Circuit board simulating BGA mounting effect

Abstract

The utility model relates to the technical field of electronic component testing and manufacturing, in particular to a circuit board for simulating a BGA (Ball Grid Array) mounting effect, which comprises a circuit board, a glass substrate and solder balls. The glass substrate is arranged above the circuit board, and the solder balls are located between the circuit board and the glass substrate. The size of the glass substrate is matched with the size of a bonding pad on the circuit board, and the glass substrate is made of a transparent material. The beneficial effects of the utility model are as follows: 1, the use of the glass substrate enables the filling process and effect of the adhesive at the bottom of the BGA to be directly observed in the testing process, and complex adhesive filling and slicing steps are not needed; 2, an actual BGA chip does not need to be consumed, so that the test cost is reduced; and 3, the test steps are simplified, and the test efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component testing and manufacturing, and more specifically, to a circuit board simulating BGA mounting effect. Background Art

[0002] BGA (Ball Grid Array) packaging technology is widely used in modern electronic products, especially in the field of integrated circuit packaging. Due to its good electrical performance and heat dissipation performance, BGA packaging is widely used in high-density and high-performance electronic products. After the small BGA chip is mounted, in some application scenarios, especially in the application on FPC (Flexible Printed Circuit Board), underfill glue is used to fill and protect the bottom of the BGA. This filling process helps to enhance the mechanical strength of the chip, improve heat conduction and increase the overall reliability.

[0003] However, the existing methods for detecting the underfill effect of adhesives on the bottom of BGA chips have some significant drawbacks:

[0004] High cost: Directly using BGA chips for testing requires consuming a large number of chips and circuit boards, which poses high requirements for cost control and increases the overall testing cost.

[0005] Complex process: The existing methods need to go through multiple steps, such as glue filling, curing, slicing and microscopic observation, to observe the underfill effect at the bottom of the BGA chip. This not only increases the workload, but also prolongs the testing time and reduces the testing efficiency.

[0006] Unintuitive observation: Due to the structural characteristics of the BGA chip package, the filling process and filling effect are difficult to directly observe. Indirect analysis must be relied on through means such as slicing, which makes the observation process complex and unintuitive, and it is difficult to quickly obtain the required test results. Summary of the Utility Model

[0007] In order to solve the above problems, the utility model provides a method and device for making a circuit board simulating BGA mounting effect. By using a transparent glass substrate to replace the BGA chip, the filling process and final effect of the adhesive at the bottom of the BGA can be directly observed, the testing cost is reduced, the testing process is simplified, and the intuitiveness and accuracy of the testing are improved.

[0008] To achieve the above object, the utility model provides the following technical solutions, mainly including:

[0009] A circuit board simulating BGA mounting effect, including the following structures:

[0010] A circuit board;

[0011] A glass substrate, which is disposed above the circuit board;

[0012] Solder balls, which are located between the circuit board and the glass substrate.

[0013] Preferably, the size of the glass substrate matches the size of the BGA pads on the circuit board.

[0014] Preferably, the glass substrate is made of a transparent material.

[0015] Preferably, the solder balls are evenly distributed in the BGA pad area of the circuit board.

[0016] Preferably, the solder balls are soldered to the circuit board.

[0017] Preferably, the BGA pad area on the circuit board is provided with a bonding area for fixing the glass substrate.

[0018] Preferably, the bonding area between the glass substrate and the circuit board is fixedly connected by soldering.

[0019] Through the above technical solutions, compared with the prior art, the following technical effects are achieved by the present utility model:

[0020] Transparent observation: The use of the glass substrate enables direct observation of the filling process and effect of the adhesive at the bottom of the BGA during the test, without the need for complex potting and slicing steps.

[0021] Cost reduction: No actual BGA chips need to be consumed, reducing the test cost.

[0022] Simple operation: The test steps are simplified, improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model, and those of ordinary skill in the art can obtain other drawings according to the provided drawings without creative efforts.

[0024] Figure 1 It is a top view of the structure of the present utility model.

[0025] Figure 2 It is a side structural schematic diagram of the present utility model.

