CPU heat dissipation test tool
By designing the adjustable temperature measuring component position, the problem of inconvenient fixation of temperature sensors in existing CPU heat dissipation test tools is solved, and the convenience of use and maintenance of the equipment is improved.
Patent Information
- Application Number
- CN202421935579.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-12
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-08-12
AI Technical Summary
The temperature sensor of the existing CPU heat dissipation test tool is fixed to the support bracket, which is inconvenient to adjust the position of the CPU chip, resulting in poor convenience of use.
A CPU heat dissipation test tool including a bracket, a telescopic rod, a sliding column and a temperature measurement assembly is designed. By setting a rotatable temperature measurement assembly at the bottom of the sliding column, and matching the displacement block and a telescopic rod, the position of the temperature measurement assembly is realized.
The position adjustment of the temperature measurement component is realized, which is convenient for adjustment in various installation positions on the motherboard with the CPU sheet, improves the convenience of the temperature measurement component, and simplifies the disassembly and maintenance process.
Smart Images

Figure CN222887756U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of CPU heat dissipation testing, in particular to a CPU heat dissipation testing tooling. Background Technique
[0002] The CPU (Central Processing Unit) is the core component of a computer system, responsible for executing instructions in computer programs. A CPU heat dissipation testing tooling is a professional device used to evaluate and test the heat dissipation performance of a central processing unit. Its main purpose is to measure the temperature changes of the CPU under different loads. The CPU heat dissipation testing tooling consists of a temperature sensor, a load generator, a load generator, a data acquisition system, a test platform, and a software interface. The temperature sensor is used to monitor the temperature of the CPU in real time. The load generator can simulate different CPU loads, usually using specific software or hardware. The radiator includes various cooling solutions such as air cooling and liquid cooling for testing. The data acquisition system records temperature data and load conditions and performs analysis. The test platform includes a motherboard, a power supply, and other necessary hardware components. The software interface is used to control the test process, record data, and generate reports.
[0003] The temperature sensor of a common CPU heat dissipation testing tooling is fixed on a support bracket, and the positions of the CPU chips on the motherboard are different. The fixed temperature sensor is not convenient to adjust according to the position of the CPU chip, resulting in poor usability of the CPU heat dissipation testing tooling. Therefore, we propose a CPU heat dissipation testing tooling. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a CPU heat dissipation testing tooling to solve the problem that the temperature sensor fixed on the support bracket is not convenient to adjust according to the position of the CPU chip as mentioned in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solution: A CPU heat dissipation testing tooling, including:
[0006] A bracket, on the top of which a motherboard is arranged, on the top of the motherboard a CPU chip is arranged, on the side wall of the bracket a load component electrically connected to the motherboard is arranged, at the rear of the bracket a support column is arranged, on the top of the support column a rotating ring is arranged, and on the top of the rotating ring a locking knob is arranged;
[0007] A telescopic rod, which is fixedly connected to the side wall of the rotating ring, on the side wall of the telescopic rod a displacement block is arranged, inside the displacement block a locking block is arranged, and on the side wall of the locking block a locking bolt is arranged;
[0008] A sliding column, which penetrates through the top of the displacement block, on the top of the sliding column a clamping piece is arranged, on the bottom of the sliding column a temperature measuring component is arranged, and on the side wall of the sliding column a locking knob is arranged.
[0009] Preferably, a plurality of locking bars adapted to the main board are provided at the top of the bracket.
[0010] Preferably, the temperature measuring component is adapted to the top of the main board.
[0011] Preferably, a groove adapted to the main board is formed at the top of the bracket.
[0012] Preferably, the locking block is adapted to the side wall of the sliding column.
[0013] Preferably, a convex connecting piece is arranged inside the sliding column.
[0014] Preferably, a concave connecting piece is arranged on the side wall of the temperature measuring component.
[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0016] 1. In the present utility model, a rotatable temperature measuring component is arranged at the bottom of the sliding column, and then the sliding column can be adjusted up and down in cooperation with the displacement block. Then, the displacement block can be pushed and pulled in cooperation with the telescopic column, and then the telescopic column can be pushed to make the rotating ring rotate in cooperation with the support column, so as to realize the position adjustment of the temperature measuring component, so that the temperature measuring component can be adjusted in cooperation with various installation positions of the CPU chip on the main board, which is convenient for the temperature measuring component to be used under various requirements.
[0017] 2. When the sliding column slides up and down in the present utility model, the clamping piece can be removed. At this time, the sliding column can be removed from the displacement block, and then the locking knob can be loosened by hand. At this time, the temperature measuring component can be removed, which can realize the convenient disassembly of the temperature measuring component, saving the trouble of using tools to screw the bolts, and facilitating the disassembly, inspection and maintenance of the temperature measuring component. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0019] Figure 2 is a schematic diagram of the combined structure of the sliding column and the temperature measuring component of the present utility model;
[0020] Figure 3 is a schematic diagram of the disassembled structure of the sliding column, the temperature measuring component and the locking knob of the present utility model;
[0021] Figure 4 is a schematic diagram of the disassembled structure of the locking knob and the rotating ring of the present utility model.
