Adhesive force testing device

Abstract

The utility model provides an adhesive force testing device, which is characterized in that the device comprises a rack, and a slide glass mechanism, a scribing feeding mechanism, a rotation input mechanism and a transmission mechanism which are arranged on the rack, the slide glass disc is fixed on a first shaft of the transmission mechanism and is arranged to rotate along with the rotation of the first shaft; the scribing feeding mechanism comprises a scribing needle and a compression shaft, the scribing needle is used for scribing the surface of the object to be measured, the scribing needle is arranged at the first end of the compression shaft, and the scribing needle and the compression shaft are arranged to linearly move along the radial direction of the slide glass disc under the driving of the transmission mechanism; and the transmission mechanism is coupled with the slide tray and the scribing feeding mechanism and is arranged to transmit the rotary motion input from the rotary input mechanism to the slide tray and the scribing feeding mechanism.

Description

Technical Field

[0001] The present disclosure relates to the technical field of integrated circuit manufacturing, and more specifically, to an adhesion testing device. Background Art

[0002] In the surface acoustic wave filter manufacturing process and vacuum thin film deposition process, the adhesion test of the coating layer on the wafer surface is usually involved. There are currently two main methods in the industry for the adhesion test of the coating layer on the wafer surface. The first method is the scratch method, which uses a customized scratching needle to scratch the surface of the coated wafer until the coating layer peels off, and indirectly estimates the adhesion of the coating layer by the scratching force when the coating layer peels off. The second method is the sticking method, which tests the adhesion between the coating layer and the wafer substrate by manually tearing the film with tapes of different viscosities. However, no matter which method is used, the current adhesion test method is mostly manual operation, and each link requires manual measurement, which introduces a large number of manual errors and affects the measurement accuracy. In addition, the current adhesion test device also has the disadvantages of complex structure and difficult operation. Therefore, there is a need for an adhesion test device and related methods with simple structure, simple and efficient operation and high measurement accuracy. Utility Model Content

[0003] An embodiment of the present disclosure provides an adhesion testing device, characterized in that the device comprises: a frame and a carrier mechanism, a scribing and feeding mechanism, a rotating input mechanism and a transmission mechanism installed on the frame, wherein the carrier mechanism comprises a carrier plate for placing an object to be tested, the carrier plate is fixed on a first axis of the transmission mechanism and is configured to rotate with the rotation of the first axis; the scribing and feeding mechanism comprises a marking needle and a compression shaft, the marking needle is used to scratch the surface of the object to be tested, the marking needle is arranged at a first end of the compression shaft, the marking needle and the compression shaft are configured to perform linear motion along the radial direction of the carrier plate under the drive of the transmission mechanism; the transmission mechanism is coupled to the carrier plate and the scribing and feeding mechanism, and is configured to transmit the rotational motion input from the rotating input mechanism to the carrier plate and the scribing and feeding mechanism.

[0004] According to an embodiment of the present disclosure, one or more stoppers are disposed on the upper surface of the wafer carrier, and the one or more stoppers respectively correspond to the sizes of one or more objects to be measured.

[0005] According to an embodiment of the present disclosure, the carrier mechanism also includes a first pressure device and a pressure plate, wherein the first pressure device is coupled to the upper surface of the pressure plate; the pressure plate is arranged directly above the carrier plate, and is arranged to be separated from the upper surface of the carrier plate in a lifted state and to press the object to be measured against the upper surface of the carrier plate with a first pressure in a pressed state and to rotate with the rotation of the carrier plate, wherein the first pressure is provided by adjusting the first pressure device.

[0006] According to an embodiment of the present disclosure, the carrier mechanism also includes a handle and a pressure plate shaft, the handle is coupled to the first end of the pressure plate shaft through a rolling bearing, so that the handle and the pressure plate shaft can rotate independently of each other; the second end of the pressure plate shaft is coupled to the first pressure device; and the carrier mechanism also includes a lifting and pressing down limiting structure, the lifting and pressing down limiting structure is fixed on the frame and is provided with a lifting position groove and a pressing down position groove, wherein, when the handle is placed in the lifting position groove, the pressure plate is in the lifting state; and when the handle is placed in the pressing down groove, the pressure plate is in the pressing down state.

[0007] According to an embodiment of the present disclosure, a compression adjustment ring is further provided at the connection between the pressure plate shaft and the first pressure device for adjusting the compression of the first pressure device.

