SMT printing device

Abstract

According to the SMT printing device provided by the utility model, the mounting groove suitable for mounting the circuit board is formed in the substrate, and the accommodating groove for accommodating the patch element is formed in the bottom of the mounting groove, so that compared with the prior art, the patch element cannot be touched; besides, a pressing plate is arranged, the pressing plate is movably installed on the substrate and is provided with a first position which moves to the position above the edge of the circuit board for crimping and a second position which is separated from the circuit board, and a positioning structure which is positioned at the first position and the second position is arranged between the pressing plate and the substrate. The positioning structure comprises a first clamping groove, a second clamping groove and an elastic buckle, the first clamping groove and the second clamping groove are formed in the base plate, the elastic buckle is arranged on the pressing plate, and when the pressing plate is located at the first position, the elastic buckle is connected with the first clamping groove in a matched and clamped mode; when the pressing plate is located at the second position, the elastic buckle and the second clamping groove are clamped in a matched mode, the pressing plate can better limit the position of the circuit board, and therefore the printing quality is guaranteed, and the elastic buckle, the first positioning groove and the second positioning groove have the advantage of being simple in structure.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board patch technology, in particular to an SMT printing device. Background Art

[0002] Double-sided circuit boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and routing, and vias can be used to conduct the circuits between the two layers to form the required electrical connection.

[0003] When soldering a double-sided circuit board, the chip components are first soldered on the first side of the double-sided circuit board, and then the circuit board is turned over to print solder paste and solder the chip components on the second side. When printing solder paste on the second side, the first side is supported by ejectors. On the one hand, the ejectors are easy to push against the chip components on the first side, causing damage to the chip components. On the other hand, some ejectors are easy to be damaged after long-term use, so that the circuit board cannot be well supported, which affects the pressure of the scraper when printing solder paste, and the printing quality cannot be guaranteed. Utility Model Content

[0004] Therefore, the technical problem to be solved by the utility model is to overcome the defect in the prior art that the circuit board is supported by ejector pins, which causes damage to the patch components, thereby providing an SMT printing device in which the patch components are not easily damaged.

[0005] To this end, the utility model provides an SMT printing device, including a substrate and a plurality of pressing plates, the substrate being formed with a mounting groove suitable for installing a circuit board, the bottom of the mounting groove being provided with a accommodating groove for accommodating patch components; a plurality of pressing plates being distributed around the mounting groove, the pressing plate being movably installed on the substrate, and having a first position for moving to the top of the edge of the circuit board for crimping, and a second position for separating from the circuit board, a positioning structure for positioning at the first position and the second position being provided between the pressing plate and the substrate, the positioning structure comprising a first card slot and a second card slot provided on the substrate, and an elastic card buckle provided on the pressing plate, wherein when the pressing plate is located at the first position, the elastic card buckle is adapted to be engaged with the first card slot; when the pressing plate is located at the second position, the elastic card buckle is adapted to be engaged with the second card slot.

[0006] A sliding groove for the pressing plate to slide is formed on the base plate.

[0007] The first clamping slot and the second clamping slot are both provided on two oppositely disposed side walls of the slide slot, and the pressure plate is provided with two elastic buckles corresponding to the two side walls.

[0008] The top surface of the pressing plate is provided with a boss.

[0009] There are four pressing plates, and the four pressing plates are distributed at four corners of the mounting groove.

[0010] A notch is provided on one side of the mounting groove.

[0011] The technical solution of this utility model has the following advantages:

[0012] 1. The SMT printing device provided by the utility model has a substrate formed with an installation groove suitable for installing a circuit board, and a receiving groove for accommodating a patch component is provided at the bottom of the installation groove. Compared with the prior art, the patch component will not be touched in this way, and the installation groove can better support the circuit board to ensure the printing quality; in addition, by setting a pressing plate, the pressing plate can be movably installed on the substrate, and it has a first position moved to the upper edge of the circuit board for crimping, and a second position separated from the circuit board, and a positioning structure positioned at the first position and the second position is provided between the pressing plate and the substrate, and the positioning structure includes a first card slot and a second card slot provided on the substrate, and an elastic clip provided on the pressing plate, wherein when the pressing plate is located at the first position, the elastic clip is adapted to be engaged with the first card slot; when the pressing plate is located at the second position, the elastic clip is adapted to be engaged with the second card slot, and the pressing plate can better limit the position of the circuit board, thereby ensuring the printing quality, and the elastic clip, the first positioning slot and the second positioning slot have the advantage of simple structure.

[0013] 2. In the SMT printing device provided by the utility model, a boss is provided on the top surface of the pressing plate, thereby facilitating operation.

[0014] 3. The SMT printing device provided by the utility model has a notch on one side of the mounting slot, so as to facilitate the removal of the circuit board after printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a structural schematic diagram of the SMT printing device of the utility model;

[0017] Figure 2 This is an enlarged schematic diagram of the pressure plate.

