Wet groove type cleaning equipment for reducing surface charges of wafer
By setting up an electrostatic ion removal device in the working area of the wet tank cleaning equipment, the wafer surface charge is removed, and the problem of PA particles adsorption caused by the wafer surface charge is solved, and the effect of wet tank cleaning is improved.
Patent Information
- Application Number
- CN202421752910.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-23
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-23
AI Technical Summary
During the wet tank cleaning process, there is a lot of charge on the wafer surface, which leads to adsorption of PA particles and affects the cleaning effect.
A wet tank cleaning device is designed, and an electrostatic ion removal device is provided in the working area. The electrostatic ion removal device is placed above the work tank body to remove charge on the wafer surface.
By removing the surface charge of the wafer, the adsorption of PA particles during the wet tank cleaning process is reduced, and the cleaning effect is improved.
Smart Images
Figure CN222883501U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wet tank cleaning equipment, and in particular to a wet tank cleaning equipment for reducing surface charge of a wafer. Background Art
[0002] Most of the wet cleaning process is after the dry etching process. After the critical dimension measurement of some special layers, more charges will be present on the incoming wafers. The accumulation of more charges will lead to the adsorption of PA (Particle) during wet tank cleaning.
[0003] Based on this, a new technical solution is needed. Utility Model Content
[0004] In view of this, an embodiment of the present specification provides a wet tank cleaning device for reducing the charge on the surface of a wafer.
[0005] The embodiments of this specification provide the following technical solutions:
[0006] An embodiment of the present specification provides a wet tank cleaning device for reducing the surface charge of a wafer, comprising an operating area and an electrostatic ion removal device, and the wafer is transferred to the operating area for wet tank cleaning; the operating area has an operating tank body, and the operating tank body is used to operate on the wafer transferred to the operating tank body; the electrostatic ion removal device is arranged in the operating area, and the electrostatic ion removal device in the operating area is located above the operating tank body, and is used to remove the surface charge of the wafer transferred to the operating tank body.
[0007] Preferably, the electrostatic ion removal range of the electrostatic ion removal device located above the working tank body covers the wafers transferred to the working tank body.
[0008] Preferably, the electrostatic ion removal device located above the working tank body is arranged in the upper center area of the working tank body.
[0009] Preferably, the electrostatic ion removal device located above the operating tank body is higher than the door plate of the operating tank body in the open state, so as to maintain smooth wafer transmission and handover between the operating tank body and wafer operation.
[0010] Preferably, the working area has multiple working chambers, and the working trough body and the electrostatic ion removal device in the working area are both arranged in multiple numbers, and the electrostatic ion removal device and the working trough body are arranged in the working chamber one by one, and the electrostatic ion removal devices in the working area are respectively installed in the top area in the working chamber.
[0011] Preferably, the wet tank cleaning equipment further comprises a conveying area, and the wafer is conveyed to the working area through the conveying area;
[0012] The conveying area is provided with a conveying unit for transferring the position of the wafer.
[0013] Preferably, the transfer chamber is also provided with a drying tank, and the electrostatic ion removal device is also separately arranged in the transfer area, and the electrostatic ion removal device in the transfer area is located above the transfer unit and the drying tank. The electrostatic ion removal range of the electrostatic ion removal device in the transfer area covers the wafers transferred to the transfer unit and the drying tank, and is used to remove the surface charge of the wafers transferred to the transfer unit and the drying tank.
[0014] Preferably, the electrostatic ion removal device in the conveying area is arranged in the upper center area of the conveying unit and the drying tank.
[0015] Preferably, the conveying area has a conveying chamber, and the conveying unit, the drying tank and the electrostatic ion removal device in the conveying area are all located in the conveying chamber, and the electrostatic ion removal device in the conveying area is installed in the top area of the conveying chamber.
[0016] Preferably, the electrostatic ion removal device is an electrostatic ion removal rod, and the rod length arrangement direction of the electrostatic ion removal rod follows the lateral conveying direction of the wafer.