[0008] According to an embodiment of the present disclosure, the scribing feed mechanism also includes a compression track, the upper surface of which is fixed on the frame, and the lower surface of which is arranged as an inclined surface relative to the plane where the pressure plate is located, and is in contact with the second end of the compression shaft; and a second pressure device is also arranged in the compression shaft, and the second pressure device is arranged to perform axial compression along the compression shaft and provide a linearly increasing scribing force to the scribing needle when the compression shaft moves linearly along the radial direction of the carrier disc toward the center of the carrier disc.

[0009] According to an embodiment of the present disclosure, the transmission mechanism includes a first transmission device and a second transmission device, wherein the first transmission device is coupled to the wafer carrier through the first shaft, and is configured to transmit the rotational motion input from the rotation input mechanism to the wafer carrier so as to rotate the wafer carrier; and the second transmission device is coupled to the scoring feed mechanism, and is configured to transmit the rotational motion input from the rotation input mechanism to the scoring feed mechanism so as to cause the scoring needle and the compression shaft to perform the linear motion.

[0010] According to an embodiment of the present disclosure, the scoring feed mechanism also includes a ball screw and a sliding mechanism, wherein the compression shaft is arranged on the sliding mechanism, and the sliding mechanism is sleeved on the ball screw; the ball screw is horizontally arranged and coupled to the second transmission device, and the ball screw is configured to convert the rotational motion transmitted from the second transmission device into linear motion of the sliding mechanism in the horizontal direction.

[0011] According to an embodiment of the present disclosure, the second transmission device includes a first transmission wheel, a first transmission belt and a second transmission wheel, wherein the first transmission wheel is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis, the second transmission wheel is fixed on one end of the ball screw, and the first transmission wheel and the second transmission wheel are coupled by the first transmission belt.

[0012] According to an embodiment of the present disclosure, a rotation speed ratio between the first transmission wheel and the second transmission wheel is set to 1:1.

[0013] According to an embodiment of the present disclosure, the first transmission device includes a first bevel gear, a second bevel gear, a third transmission wheel, a second transmission belt and a fourth transmission wheel, wherein the first bevel gear is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis; the second bevel gear is vertically engaged with the first bevel gear; the third transmission wheel is coupled to the second bevel gear through a second shaft, and is configured to rotate with the rotation of the second bevel gear; the fourth transmission wheel is coupled to the wafer carrier through the first shaft; and the third transmission wheel and the fourth transmission wheel are coupled through the second transmission belt.

[0014] According to an embodiment of the present disclosure, the rotation input mechanism includes a hand wheel and a central shaft, wherein the hand wheel is fixed on the central shaft, and when the hand wheel is rotated, the central shaft is driven to rotate.

[0015] According to an embodiment of the present disclosure, the object to be tested is a wafer.

[0016] According to an embodiment of the present disclosure, the first pressure device is a spring.

[0017] According to an embodiment of the present disclosure, the second pressure device is a spring.

[0018] An embodiment of the present disclosure provides an adhesion testing method, comprising: placing an object to be tested on a wafer carrier so that the object to be tested can rotate synchronously with the rotation of the wafer carrier; scratching the surface of the object to be tested with a first scratching force using a scratching needle, wherein the scratching needle moves linearly from the edge of the object to be tested along the radial direction of the wafer carrier toward the center of the wafer carrier while the wafer carrier rotates until the coating layer on the surface of the object to be tested begins to separate from the object to be tested, wherein the first scratching force increases linearly with the linear motion; measuring the length of the scratch generated by the scratching on the surface of the object to be tested; and determining the adhesion of the coating layer on the surface of the object to be tested based on the scratch length.

[0019] The embodiments of the present disclosure provide an adhesion testing device and a related method with simple structure, easy and efficient operation and high measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 A schematic structural diagram of an adhesion testing device 100 according to an embodiment of the present disclosure is shown;

[0022] Figure 2a and Figure 2b A schematic structural diagram of a film carrier mechanism 102 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown;

[0023] Figure 3 A schematic structural diagram of a scribing and feeding mechanism 103 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown;

[0024] Figure 4 A schematic structural diagram of a transmission mechanism 104 and a rotation input mechanism 105 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown; and

