Chamfering machine for processing edge of silicon wafer

Abstract

The utility model relates to the technical field of silicon wafer edge processing, and discloses a chamfering machine for silicon wafer edge processing, which comprises a chamfering machine, a working table and a silicon wafer, the chamfering machine is positioned at the top of the working table and is fixedly mounted with the top of the working table, the silicon wafer is positioned at the top of the working table and is horizontally aligned with the bottom of the chamfering machine, and the silicon wafer is positioned at the bottom of the chamfering machine. The chamfering machine is electrically connected with the workbench; the left and right sides of the front side and the rear side of the top of the workbench are respectively provided with a pressing mechanism used in cooperation with a silicon wafer. The left side and the right side of the top of the workbench are provided with clamping mechanisms used in cooperation with silicon wafers. The problems that in the process of chamfering a silicon wafer through a chamfering machine, no assembly capable of clamping and limiting the silicon wafer exists, so that the stability of silicon wafer chamfering machining is reduced, the silicon wafer is prone to falling off, and a user cannot conveniently machine the silicon wafer through the chamfering machine are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer edge processing, in particular to a chamfering machine for silicon wafer edge processing. Background Art

[0002] The chamfering machine for silicon wafer edge processing is a device specially used for chamfering the edges of silicon wafers. Its main function is to cut and trim the edges of silicon wafers mechanically or chemically to form rounded or beveled edges, and to achieve chamfering through the friction between the silicon wafer and the grinding tool. Although the processing speed is fast, it may generate heat and mechanical stress, causing damage and deformation to the surface of the silicon wafer, and using chemical solutions to dissolve and remove the surface of the silicon wafer. This method does not produce mechanical stress, but requires stricter control of the concentration and temperature of the etching liquid, and the processing speed is slower. It improves the mechanical strength and stability of the silicon wafer, reduces the risk of damage in the subsequent production process, improves the reliability and stability of semiconductor devices, reduces the possibility of oxidation and corrosion, reduces leakage problems, improves the electrical performance of the device, improves the appearance of the silicon wafer, and improves the market competitiveness of the product. In the market, there are many different brands and models of silicon wafer chamfering machines to choose from, such as the German PROTEM portable chamfering machine, etc. These devices differ in price, performance and function. In summary, the chamfering machine for silicon wafer edge processing is an indispensable and important equipment in the semiconductor industry. It plays a vital role in improving the processing quality and production efficiency of silicon wafers.

[0003] The chamfering machine for silicon wafer edge processing plays a key role in the semiconductor industry. Its main function is to improve the mechanical strength and processability of silicon wafers by chamfering the four corners of silicon wafers, while reducing the problems of cracks, edge collapse and lattice defects that may occur at the edges of silicon wafers during subsequent processing. Silicon wafers are very fragile during the manufacturing process of semiconductor devices and are easily broken or damaged by external forces. The chamfering machine effectively reduces the stress concentration at the edges of silicon wafers by trimming the edges of silicon wafers to form rounded corners or bevels, increases the overall strength of silicon wafers, and reduces the risk of damage in subsequent production processes. The edges of silicon wafers that have been chamfered are smoother, reducing friction with other equipment or components, thereby preventing mechanical damage caused by friction. Chamfering can reduce the number, size and distribution of particles / traces at the edges of silicon wafers, reduce stress concentration at the edges of silicon wafers, avoid edge cracks and chip device breakage, thereby improving the reliability and stability of semiconductor devices. During the packaging and welding process of semiconductor devices, the edges of silicon wafers often need to be connected to other metal devices or wires. Chamfering can eliminate small scratches or sharp angles on the edge of silicon wafers, increase the contact area between the edge of silicon wafers and other metal devices or wires, reduce contact resistance, and thus reduce leakage problems of devices. Chamfering can remove sharp areas and edge defects on the edge of silicon wafers, making the surface of silicon wafers smoother and smoother, and improving the overall appearance quality and aesthetics of silicon wafers. Chamfering can not only reduce residues in chip making, but also reduce the loss of wafers during processing, thereby reducing manufacturing costs. In summary, the chamfering machine for silicon wafer edge processing plays a vital role in the semiconductor industry. Its role covers improving the mechanical strength and stability of silicon wafers, reducing friction, improving the reliability and stability of semiconductor devices, reducing leakage problems, improving appearance quality, and reducing manufacturing costs. The problem with the above technology is that in the process of chamfering silicon wafers through the chamfering machine, there is no component that can clamp and limit the silicon wafers, thereby reducing the stability of the chamfering of silicon wafers, and it is easy to fall off, so it is not convenient for users to process silicon wafers through the chamfering machine. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model provides a chamfering machine for processing the edge of a silicon wafer which can overcome the above problems or at least partially solve the above problems.