[0026] Description of the reference numerals: 1 - circuit board, 2 - glass substrate, 3 - solder balls. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Embodiment 1

[0029] A circuit board simulating the BGA mounting effect, as Figure 1 and Figure 2 shown, includes the following structures:

[0030] Circuit board 1;

[0031] Glass substrate 2, which is arranged above circuit board 1;

[0032] Solder balls 3, which are located between circuit board 1 and glass substrate 2.

[0033] To further optimize the above solution, the size of glass substrate 2 matches the size of the BGA pads on circuit board 1.

[0034] To further optimize the above solution, glass substrate 2 is made of a transparent material and is used to directly observe the filling process and effect of the adhesive at the bottom of the BGA chip.

[0035] To further optimize the above solution, solder balls 3 are evenly distributed in the BGA pad area of circuit board 1 and are used to simulate the soldering effect of the BGA chip.

[0036] To further optimize the above solution, after solder balls 3 are melted, glass substrate 2 squeezes solder balls 3 by its own gravity, so that glass substrate 2 fits with the BGA pad area on circuit board 1.

[0037] To further optimize the above solution, the material selection and structural design of circuit board 1 and glass substrate 2 ensure the matching of the thermal expansion coefficients at different temperatures and avoid stress damage during the heating process.

[0038] To further optimize the above solution, circuit board 1 and glass substrate 2 go through two heating processes to make solder balls 3 evenly distributed and form a stable soldering connection.

[0039] To further optimize the above solution, the fitting area between glass substrate 2 and circuit board 1 has good flatness to ensure the stability and uniformity of the soldering process.

[0040] To further optimize the above solution, position marks for fixing the glass substrate 2 are provided in the BGA pad area on the circuit board 1 to ensure the accurate positioning of the glass substrate 2.

[0041] The specific manufacturing steps are as follows:

[0042] Cut the glass substrate 2 with reference to the BGA chip size so that the glass substrate 2 matches the pad size of the circuit board 1;

[0043] Bake the circuit board 1 in an oven at 130 °C for 2 hours to remove the moisture inside the circuit board 1 and avoid delamination of the circuit board 1 during the subsequent heating process;

[0044] Use a printing mold to print solder paste onto the BGA pads of the circuit board 1. The thickness of the printing mold is selected according to the height of the solder balls at the bottom of the BGA chip;

[0045] Place the circuit board 1 printed with solder on a heating table at a constant temperature of 220 °C for solder melting operation;

[0046] Place the cut glass substrate 2 on the pad area after solder melting;

[0047] Place the circuit board 1 with the glass substrate 2 on a heating table at a constant temperature of 230 °C to melt the solder again, so that the glass substrate 2 squeezes the molten solder balls 3 downward under its own gravity;

[0048] Remove the circuit board 1 from the heating table and wait for the solder and the circuit board 1 to cool down to room temperature.

[0049] In summary, this application uses a transparent glass substrate 2 to replace the BGA chip, which has a low cost, and can directly observe the filling process and the final filling effect of the adhesive at the bottom of the BGA chip, reducing the subsequent processes of glue filling and slicing.

[0050] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0051] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board simulating BGA mounting effect, characterized in that: Includes the following structures: Circuit boards; A glass substrate, wherein the glass substrate is arranged above the circuit board; A solder ball is located between the circuit board and the glass substrate.

2. A circuit board simulating BGA mounting effect according to claim 1, characterized in that: The size of the glass substrate matches the size of the BGA pad on the circuit board.

3. A circuit board simulating BGA mounting effect according to claim 1, characterized in that: The glass substrate is a transparent material.

4. A circuit board simulating BGA mounting effect according to claim 1, characterized in that: The solder balls are evenly distributed in the BGA pad area of ​​the circuit board.

5. A circuit board simulating BGA mounting effect according to any one of claims 1 or 4, characterized in that: The solder balls are connected to the circuit board by welding.

6. A circuit board simulating BGA mounting effect according to claim 1, characterized in that: The BGA pad area on the circuit board is provided with a bonding area for fixing the glass substrate.

7. A circuit board simulating BGA mounting effect according to any one of claims 3 or 6, characterized in that: The glass substrate and the bonding area of ​​the circuit board are fixedly connected by soldering.

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