Preparation device of electroplating liquid for electroplating processing of electronic circuit board

Abstract

The utility model relates to the technical field of electronic circuit board processing, and discloses an electroplating liquid preparation device for electroplating processing of an electronic circuit board. The electroplating processing electroplating liquid preparation device for the electronic circuit board comprises a supporting column, a supporting plate is fixedly installed at the upper end of the supporting column, a connecting rod is fixedly installed above the supporting plate, a limiting frame is fixedly installed at the upper end of the connecting rod, and an electric heating pipe is fixedly installed at the bottom of the limiting frame; filter cartridges are installed above the limiting frame in a penetrating mode, the filter cartridges are formed by weaving metal wires and can bear materials, the materials are divided into four parts to be poured into the four filter cartridges when the materials are added, the materials can be dissolved along with continuous rotation of a solution, and disintegrating slag which cannot be dissolved into the solution can be collected by the filter cartridges and stays in the filter cartridges; the filter cylinder and the limiting frame are in sliding connection, the filter cylinder can be taken out after preparation is completed, disintegrating slag is poured out, and the disintegrating slag can be prevented from being discharged along with the electroplating liquid in the mode.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuit board processing, in particular to a device for preparing electroplating liquid for electroplating processing of electronic circuit boards. Background Art

[0002] Because different types of plating solution formulas require different ingredients, the specific methods of their preparation are also different. They should be prepared correctly according to the specific preparation process and precautions. However, the various preparation methods and sequences are roughly the same.

[0003] The existing referenceable Chinese utility model patent with announcement number: CN218191538U discloses a device for preparing electroplating liquid for electroplating processing, including a frame, a variable speed motor is fixedly connected to the left side of the frame, a gear is fixedly connected to the output end of the variable speed motor, a preparation box is movably connected to the inner side of the frame, a rack is fixedly connected to the outer side of the preparation box, and a cleaning component is provided in the inner cavity of the preparation box, and the cleaning component includes a servo motor fixedly installed on the upper end of the preparation box, a threaded rod is fixedly connected to the output end of the servo motor, and a mounting seat is fixedly connected to the lower end of the threaded rod. The device for preparing electroplating liquid for electroplating processing is provided with a cleaning component, which is started by a servo motor, and the servo motor drives the threaded rod to rotate. Under the restriction of the auxiliary rod and the connecting rod, the threaded block moves in a directional manner on the threaded rod, and synchronously drives the connecting rod, so that the connecting rod drives the cleaning brush to clean the inner cavity wall of the preparation box, thereby solving the problem of inconvenience of manual cleaning.

[0004] The preparation of the plating solution requires adding materials to distilled water for mixing, and after the mixing is completed, it needs to be mixed by stirring. The existing preparation device cannot collect the material debris remaining in the plating solution after mixing. The debris will be discharged with the plating solution. At the same time, special materials have a slow dissolution rate at room temperature, and stirring alone cannot meet the dissolution needs of different components. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the utility model provides a plating liquid preparation device for electroplating processing of electronic circuit boards, which has the advantages of being able to filter material debris in the plating liquid and being able to increase the dissolution rate, thereby solving the above-mentioned technical problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for preparing electroplating liquid for electroplating processing of electronic circuit boards, comprising: a support column, a support plate is fixedly installed on the upper end of the support column, a connecting rod is fixedly installed on the upper end of the support plate, a limiting frame is fixedly installed on the upper end of the connecting rod, an electric heating pipe is fixedly installed on the bottom of the limiting frame, a filter cartridge is inserted and installed on the upper end of the limiting frame, a motor is fixedly installed on the upper end of the support plate, a gear is fixedly installed on the outer side of the rotating shaft of the motor, and a limiting A mixing barrel is fixedly installed at the center of the support plate and the limit plate, a receiving bucket is fixedly installed at the bottom end of the mixing barrel, a drain valve is inserted through the lower end of the receiving bucket, a connecting bearing is fixedly installed inside the mixing barrel, a connecting frame is fixedly installed inside the connecting bearing, a gear ring is inserted through the top of the connecting frame, a fixing frame is fixedly installed at the bottom end of the connecting frame, a fixed shaft is inserted through the center of the fixing frame, and a paddle is fixedly installed on the outer side of the fixed shaft; the limit frame can limit the position of the electric heating tube and the filter cartridge.

[0009] As the preferred technical solution of the utility model, the support column is symmetrically installed at the four corners of the bottom surface of the support plate with the center of the support plate as the reference, and the connecting rod is fixed to the top surface of the support plate in an "X" shape at an angle of ninety degrees with the center of the support plate as the reference, and the upper end of the connecting rod passes through the limit plate; the connecting rod can limit the position of the limit frame.