[0025] Figure 5 A schematic diagram of an adhesion testing method 500 according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0026] Before proceeding to the following detailed description, it may be advantageous to set forth the definitions of certain words and phrases used throughout this patent document. The terms "coupling", "connection" and their derivatives refer to any direct or indirect communication or connection between two or more elements, regardless of whether those elements are in physical contact with each other. The terms "transmission", "reception" and "communication" and their derivatives cover direct and indirect communication. The terms "include" and "comprise" and their derivatives refer to including but not limited to. The term "or" is inclusive, meaning and / or. The phrases "associated with...", "corresponding to..." and their derivatives refer to including, including within, interconnecting, including, including within, connecting or connecting with, coupling or coupling with, communicating with, cooperating, interweaving, parallel, close to, binding or binding with, having, having attributes, having a relationship or having a relationship with, etc. The term "controller" refers to any device, system or part thereof that controls at least one operation. Such a controller can be implemented with hardware, or a combination of hardware and software and / or firmware. The functions associated with any particular controller can be centralized or distributed, whether local or remote. The phrase "at least one of", when used with a list of items, means that different combinations of one or more of the listed items may be used, and only one of the items in the list may be required. For example, "at least one of A, B, C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, A and B and C.

[0027] The term "fixed" and its derivatives refer to any direct or indirect fixation between two or more elements, regardless of whether those elements are in physical contact with each other. For example, "element A is fixed to element B" may mean that element A is directly fixed to element B and in contact with element B, and may also mean that element A is indirectly fixed to element B through any other intermediate member or intermediate structure, in which case element A may not be in direct contact with element B.

[0028] Definitions for other specific words and phrases are provided throughout this patent document. Those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior and future uses of such defined words and phrases.

[0029] In this patent document, the application combination of modules and the division level of submodules are only used for illustration. Without departing from the scope of the present disclosure, the application combination of modules and the division level of submodules can have different modes. The embodiments of the present disclosure can be implemented in different forms and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make the present disclosure thorough and complete, and to fully convey exemplary implementation methods to those skilled in the art. The embodiments of the present disclosure can be combined to form additional embodiments.

[0030] The present disclosure will be described in detail below with reference to exemplary embodiments of the present disclosure. However, the present disclosure is not limited to the embodiments described herein, and it can be implemented in many different forms. The described embodiments are only used to make the present disclosure thorough and complete, and to fully convey the concept of the present disclosure to those skilled in the art. The features of the various embodiments described can be combined or replaced with each other, unless explicitly excluded or should be excluded according to the context.

[0031] In the present disclosure, the singular form of an element may refer to its plural form, and the plural form of an element may also refer to its singular form. For example, "element" or "an element" may refer to each other with "at least one element", "one or more elements" or "a plurality of elements" etc.

[0032] Figure 1 A schematic structural diagram of an adhesion testing device 100 according to an embodiment of the present disclosure is shown.

[0033] like Figure 1 As shown, the adhesion testing device 100 according to the embodiment of the present disclosure may include a frame 101 and a film carrier mechanism 102 , a scribing and feeding mechanism 103 , a rotating input mechanism 105 and a transmission mechanism 104 installed on the frame 101 .

[0034] The frame 101 can be used to support and / or fix the parts of the test device 100. The carrier mechanism 102 can be used to carry the object to be tested. The scribing feed mechanism 103 can include a scribing needle and can be used to scribing the surface of the object to be tested. The rotation input mechanism 105 can be used to input the driving force required for the test process to the adhesion test device 100, for example, by rotational motion. The transmission mechanism 104 can be used to transfer the driving force input from the rotation input mechanism 105 to the carrier mechanism 102 and the scribing feed mechanism 103, etc., respectively, so as to perform the test operation. The various components of the adhesion test device 100 will be further described in detail below in conjunction with the accompanying drawings.

[0035] Figure 2a and Figure 2b A schematic structural diagram of a film carrier mechanism 102 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown.

[0036] like Figure 2a As shown, the slide mechanism 102 may include a slide tray 201 for placing the object to be tested. In some embodiments, the slide tray 201 may be fixed to the first shaft 210 of the transmission mechanism 104 and may be configured to rotate together with the rotation of the first shaft 210.

