NAND flash memory chip TSOP packaging device

Abstract

The utility model relates to the technical field of packaging equipment, and particularly discloses NAND flash memory chip TSOP packaging equipment which comprises a base, the upper end face of the base is fixedly connected with a moving mechanism, the upper portion of the moving mechanism is connected with a lower die, the rear side of the upper end face of the base is fixedly connected with a case, the inner top of the case is fixedly connected with an upper die, and the inner top of the case is fixedly connected with the lower die. The lower die comprises a die body, a chip placement groove is formed in the middle of the upper end face of the die body, blocking edges are fixedly connected to the two sides of the chip placement groove correspondingly, movable sliding blocks are slidably connected to the outer sides of the blocking edges, a locking assembly is arranged in the die body, the upper die comprises an air cylinder, the lower end of the air cylinder is fixedly connected with a pressing base, and the pressing base is fixedly connected with the lower end of the air cylinder. A positioning assembly is arranged in the middle of the lower end face of the pressing base. According to the utility model, the operation of bending the lead frame and the lead can be completed through one-time action, so that the packaging action is reduced, the TSOP packaging speed of the flash memory chip can be effectively improved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging equipment, in particular to NAND flash memory chip TSOP packaging equipment. Background Art

[0002] TSOP, or thin small package, is one of the common packaging forms of NAND flash memory chips. The size of TSOP package is relatively small, which helps to save space on the PCB board and is suitable for electronic devices with limited space. For example, in some thin and light laptops and smart phones, TSOP-packaged NAND flash memory can better meet the needs of device miniaturization and has a relatively low cost, which makes it advantageous in cost-sensitive applications.

[0003] In the TSOP packaging process, after the chip is plastic-sealed, the outer frame of the chip pins needs to be cut off, and then the pins need to be bent. The current chip packaging equipment needs to perform the operations of cutting the outer frame of the pins and bending the pins in steps, which reduces the packaging speed and is not conducive to improving production efficiency. Therefore, those skilled in the art provide a NAND flash memory chip TSOP packaging device to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a NAND flash memory chip TSOP packaging device to solve the following technical problems:

[0005] How to speed up packaging and improve production efficiency.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] NAND flash memory chip TSOP packaging equipment, including a base, the upper end surface of the base is fixedly connected to a moving mechanism, the upper part of the moving mechanism is connected to a lower mold, the rear side of the upper end surface of the base is fixedly connected to a chassis, and the inner top of the chassis is fixedly connected to an upper mold;

[0008] The lower mold comprises a mold body, a chip placement groove is provided in the middle of the upper end surface of the mold body, both sides of the chip placement groove are fixedly connected with a stop edge, the outer side of the stop edge is slidably connected with a movable slider, and a locking component is provided inside the mold body;

[0009] The upper die comprises a cylinder, the lower end of the cylinder is fixedly connected to a press seat, a positioning assembly is arranged at the middle of the lower end surface of the press seat, bending heads are fixedly connected to both sides of the lower end surface of the press seat, and a cutting knife is fixedly connected to the outer side of the bending head.

[0010] Further, the moving mechanism includes a trough body, a screw rod is rotatably connected to the inner side of the trough body, a slide is sleeved on the outer end of the screw rod, the slide is fixedly connected to the mold body, a motor is fixedly connected to the rear end of the trough body, the output end of the motor is fixedly connected to the screw rod, a slide rail is fixedly connected to the inner side of the trough body, and the slide is slidably connected to the slide rail;

[0011] Further, two first guide rods are slidably sleeved on the lower side of the movable slider, the lower ends of the first guide rods are fixedly connected to the mold body, the outer ends of the first guide rods are sleeved with first springs, and both sides of the mold body below the movable slider are fixedly connected to limiting bosses;

[0012] Further, the locking assembly comprises a sealing tube arranged inside the mold body, both ends of the sealing tube are slidably sleeved with a lock head, the rear end of the lock head is fixedly connected with a piston, the outer end of the sealing tube is fixedly connected with two air pipes, and a third spring is arranged between the piston and the lock head;

