Anti-impact structure of quartz crystal oscillator

Abstract

The utility model provides an anti-impact structure of a quartz crystal oscillator, which comprises a main body shell and a cover plate, the cover plate and the main body shell are detachably connected through screws to form a mounting cavity, a connecting base is arranged in the mounting cavity, and a plurality of groups of buffer assemblies are arranged between the connecting base and the main body shell; the wafer body is mounted in the connecting base, a plurality of groups of elastic sheets are arranged in the connecting base, and the elastic sheets are positioned between the connecting base and the wafer body and are in contact with the wafer body; a fixing plate is detachably arranged on the connecting base, and the wafer body is clamped between the fixing plate and the connecting base. According to the impact structure, the mounting cavity is formed by the cover plate and the main body shell, and the wafer body is mounted on the connecting base and located in the mounting cavity, so that external force of collision can be prevented from directly acting on the wafer body; and a plurality of groups of buffer assemblies are arranged between the connecting base and the main body shell, and the buffer assemblies can effectively absorb and disperse impact force, so that the possibility of damage to the wafer body is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of oscillators, and more specifically, particularly relates to an anti-shock structure of a quartz crystal oscillator. Background Art

[0002] In the development of modern electronic technology, quartz crystal oscillators are a key frequency control component that provides a stable clock reference and frequency source for various electronic systems and is widely used in various electronic equipment and systems. During use, quartz crystal oscillators may be affected by various shocks and vibrations. Since the quartz crystal itself is relatively fragile, it is easy to be damaged or its performance degraded when subjected to strong shocks; however, traditional quartz crystal oscillators do not have an effective shock-resistant structure. When faced with various forms of external force collisions, the impact force will directly act on the quartz crystal, which is easy to cause damage to the quartz crystal, which will not only affect the normal operation of the oscillator, causing its frequency output to deviate or become unstable, but may also cause the entire device to fall into a fault state, thereby causing serious interference and adverse effects on the operation of related systems. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a quartz crystal oscillator anti-shock structure to solve the technical problem in the prior art that the traditional quartz crystal oscillator does not have an effective anti-shock structure, and when hit by external force, it will directly act on the quartz crystal, easily causing damage to the quartz crystal and causing frequency output deviation or instability.

[0004] The purpose and effect of the shock-resistant structure of the quartz crystal oscillator of the utility model are achieved by the following specific technical means:

[0005] The impact-resistant structure of a quartz crystal oscillator includes a main shell and a cover plate, wherein the cover plate and the main shell are detachably connected by screws to form an installation cavity, wherein a connecting base is arranged in the installation cavity, and a plurality of buffer components are arranged between the connecting base and the main shell; a chip body is installed in the connecting base, wherein a plurality of spring plates are arranged in the connecting base, wherein the spring plates are located between the connecting base and the chip body and contact the chip body; a fixing plate is detachably arranged on the connecting base, and the chip body is clamped between the fixing plate and the connecting base.

[0006] According to a preferred embodiment, the buffer assembly includes a buffer base, a mounting groove is opened in the main shell, and the buffer base is clamped in the mounting groove; a plurality of groups of positioning columns are arranged on the bottom surface of the mounting groove, and the buffer base is clamped in the positioning hole corresponding to the positioning columns, and the positioning columns are passed through the positioning holes.

[0007] According to a preferred embodiment, the buffer assembly also includes a buffer plate, a buffer rod is provided on the bottom surface of the buffer plate, and the buffer rod is inserted into the buffer base; first clamping grooves are provided on both sides of the buffer rod, and the buffer base is provided with a first slide groove corresponding to the first clamping groove, and a first clamping block passes through the first slide groove and is clamped in the first clamping groove; a first spring is provided between the buffer rod and the buffer base.

[0008] According to a preferred embodiment, a buffer pad is provided on the top surface of the buffer plate, and the buffer pad is in contact with the connection base.

[0009] According to a preferred embodiment, a plurality of connection blocks are arranged on the connection base, the connection blocks are provided with connection grooves, and the limit blocks are inserted into the connection grooves.