[0037] In some embodiments, Figure 2bAs shown, the upper surface of the wafer carrier 201 may be provided with a limiter 211. The limiter 211 may be an annular groove or a snap ring structure provided on the upper surface of the wafer carrier 201, which may correspond to a specific size of the object to be tested, so that the object to be tested with the specific size can be stably carried by the wafer carrier 201 without relative sliding during the test process. Figure 2b Only one stopper 211 is shown. It should be understood that according to the embodiment of the present disclosure, one or more stoppers corresponding to one or more specific sizes may be provided on the wafer carrier 201, and this is not limited herein.

[0038] In some embodiments, the wafer carrier mechanism 102 may further include a first pressure device 203 and a pressure plate 202. Figure 2a As shown, the first pressure device 203 can be coupled to the upper surface of the pressure plate 202. The pressure plate 202 can be arranged directly above the wafer carrier 201, and can be arranged to be separated from the upper surface of the wafer carrier 201 in a lifted state and to press the object to be measured against the upper surface of the wafer carrier 201 with a first pressure in a pressed state and to rotate with the rotation of the wafer carrier 201.

[0039] For example, in some embodiments, the pressure plate 202 can be placed in a raised state so as to place the object to be tested on the wafer carrier 201. Then, the pressure plate 202 can be placed in a pressed state so as to press the object to be tested against the upper surface of the wafer carrier 201. At this time, when the wafer carrier 201 rotates, the pressure plate 202 and the object to be tested can rotate together with the rotation of the wafer carrier 201. Here, the first pressure can be provided by the first pressure device 203, and the magnitude of the first pressure can be adjusted by adjusting the first pressure device 203, so as to ensure that the object to be tested is fixed relative to the wafer carrier 201 without being crushed or squeezed and damaged.

[0040] In certain embodiments, the first pressure device 203 may be a spring whose rebound force is proportional to the compression (linear). In other embodiments, the first pressure device 203 may also be a hydraulic device, an air compressor or any other device made of any other elastic material whose rebound force is proportional to the compression.

[0041] In some embodiments, the slide mechanism 102 may further include a handle 208 and a platen shaft 205. The handle 208 may be coupled to a first end (e.g., the upper end) of the platen shaft 205 via a rolling bearing 209, so that the handle 208 and the platen shaft 205 can rotate independently of each other. The second end (e.g., the lower end) of the platen shaft 205 may be coupled to the first pressure device 203.

[0042] In some embodiments, the film carrier mechanism 102 may further include a lifting and pressing limit structure 207. The lifting and pressing limit structure 207 may be fixed to the frame 101 and provided with a lifting position groove and a pressing position groove. When the handle 208 is placed in the lifting position groove, the pressure plate 202 may be in the lifting state as described above. When the handle 208 is placed in the pressing position groove, the pressure plate 202 may be in the pressing state as described above.

[0043] In some embodiments, a compression adjustment ring 204 may be further provided at the connection between the pressure plate shaft 205 and the first pressure device 203 to adjust the initial compression of the first pressure device 203. For example, the compression adjustment ring 204 may be configured to be sleeved on the pressure plate shaft 205, and when rotated, may move axially along the pressure plate shaft 205, so that the first pressure device 203 may be compressed to different degrees, so that the first pressure device 203 may have corresponding different initial compressions.

[0044] like Figure 2a As shown, the frame 101 may be provided with an opening, and the opening may be provided with a sliding bearing 206. The platen shaft 205 of the film carrier mechanism 102 may pass through the opening and be coupled to the frame 101 through the sliding bearing 206, so that the platen shaft 205 can be supported by the frame 101 and can rotate flexibly.

[0045] Figure 3 A schematic structural diagram of a scribing and feeding mechanism 103 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown.

[0046] like Figure 3 As shown, the scribing feed mechanism 103 may include a scribing needle 301 and a compression shaft 302. The scribing needle 301 can be used to scribble the surface of the object to be tested, thereby generating scratches on the surface of the object to be tested and implementing an adhesion test of the coating layer on the surface of the object to be tested. The scribing needle 301 can be arranged at a first end (e.g., toward the lower end) of the compression shaft 302. The scribing needle 301 can be customized from a special material. The scribing needle 301 and the compression shaft 302 are arranged to perform linear motion along the radial direction of the carrier disc 201 under the drive of the transmission mechanism 104.

[0047] In some embodiments, the scribing feed mechanism 103 may further include a compression track 303. The upper surface of the compression track 303 may be fixed to the frame 101, and the lower surface of the compression track 303 may be fixed to the frame 101. Figure 3 The illustrated surface is arranged as an inclined surface relative to the plane where the pressure plate 202 and / or the wafer carrier plate 201 are located, and can contact the second end (e.g., the upward end) of the compression shaft 302. In some embodiments, the contact can be achieved by a sliding bearing.