[0013] Furthermore, the locking assembly further comprises a locking groove provided on the inner side of the rear end of the movable slider, and the locking head and the locking groove can be correspondingly plugged;

[0014] Further, the positioning assembly includes a fixed seat fixedly connected to the lower end surface of the pressure seat, a pressure plate is arranged below the fixed seat, a plurality of second guide rods slidably sleeved with the fixed seat are fixedly connected to the upper end surface of the pressure plate, and a second spring is sleeved on the outer end of the second guide rod;

[0015] Furthermore, the upper die also includes a guide rail fixedly connected to the chassis, the outer end of the guide rail is slidably sleeved with a sliding sleeve, the sliding sleeve is fixedly connected to the pressure seat, and the cylinder is fixedly connected to the chassis;

[0016] Furthermore, the inner side of the bending head and the outer corners of the retaining edge are both configured as rounded corners;

[0017] Beneficial effects of the utility model:

[0018] The utility model provides a NAND flash memory chip TSOP packaging device. When the device is in use, the flash memory chip is arranged in a placement groove. After the upper mold is pressed down, the cutter cuts off the lead frame, and then the bending head contacts the lead wire, thereby bending the lead wire, so that the upper mold can complete the operation of bending the lead frame and the lead wire in one action, thereby reducing the packaging action, and can effectively improve the flash memory chip TSOP packaging speed and improve the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings.

[0020] Figure 1This is the overall structural diagram of the NAND flash memory chip TSOP packaging device proposed by the utility model;

[0021] Figure 2 It is a structural diagram of the moving mechanism and lower mold of the NAND flash memory chip TSOP packaging device proposed by the utility model;

[0022] Figure 3 This is a structural diagram of the upper die of the NAND flash memory chip TSOP packaging device proposed by the utility model;

[0023] Figure 4 It is a cross-sectional view of a positioning component of a NAND flash memory chip TSOP packaging device proposed by the utility model;

[0024] Figure 5 It is a structural diagram of a locking component of a NAND flash memory chip TSOP packaging device proposed by the utility model.

[0025] Reference numerals:

[0026] 1. Base; 2. Moving mechanism; 21. Slot body; 22. Screw rod; 23. Slide; 24. Slide rail; 25. Motor; 3. Lower mold; 31. Mold body; 32. Chip placement groove; 33. Stop edge; 34. Movable slider; 35. First guide rod; 36. First spring; 37. Limiting boss; 38. Locking assembly; 381. Sealing tube; 382. Air pipe; 383. Piston; 384. Locking head; 385. Locking groove; 386. Third spring; 4. Chassis; 5. Upper mold; 51. Cylinder; 52. Press seat; 53. Guide rail; 54. Sliding sleeve; 55. Positioning assembly; 551. Fixed seat; 552. Second guide rod; 553. Second spring; 554. Press plate; 56. Bending head; 57. Cutter. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Please see attached Figures 1 to 5As shown, the NAND flash memory chip TSOP packaging device in the embodiment of the utility model includes a base 1, the upper end surface of the base 1 is fixedly connected with a moving mechanism 2, the upper part of the moving mechanism 2 is connected with a lower mold 3, the rear side of the upper end surface of the base 1 is fixedly connected with a chassis 4, the inner top of the chassis 4 is fixedly connected with an upper mold 5, and the moving mechanism 2 is provided to drive the lower mold 3 to enter and exit the chassis 4. The lower mold 3 moves out of the chassis 4 to facilitate the removal of the chip, and the lower mold 3 moves into the chassis 4 to facilitate the pressing of the lower mold 3 and the upper mold 5.