[0005] The utility model is implemented as follows: a chamfering machine for processing the edge of a silicon wafer comprises a chamfering machine, a workbench and a silicon wafer, wherein the chamfering machine is located on the top of the workbench and is fixedly installed with the top of the workbench, the silicon wafer is located on the top of the workbench and is horizontally aligned with the bottom of the chamfering machine, and the chamfering machine is electrically connected to the workbench; both the left and right sides of the front and rear sides of the top of the workbench are provided with a pressing mechanism used in conjunction with the silicon wafer; both the left and right sides of the top of the workbench are provided with a clamping mechanism used in conjunction with the silicon wafer; both the opposite sides of the two clamping mechanisms are provided with a positioning mechanism used in conjunction with the clamping mechanism; both the left and right sides of the workbench are provided with an adjusting mechanism used in conjunction with the clamping mechanism.

[0006] In order to improve the docking stability between the silicon wafer and the workbench, preferably, the pressing mechanism includes an electric push rod, an arc plate and a pressing block, the electric push rod is located at the top of the workbench and fixedly connected to the top of the workbench, the arc plate is located at the top of the electric push rod and fixedly connected to the top of the electric push rod, and the pressing block is located at the bottom of the arc plate and fixedly connected to the bottom of the arc plate. By setting up the pressing mechanism, the electric push rod can quickly press the top of the silicon wafer through the cooperation of the arc plate and the pressing block, thereby avoiding the silicon wafer from falling off during the processing process.

[0007] In order to improve the docking stability between the silicon wafer and the chamfering machine, preferably, the clamping mechanism includes a clamping plate, a connecting rod and a slider. The clamping plate is located on the top of the workbench and fits the surface of the silicon wafer. The connecting rod is located on the right side of the clamping plate and is fixedly connected to the right side of the clamping plate. The slider is located on the right side of the connecting rod. By setting up the clamping mechanism, the slider can quickly clamp the two sides of the silicon wafer through the mutual cooperation of the connecting rod and the clamping plate, thereby avoiding the problem of silicon wafer offset during the chamfering process.

[0008] In order to improve the assembly convenience of the clamping mechanism, preferably, the positioning mechanism includes a plug-in block, a connecting plate and a positioning rod, the plug-in block is located on the right side of the connecting rod and is fixedly connected to the right side of the connecting rod, the surface of the plug-in block contacts the inner cavity of the slider, the connecting plate is located on the right side of the slider and is fixedly connected to the right side of the slider, the top of the connecting plate is horizontally aligned with the bottom of the plug-in block, and the positioning rod is located at the bottom of the connecting plate. By setting the positioning mechanism, the positioning rod can quickly assemble the connecting rod and the slider through the mutual cooperation of the connecting plate and the plug-in block.

[0009] In order to improve the ease of use of the clamping mechanism, preferably, the adjusting mechanism includes a rotating motor, a screw and a shaft block, the shaft block is located on the right side of the workbench and fixedly connected to the right side of the workbench, the left side of the screw is movably connected to the right side of the shaft block through a rotating shaft, the rotating motor is located on the right side of the screw and fixedly connected to the right side of the screw, the inner cavity of the slider is connected to the surface of the screw by a thread, and by setting up the adjusting mechanism, the rotating motor can quickly drive the connecting rod and the clamp to adjust the position through the mutual cooperation of the screw and the slider, so as to make the clamping mechanism adapt to a variety of silicon wafers of different sizes for use.