[0048] In some embodiments, a second pressure device 304 may be further provided in the compression shaft 302. The second pressure device 304 may be configured to be axially compressed along the compression shaft 302 and provide a linearly increasing scribing force to the scribing needle 301 when the compression shaft 302 moves (horizontally) linearly toward the center of the wafer carrier 201 along the radial direction of the wafer carrier 201, and is constrained (or squeezed) by the linear increase of the compression track 303.

[0049] The inclination angle of the lower surface of the compression track 303 can be flexibly set depending on the desired rate of linear change of the scoring force.

[0050] In some embodiments, the second pressure device 304 can be a spring configured so that the rebound force is linearly proportional to the compression amount. In other embodiments, the second pressure device 304 can also be a hydraulic device, an air compressor, or any other device made of any other elastic material so that the rebound force is linearly proportional to the compression amount.

[0051] Figure 4 A schematic structural diagram of a transmission mechanism 104 and a rotation input mechanism 105 of an adhesion testing device 100 according to an embodiment of the present disclosure is shown.

[0052] like Figure 4 As shown, the transmission mechanism 104 can be coupled to the carrier disc 201 and the scribing feed mechanism 103, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the carrier disc 201 and the scribing feed mechanism 103.

[0053] In some embodiments, the transmission mechanism 104 may include a first transmission device 401 and a second transmission device 402 .

[0054] The first transmission device 401 can be coupled to the wafer carrier 201 through the first shaft 210, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the wafer carrier 201 to rotate the wafer carrier 201.

[0055] The second transmission device 402 can be coupled to the scoring feed mechanism 103, and can be configured to transmit the rotational motion input from the rotation input mechanism 105 to the scoring feed mechanism 103, so that the scoring needle 301 and the compression shaft 302 can perform a linear motion along the radial direction of the carrier disk 201.

[0056] In some embodiments, Figure 3 As shown, the scribing feeding mechanism 103 may further include a ball screw 305 and a sliding mechanism 306. The compression shaft 302 may be disposed on the sliding mechanism 306 and may perform linear motion with the sliding mechanism 306. The sliding mechanism 306 may be sleeved on the ball screw 305 and may slide along the ball screw 305 or perform linear motion.

[0057] like Figure 3 or Figure 4 As shown, the ball screw 305 can be arranged horizontally (for example, its axial direction can be in a horizontal plane) or its axial direction can be in the same plane as the carrier plate 201. The ball screw 305 can be coupled to the second transmission device 402. The ball screw 305 can be configured to convert the rotational motion transmitted from the second transmission device 402 into the linear motion of the sliding mechanism 306 in the horizontal direction.

[0058] In some embodiments, Figure 4 As shown, the second transmission device 402 may include a first transmission wheel 411 , a first transmission belt 412 , and a second transmission wheel 413 .

[0059] The first transmission wheel 411 can be fixed on the central axis 420 of the rotation input mechanism 105 and can be set to rotate with the rotation of the central axis 420. The second transmission wheel 413 can be fixed (for example, directly fixed or through a corresponding intermediate piece) at one end of the ball screw 305. The first transmission wheel 411 and the second transmission wheel 413 can be coupled through the first transmission belt 412, so that the rotation of the first transmission wheel 411 can be transmitted to the second transmission wheel 413 through the first transmission belt 412. Thus, the rotational motion input from the rotation input mechanism 105 can be transmitted to the ball screw 305 through the first transmission wheel 411, the first transmission belt 412 and the second transmission wheel 413, and converted into the sliding or linear motion of the sliding mechanism 306 in the axial direction of the ball screw 305, so that the stylus 301 and the compression shaft 302 can perform a linear motion along the radial direction of the carrier plate 201 with the movement of the sliding mechanism 306.

[0060] In some embodiments, the speed ratio of the first transmission wheel 411 and the second transmission wheel 413 can be set to 1: 1. In other embodiments, depending on the desired configuration, the speed ratio of the first transmission wheel 411 and the second transmission wheel 413 can also be set to any other ratio, for example, 1:2, 2:1, etc.