[0010] According to a preferred embodiment, a second slot is provided on the limit block, a second slide groove is provided on the connecting block corresponding to the second slot, and the second block passes through the second slide groove and is clamped in the second slot; a second spring is provided between the limit block and the connecting block, and the bottom surface of the limit block is in contact with the chip body.

[0011] According to a preferred embodiment, a plurality of transmission pins are disposed on the bottom surface of the connection base, a plurality of through slots are provided on the main body shell, and the transmission pins are inserted into the through slots.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. The main shell is connected to the cover plate to form a relatively closed installation cavity. The connection base is installed in the installation cavity, and the chip body is clamped in the connection base, so that the installation cavity can effectively separate the chip body from the external environment, reducing the adverse effects of external factors on its performance and life, and ensuring the reliable function of the overall function of the quartz crystal oscillator. At the same time, multiple groups of buffer components are arranged in the installation cavity. The buffer components are located between the connection base and the main shell. When impacted by external force, the buffer components can effectively absorb and disperse the impact force to avoid its direct effect on the chip body, greatly reducing the risk of damage to the chip body. The cooperation between the buffer base and the installation groove and the setting of the positioning column and the positioning hole ensure the stability of the installation of the buffer component, so that it can function stably under impact.

[0014] 2. In the anti-shock mechanism, multiple groups of springs are arranged in the connection base. When the chip body is stuck in the connection base, the springs are located between the two and in contact with the chip body, which increases the buffering and support for it and reduces the impact of shaking on it. At the same time, multiple groups of connection blocks are arranged on the connection base. The limit block is stuck in the connection groove on the connection block. A second spring is arranged between the limit block and the connection block. The second spring limit block completes the telescopic operation in the connection groove. Through their cooperation, the chip body can be quickly installed and removed; a fixing plate is detachably arranged on the connection base. There is a gap between the fixing plate and the chip body, which can effectively prevent external force from directly acting on the chip body, thereby improving the stability and safety of the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model after assembly.

[0016] Figure 2 It is a schematic diagram of the structure of the utility model after being disassembled.

[0017] Figure 3 This is a schematic diagram of the structure after the buffer component is disassembled.

[0018] Figure 4 yes Figure 2 A partial enlarged view of area a.

[0019] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0020] 11. Main body shell; 12. Cover plate; 13. Mounting slot; 14. Positioning column; 21. Connecting base; 22. Spring piece; 23. Fixing plate; 24. Connecting block; 25. Connecting slot; 26. Second slide slot; 27. Transmission foot; 31. Wafer body; 32. Limiting block; 33. Second slot; 34. Second block; 41. Buffer base; 42. Positioning hole; 43. Buffer plate; 44. Buffer rod; 45. First slot; 46. First slide slot; 47. First block; 48. Buffer pad. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solution of the present invention, but cannot be used to limit the protection scope of the present invention.

[0022] Example:

[0023] like Figure 1 , 2As shown, the utility model provides a quartz crystal oscillator impact-resistant structure, including a main body shell 11 and a cover plate 12, and the cover plate 12 and the main body shell 11 are detachably connected by screws, which is not only firm and reliable, but also convenient for disassembly and maintenance when needed. After the two are connected together, a relatively closed installation cavity is formed. A connecting base 21 is arranged in this installation cavity, which plays a key role in bearing and fixing. In order to better cope with possible external force impacts and the like, multiple groups of buffer components are arranged between the connecting base 21 and the main body shell 11, which can effectively absorb and disperse the impact force from all directions. When the external impact force acts on the device, the buffer component will quickly play a role, dissolve and disperse the impact force, and avoid the impact force from being directly transmitted to other internal components, thereby well protecting the relevant structures and components in the device. The chip body 31 is installed in the connecting base 21 to achieve its stable operation and function. Multiple groups of shrapnel 22 are arranged inside the connecting base 21, and these shrapnel 22 are distributed between the connecting base 21 and the chip body 31. The spring piece 22 contacts the chip body 31, providing strong support and cushioning for the chip body 31. When the device vibrates or is subjected to a small impact during operation, the spring piece 22 can absorb and mitigate these adverse effects through its own elastic deformation, ensuring that the chip body 31 is always in a relatively stable state and avoiding damage. At the same time, a fixing plate 23 can be detachably provided on the connecting base 21, and this fixing plate 23 also plays an important role. The chip body 31 is clamped between the fixing plate 23 and the connecting base 21, forming a relatively stable installation structure. The fixing plate 23 provides additional protection and fixation for the chip body 31, further enhancing the safety and stability of the chip body 31.