[0018] Explanation of the accompanying drawings: 1. Base plate; 2. Mounting groove; 3. Accommodating groove; 4. Pressing plate; 5. First card slot; 6. Second card slot; 7. Elastic buckle; 8. Slide groove; 9. Boss; 10. Notch. DETAILED DESCRIPTION

[0019] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0023] Example

[0024] This embodiment provides a SMT printing device, such as Figure 1 As shown, it includes a base plate 1 and a plurality of pressing plates 4.

[0025] Substrate 1, such as Figure 1 As shown, it is formed with a mounting groove 2 suitable for mounting a circuit board, the bottom of the mounting groove 2 is provided with a receiving groove 3 for accommodating patch components, and one side of the mounting groove 2 is provided with a notch 10, so that it is convenient for a hand to reach into the notch 10 to take out the circuit board. The base plate 1 is formed with a slide groove 8 for the pressing plate 4 to slide, and the two side walls of the slide groove 8 that are arranged opposite to each other are provided with a first card groove 5 and a second card groove 6.

[0026] A plurality of pressing plates 4 are distributed around the mounting groove 2. The pressing plates 4 are movably mounted on the substrate 1. The pressing plates 4 have a first position for pressing above the edge of the circuit board and a second position for separating from the circuit board. A positioning structure for positioning at the first position and the second position is provided between the pressing plates 4 and the substrate 1. Figure 2 As shown, the positioning structure includes a first card slot 5 and a second card slot 6 provided on the base plate 1, and an elastic buckle 7 provided on the pressing plate 4, wherein when the pressing plate 4 is located at the first position, the elastic buckle 7 is adapted to be engaged with the first card slot 5; when the pressing plate 4 is located at the second position, the elastic buckle 7 is adapted to be engaged with the second card slot 6. The pressing plate 4 is provided with two elastic buckles 7 corresponding to the two side walls, and the top surface of the pressing plate 4 is provided with a boss 9, so that it is convenient for the hand to grasp the boss 9 and move the pressing plate 4. In this embodiment, there are four pressing plates 4, and the four pressing plates 4 are distributed at the four corners of the mounting slot 2.

[0027] The SMT printing device provided by the utility model has a substrate 1 formed with a mounting groove 2 suitable for installing a circuit board, and a receiving groove 3 for receiving a patch element is provided at the bottom of the mounting groove 2. Compared with the prior art, the patch element will not be touched in this way, and the mounting groove 2 can better support the circuit board, thereby ensuring the printing quality; in addition, by providing a pressing plate 4, the pressing plate 4 can be movably installed on the substrate 1, and has a first position for moving to the top of the edge of the circuit board for crimping, and a second position separated from the circuit board, and a positioning structure positioned at the first position and the second position is provided between the pressing plate 4 and the substrate 1, and the positioning structure includes a first card slot 5 and a second card slot 6 provided on the substrate, and an elastic buckle 7 provided on the pressing plate, wherein when the pressing plate 4 is located at the first position, the elastic buckle 7 is adapted to be clamped with the first card slot 5; when the pressing plate 4 is located at the second position, the elastic buckle 7 is adapted to be clamped with the second card slot 6, and the pressing plate 4 can better limit the position of the circuit board, thereby ensuring the printing quality, and the elastic buckle, the first positioning groove and the second positioning groove have the advantage of simple structure.

[0028] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A SMT printing device, characterized in that: include: A base plate (1) is formed with a mounting groove (2) suitable for mounting a circuit board, and a receiving groove (3) for accommodating a patch component is provided at the bottom of the mounting groove (2); A plurality of pressing plates (4) are distributed around the mounting groove (2). The pressing plate (4) is movably mounted on the substrate (1) and has a first position for moving to the upper edge of the circuit board for crimping, and a second position for separating from the circuit board. A positioning structure for positioning at the first position and the second position is provided between the pressing plate (4) and the substrate (1). The positioning structure comprises a first card slot (5) and a second card slot (6) provided on the substrate (1), and an elastic card buckle (7) provided on the pressing plate (4). When the pressing plate (4) is located at the first position, the elastic card buckle (7) is adapted to be engaged with the first card slot (5); when the pressing plate (4) is located at the second position, the elastic card buckle (7) is adapted to be engaged with the second card slot (6).

2. The SMT printing device according to claim 1, characterized in that: A sliding groove (8) for the pressing plate (4) to slide is formed on the base plate (1).

3. The SMT printing device according to claim 2, characterized in that: The first clamping groove (5) and the second clamping groove (6) are both provided on two oppositely arranged side walls of the slide groove (8), and the pressure plate (4) is provided with two elastic buckles (7) corresponding to the two side walls.

4. The SMT printing device according to claim 1, characterized in that: The top surface of the pressing plate (4) is provided with a boss (9).

5. The SMT printing device according to claim 1, characterized in that: There are four pressing plates (4), and the four pressing plates (4) are distributed at the four corners of the installation groove (2).

6. The SMT printing device according to claim 1, characterized in that: A notch (10) is provided on one side of the installation groove (2).

Images