Laminated packaging structure of integrated circuit chip

Abstract

The utility model relates to the technical field of circuit chip packaging, in particular to a laminated packaging structure of an integrated circuit chip, which comprises a packaging shell with a plugging cover hinged at the top, a sliding plate is arranged in the packaging shell in a sliding manner, a damping cylinder and a buffer spring are fixedly mounted at the bottom of the sliding plate, the buffer spring is movably sleeved on the damping cylinder, and the plugging cover is arranged in the packaging shell. The telescopic end of the damping cylinder and the other end of the buffer spring are fixedly installed on the inner bottom wall of the packaging shell. When the packaging shell runs on a bumpy road surface under the conditions of transportation, transfer and the like, a vehicle vibrates, the vibration is transmitted to the packaging shell at the moment, then the sliding plate slides downwards and compresses the buffer spring, and after vibration force is completely absorbed by the buffer spring, the damping cylinder is matched to enable the buffer spring to rebound slowly, so that the vibration force is absorbed by the packaging shell. The buffer effect on the sliding plate can be achieved, and the problem that the circuit chip is bounced and impacted on the plugging cover due to the fact that the sliding plate is immediately rebounded by a pure buffer spring is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit chip packaging, in particular to a stacked packaging structure of an integrated circuit chip. Background Art

[0002] An integrated circuit chip is an electronic component that includes a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring. With the rapid development of the semiconductor industry, electronic products are becoming increasingly miniaturized and thinner to meet user needs and product performance and memory are becoming higher and higher. Therefore, a stacked packaging structure of integrated circuit chips has emerged.

[0003] For example, the patent specification of an existing Chinese patent (publication number: CN215815846U) discloses a stacked packaging structure for an integrated circuit chip. By cooperating with the set fixing plate, the rubber plate, the first spring, and the rubber strip, friction on the chip during packaging can be prevented to prevent damage, thereby playing a protective role and preventing the chip from shaking inside the packaging device and causing damage.

[0004] However, in the implementation of relevant technologies, it was found that the stacked packaging structure of the integrated circuit chip designed above has the following problems: although the stacked packaging structure of the integrated circuit chip can use springs to absorb vibration force, etc., the simple spring will rebound immediately after absorbing the vibration force, which makes the board connected to the spring drive the circuit chip to rebound, and then easily causes the chip to hit the top of the shell, thereby easily damaging the circuit chip. In view of this, a stacked packaging structure of an integrated circuit chip is provided to overcome the above defects. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a stacked packaging structure for integrated circuit chips.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a stacked packaging structure of an integrated circuit chip, comprising a packaging shell with a sealing cover hinged on the top, a slide plate slidably arranged inside the packaging shell, a damping cylinder and a buffer spring are fixedly installed at the bottom of the slide plate, the buffer spring is movably sleeved on the damping cylinder, and the telescopic end of the damping cylinder and the other end of the buffer spring are fixedly installed on the bottom wall of the packaging shell, and limit balls are rotatably arranged on both sides of the slide plate, and the limit balls are rollingly connected in the packaging shell.

[0007] As a further description of the above technical solution: the number of the damping cylinders and buffer springs is multiple, and the multiple damping cylinders and buffer springs are arranged at equal intervals between the skateboard and the inner bottom wall of the packaging shell. During the sliding of the skateboard, the limiting balls will roll in the slide groove, which can limit the two sides of the skateboard to avoid the problem of tilting of the skateboard during movement.

[0008] As a further description of the above technical solution: two slide grooves are provided in the packaging shell, and limiting grooves are provided on both sides of the slide plate. The limiting balls are rotatably connected in the limiting grooves and rollingly connected in the slide grooves.

[0009] As a further description of the above technical solution: a guide rod is fixedly installed in the skateboard, and two sliders are symmetrically slidably sleeved on the guide rod. A clamping plate is installed on the top of the slider, and the clamping plate is slidably connected to the top of the skateboard. A driving member is also arranged in the skateboard, and the driving member is connected to the slider.

[0010] As a further description of the above technical solution: the driving member includes two rotating shafts, the rotating shafts are rotatably installed in the skateboard and have gears fixedly sleeved thereon, the two gears are meshed and connected to each other, a motor is fixedly installed in the skateboard, the driving shaft of the motor is transmission-connected to one of the rotating shafts, a rack is fixedly installed at the bottom of the slider, the rack is meshed and connected to the gears, when placing the circuit chip, the motor is turned on to rotate one of the gears, since the two gears are meshed and connected, the two gears will rotate in opposite directions, at this time the two gears will respectively drive the two sliders and the clamping plates closer to each other until the two clamping plates cooperate to clamp the circuit chip, which can further improve the stability of the circuit chip in the packaging shell.