[0061] In some embodiments, Figure 4 As shown, the first transmission device 401 may include a first bevel gear 417 , a second bevel gear 418 , a third transmission wheel 414 , a second transmission belt 415 and a fourth transmission wheel 416 .

[0062] The first bevel gear 417 can be fixed on the central shaft 420 of the rotation input mechanism 105 and can be set to rotate with the rotation of the central shaft 420. The second bevel gear 418 can be perpendicular to the first bevel gear 417 (for example, 90 degrees to each other) to change the direction of the rotational movement. The third transmission wheel 414 can be coupled to the second bevel gear 418 through the second shaft 421, and can be set to rotate with the rotation of the second bevel gear 418.

[0063] The fourth transmission wheel 416 may be coupled to the wafer carrier 201 via the first shaft 210. The third transmission wheel 414 and the fourth transmission wheel 416 may be coupled via the second transmission belt 415. Thus, the rotational motion input from the rotation input mechanism 105 may be transmitted to the second bevel gear 418 via the first bevel gear 417, and transmitted to the wafer carrier 201 via the second shaft 421, the third transmission wheel 414, the second transmission belt 415, the fourth transmission wheel 416, and the first shaft 210, so that the wafer carrier 201 can rotate with the rotational motion input from the central shaft 420 of the rotation input mechanism 105.

[0064] Similarly, the speed ratio of the third transmission wheel 414 and the fourth transmission wheel 416 can also be set to 1: 1. In other embodiments, depending on the desired configuration, the speed ratio of the third transmission wheel 414 and the fourth transmission wheel 416 can also be set to any other ratio (e.g., 1:2, 2:1, etc.), and the speed ratio of the first bevel gear 417 and the second bevel gear 418 can also be set to any other ratio (e.g., 1:1, 1:2, 2:1, etc.), which is not limited herein.

[0065] In some embodiments, Figure 4 As shown, the rotation input mechanism 105 may include a hand wheel 431 and a central shaft 420. The hand wheel 431 may be fixed on the central shaft 420, and when the hand wheel 431 is rotated, the central shaft 420 may be driven to rotate. In some embodiments, the rotation input mechanism 105 may also provide rotation input electrically, in which case the rotation input may be provided directly by, for example, a motor, without manually rotating the hand wheel 431. It should be understood that the hand wheel 431 may provide rotational motion in both clockwise and counterclockwise directions, so that the carrier plate 201 may rotate clockwise or counterclockwise accordingly, and / or the stylus 301 may move toward or away from the center of the carrier plate 201. By this arrangement, when the rotation input is provided by the rotation input mechanism 105, the stylus 301 and the carrier plate 201 may move in conjunction according to a preset configuration, so that a simpler and more efficient operation and a more accurate measurement may be provided.

[0066] In some embodiments, the object to be tested described herein may be a wafer or a chip. In other embodiments, the object to be tested described herein may also be any other device to be tested that needs to measure the adhesion of a surface coating.

[0067] As described above, the embodiments of the present disclosure provide a novel adhesion testing device 100 for testing adhesion using a scratch method. Taking the adhesion test of the coating layer on the surface of a wafer as an example, using the adhesion testing device 100, the stylus can make scratches on the wafer by performing circular scratching motion (due to the rotation of the carrier plate and the radial linear motion of the stylus along the carrier plate, the trajectory of the stylus is essentially spiral), and the pressure of the stylus increases linearly during this process until the coating layer peels off or begins to separate from the wafer, and the adhesion of the coating is determined or estimated by the length of the scratch. The peeling off of the coating layer or the beginning of separation from the wafer can be detected by manual observation or by providing an electronic detection device in the stylus (for example, a friction detection device capable of detecting sudden changes in friction).

[0068] In some embodiments, the stylus pressure of the adhesion test device 100 can be designed to be linearly related to the circular motion displacement of the stylus 301 on the wafer, so as to provide a more accurate estimation of the adhesion. For example, by adjusting one or more of the second pressure device 304, the inclination angle of the inclined surface of the compression track 303, the speed ratio of the first transmission wheel 411 and the second transmission wheel 413, the speed ratio of the third transmission wheel 414 and the fourth transmission wheel 416, the speed ratio of the first bevel gear 417 and the second bevel gear 418, etc., each time the stylus 301 moves 1 mm along the radial direction of the wafer carrier 201 toward the center straight line of the wafer carrier 201, the stylus pressure of the stylus 301 increases linearly by ΔF, and the wafer carrier 201 just rotates 1 circle (360 degrees) during this process. In this example, assume that the initial pressure when the scratching needle is at the edge of the wafer is F0. If it is observed that the coating layer peels off and the scratch on the wafer is exactly 2 circles (spiral), it can be known that the scratching needle pressure at this time is F0+2*ΔF, and the adhesion can be estimated or determined based on the scratching needle pressure at this time.