[0010] In order to improve the docking effect of the positioning rod, preferably, a connecting hole is provided in the inner cavity of the connecting plate, a positioning groove is provided at the bottom of the plug-in block, the top of the positioning rod passes through the connecting hole and extends to the inner cavity of the positioning groove, and the surface of the positioning rod is connected to the connecting hole and the inner cavity of the positioning groove by threads. By setting the connecting hole and the positioning groove, the connecting hole can enable the positioning rod to quickly dock with the positioning groove.

[0011] In order to improve the stability of the adjustment mechanism, preferably, the right side of the screw rod is movably connected to a support plate through a rotating shaft, the front and rear sides of the left side of the support plate are fixedly connected to support rods, the left side of the support rod is fixedly connected to the surface of the workbench, and the front and rear sides of the left side of the rotating motor are fixedly connected to the surface of the support plate. By setting the support plate and the support rod, the support rod can cooperate with the support plate to achieve the function of assisting the screw rod to move stably, thereby avoiding shaking of the screw rod during use.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0013] The utility model connects the connecting rod with the slider by arranging a chamfering machine, a workbench, a silicon wafer, a pressing mechanism, a clamping mechanism, a positioning mechanism and an adjusting mechanism. During the docking process, the plug-in block needs to be inserted into the inner cavity of the slider. After the plugging is completed, the positioning rod is rotated to make the positioning rod pass through the connecting hole and insert into the inner cavity of the positioning groove. After the positioning rod is inserted into the inner cavity of the positioning groove, the connecting rod and the slider can be quickly assembled through the cooperation of the connecting plate and the plug-in block. After the assembly of the clamping mechanism is completed, the electric push rod is started, and the electric push rods around can quickly drive the arc plate to move through their own output ends, and the arc plate can press the top of the silicon wafer through the pressing block during the movement. After the pressing of the top of the silicon wafer is completed, the rotating motor is started, and the rotating motor can drive the screw rod to rotate through its own output end, and the screw rod can drive the slider to move during the rotation, and the slider can clamp and limit the two sides of the silicon wafer through the cooperation of the connecting rod and the clamp during the movement, so as to achieve the effect of stable docking processing between the silicon wafer and the workbench chamfering machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of a three-dimensional structure provided by an embodiment of the utility model;

[0015] Figure 2 It is a schematic diagram of adjusting the pressing mechanism and the clamping mechanism provided by the embodiment of the utility model;

[0016] Figure 3 The embodiment of the utility model provides a three-dimensional cross-sectional view;

[0017] Figure 4 The utility model embodiment provides Figure 3 A partial enlarged view of point A in the middle.

[0018] In the figure: 1. chamfering machine; 2. workbench; 3. silicon wafer; 4. pressing mechanism; 5. clamping mechanism; 6. positioning mechanism; 7. adjusting mechanism; 401. electric push rod; 402. arc plate; 403. pressing block; 501. clamping plate; 502. connecting rod; 503. sliding block; 601. plug-in block; 602. connecting plate; 603. positioning rod; 701. rotating motor; 702. screw rod; 703. rotating shaft block; 8. connecting hole; 9. positioning groove; 10. supporting plate; 11. supporting rod. DETAILED DESCRIPTION

[0019] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0020] The structure of the utility model is described in detail below in conjunction with the accompanying drawings.