[0029] The lower mold 3 includes a mold body 31, a chip placement groove 32 is opened in the middle of the upper end surface of the mold body 31, both sides of the chip placement groove 32 are fixedly connected with a stop edge 33, the outer side of the stop edge 33 is slidably connected with a movable slider 34, and a locking component 38 is arranged inside the mold body 31. When the lower mold 3 is in use, the chip is placed in the chip placement groove 32 after plastic sealing, the pins on both sides are overlapped on the stop edge 33, and the movable slider 34 can slide up and down.

[0030] The upper mold 5 includes a cylinder 51, the lower end of the cylinder 51 is fixedly connected to a pressure seat 52, a positioning assembly 55 is provided at the middle of the lower end surface of the pressure seat 52, both sides of the lower end surface of the pressure seat 52 are fixedly connected to bending heads 56, and the outer side of the bending head 56 is fixedly connected to a cutter 57. When the upper mold 5 is in use, the cylinder 51 drives the pressure seat 52 to be pressed down, and then the cutter 57 contacts the outer end of the pin to cut off the pin frame, and then the pressure seat 52 continues to move the bending head 56 to press the pin down, and at the same time the movable slider 34 is pressed to move downward, so that the pin is bent into a stepped shape.

[0031] The moving mechanism 2 includes a groove body 21, a screw rod 22 is rotatably connected to the inner side of the groove body 21, a slide 23 is sleeved on the outer end of the screw rod 22, the slide 23 is fixedly connected to the mold body 31, a motor 25 is fixedly connected to the rear end of the groove body 21, the output end of the motor 25 is fixedly connected to the screw rod 22, a slide rail 24 is fixedly connected to the inner side of the groove body 21, and the slide 23 is slidably connected to the slide rail 24. When the moving mechanism 2 is in use, the motor 25 drives the screw rod 22 to rotate, thereby driving the slide 23 to move, and then driving the mold body 31 to move.

[0032] Two first guide rods 35 are slidably sleeved on the lower side of the movable slider 34, the lower ends of the first guide rods 35 are fixedly connected to the mold body 31, the outer ends of the first guide rods 35 are sleeved with first springs 36, and both sides of the mold body 31 below the movable slider 34 are fixedly connected to limiting bosses 37, and the movable slider 34 can move up and down along the first guide rods 35. The first springs 36 are provided to facilitate the resetting of the movable slider 34, and the limiting bosses 37 are provided to limit the position of the movable slider 34.

[0033] The locking assembly 38 includes a sealing tube 381 disposed inside the mold body 31, and both ends of the sealing tube 381 are slidably sleeved with a lock head 384, the rear end of the lock head 384 is fixedly connected to a piston 383, the outer end of the sealing tube 381 is fixedly connected to two air pipes 382, ​​and a third spring 386 is provided between the piston 383 and the lock head 384. The locking assembly 38 also includes a lock groove 385 provided on the inner side of the rear end of the movable slider 34, and the lock head 384 and the lock groove 385 can be correspondingly plugged. Component 38 is used to lock the movable slider 34. Specifically, compressed gas is input through an air pipe 382 to push the piston 383 so that the lock head 384 extends out and engages with the lock groove 385. Another air pipe 382 is used to exhaust gas. After exhausting, the lock head 384 retreats and is unlocked. Before the cutter 57 contacts the chip pin, the movable slider 34 is locked by the locking component 38 to keep the movable slider 34 stable. After the pin frame is cut off, the locking component 38 is unlocked to allow the movable slider 34 to move downward.

[0034] The positioning assembly 55 includes a fixed seat 551 fixedly connected to the lower end surface of the pressure seat 52, a pressure plate 554 is arranged below the fixed seat 551, and a plurality of second guide rods 552 slidably sleeved with the fixed seat 551 are fixedly connected to the upper end surface of the pressure plate 554, and a second spring 553 is sleeved on the outer end of the second guide rod 552. After the positioning assembly 55 is pressed down, the pressure plate 554 contacts the surface of the chip, thereby pressing the chip to prevent the chip from shaking.

