the upper substrate and the lower substrate; a wire, connected to the lower substrate, and the wire is also connected to a computing device; wherein the upper substrate, the lower substrate and the base are provided with a circuit, and the wire connects the first temperature sensing chip and the second temperature sensing chip through the circuit; the base is provided with a through hole, and the through hole connects and exposes the upper substrate and the lower substrate; the first temperature sensing chip is provided on a side of the upper substrate away from the through hole, and the second temperature sensing chip is provided in the through hole.

[0009] A further technical solution is that it further comprises a heat-resistant plastic shell, wherein the upper substrate, the lower substrate and the base are arranged in the heat-resistant plastic shell; and the temperature sensing end of the first temperature sensing chip is exposed from the heat-resistant plastic shell.

[0010] A further technical solution is that the temperature sensing end of the first temperature sensing chip is flush with the outer surface of the temperature-resistant rubber shell.

[0011] A further technical solution is that the length direction of the wire is perpendicular to the lower substrate.

[0012] A further technical solution is that the length direction of the wire is parallel to the lower substrate.

[0013] A further technical solution is that a wire outlet hole is provided on the heat-resistant plastic shell, and the wire passes through the wire outlet hole.

[0014] The liquid heater comprises a container and a temperature sensing device; the temperature sensing device is arranged on the container; and the first temperature sensing chip contacts the container.

[0015] A further technical solution is that a heat-conducting material is provided between the temperature sensing device and the container; and the temperature-sensing end of the first temperature-sensing chip contacts the heat-conducting material.

[0016] A further technical solution is that a bracket is also provided on the container, and the temperature sensing device is provided on the bracket.

[0017] A further technical solution is that it also includes a base, the container includes a kettle body and a heating plate arranged at the bottom of the kettle body; the temperature sensing device is arranged between the heating plate and the base, and the first temperature sensing chip contacts the heating plate.

[0018] The beneficial technical effects of the utility model are as follows:

[0019] (1) The temperature sensing device in the utility model is provided with a first temperature sensing chip and a second temperature sensing chip at intervals. The first temperature sensing chip directly measures the surface temperature T1 of the container, and the second temperature sensing chip measures the remaining temperature T2 after a certain loss. Then, based on the thermal resistance R0 of the container and the ratio of the thermal resistance R1 between the first temperature sensing chip and the second temperature sensing chip, the temperature T0 of the liquid in the container is obtained, and the temperature of the liquid inside the container is indirectly measured. For indirect measurement, the temperature sensing device does not need to enter the interior of the container, eliminating the risk of the temperature sensing device contaminating the liquid. At the same time, the temperature sensing device does not contact the liquid, which also prevents the service life of the temperature sensing device from being affected by the liquid.

[0020] (2) Furthermore, a base, an upper substrate and a lower substrate are provided to support the positions of the first temperature sensing chip and the second temperature sensing chip, and at the same time, filtering of the chip and the wire is realized, so that the chip can establish effective connection and interaction with the outside. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The exploded structure diagram of the temperature sensing device in the first embodiment of the present utility model is shown.

[0022] Figure 2 The exploded structure diagram of the temperature sensing device in the second embodiment of the present utility model is shown.

[0023] Figure 3 A schematic cross-sectional structure diagram of a liquid heater in Embodiment 3 of the present utility model is shown.

[0024] Figure 4 A partial enlarged view of the liquid heater at position A in the third embodiment of the present utility model is shown.

[0025] Figure 5 A schematic cross-sectional structure diagram of a liquid heater in a fourth embodiment of the present utility model is shown.

[0026] Figure 6 A partial enlarged view of the liquid heater at position B in the fourth embodiment of the utility model is shown.

[0027] Markings in the accompanying drawings:

[0028] 1. Heat-resistant plastic shell; 11. Wire outlet hole; 2. First temperature sensing chip; 3. Base; 31. Upper substrate; 32. Lower substrate; 33. Through hole; 4. Second temperature sensing chip; 5. Wire; 6. Container; 61. Kettle body; 62. Heating plate; 7. Heat-conducting material; 8. Bracket; 9. Base. DETAILED DESCRIPTION

[0029] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the attached drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model.