[0021] like Figures 1 to 4As shown, a chamfering machine for processing the edge of a silicon wafer provided by an embodiment of the utility model comprises a chamfering machine 1, a workbench 2 and a silicon wafer 3, wherein the chamfering machine 1 is located on the top of the workbench 2 and is fixedly installed with the top of the workbench 2, the silicon wafer 3 is located on the top of the workbench 2 and is horizontally aligned with the bottom of the chamfering machine 1, and the chamfering machine 1 is electrically connected to the workbench 2; pressing mechanisms 4 for use with the silicon wafer 3 are arranged on the left and right sides of the front and rear sides of the top of the workbench 2; clamping mechanisms 5 for use with the silicon wafer 3 are arranged on the left and right sides of the top of the workbench 2; positioning mechanisms 6 for use with the clamping mechanisms 5 are arranged on the opposite sides of the two clamping mechanisms 5; adjusting mechanisms 7 for use with the clamping mechanisms 5 are arranged on the left and right sides of the workbench 2, and the pressing mechanism 4 comprises an electric push rod 401, arc plate 402 and pressing block 403, the electric push rod 401 is located at the top of the workbench 2 and is fixedly connected to the top of the workbench 2, the arc plate 402 is located at the top of the electric push rod 401 and is fixedly connected to the top of the electric push rod 401, the pressing block 403 is located at the bottom of the arc plate 402 and is fixedly connected to the bottom of the arc plate 402, by setting the pressing mechanism 4, the electric push rod 401 can achieve the effect of quickly pressing the top of the silicon wafer 3 through the mutual cooperation of the arc plate 402 and the pressing block 403, avoiding the situation that the silicon wafer 3 falls off during the processing, the clamping mechanism 5 includes a clamping plate 501, a connecting rod 502 and a slider 503, the clamping plate 501 is located at the top of the workbench 2 and is in contact with the surface of the silicon wafer 3, and the connecting rod 502 and the slider 503 are connected. The connecting rod 502 is located on the right side of the clamping plate 501 and is fixedly connected to the right side of the clamping plate 501. The sliding block 503 is located on the right side of the connecting rod 502. By setting the clamping mechanism 5, the sliding block 503 can quickly clamp the two sides of the silicon wafer 3 through the mutual cooperation of the connecting rod 502 and the clamping plate 501, thereby avoiding the problem of offset of the silicon wafer 3 during the chamfering process. The positioning mechanism 6 includes a plug-in block 601, a connecting plate 602 and a positioning rod 603. The plug-in block 601 is located on the right side of the connecting rod 502 and is fixedly connected to the right side of the connecting rod 502. The surface of the plug-in block 601 contacts the inner cavity of the sliding block 503. The connecting plate 602 is located on the right side of the sliding block 503 and is fixedly connected to the right side of the sliding block 503. The top of the connecting plate 602 The bottom of the connecting plate 602 is horizontally aligned with the bottom of the plug-in block 601, the positioning rod 603 is located at the bottom of the connecting plate 602, and by setting the positioning mechanism 6, the positioning rod 603 can quickly assemble the connecting rod 502 and the slider 503 through the mutual cooperation of the connecting plate 602 and the plug-in block 601. The adjusting mechanism 7 includes a rotating motor 701, a screw rod 702 and a rotating shaft block 703. The rotating shaft block 703 is located on the right side of the workbench 2 and is fixedly connected to the right side of the workbench 2. The left side of the screw rod 702 is movably connected to the right side of the rotating shaft block 703 through a rotating shaft. The rotating motor 701 is located on the right side of the screw rod 702 and is fixedly connected to the right side of the screw rod 702. The inner cavity of the slider 503 is connected to the surface of the screw rod 702 through a thread. By setting the adjusting mechanism 7,The rotating motor 701 can quickly drive the connecting rod 502 and the clamping plate 501 to adjust their positions through the cooperation between the screw rod 702 and the slider 503, so that the clamping mechanism 5 can be adapted to a variety of silicon wafers 3 of different sizes for use. The inner cavity of the connecting plate 602 is provided with a connecting hole 8, and the bottom of the plug-in block 601 is provided with a positioning groove 9. The top of the positioning rod 603 passes through the connecting hole 8 and extends to the inner cavity of the positioning groove 9. The surface of the positioning rod 603 is connected to the inner cavity of the connecting hole 8 and the positioning groove 9 by threads. By setting the connecting hole 8 and the positioning groove 9, the connecting hole 8 can make the positioning The positioning rod 603 quickly docks with the positioning groove 9. The right side of the screw rod 702 is movably connected to the support plate 10 through the rotating shaft. The front and rear sides of the left side of the support plate 10 are fixedly connected to the support rod 11. The left side of the support rod 11 is fixedly connected to the surface of the workbench 2. The front and rear sides of the left side of the rotating motor 701 are fixedly connected to the surface of the support plate 10. By setting the support plate 10 and the support rod 11, the support rod 11 can cooperate with the support plate 10 to achieve the function of assisting the screw rod 702 to move stably, avoiding the shaking of the screw rod 702 during use.