[0017] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:
[0018] The present application arranges an electrostatic ion removal device in the working area and places it in the space above the working tank. The electrostatic ion removal device can remove the surface charge of the wafer, so that during the wafer transmission and operation process, the surface charge of the wafer transmitted to the working tank and the surrounding of the working tank can be removed, and the generation of charge on the surface of the wafer can be reduced, so as to achieve the effect of reducing the charge on the surface of the wafer and reduce the adsorption of the wafer during the wet tank cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 is a schematic diagram of a wet tank cleaning device in the related art;
[0021] Figure 2 It is a schematic diagram of the structure of the wet tank cleaning equipment in this application;
[0022] Figure 3It is a schematic diagram showing that the electrostatic ion removal rod in the present application is higher than the tank door plate.
[0023] Figure numerals: 1. wafer transferor; 2. wafer position adjuster; 3. batch wafer; 4. first energy supplier; 5. second energy supplier; 6. operation tank; 7. electrostatic ion removal device; 8. door panel; 9. cleaning tank; 10. chemical tank; 11. drying tank; 12. conveying unit; 13. cleaning area. DETAILED DESCRIPTION
[0024] The embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0025] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.
[0026] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.
[0027] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0028] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.
[0029] In view of this, the applicant has conducted in-depth research and improvement exploration on wet tank cleaning equipment and charge removal equipment, and found that: the current transfer mode used in wet tank cleaning equipment is: first, the wafer enters the transfer area, and the structure of the wafer transfer area is as follows: Figure 1 As shown, after the wafer arrives at the transfer area, the wet tank cleaning machine is equipped with Figure 1 There is an anti-static ion bar (ion bar) in the middle position, but the anti-static ion bar in the transfer area removes less charge from the wafer surface, and there is still a lot of charge on the wafer surface. At present, the charge removal equipment of wet tank cleaning equipment, such as the anti-static ion removal bar, is generally only placed in the transfer area (WTR). The anti-static ion removal bar is not set in the wafer operation area of the tank cleaning machine. The anti-static ion removal bar only exists in this area and does not exist in other areas of the wet tank cleaning machine. The wafer stays in this area for a short time, and there is still charge on the surface of the wafer. There is no device for removing ions during the tank cleaning process (Process) and completion. There may be defects (defect) adsorption that affects the wafer state and performance level (profile). The presence of a large amount of surface charge will cause the defect type in the environment to be secondary adsorption of particles or residues (Particle & Residue). The transmission unit in the related art includes a transmission unit including a wafer transferor 1, a wafer position adjuster 2, a first energy supplier 4 and a second energy supplier 5. The batch wafers 3 are incoming wafers in batch combination, the wafer transfer device 1 is used to transfer the incoming wafers or the wafers in the wafer transfer box to the transfer arm (wafer transfer from FOUP to Hand-Z), and the wafer position adjuster 2 is used as an aligner to adjust the position of the transferred wafers for subsequent wet tank cleaning. The first energy supplier 4 and the second energy supplier 5 are used for energy supply (power supply).
[0030] Based on this, Figure 2 and Figure 3 As shown, the embodiment of this specification proposes a wet tank cleaning equipment for reducing the surface charge of the wafer, including an operating area and an electrostatic ion removal device 7, and the wafer is transferred to the operating area for wet tank cleaning; the operating area has an operating tank body 6, and the operating tank body 6 is used to operate on the wafer transferred to the operating tank body 6; the electrostatic ion removal device 7 is arranged in the operating area, and the electrostatic ion removal device in the operating area is located above the operating tank body 6, and is used to remove the surface charge of the wafer transferred to the operating tank body 6.
[0031] In one embodiment, if Figure 2 and Figure 3As shown, the electrostatic ion removal range of the electrostatic ion removal device 7 located above the working tank body 6 covers the wafers transferred to the working tank body 6 .
[0032] In one embodiment, if Figure 2 and Figure 3 As shown, the electrostatic ion removal device 7 located above the working tank body 6 is arranged in the upper center area of the working tank body 6.
[0033] In one embodiment, if Figure 2 and Figure 3 As shown, the electrostatic ion removal device 7 located above the operation tank body 6 is higher than the door plate 8 of the operation tank body 6 in the open state, which is used to keep the wafer transmission and the handover of the operation tank body 6 to the wafer operation unobstructed. Gate represents the tank body door plate 8.