[0035] The upper mold 5 also includes a guide rail 53 fixedly connected to the chassis 4, the outer end of the guide rail 53 is slidably sleeved with a sliding sleeve 54, the sliding sleeve 54 is fixedly connected to the pressure seat 52, and the cylinder 51 is fixedly connected to the chassis 4. The provision of the guide rail 53 and the sliding sleeve 54 can improve the stability of the pressure seat 52 during movement.

[0036] The inner side of the bending head 56 and the outer corners of the retaining edge 33 are both rounded.

[0037] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A NAND flash memory chip TSOP packaging device, comprising a base (1), characterized in that: The upper end surface of the base (1) is fixedly connected to a moving mechanism (2), the upper part of the moving mechanism (2) is connected to a lower mold (3), the rear side of the upper end surface of the base (1) is fixedly connected to a chassis (4), and the inner top of the chassis (4) is fixedly connected to an upper mold (5); The lower mold (3) comprises a mold body (31), a chip placement groove (32) is provided at the middle of the upper end surface of the mold body (31), both sides of the chip placement groove (32) are fixedly connected with stop edges (33), the outer side of the stop edge (33) is slidably connected with a movable slider (34), and a locking component (38) is provided inside the mold body (31); The upper die (5) comprises a cylinder (51), the lower end of the cylinder (51) is fixedly connected to a pressure seat (52), a positioning assembly (55) is provided at the middle of the lower end surface of the pressure seat (52), both sides of the lower end surface of the pressure seat (52) are fixedly connected to bending heads (56), and the outer side of the bending head (56) is fixedly connected to a cutting knife (57).

2. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: The moving mechanism (2) comprises a trough body (21), a screw rod (22) is rotatably connected to the inner side of the trough body (21), a slide table (23) is sleeved on the outer end of the screw rod (22), the slide table (23) is fixedly connected to the mold body (31), a motor (25) is fixedly connected to the rear end of the trough body (21), the output end of the motor (25) is fixedly connected to the screw rod (22), a slide rail (24) is fixedly connected to the inner side of the trough body (21), and the slide table (23) is slidably connected to the slide rail (24).

3. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: Two first guide rods (35) are slidably sleeved on the lower side of the movable slide block (34); the lower ends of the first guide rods (35) are fixedly connected to the mold body (31); the outer ends of the first guide rods (35) are sleeved with first springs (36); and both sides of the mold body (31) below the movable slide block (34) are fixedly connected to limiting bosses (37).

4. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: The locking assembly (38) comprises a sealing tube (381) arranged inside the mold body (31), both ends of the sealing tube (381) are slidably sleeved with locking heads (384), the rear end of the locking head (384) is fixedly connected to a piston (383), the outer end of the sealing tube (381) is fixedly connected to two air pipes (382), and a third spring (386) is arranged between the piston (383) and the locking head (384).

5. The NAND flash memory chip TSOP packaging device according to claim 4, characterized in that: The locking assembly (38) further comprises a locking groove (385) provided on the inner side of the rear end of the movable slider (34), and the locking head (384) and the locking groove (385) can be plugged in correspondence.

6. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: The positioning assembly (55) comprises a fixed seat (551) fixedly connected to the lower end surface of the pressure seat (52), a pressure plate (554) is arranged below the fixed seat (551), and a plurality of second guide rods (552) slidably sleeved with the fixed seat (551) are fixedly connected to the upper end surface of the pressure plate (554), and a second spring (553) is sleeved on the outer end of the second guide rod (552).

7. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: The upper mold (5) further comprises a guide rail (53) fixedly connected to the chassis (4); the outer end of the guide rail (53) is slidably sleeved with a sliding sleeve (54); the sliding sleeve (54) is fixedly connected to the pressure seat (52); and the cylinder (51) is fixedly connected to the chassis (4).

8. The NAND flash memory chip TSOP packaging device according to claim 1, characterized in that: The inner side of the bending head (56) and the outer corners of the retaining edge (33) are both configured as rounded corners.

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