[0011] As a further description of the above technical solution: a cavity and a sliding opening are respectively opened inside and on the top of the skateboard, the cavity and the sliding opening are communicated with each other, the rotating shaft is rotatably connected in the cavity, both ends of the guide rod are fixedly installed in the cavity, the motor is fixedly installed on the rear wall of the cavity, and the slider is slidably inserted in the sliding opening.

[0012] As a further description of the above technical solution: elastic pads are fixedly installed on the opposite sides of the two clamping plates, and the elastic pads are made of rubber. The elastic pads can protect the outer surface of the circuit chip and can also be used as a reference for personnel to judge whether the clamping plates are clamping the circuit chip. When the elastic pads are deformed, it means that the circuit chip is clamped, and the motor can be turned off, so that the circuit chip can be stably clamped without damaging it.

[0013] The utility model has the following beneficial effects:

[0014] The stacked packaging structure of the integrated circuit chip designed by the utility model can generate vibration when the packaging shell is traveling on a bumpy road during transportation or transshipment. At this time, the vibration is transmitted to the packaging shell, and then the slide plate slides downward and compresses the buffer spring. After the vibration force is completely absorbed by the buffer spring, the buffer spring can slowly rebound in cooperation with the damping cylinder, thereby achieving the effect of buffering the slide plate and avoiding the problem that the slide plate is immediately rebounded by the simple buffer spring and the circuit chip is bounced up and hits the blocking cover.

[0015] The stacked packaging structure of the integrated circuit chip designed by the utility model can make one of the gears rotate by turning on the motor. Since the two gears are meshed and connected, the two gears will rotate in opposite directions. At this time, the two gears will respectively drive the two sliders and the clamping plates to approach each other until the two clamping plates cooperate to clamp the circuit chip, which can further improve the stability of the circuit chip in the packaging shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the interior of the packaging shell of the utility model in a half-section view;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the interior of the skateboard of the utility model in a half-section view;

[0019] Figure 4 For this utility model Figure 3 Enlarged view of point A in the middle.

[0020] Legend:

[0021] 1. Encapsulation shell; 2. Sealing cover; 3. Slide plate; 4. Damping cylinder; 5. Buffer spring; 6. Limiting ball; 7. Limiting groove; 8. Slide groove; 9. Guide rod; 10. Slider; 11. Clamping plate; 12. Rotating shaft; 13. Gear; 14. Motor; 15. Cavity; 16. Slide mouth; 17. Elastic pad; 18. Rack. DETAILED DESCRIPTION

[0022] Reference Figure 1-4The utility model provides a stacked packaging structure of an integrated circuit chip: it includes a packaging shell 1 with a blocking cover 2 hinged on the top, a slide plate 3 is slidably arranged inside the packaging shell 1, a damping cylinder 4 and a buffer spring 5 are fixedly installed at the bottom of the slide plate 3, the buffer spring 5 is movably sleeved on the damping cylinder 4, and the telescopic end of the damping cylinder 4 and the other end of the buffer spring 5 are fixedly installed on the bottom wall of the packaging shell 1, limit balls 6 are rotatably arranged on both sides of the slide plate 3, the limit balls 6 are rollingly connected in the packaging shell 1, two slide grooves 8 are provided in the packaging shell 1, and limit grooves 7 are provided on both sides of the slide plate 3. The limit balls 6 are rotatably connected in the limit grooves 7 and rollingly connected in the slide grooves 8.

[0023] In specific implementation, when it is necessary to encapsulate the circuit chip in the packaging shell 1, the circuit chip is first placed on the top of the slide plate 3, and then the sealing cover 2 is abutted against and snapped against the top of the packaging shell 1, so that the circuit chip can be easily encapsulated. When the packaging shell 1 is traveling on a bumpy road during transportation, transshipment, etc., the vehicle will vibrate, and the vibration is transmitted to the packaging shell 1. Then the slide plate 3 will slide downward and compress the buffer spring 5. After the vibration force is absorbed by the buffer spring 5, the buffer spring 5 can be slowly rebounded by cooperating with the damping cylinder 4, so as to achieve the effect of buffering the slide plate 3, thereby avoiding the problem that the slide plate 3 is immediately rebounded by the buffer spring 5 alone, causing the circuit chip to be bounced up and hit the blocking cover 2.