[0010] As the preferred technical solution of the utility model, the limit frame is fixedly connected to the support plate by a connecting rod, the electric heating tube is fixedly installed at the bottom of the center of the limit frame, and the filter cartridge is installed above the limit frame in an "X" shape at a ninety-degree angle based on the center of the limit frame; the filter cartridge is woven from metal wire, can receive materials, and prevent insoluble debris from entering the electroplating solution.

[0011] As the preferred technical solution of the utility model, the motor is symmetrically installed on the front and rear sides of the top surface of the support plate with the center of the support plate as the reference, the motor passes through the limit plate, and the motor and the limit plate are fixedly connected; the limit plate can limit the position of the motor.

[0012] As a preferred technical solution of the utility model, the mixing barrel is fixedly connected with the support column through the support plate, the drain valve is connected with the mixing barrel through the receiving bucket, the connecting bearing is fixedly installed at the upper and lower ends of the mixing barrel, and the connecting bearing is inserted and installed under the connecting frame; the connecting bearing can facilitate the rotation of the connecting frame.

[0013] As a preferred technical solution of the utility model, the connecting frame is rotatably connected to the mixing barrel via a connecting bearing, and the gear ring is meshed with gears fixed on the outside of the motor shaft on the front and rear sides of the support plate; the gear ring can drive the connecting frame to rotate.

[0014] As the preferred technical solution of the utility model, the fixing frame is symmetrically installed at the upper and lower ends of the fixed shaft with the center of the fixed shaft as the reference, the fixed shaft is fixedly connected through the fixing frame and the connecting frame, the paddle is installed in a ring shape at a forty-five degree angle on the outside of the fixed shaft with the center of the fixed shaft as the reference, and the outer edge of the paddle is fixedly connected to the connecting frame; the paddle can drive the electroplating liquid to rotate.

[0015] Compared with the prior art, the utility model provides a device for preparing electroplating liquid for electroplating processing of electronic circuit boards, which has the following beneficial effects:

[0016] 1. The utility model arranges an electric heating tube, which is fixedly installed at the bottom of the center of the limit frame. The limit frame is fixed to the top of the limit plate through a connecting rod. The electric heating tube is located inside the mixing barrel. When configured, the electric heating tube can heat the distilled water, thereby increasing the temperature of the distilled water to increase the dissolution rate of the material. At the same time, the motor can drive the connecting frame to rotate through the gears and the gear ring, so that the paddles at the bottom of the connecting frame rotate. When the paddles rotate, the solution inside the mixing barrel can rotate with the center of the mixing barrel as the reference. Since the filter cartridge is used as the reference, the material deviates from the center of rotation of the solution. When the solution rotates, it can continuously contact with the material inside the filter cartridge to increase the dissolution rate.

[0017] 2. The utility model sets a filter cartridge, and the center of the filter cartridge limiting frame is used as a reference, and the filter cartridge is installed above the limiting frame in an "X" shape with a 90-degree angle. The filter cartridge is woven with metal wires and can receive materials. When adding materials, the materials are divided into four parts and poured into the four filter cartridges respectively. The materials will dissolve with the continuous rotation of the solution, and the debris that cannot be dissolved into the solution will be collected by the filter cartridge and remain in the filter cartridge. A sliding connection is formed between the filter cartridge and the limiting frame. After the preparation is completed, the filter cartridge can be taken out and the debris can be poured out. This method can prevent the debris from being discharged with the electroplating solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure between the support plate and the electric heating pipe of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the mixing barrel and the drain valve of the utility model;

[0021] Figure 4 This is a schematic diagram of the installation structure of the blade and the connecting frame of the utility model;

[0022] Among them: 1. Support column; 11. Support plate; 12. Connecting rod; 13. Limiting frame; 14. Electric heating tube; 15. Filter cartridge; 16. Motor; 17. Gear; 18. Limiting plate; 2. Mixing barrel; 21. Receiving bucket; 22. Drain valve; 23. Connecting bearing; 24. Connecting frame; 25. Gear ring; 26. Fixed frame; 27. Fixed shaft; 28. Paddle. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0024] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1 - Figure 4 In the present embodiment, a device for preparing electroplating liquid for electroplating processing of electronic circuit boards comprises: a support column 1, a support plate 11 is fixedly installed on the upper end of the support column 1, a connecting rod 12 is fixedly installed on the upper end of the support plate 11, a limiting frame 13 is fixedly installed on the upper end of the connecting rod 12, an electric heating pipe 14 is fixedly installed on the bottom of the limiting frame 13, a filter cartridge 15 is inserted and installed on the upper part of the limiting frame 13, a motor 16 is fixedly installed on the upper part of the support plate 11, a gear 17 is fixedly installed on the outer side of the rotating shaft of the motor 16, and a limiting plate 18 is fixedly installed on the outer side of the motor 16.