[0030] In the description of the present invention, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] Embodiment 1

[0032] Figure 1 The exploded structure diagram of the temperature sensing device in the first embodiment of the present utility model is shown. Figure 1 , a temperature sensing device, comprising an upper substrate 31, a lower substrate 32, a base 3 and a wire 5. The upper substrate 31 is provided with a first temperature sensing chip 2. The lower substrate 32 is provided with a second temperature sensing chip 4. The base 3 is arranged between the upper substrate 31 and the lower substrate 32. The wire 5 is connected to the lower substrate 32, and the wire 5 is also connected to a computing device. The computing device can be a single-chip microcomputer, a field programmable gate array, a digital signal processor, an advanced reduced instruction set machine or a system on a chip. The length direction of the wire 5 is perpendicular to the lower substrate 32, and one end of the wire 5 connected to the lower substrate 32 is bent and attached to the lower substrate 32, and the end of the wire 5 connected to the lower substrate 32 is restricted, so as to increase the connection strength between the wire 5 and the lower substrate 32 and prevent the connection position between the wire 5 and the lower substrate 32 from being loosened.

[0033] Among them, the upper substrate 31, the lower substrate 32 and the base 3 are provided with circuits, and the wire 5 connects the first temperature sensing chip 2 and the second temperature sensing chip 4 through the circuit. The base 3 is provided with a through hole 33, which exposes the upper substrate 31 and the lower substrate 32 to form a space for temperature transfer and detection between the upper substrate 31 and the lower substrate 32. The first temperature sensing chip 2 is arranged on the side of the upper substrate 31 away from the through hole 33, so that the first temperature sensing chip 2 can be directly attached to the instrument for holding the object to be measured to detect the temperature T1 of the instrument. The second temperature sensing chip 4 is arranged in the through hole 33 to detect the temperature T2 after the loss through the through hole 33. Through the first temperature sensing chip 2 and the second temperature sensing chip 4. Then, according to the thermal resistance R0 of the instrument and the ratio of the thermal resistance R1 between the first temperature sensing chip 2 and the second temperature sensing chip 4, the temperature T0 of the object to be measured is obtained by using the formula TO=(RO / R1)*(T1-T2)+T1. By using the indirect measurement method, the temperature sensing device does not need to enter the interior of the instrument, eliminating the risk of the temperature sensing device contaminating the object to be measured. At the same time, the temperature sensing device does not contact the object to be measured, which also prevents the temperature sensing device from being affected by the object to be measured. Service life.

[0034] Furthermore, it also includes a heat-resistant rubber shell 1, and the upper substrate 31, the lower substrate 32 and the base 3 are arranged in the heat-resistant rubber shell 1. The heat-resistant rubber shell 1 fixes the positions of the upper substrate 31, the lower substrate 32 and the base 3, and its high temperature resistance ensures its service life in a high temperature environment, and is suitable for a high temperature detection environment. The temperature sensing end of the first temperature sensing chip 2 is exposed to the heat-resistant rubber shell 1. Preferably, the temperature sensing end of the first temperature sensing chip 2 is flush with the outer surface of the heat-resistant rubber shell 1. In this way, when the temperature sensing end of the first temperature sensing chip 2 contacts the device, the heat-resistant rubber shell 1 will not interfere with the first temperature sensing chip 2, and the heat-resistant rubber shell 1 will also contact the device, so that the contact area between the temperature sensing device and the device is increased. The increase in the contact area between the temperature sensing device and the device can disperse the load applied to the first temperature sensing chip 2 and reduce local pressure.