[0024] It should be noted that in order to ensure a stable connection between the packaging shell 1 and the sealing cover 2, a buckle can be set on the top of one side of the packaging shell 1, and then a ring body can be installed on one side of the sealing cover 2. The ring body is made of a metal material that can be slightly deformed. Specifically, after the sealing cover 2 is closed on the top of the packaging shell 1, the ring body is pulled and slightly deformed to be buckled on the buckle, so that the sealing cover 2 can be stably connected to the packaging shell 1. Since the buckle and the ring body are both existing mature technologies, they will not be explained in detail in this manual.

[0025] As a further implementation of the above technical solution: the number of damping cylinders 4 and buffer springs 5 ​​is multiple, and multiple damping cylinders 4 and buffer springs 5 ​​are arranged at equal intervals between the slide plate 3 and the inner bottom wall of the packaging shell 1. The arrangement of multiple damping cylinders 4 and buffer springs 5 ​​can further improve the buffering capacity.

[0026] It should be noted that, during the sliding of the slide plate 3 , the limiting balls 6 will roll in the slide groove 8 , and the two sides of the slide plate 3 can be limited to avoid the problem of the slide plate 3 tilting during movement.

[0027] As a further implementation scheme of the above technical scheme: a guide rod 9 is fixedly installed in the skateboard 3, and two sliders 10 are symmetrically slidably sleeved on the guide rod 9. A clamping plate 11 is installed on the top of the slider 10, and the clamping plate 11 is slidably connected to the top of the skateboard 3. A driving member is also provided in the skateboard 3, and the driving member is connected to the slider 10. The driving member includes two rotating shafts 12, which are rotatably installed in the skateboard 3 and fixedly sleeved with gears 13. The two gears 13 are meshed and connected with each other. A motor 14 is fixedly installed in the skateboard 3, and the driving shaft of the motor 14 is transmission-connected to one of the rotating shafts 12. A rack 18 is fixedly installed at the bottom of the slider 10, and the rack 18 is meshed and connected with the gear 13. A cavity 15 and a sliding port 16 are respectively provided inside and on the top of the skateboard 3, and the cavity 15 and the sliding port 16 are connected. The rotating shaft 12 is rotatably connected in the cavity 15, both ends of the guide rod 9 are fixedly installed in the cavity 15, the motor 14 is fixedly installed on the rear wall of the cavity 15, and the slider 10 is slidably inserted in the sliding port 16.

[0028] In specific implementation, based on the above implementation, when placing the circuit chip, turn on the motor 14 to rotate one of the gears 13. Since the two gears 13 are meshed and connected, the two gears 13 will rotate in opposite directions. At this time, the two gears 13 will respectively drive the two sliders 10 and the clamping plates 11 to approach each other until the two clamping plates 11 cooperate to clamp the circuit chip, which can further improve the stability of the circuit chip in the packaging shell 1.

[0029] As a further implementation of the above technical solution: elastic pads 17 are fixedly installed on opposite sides of the two clamping plates 11, and the elastic pads 17 are made of rubber. The elastic pads 17 can protect the outer surface of the circuit chip, and can also be used as a reference for personnel to judge whether the clamping plate 11 clamps the circuit chip. When the elastic pads 17 are deformed, it means that the circuit chip is clamped, and the motor 14 can be turned off, so that the circuit chip can be stably clamped without damaging it.

[0030] In addition, in order to facilitate personnel to control the switch of the motor 14, a controller can be set on the packaging shell 1. The controller is connected to the battery and the motor 14 line. The switch and operating status of the motor 14 can be controlled by operating the controller. Since the controller is an existing mature technology, it will not be explained in detail in this manual.