[0022] In the figure: 100, bracket; 101, locking bar; 102, main board; 103, CPU chip; 110, load component; 120, support column; 130, rotating ring; 131, locking knob; 200, telescopic rod; 210, displacement block; 220, locking block; 221, locking bolt; 300, sliding column; 310, clamping piece; 320, temperature measuring component; 321, locking knob; 322, concave connecting piece; 323, convex connecting piece. Detailed implementation manner
[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0024] Embodiment
[0025] Please refer to Figures 1 - 4 , the CPU heat dissipation test tooling shown in the figure includes:
[0026] A main board 102 is provided at the top of the bracket 100. The main board 102 is a common PCB circuit board on the market for use with the CPU chip 103. A CPU chip 103 is provided at the top of the main board 102. The CPU chip 103 uses a common CPU on the market. A load component 110 electrically connected to the main board 102 is provided on the side wall of the bracket 100. The load component 110 can simulate different CPU loads and uses a common computer host. A support column 120 is provided at the rear of the bracket 100. A rotating ring 130 is provided at the top of the support column 120. A locking knob 131 is provided at the top of the rotating ring 130. The locking knob 131 is a bolt that can be directly screwed by hand;
[0027] The telescopic rod 200 is fixedly connected to the side wall of the rotating ring 130. The telescopic rod 200 is a common gas strut on the market. A displacement block 210 is provided on the side wall of the telescopic rod 200. A locking block 220 is provided inside the displacement block 210. A locking bolt 221 is provided on the side wall of the locking block 220;
[0028] The sliding column 300 passes through the top of the displacement block 210. A clamping piece 310 is provided at the top of the sliding column 300, and a temperature measuring component 320 is provided at the bottom of the sliding column 300. A common infrared temperature sensor is embedded at the bottom of the temperature measuring component 320. The infrared temperature sensor is a non-contact temperature measuring device that uses the infrared radiation emitted by the CPU chip 103 to determine its surface temperature. The infrared temperature sensor of the temperature measuring component 320 is electrically connected to the load component 110. A display screen is provided on the side wall of the load component 110, and can be displayed on the display screen after the load component 110 receives the data of the temperature measuring component 320. A locking knob 321 is provided on the side wall of the sliding column 300.
[0029] Specifically, a plurality of locking bars 101 that cooperate with the main board 102 are provided on the top of the bracket 100, and a rubber strip is provided at the bottom of the locking bars 101.
[0030] Furthermore, the temperature measuring component 320 is fitted to the top of the main board 102.
[0031] Still further, a groove that cooperates with the main board 102 is formed on the top of the bracket 100.
[0032] Still further, the locking block 220 is fitted to the side wall of the sliding column 300.
[0033] It should be noted that a convex connecting piece 323 is provided inside the sliding column 300.
[0034] It should be noted that a concave connecting piece 322 that cooperates with the locking knob 321 is provided on the side wall of the temperature measuring component 320. When the locking knob 321 is tightened, the locking knob 321 enters the inside of the concave connecting piece 322. At this time, a concave connecting piece 322 that cooperates with the convex connecting piece 323 is provided at the rear side of the temperature measuring component 320.
[0035] In addition, the above-mentioned electrical components and electrical equipment all use an external power supply. The circuits, electronic components and modules involved in the present utility model are all prior arts, which can be fully realized by those skilled in the art without further elaboration. The content protected by the present utility model does not involve improvements to the internal structure and method either;
[0036] Working principle: By setting a rotatable temperature measuring component 320 at the bottom of the sliding column 300, the sliding column 300 can be adjusted up and down in cooperation with the displacement block 210. Then, the telescopic column can be used to push and pull the displacement block 210, and then the telescopic column can be pushed to make the rotating ring 130 rotate in cooperation with the support column 120, so as to realize the position adjustment of the temperature measuring component 320, enabling the temperature measuring component 320 to be adjusted according to various installation positions of the CPU chip 103 on the main board 102, which is convenient for the temperature measuring component 320 to be used under various requirements. When the sliding column 300 slides up and down, the clamping piece 310 can be removed. At this time, the sliding column 300 can be removed from the displacement block 210, and then the locking knob 321 can be loosened by hand. At this time, the temperature measuring component 320 can be removed, which realizes the convenient disassembly of the temperature measuring component 320, eliminating the trouble of using tools to turn bolts, and facilitating the disassembly, inspection and maintenance of the temperature measuring component 320.
[0037] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.
[0038] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. CPU heat dissipation test tooling, characterized in that: include: A bracket (100), wherein a mainboard (102) is arranged on the top of the bracket (100), a CPU chip (103) is arranged on the top of the mainboard (102), a load component (110) electrically connected to the mainboard (102) is arranged on the side wall of the bracket (100), a support column (120) is arranged on the rear side of the bracket (100), a rotating circle (130) is arranged on the top of the support column (120), and a locking knob (131) is arranged on the top of the rotating circle (130); A telescopic rod (200), the telescopic rod (200) being fixedly connected to a side wall of the rotating circle (130), a displacement block (210) being provided on the side wall of the telescopic rod (200), a locking block (220) being provided inside the displacement block (210), and a locking bolt (221) being provided on the side wall of the locking block (220); A sliding column (300), the sliding column (300) passes through the top of the displacement block (210), a clamping piece (310) is provided at the top of the sliding column (300), a temperature measuring component (320) is provided at the bottom of the sliding column (300), and a locking knob (321) is provided on the side wall of the sliding column (300).
2. The CPU heat dissipation test tool according to claim 1, characterized in that: A plurality of locking bars (101) matched with the main board (102) are arranged on the top of the bracket (100).
3. The CPU heat dissipation test tool according to claim 1, characterized in that: The temperature measurement component (320) is matched with the top of the main board (102).
4. The CPU heat dissipation test tool according to claim 1, characterized in that: The top of the bracket (100) is provided with a groove which matches the main board (102).
5. The CPU heat dissipation test tool according to claim 1, characterized in that: The locking block (220) is matched with the side wall of the sliding column (300).
6. The CPU heat dissipation test tool according to claim 1, characterized in that: A convex piece (323) is arranged inside the sliding column (300).
7. The CPU heat dissipation test tool according to claim 1, characterized in that: A concave connecting piece (322) is provided on the side wall of the temperature measuring component (320).