[0035] The specific workflow of this embodiment is as follows:

[0036] First, the temperature sensing device is installed on the instrument, and the first temperature sensing chip 2 contacts the surface of the instrument. After the temperature of the object to be measured in the instrument rises, the temperature of the object to be measured is conducted to the first temperature sensing chip 2 through the instrument, and is conducted to the second temperature sensing chip 4 along the upper substrate 31, the base 3 and the through hole 33. The first temperature sensing chip 2 measures the temperature T1 of the surface of the instrument, and the temperature data is transmitted along the wire 5. The second temperature sensing chip 4 measures the temperature T2 at the through hole 33, and obtains the temperature difference value from the first temperature sensing chip 2 to the second temperature sensing chip 4, and the temperature data is transmitted along the wire 5. The calculation device receives the temperature data and performs calculations to obtain the temperature T0 of the object to be measured.

[0037] Embodiment 2

[0038] Figure 2 The exploded structure diagram of the temperature sensing device in the second embodiment of the present utility model is shown. Figure 2 Based on the first embodiment, the second embodiment discloses a temperature sensing device, wherein the length direction of the wire 5 is parallel to the first temperature sensing chip 2. When the temperature sensing device is arranged on the surface of the device for holding the object to be measured, the wire 5 is parallel to the surface of the device, thereby reducing the space occupied by the wire 5. At this time, a wire outlet hole 11 is provided on the side of the heat-resistant plastic shell 1, and the wire 5 passes through the wire outlet hole 11, and the wire 5 extends out of the heat-resistant plastic shell 1 from the wire outlet hole 11.

[0039] Embodiment 3

[0040] Figure 3 A schematic cross-sectional structure diagram of a liquid heater in Embodiment 3 of the present utility model is shown. Figure 4 FIG. 1 shows a partial enlarged view of the liquid heater at position A in the third embodiment of the present utility model. Please refer to Figure 3 and Figure 4 Based on the first and second embodiments, the third embodiment discloses a liquid heater, including a container 6 and a temperature sensing device. The temperature sensing device is arranged on the container 6. The first temperature sensing chip 2 contacts the container 6, and the heat of the liquid is conducted to the first temperature sensing chip 2 through the container 6. A heat-conducting material 7 is arranged between the temperature sensing device and the container 6, and the temperature sensing end of the first temperature sensing chip 2 contacts the heat-conducting material 7. The heat-conducting material 7 can be a thermal grease, a thermally conductive silicone, a graphite gasket or a soft silicone thermal pad. The heat-conducting material 7 can improve the heat transfer efficiency and make the temperature transfer more uniform and faster. By using the heat-conducting material 7, the heat-conducting material 7 is completely attached to the container 6 and the temperature sensing end of the first temperature sensing chip 2, and then the first temperature sensing chip 2 measures the temperature of the heat-conducting material 7, so as to avoid the incomplete contact of the first temperature sensing chip 2, resulting in the measured temperature not being the true temperature of the container 6.

[0041] Embodiment 4

[0042] Figure 5 A schematic cross-sectional structure diagram of a liquid heater in a fourth embodiment of the present utility model is shown. Figure 6 FIG. 4 shows a partial enlarged view of the liquid heater at position B in the fourth embodiment of the present utility model. Please refer to Figure 5 and Figure 6 Based on the first, second and third embodiments, the fourth embodiment discloses a liquid heater, which includes a base 9, and its container 6 includes a kettle body 61 and a heating plate 62 arranged at the bottom of the kettle body 61. The heating plate 62 is preferably a microcrystalline heating disk, and the microcrystalline heating disk includes a microcrystalline plate and a heating film attached to the microcrystalline plate. The microcrystalline heating disk is combined with the kettle body 61 made of glass material and the temperature sensing device for indirect measurement to form a fully transparent container 6. The container 6 has high transparency and is convenient for controlling the addition and subtraction of liquid. At the same time, the glass material is not easy to absorb odor, has good heat resistance, is non-toxic and harmless, is relatively easy to clean and is beautiful.