[0034] In one embodiment, if Figure 2 and Figure 3 As shown, the working area has multiple working chambers, and the working trough body 6 and the electrostatic ion removal device 7 in the working area are both set in multiples, and the electrostatic ion removal device 7 and the working trough body 6 are arranged in the working chamber one by one, and the electrostatic ion removal devices 7 in the working area are respectively installed in the top area in the working chamber.
[0035] In one embodiment, the operation tank body 6 includes an operation tank body 6 composed of two cleaning tanks 9, and an operation tank body 6 composed of a cleaning tank 9 and a chemical tank 10. The wafer is transferred from the cleaning tank 9 to the chemical tank 10 in the operation chamber. The door panel 8 of the operation tank body 6 can be the door panel 8 of the entire tank body, or can refer to the door panel 8 of the cleaning tank 9 and the chemical tank 10. The cleaning tank 9 can contain the same and / or different cleaning substances, and the chemical tank 10 can also contain the same and / or different chemical solutions.
[0036] In one embodiment, if Figure 2 and Figure 3 As shown, the wet tank cleaning equipment also includes a transfer area, and the wafer is transferred to the operation area through the transfer area; the transfer area is provided with a transfer unit 12 for transferring the position of the wafer.
[0037] In one embodiment, one implementation is that the operation tank body 6 includes the operation tank body 6 formed by the drying tank 11. The conveying unit 12 is located in the conveying chamber of the conveying area. Alternatively, another implementation is as follows: Figure 2 and Figure 3As shown, the conveying area is also provided with a drying tank 11, and the electrostatic ion removal device 7 is also separately provided in the conveying area, and the electrostatic ion removal device 7 in the conveying area is located above the conveying unit 12 and the drying tank 11. The electrostatic ion removal range of the electrostatic ion removal device 7 in the conveying area covers the wafers conveyed to the conveying unit 12 and the drying tank 11, and is used to remove the surface charge of the wafers conveyed to the conveying unit 12 and the drying tank 11. The electrostatic ion removal device 7 is also higher than the door plate 8 of the drying tank 11.
[0038] In one embodiment, if Figure 2 As shown, the electrostatic ion removal device 7 in the conveying area is arranged in the upper center area of the conveying unit 12 and the drying tank 11.
[0039] In one embodiment, if Figure 2 As shown, the conveying area has a conveying chamber, and the conveying unit 12, the drying tank 11 and the electrostatic ion removal device 7 in the conveying area are all located in the conveying chamber, and the electrostatic ion removal device 7 in the conveying area is installed in the top area of the conveying chamber.
[0040] In one embodiment, if Figure 2 As shown, the transfer chamber and the working chamber are arranged along the lateral transfer direction of the wafer, with the transfer chamber as the head end and the drying tank 11 as the first tank body. The wafer is transferred by the transfer arm, and a cleaning chamber with a cleaning area 13 is located behind the working chamber at the end of the arrangement, which is used for cleaning the transfer arm.
[0041] In one embodiment, if Figure 2 and Figure 3 As shown, the electrostatic ion removal device 7 is an electrostatic ion removal rod, and the rod length of the electrostatic ion removal rod is arranged in the lateral conveying direction of the wafer. The working principle of the electrostatic ion removal rod is: positive and negative (+, -) high voltage is applied alternately to each electrode needle by pulse alternating current (AC) to generate two polarity ions, and the positive and negative (+, -) ions are used to neutralize the surface charge of the wafer.
[0042] The vertical conveying direction of the wafer is used to convey the wafer into the tank of the operation tank body 6. The arrangement direction of the tanks in the operation tank body 6 containing multiple operation tanks is the lateral conveying direction of the wafer. The arrangement direction of the multiple operation tank bodies 6 is the lateral conveying direction of the wafer.
[0043] Ion bar installation location: Figure 2 and Figure 3 As shown, the wet cleaning tank cleaning tank body is higher than Figure 3The door plate 8 of the tank body shown is involved in the transportation of wafers and silicon slices, and the handover of tank operations. The ion bar is installed in the center above each tank body, wherein the tank body includes a chemical tank 10 and a cleaning tank 9, to ensure that there is an ion bar to neutralize the charge when transporting to various areas.