[0024] like Figure 2 , 3 As shown, the buffer assembly includes a buffer base 41, and a mounting groove 13 is provided inside the main housing 11. The buffer base 41 is clamped in the mounting groove 13 to achieve a stable installation. In order to further ensure the accuracy and stability of the installation of the buffer base 41, multiple groups of positioning columns 14 are provided on the bottom surface of the mounting groove 13, and positioning holes 42 are provided at corresponding positions on the buffer base 41, so that the positioning columns 14 can be accurately penetrated in the positioning holes 42 to play a positioning role.

[0025] The buffer assembly also includes a buffer plate 43, and a buffer rod 44 is arranged on the bottom surface of the buffer plate 43. The buffer rod 44 can be inserted into the buffer base 41 to achieve connection and interaction between the two. First card slots 45 are provided on both sides of the buffer rod 44, and a first slide 46 is provided at a position corresponding to the first card slot 45 on the buffer base 41. The first block 47 can pass through the first slide 46 and be accurately clamped in the first slot 45, so that the connection between the buffer rod 44 and the buffer base 41 is more reliable and will not easily become loose or shifted. A first spring is also arranged between the buffer rod 44 and the buffer base 41. When impacted by external force, the first spring can exert its elastic effect, effectively absorb and buffer the external force, and ensure the safety of the entire device.

[0026] A buffer pad 48 is provided on the top surface of the buffer plate 43, and the buffer pad 48 is in direct contact with the connection base 21. When an external impact force is transmitted, the buffer pad 48 will first contact the connection base 21, and then the impact force will be dispersed and resolved layer by layer through the coordinated action of a series of components such as the buffer plate 43, the buffer rod 44, the first spring and the buffer base 41, thereby greatly reducing the impact on the connection base 21 and the internal wafer body 31.

[0027] like Figure 2 , 4 As shown, a plurality of connection blocks 24 are arranged on the connection base 21, and a connection groove 25 is provided on the connection block 24. The limit block 32 can be inserted into the connection groove 25 and can be extended and retracted in the connection groove 25. In order to further enhance the stability and reliability of the connection, a second clamping groove 33 is provided on the limit block 32, and a second slide groove 26 is provided on the connection block 24 at a position corresponding to the second clamping groove 33. The second clamping block 34 can pass through the second slide groove 26 and be firmly clamped in the second clamping groove 33, forming a locking mechanism, which effectively prevents the limit block 32 from moving randomly in the connection groove 25. In addition, a second spring is provided between the limit block 32 and the connection block 24. The elasticity of the second spring supports the limit block 32, so that the limit block 32 can limit the chip body 31. When the chip body 31 needs to be disassembled, the expansion and contraction of the second spring can be controlled by pressing the second clamping block 34, and the limit block 32 shrinks into the connection groove 25 to release the fixation to the chip body 31. A plurality of transmission pins 27 are provided on the bottom surface of the connection base 21, and a plurality of through grooves are correspondingly provided on the main shell 11. These transmission pins 27 can be accurately inserted into the through grooves. This not only realizes the effective connection and signal transmission between the connection base 21 and the outside, but also ensures the rationality and stability of the entire structure.

[0028] The specific usage and function of this embodiment are as follows:

[0029] First, the main housing 11 and the cover plate 12 are firmly and detachably connected by screws to form a relatively closed installation cavity. Then, the wafer body 31 to be installed is placed in the connection base 21 so that it is supported and buffered by the spring 22. Next, the wafer body 31 is clamped in an appropriate position by the fixing plate 23 to further fix and protect the wafer body 31.