[0043] The temperature sensing device is arranged between the heating plate 62 and the base 9, the first temperature sensing chip 2 contacts the heating plate 62, and the heat of the liquid is transferred to the first temperature sensing chip 2 through the heating plate 62. Specifically, when the heating plate 62 is a microcrystalline heating disk, the first temperature sensing chip 2 contacts the surface of the microcrystalline plate without the heating film attached. The position of the heating film avoids the temperature sensing device to prevent the heat of the heating film from interfering with the temperature sensing device.

[0044] A thermal conductive material 7 is filled between the first temperature sensing chip 2 and the heating plate 62. The thermal conductive material 7 can be thermal grease, thermal conductive silicone, graphite gasket or soft silicone thermal pad, etc. The thermal conductive material 7 can improve the heat transfer efficiency and make the temperature transfer more uniform and rapid. By using the thermal conductive material 7, the thermal conductive material 7 is completely attached to the heating plate 62 and the temperature sensing end of the first temperature sensing chip 2, and then the first temperature sensing chip 2 measures the temperature of the thermal conductive material 7, avoiding incomplete contact of the first temperature sensing chip 2, resulting in the measured temperature not being the true temperature of the heating plate 62.

[0045] In addition, a bracket 8 is also provided on the container 6, and the temperature sensing device is provided on the bracket 8. The bracket 8 is fixed on the heating plate 62 by screws, and the temperature sensing device is also fixed on the bracket 8 by screws.

[0046] It can be seen that the above-mentioned temperature sensing device and liquid heater realize indirect measurement of the temperature of the liquid inside the container 6. The temperature sensing device does not need to enter the interior of the container 6, eliminating the risk of the temperature sensing device contaminating the liquid. At the same time, the temperature sensing device does not contact the liquid, which also avoids the service life of the temperature sensing device being affected by the liquid.

[0047] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A temperature sensing device, characterized in that: It includes: The upper substrate is provided with a first temperature sensing chip; The lower substrate is provided with a second temperature sensing chip; A base, disposed between the upper substrate and the lower substrate; A wire connected to the lower substrate, the wire is also connected to a computing device; Among them, the upper substrate, the lower substrate and the base are provided with circuits, and the wire connects the first temperature sensing chip and the second temperature sensing chip through the circuit; a through hole is opened on the base, and the through hole exposes the upper substrate and the lower substrate; the first temperature sensing chip is arranged on a side of the upper substrate away from the through hole, and the second temperature sensing chip is arranged in the through hole.

2. The temperature sensing device according to claim 1, characterized in that: It also includes a heat-resistant plastic shell, in which the upper substrate, the lower substrate and the base are arranged; and the temperature sensing end of the first temperature sensing chip is exposed from the heat-resistant plastic shell.

3. The temperature sensing device according to claim 2, characterized in that: The temperature sensing end of the first temperature sensing chip is flush with the outer surface of the temperature-resistant plastic shell.

4. The temperature sensing device according to claim 1, characterized in that: The length direction of the wire is perpendicular to the lower substrate.

5. The temperature sensing device according to claim 1, characterized in that: The length direction of the wire is parallel to the lower substrate.

6. The temperature sensing device according to claim 2, characterized in that: The heat-resistant plastic shell is provided with a wire outlet hole, and the wire passes through the wire outlet hole.

7. Liquid heater, characterized in that: It comprises a container and the temperature sensing device as claimed in claims 1 to 6; the temperature sensing device is arranged on the container; and the first temperature sensing chip contacts the container.

8. The liquid heater according to claim 7, characterized in that: A heat-conducting material is arranged between the temperature-sensing device and the container; and the temperature-sensing end of the first temperature-sensing chip contacts the heat-conducting material.

9. The liquid heater according to claim 7, characterized in that: The container is also provided with a bracket, and the temperature sensing device is arranged on the bracket.

10. The liquid heater according to claim 7, characterized in that: It also includes a base, the container includes a kettle body and a heating plate arranged at the bottom of the kettle body; the temperature sensing device is arranged between the heating plate and the base, and the first temperature sensing chip contacts the heating plate.

Images