[0027] The support column 1 is symmetrically installed at the four corners of the bottom surface of the support plate 11 with the center of the support plate 11 as the reference. The connecting rod 12 is fixed to the top surface of the support plate 11 in an "X" shape at a 90-degree angle with the center of the support plate 11 as the reference, and the upper end of the connecting rod 12 passes through the limit plate 18.

[0028] The limit frame 13 is fixedly connected to the support plate 11 through the connecting rod 12, the electric heating tube 14 is fixedly installed at the bottom of the center of the limit frame 13, and the filter cartridge 15 is installed above the limit frame 13 in an "X" shape at a 90-degree angle based on the center of the limit frame 13.

[0029] The motor 16 is symmetrically installed on the front and rear sides of the top surface of the support plate 11 with the center of the support plate 11 as the reference. The motor 16 passes through the limit plate 18, and the motor 16 and the limit plate 18 are fixedly connected.

[0030] Specifically, the support column 1 can support the support plate 11, the support plate 11 can limit the position of the mixing barrel 2 and support the motor 16, the connecting rod 12 can limit the position of the limit frame 13, the limit frame 13 can limit the positions of the electric heating tube 14 and the filter cartridge 15, the electric heating tube 14 can heat distilled water, the filter cartridge 15 is woven with metal wire, can receive materials, and prevent insoluble debris from entering the electroplating solution, the motor 16 can drive the gear 17 to rotate, the gear 17 can drive the gear ring 25 to rotate, and the limit plate 18 can limit the position of the motor 16.

[0031] A mixing barrel 2 is fixedly installed at the center of the support plate 11 and the limit plate 18, a receiving bucket 21 is fixedly installed at the bottom end of the mixing barrel 2, a drain valve 22 is inserted through the lower end of the receiving bucket 21, a connecting bearing 23 is fixedly installed inside the mixing barrel 2, a connecting frame 24 is fixedly installed inside the connecting bearing 23, a gear ring 25 is inserted through the top end of the connecting frame 24, a fixing frame 26 is fixedly installed at the bottom end of the connecting frame 24, a fixing shaft 27 is inserted through the center of the fixing frame 26, and a paddle 28 is fixedly installed on the outer side of the fixed shaft 27.

[0032] The mixing barrel 2 is fixedly connected to the support column 1 through the support plate 11, the drain valve 22 is connected to the mixing barrel 2 through the receiving bucket 21, the connecting bearing 23 is fixedly installed at the upper and lower ends of the mixing barrel 2, and the connecting bearing 23 is inserted and installed below the connecting frame 24.

[0033] The connecting frame 24 is rotatably connected to the mixing barrel 2 via the connecting bearing 23 , and the gear ring 25 is meshed with the gears 17 fixed on the outer side of the rotating shaft of the motor 16 at the front and rear sides of the support plate 11 .

[0034] The fixing frame 26 is symmetrically installed at the upper and lower ends of the fixing shaft 27 with the center of the fixing shaft 27 as the reference. The fixing shaft 27 is fixedly connected with the connecting frame 24 through the fixing frame 26. The paddle blades 28 are installed in a ring shape at a forty-five degree angle on the outside of the fixing shaft 27 with the center of the fixing shaft 27 as the reference, and the outer edge of the paddle blades 28 is fixedly connected to the connecting frame 24.

[0035] Specifically, the mixing barrel 2 can receive the electroplating liquid, the receiving bucket 21 can guide the electroplating liquid into the drain valve 22, the drain valve 22 can facilitate the discharge of the electroplating liquid, the connecting bearing 23 can facilitate the rotation of the connecting frame 24, the connecting frame 24 can facilitate the rotation of the paddle 28, the gear ring 25 can drive the connecting frame 24 to rotate, the fixed frame 26 can limit the position of the fixed shaft 27, the fixed shaft 27 can limit the position of the inner end of the paddle 28, and the paddle 28 can drive the electroplating liquid to rotate.