[0069] The following further describes example operation steps for performing adhesion testing of a wafer coating layer using the adhesion testing device 100 according to an embodiment of the present disclosure.

[0070] Step 1, loading the wafer: Rotate the hand wheel to move the scriber outside the wafer carrier. Lift the pressure plate handle and place the wafer in the wafer slot of the wafer carrier. Press down the handle and rotate it so that the handle is stuck in the groove of the limiting structure.

[0071] Step 2, move the needle to the initial position: lift the needle and rotate the hand wheel to move the needle to the edge of the wafer, and then put down the needle.

[0072] Step 3, Scratching: Rotate the hand wheel, the wafer rotates with the wafer carrier, and the scribing needle moves from the edge of the wafer to the center of the wafer, leaving a spiral scratch on the wafer. Stop the operation when the scratch begins to peel off.

[0073] Step 4, evaluate adhesion: measure the number of scratch circles, that is, the scratch length, to evaluate the relative size of the adhesion.

[0074] Next, Figure 5 A schematic diagram of an adhesion testing method 500 according to an embodiment of the present disclosure is shown.

[0075] like Figure 5 As shown, the adhesion test method 500 according to the embodiment of the present disclosure may include: in step S501, placing the object to be tested on a wafer carrier, so that the object to be tested can rotate synchronously with the rotation of the wafer carrier; in step S502, scratching the surface of the object to be tested with a first scratching force by a scratching needle. The scratching needle can move linearly from the edge of the object to be tested along the radial direction of the wafer carrier toward the center of the wafer carrier while the wafer carrier rotates, until the coating layer on the surface of the object to be tested begins to separate from the object to be tested. The first scratching force can increase linearly with the linear motion; in step S503, measuring the length of the scratch caused by the scratching on the surface of the object to be tested; and in step S504, determining the adhesion of the coating layer on the surface of the object to be tested based on the scratch length.

[0076] It should be understood that the adhesion testing method 500 according to the embodiment of the present disclosure may also include any other operating steps or methods of the adhesion testing device 100, which are not limited herein.

[0077] The block diagrams of circuits, devices, apparatuses, equipment, and systems involved in the present disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these circuits, devices, apparatuses, equipment, and systems may be connected, arranged, or configured in any manner as long as the desired purpose can be achieved.

[0078] Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. The present disclosure is intended to encompass such changes and modifications as fall within the scope of the appended claims.

[0079] Any description in this disclosure should not be construed as implying that any particular element, step, or function is an essential element that must be included in the claims scope. The scope of the patented subject matter is limited solely by the claims.

[0080] Exemplary embodiments according to the present disclosure have been disclosed herein, and although specific terms are employed, they are used and interpreted only in a general and descriptive sense and not for limiting purposes. In some cases, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise stated. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made to the present disclosure without departing from the spirit and scope of the claims.

Claims

1. An adhesion testing device, characterized in that: The device comprises: A frame and a film loading mechanism, a scribing feeding mechanism, a rotating input mechanism and a transmission mechanism installed on the frame, wherein: The slide mechanism comprises a slide tray for placing the object to be tested, the slide tray is fixed on the first shaft of the transmission mechanism and is configured to rotate with the rotation of the first shaft; The scribing feeding mechanism comprises a scribing needle and a compression shaft, wherein the scribing needle is used to scribble the surface of the object to be measured, the scribing needle is arranged at a first end of the compression shaft, and the scribing needle and the compression shaft are arranged to perform linear motion along the radial direction of the wafer carrier under the drive of the transmission mechanism; The transmission mechanism is coupled to the carrier disc and the scribing and feeding mechanism, and is configured to transmit the rotational motion input from the rotation input mechanism to the carrier disc and the scribing and feeding mechanism.

2. The device according to claim 1, characterized in that One or more stoppers are arranged on the upper surface of the wafer carrier, and the one or more stoppers respectively correspond to the sizes of one or more objects to be measured.