[0030] During the installation of the buffer assembly, the buffer base 41 is accurately inserted into the installation groove 13 inside the main housing 11, and the positioning column 14 cooperates with the positioning hole 42 to ensure the accurate installation position. Then, the buffer rod 44 on the bottom surface of the buffer plate 43 is inserted into the buffer base 41, and the first clamping block 47 passes through the first sliding groove 46 and is clamped into the first clamping groove 45, completing the installation of the buffer assembly.

[0031] The connection block 24 and other related structures are arranged on the connection base 21 to ensure that the limit block 32 can normally expand and contract in the connection slot 25 and form a stable lock with the second slot 33 through the second clamping block 34. When the chip body 31 needs to be disassembled, the second clamping block 34 is pressed to control the expansion and contraction of the second spring, so that the limit block 32 contracts to release the fixation of the chip body 31. Finally, ensure that the transmission pin 27 on the bottom surface of the connection base 21 is accurately inserted into the through groove on the main shell 11 to achieve the overall connection and normal operation of the device. During use, once an external impact force is encountered, the buffer assembly and the synergistic effect of various components will effectively resolve and disperse the impact force, protect the internal structure and components, and ensure that the quartz crystal oscillator works stably and safely.

[0032] The basic principle and main features of the present invention and the advantages of the present invention are shown and described above. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments.

Claims

1. A quartz crystal oscillator anti-shock structure, comprising a main housing (11) and a cover plate (12), characterized in that The cover plate (12) is detachably connected to the main shell (11) by screws to form an installation cavity, a connection base (21) is arranged in the installation cavity, and a plurality of buffer components are arranged between the connection base (21) and the main shell (11); a chip body (31) is installed in the connection base (21), and a plurality of spring sheets (22) are arranged in the connection base (21), and the spring sheets (22) are located between the connection base (21) and the chip body (31) and are in contact with the chip body (31); a fixing plate (23) is detachably arranged on the connection base (21), and the chip body (31) is clamped between the fixing plate (23) and the connection base (21).

2. The quartz crystal oscillator anti-shock structure according to claim 1, characterized in that: The buffer assembly comprises a buffer base (41), a mounting groove (13) is provided in the main body shell (11), and the buffer base (41) is clamped in the mounting groove (13); a plurality of groups of positioning columns (14) are provided on the bottom surface of the mounting groove (13), and the buffer base (41) is clamped in the positioning hole (42) corresponding to the positioning column (14), and the positioning column (14) is inserted into the positioning hole (42).

3. The quartz crystal oscillator anti-shock structure according to claim 2, characterized in that: The buffer assembly also includes a buffer plate (43), a buffer rod (44) is arranged on the bottom surface of the buffer plate (43), and the buffer rod (44) is inserted into the buffer base (41); first clamping grooves (45) are provided on both sides of the buffer rod (44), and the buffer base (41) is provided with a first sliding groove (46) corresponding to the first sliding groove (45), and a first clamping block (47) passes through the first sliding groove (46) and is clamped in the first sliding groove (45); a first spring is arranged between the buffer rod (44) and the buffer base (41).

4. The quartz crystal oscillator anti-shock structure according to claim 3, characterized in that: A buffer pad (48) is provided on the top surface of the buffer plate (43), and the buffer pad (48) is in contact with the connection base (21).

5. The quartz crystal oscillator anti-shock structure according to claim 1, characterized in that: The connection base (21) is provided with a plurality of connection blocks (24), the connection blocks (24) are provided with connection grooves (25), and the limit blocks (32) are inserted into the connection grooves (25).

6. The shock-resistant structure of a quartz crystal oscillator according to claim 5, characterized in that: The limit block (32) is provided with a second slot (33); the connection block (24) is provided with a second slide groove (26) corresponding to the second slot (33); the second block (34) passes through the second slide groove (26) and is locked in the second slot (33); a second spring is provided between the limit block (32) and the connection block (24); and the bottom surface of the limit block (32) is in contact with the wafer body (31).

7. The quartz crystal oscillator anti-shock structure according to claim 6, characterized in that: The bottom surface of the connection base (21) is provided with a plurality of transmission feet (27), and the main shell (11) is provided with a plurality of through slots, and the transmission feet (27) are inserted into the through slots.

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