[0044] This application aims at the current operation mode of wet tank cleaning equipment, and proposes a solution to optimize the charge removal capability of the existing machine. An electrostatic ion removal rod is added to each existing chamber of the wet cleaning single-wafer cleaning machine to effectively reduce the charge of incoming wafers and the generation of wafer charge. This application reduces the surface charge of the wafer during the process by optimizing the wet tank cleaning equipment, thereby reducing the defects caused by charge-related problems, that is, based on the wet tank cleaning equipment, the surface charge of the wafer can be reduced during the process. This application uses the optimized wet tank cleaning equipment to reduce the surface charge of the wafer, the wafer adsorbs PA, the defect type and the probability of various defects are reduced, and the charge during the operation process is reduced to achieve defect & yield optimization.
[0045] This application is based on wet cleaning tank cleaning equipment. In each process module of the single-wafer cleaning machine, an electrostatic ion removal rod is added. By adding electrostatic ion removal rods on the process tank path, the number of electrostatic ion removal rods is increased to optimize the working environment and reduce the surface charge of the wafer: the contact operation time of the electrostatic ion removal rod is prolonged, the neutralization effect of the surface charge of the wafer is increased, and the surface charge of the wafer is reduced. This application enhances the ability of the machine to neutralize the charge on the surface of the wafer by adding electrostatic ion removal rods, thereby optimizing the surface charge distribution of the wafer and reducing the charge carried by the wafer.
[0046] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and the relevant parts can be referred to the partial description of the previous embodiments.
[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A wet tank cleaning device for reducing surface charge of a wafer, characterized in that: The invention comprises an operation area and an electrostatic ion removal device (7), and wafers are transported to the operation area for wet tank cleaning; the operation area has an operation tank body (6), and the operation tank body (6) is used to operate on the wafers transported to the operation tank body (6); the electrostatic ion removal device (7) is arranged in the operation area, and the electrostatic ion removal device in the operation area is located above the operation tank body (6) and is used to remove the surface charge of the wafers transported to the operation tank body (6).
2. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 1, characterized in that: The electrostatic ion removal range of the electrostatic ion removal device (7) located above the operation tank body (6) covers the wafers transferred to the operation tank body (6).
3. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 2, characterized in that: The electrostatic ion removal device (7) located above the working tank body (6) is arranged in the upper center area of the working tank body (6).
4. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 1, characterized in that: The electrostatic ion removal device (7) located above the operation tank body (6) is higher than the door plate (8) of the operation tank body (6) in the open state, and is used to maintain smooth wafer transmission and handover of the operation tank body (6) to wafer operations.
5. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 1, characterized in that: The working area has a plurality of working chambers, the working trough body (6) and the electrostatic ion removal device (7) in the working area are both arranged in plurality, and the electrostatic ion removal device (7) and the working trough body (6) are arranged in the working chamber in a one-to-one correspondence, and the electrostatic ion removal devices (7) in the working area are respectively installed in the top area of the working chamber.
6. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 1, characterized in that: The wet tank cleaning equipment also includes a conveying area, and the wafer is conveyed to the operating area through the conveying area; The conveying area is provided with a conveying unit (12) for transferring the position of the wafer.
7. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 6, characterized in that: The conveying area is also provided with a drying tank (11), and the electrostatic ion removal device (7) is also separately provided in the conveying area, and the electrostatic ion removal device (7) in the conveying area is located above the conveying unit (12) and the drying tank (11). The electrostatic ion removal range of the electrostatic ion removal device (7) in the conveying area covers the wafers conveyed to the conveying unit (12) and the drying tank (11), and is used to remove the surface charge of the wafers conveyed to the conveying unit (12) and the drying tank (11).
8. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 7, characterized in that: The static ion removal device (7) in the conveying area is arranged in the upper center area common to the conveying unit (12) and the drying tank (11).
9. The wet tank cleaning equipment for reducing the surface charge of a wafer according to claim 7, characterized in that: The conveying area has a conveying chamber, and the conveying unit (12), the drying tank (11) and the electrostatic ion removal device (7) in the conveying area are all located in the conveying chamber, and the electrostatic ion removal device (7) in the conveying area is installed in the top area of the conveying chamber.
10. The wet tank cleaning equipment for reducing the surface charge of a wafer according to any one of claims 1 to 9, characterized in that: The electrostatic ion removal device (7) is an electrostatic ion removal rod, and the rod length arrangement direction of the electrostatic ion removal rod follows the lateral conveying direction of the wafer.