3. The device according to claim 1, characterized in that The slide carrier mechanism further comprises a first pressure device and a pressure plate, wherein: The first pressure device is coupled to the upper surface of the pressure plate; The pressure plate is arranged directly above the wafer carrier plate, and is arranged to be separated from the upper surface of the wafer carrier plate in a raised state and to press the object to be measured against the upper surface of the wafer carrier plate with a first pressure in a pressed state and to be able to rotate with the rotation of the wafer carrier plate, wherein the first pressure is provided by adjusting the first pressure device.

4. The device according to claim 3, characterized in that The slide carrier mechanism further comprises a handle and a pressure plate shaft, wherein the handle is coupled to the first end of the pressure plate shaft via a rolling bearing, so that the handle and the pressure plate shaft can rotate independently of each other; The second end of the pressure plate shaft is coupled to the first pressure device; and The film carrier mechanism also includes a lifting and pressing down limiting structure, which is fixed on the frame and is provided with a lifting position groove and a pressing down position groove, wherein when the handle is placed in the lifting position groove, the pressure plate is in the lifting state; and when the handle is placed in the pressing down position groove, the pressure plate is in the pressing down state.

5. The device according to claim 4, characterized in that A compression adjustment ring is also provided at the connection between the pressure plate shaft and the first pressure device for adjusting the compression of the first pressure device.

6. The device according to claim 1, characterized in that The scribing feeding mechanism further comprises a compression track, the upper surface of which is fixed on the frame, the lower surface of which is arranged as an inclined surface relative to the plane where the wafer carrier is located and contacts the second end of the compression shaft; and A second pressure device is also provided in the compression shaft, and the second pressure device is configured to perform axial compression along the compression shaft and provide a linearly increasing scribing force to the scribing needle when the compression shaft moves linearly along the radial direction of the wafer carrier disc toward the center of the wafer carrier disc.

7. The device according to claim 1, characterized in that The transmission mechanism comprises a first transmission device and a second transmission device, wherein: The first transmission device is coupled to the wafer carrier through the first shaft and is configured to transmit the rotational motion input from the rotation input mechanism to the wafer carrier to rotate the wafer carrier; and The second transmission device is coupled to the scribing feed mechanism and is configured to transmit the rotational motion input from the rotation input mechanism to the scribing feed mechanism so that the scribing needle and the compression shaft perform the linear motion.

8. The device according to claim 7, characterized in that The scribing feeding mechanism also includes a ball screw and a sliding mechanism, wherein: The compression shaft is arranged on the sliding mechanism, and the sliding mechanism is sleeved on the ball screw; The ball screw is horizontally arranged and coupled to the second transmission device, and the ball screw is configured to convert the rotational motion transmitted from the second transmission device into the linear motion of the sliding mechanism in the horizontal direction.

9. The device according to claim 8, characterized in that The second transmission device comprises a first transmission wheel, a first transmission belt and a second transmission wheel, wherein: The first transmission wheel is fixed on the central axis of the rotation input mechanism and is configured to rotate with the rotation of the central axis. The second transmission wheel is fixed on one end of the ball screw, and the first transmission wheel and the second transmission wheel are coupled through the first transmission belt.

10. The device according to claim 9, characterized in that The speed ratio of the first transmission wheel and the second transmission wheel is set to 1:

1.

11. The device according to claim 7, characterized in that The first transmission device includes a first bevel gear, a second bevel gear, a third transmission wheel, a second transmission belt and a fourth transmission wheel, wherein: The first bevel gear is fixed to the central shaft of the rotation input mechanism and is configured to rotate with the rotation of the central shaft; The second bevel gear is vertically meshed with the first bevel gear; The third transmission wheel is coupled to the second bevel gear via a second shaft and is configured to rotate along with the rotation of the second bevel gear; The fourth transmission wheel is coupled to the wafer carrier through the first shaft; and The third transmission wheel and the fourth transmission wheel are coupled through the second transmission belt.

12. The device according to claim 1, characterized in that The rotation input mechanism comprises a hand wheel and a central shaft, wherein the hand wheel is fixed on the central shaft, and when the hand wheel is rotated, the central shaft is driven to rotate.

13. The device according to claim 1, characterized in that The object to be tested is a wafer.

14. The device according to claim 3, characterized in that The first pressure device is a spring.

15. The device according to claim 6, characterized in that The second pressure device is a spring.

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