[0031] Working principle:

[0032] When using the utility model, firstly, all the electrical appliances involved in the inside and outside of the packaging shell 1 are connected to an external power source, and a storage battery can be installed outside the packaging shell 1, and then the storage battery is connected to the electrical circuits involved in the inside and outside of the packaging shell 1 to supply power to them and ensure the normal operation of the electrical appliances. Since the storage battery and the installation of the storage battery are existing technologies, no more explanation is given in this specification. When it is necessary to package the circuit chip in the packaging shell 1, firstly, the circuit chip is placed on the top of the slide plate 3, and then the blocking cover 2 is abutted against and snapped against the top of the packaging shell 1, which can facilitate the packaging of the circuit chip. When the packaging shell 1 is traveling on a bumpy road during transportation, transshipment, etc., the vehicle will vibrate, and the vibration is transmitted to the packaging shell 1 at this time. Then the slide plate 3 will slide downward and compress the buffer spring 5. After the vibration force is completely absorbed by the buffer spring 5, the buffer spring 5 can be slowly rebounded in cooperation with the damping cylinder 4, so as to achieve the effect of buffering the slide plate 3, and avoid the problem that the slide plate 3 is immediately rebounded by the simple buffer spring 5, causing the circuit chip to be bounced up and hit the blocking cover 2.

[0033] It should be noted that, during the sliding of the slide plate 3, the limiting ball 6 will roll in the slide groove 8, and the two sides of the slide plate 3 can be limited to avoid the problem of the slide plate 3 tilting during movement;

[0034] In addition, when placing the circuit chip, the motor 14 is turned on to rotate one of the gears 13. Since the two gears 13 are meshed and connected, the two gears 13 will rotate in opposite directions. At this time, the two gears 13 will respectively drive the two sliders 10 and the clamping plates 11 to approach each other until the two clamping plates 11 cooperate to clamp the circuit chip, which can further improve the stability of the circuit chip in the packaging shell 1.

[0035] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A stacked packaging structure for an integrated circuit chip, comprising a packaging shell (1) with a sealing cover (2) hinged on the top, characterized in that: A slide plate (3) is slidably arranged inside the encapsulating shell (1), a damping cylinder (4) and a buffer spring (5) are fixedly mounted on the bottom of the slide plate (3), the buffer spring (5) is movably sleeved on the damping cylinder (4), and the telescopic end of the damping cylinder (4) and the other end of the buffer spring (5) are both fixedly mounted on the bottom wall of the encapsulating shell (1), and limit balls (6) are rotatably arranged on both sides of the slide plate (3), and the limit balls (6) are rollingly connected in the encapsulating shell (1).

2. The stacked package structure of an integrated circuit chip according to claim 1, characterized in that: The damping cylinder (4) and the buffer spring (5) are both provided in plural numbers, and the plural damping cylinders (4) and the buffer springs (5) are arranged at equal intervals between the slide plate (3) and the inner bottom wall of the encapsulating shell (1).

3. The stacked package structure of an integrated circuit chip according to claim 1, characterized in that: Two slide grooves (8) are provided in the packaging shell (1), and limiting grooves (7) are provided on both sides of the slide plate (3). The limiting balls (6) are rotatably connected in the limiting grooves (7) and rollingly connected in the slide grooves (8).

4. The stacked package structure of an integrated circuit chip according to claim 1, characterized in that: A guide rod (9) is fixedly installed in the slide plate (3), and two sliders (10) are symmetrically slidably sleeved on the guide rod (9). A clamping plate (11) is installed on the top of the slider (10), and the clamping plate (11) is slidably connected to the top of the slide plate (3). A driving member is also arranged in the slide plate (3), and the driving member is connected to the slider (10).

5. The stacked package structure of an integrated circuit chip according to claim 4, characterized in that: The driving member comprises two rotating shafts (12), the rotating shafts (12) are rotatably mounted in the slide plate (3) and a gear (13) is fixedly sleeved thereon, the two gears (13) are meshingly connected to each other, a motor (14) is fixedly mounted in the slide plate (3), the driving shaft of the motor (14) is transmission-connected to one of the rotating shafts (12), a rack (18) is fixedly mounted at the bottom of the slider (10), and the rack (18) is meshingly connected to the gear (13).

6. The stacked package structure of an integrated circuit chip according to claim 5, characterized in that: The interior and top of the slide plate (3) are respectively provided with a cavity (15) and a sliding opening (16); the cavity (15) and the sliding opening (16) are communicated with each other; the rotating shaft (12) is rotatably connected in the cavity (15); both ends of the guide rod (9) are fixedly installed in the cavity (15); the motor (14) is fixedly installed on the rear wall of the cavity (15); and the slider (10) is slidably inserted in the sliding opening (16).

7. The stacked package structure of an integrated circuit chip according to claim 4, characterized in that: An elastic pad (17) is fixedly mounted on one opposite side of the two clamping plates (11), and the elastic pad (17) is made of rubber.

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