[0036] When in use, the electric heating tube 14 is fixedly installed at the bottom of the center of the limiting frame 13, and the limiting frame 13 is fixed above the limiting plate 18 through the connecting rod 12. The electric heating tube 14 is located inside the mixing barrel 2. When configured, the electric heating tube 14 can heat the distilled water, thereby increasing the temperature of the distilled water to increase the dissolution rate of the material. At the same time, the motor 16 can drive the connecting frame 24 to rotate through the gear 17 and the gear ring 25, so that the paddle 28 at the bottom of the connecting frame 24 rotates. When the paddle 28 rotates, it can make the solution inside the mixing barrel 2 rotate with the center of the mixing barrel 2 as the reference. Because the filter cartridge 15 is, the material deviates from the center of the solution rotation. When it moves, it can continuously contact the material inside the filter cartridge 15 to increase the dissolution rate. The filter cartridge 15 is installed on the top of the limiting frame 13 in an "X" shape with the center of the limiting frame 13 as the reference and an angle of 90 degrees. The filter cartridge 15 is woven with metal wire and can receive materials. When adding materials, the materials are divided into four parts and poured into the four filter cartridges 15 respectively. The materials will dissolve with the continuous rotation of the solution, and the debris that cannot be dissolved into the solution will be collected by the filter cartridge 15 and remain in the filter cartridge 15. A sliding connection is formed between the filter cartridge 15 and the limiting frame 13. After the preparation is completed, the filter cartridge 15 can be taken out and the debris can be poured out. This method can prevent the debris from being discharged with the electroplating solution.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for preparing electroplating solution for electroplating of electronic circuit boards, characterized in that: include: A support column (1), wherein a support plate (11) is fixedly mounted on the upper end of the support column (1), a connecting rod (12) is fixedly mounted above the support plate (11), a limiting frame (13) is fixedly mounted on the upper end of the connecting rod (12), an electric heating pipe (14) is fixedly mounted on the bottom of the limiting frame (13), a filter cartridge (15) is inserted and mounted above the limiting frame (13), a motor (16) is fixedly mounted above the support plate (11), a gear (17) is fixedly mounted on the outer side of the rotating shaft of the motor (16), a limiting plate (18) is fixedly mounted on the outer side of the motor (16), and the support plate (11) and the limiting plate A mixing barrel (2) is fixedly installed at the center of the mixing barrel (18), a receiving bucket (21) is fixedly installed at the bottom end of the mixing barrel (2), a drain valve (22) is inserted through the lower end of the receiving bucket (21), a connecting bearing (23) is fixedly installed inside the mixing barrel (2), a connecting frame (24) is fixedly installed inside the connecting bearing (23), a gear ring (25) is inserted through the top end of the connecting frame (24), a fixing frame (26) is fixedly installed at the bottom end of the connecting frame (24), a fixing shaft (27) is inserted through the center of the fixing frame (26), and a paddle (28) is fixedly installed on the outer side of the fixing shaft (27).

2. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The support column (1) is symmetrically mounted at the four corners of the bottom surface of the support plate (11) with the center of the support plate (11) as a reference, and the connecting rod (12) is fixed to the top surface of the support plate (11) in an "X" shape at an angle of ninety degrees with the center of the support plate (11) as a reference, and the upper end of the connecting rod (12) passes through the limiting plate (18).

3. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The limiting frame (13) is fixedly connected to the support plate (11) via a connecting rod (12); the electric heating tube (14) is fixedly installed at the bottom of the center of the limiting frame (13); and the filter cartridge (15) is installed above the limiting frame (13) in an "X" shape at an angle of ninety degrees with the center of the limiting frame (13) as a reference.

4. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The motor (16) is symmetrically mounted on the front and rear sides of the top surface of the support plate (11) with the center of the support plate (11) as a reference, and the motor (16) passes through the limit plate (18), and the motor (16) and the limit plate (18) are fixedly connected.

5. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The mixing barrel (2) is fixedly connected to the supporting column (1) via the supporting plate (11); the drain valve (22) is connected to the mixing barrel (2) via the receiving bucket (21); the connecting bearing (23) is fixedly mounted at the upper and lower ends of the mixing barrel (2); and the connecting bearing (23) is inserted and installed below the connecting frame (24).

6. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The connecting frame (24) is rotatably connected to the mixing barrel (2) via the connecting bearing (23), and the gear ring (25) is meshed with the gears (17) fixed on the outer sides of the rotating shaft of the motor (16) at the front and rear sides of the support plate (11).

7. The electroplating solution preparation device for electroplating of electronic circuit boards according to claim 1, characterized in that: The fixing frame (26) is symmetrically mounted on the upper and lower ends of the fixing shaft (27) with the center of the fixing shaft (27) as a reference, and the fixing shaft (27) is fixedly connected to the connecting frame (24) through the fixing frame (26). The blade (28) is annularly mounted on the outer side of the fixing shaft (27) at an angle of 45 degrees with the center of the fixing shaft (27) as a reference, and the outer edge of the blade (28) is fixedly connected to the connecting frame (24).

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