[0022] The working principle of this utility model:

[0023] When in use, the connecting rod 502 is docked with the slider 503. During the docking process, the plug-in block 601 needs to be inserted into the inner cavity of the slider 503. After the plug-in is completed, the positioning rod 603 is rotated to make the positioning rod 603 pass through the connecting hole 8 and insert into the inner cavity of the positioning groove 9. After the positioning rod 603 is inserted into the inner cavity of the positioning groove 9, the connecting rod 502 and the slider 503 can be quickly assembled through the cooperation of the connecting plate 602 and the plug-in block 601. After the assembly of the clamping mechanism 5 is completed, the electric push rod 401 is started, and the electric push rods 401 around it will quickly pass through their own output ends to bring The movable arc plate 402 moves, and the arc plate 402 will press the top of the silicon wafer 3 through the pressing block 403 during the movement. After the top of the silicon wafer 3 is pressed, the rotating motor 701 is started. The rotating motor 701 will drive the screw rod 702 to rotate through its own output end, and the screw rod 702 will drive the slider 503 to move during the rotation. The slider 503 will clamp and limit the two sides of the silicon wafer 3 through the cooperation of the connecting rod 502 and the clamping plate 501 during the movement, so as to achieve the effect of stable docking processing of the silicon wafer 3 and the chamfering machine 1 of the workbench 2.

[0024] The specific models and specifications of the chamfering machine 1, workbench 2, electric push rod 401 and rotating motor 701 proposed in this application need to be selected and determined according to the actual specifications of the device. The specific selection calculation method, line connection method and control method all adopt the existing technology in this field, so they will not be described in detail.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] The above description is only a preferred embodiment of the utility model, and does not constitute any form of limitation to the utility model. Although the utility model has been disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this patent will not depart from the scope of the technical solution of the utility model.

Claims

1. A chamfering machine for processing the edge of a silicon wafer, comprising a chamfering machine (1), a workbench (2) and a silicon wafer (3), characterized in that: The chamfering machine (1) is located on the top of the workbench (2) and is fixedly installed on the top of the workbench (2); the silicon wafer (3) is located on the top of the workbench (2) and is horizontally aligned with the bottom of the chamfering machine (1); and the chamfering machine (1) is electrically connected to the workbench (2); The left and right sides of the front and rear sides of the top of the workbench (2) are both provided with a pressing mechanism (4) used in conjunction with the silicon wafer (3); The left and right sides of the top of the workbench (2) are both provided with clamping mechanisms (5) for use with the silicon wafer (3); A positioning mechanism (6) used in conjunction with the clamping mechanism (5) is provided on opposite sides of the two clamping mechanisms (5); Adjustment mechanisms (7) for use in conjunction with the clamping mechanism (5) are provided on both the left and right sides of the workbench (2).

2. A chamfering machine for silicon wafer edge processing as claimed in claim 1, characterized in that: The pressing mechanism (4) comprises an electric push rod (401), an arc plate (402) and a pressing block (403); the electric push rod (401) is located at the top of the workbench (2) and is fixedly connected to the top of the workbench (2); the arc plate (402) is located at the top of the electric push rod (401) and is fixedly connected to the top of the electric push rod (401); and the pressing block (403) is located at the bottom of the arc plate (402) and is fixedly connected to the bottom of the arc plate (402).

3. A chamfering machine for silicon wafer edge processing as claimed in claim 1, characterized in that: The clamping mechanism (5) comprises a clamping plate (501), a connecting rod (502) and a sliding block (503); the clamping plate (501) is located on the top of the workbench (2) and is in contact with the surface of the silicon wafer (3); the connecting rod (502) is located on the right side of the clamping plate (501) and is fixedly connected to the right side of the clamping plate (501); and the sliding block (503) is located on the right side of the connecting rod (502).

4. A chamfering machine for silicon wafer edge processing as claimed in claim 3, characterized in that: The positioning mechanism (6) comprises a plug-in block (601), a connecting plate (602) and a positioning rod (603); the plug-in block (601) is located on the right side of the connecting rod (502) and is fixedly connected to the right side of the connecting rod (502); the surface of the plug-in block (601) contacts the inner cavity of the slider (503); the connecting plate (602) is located on the right side of the slider (503) and is fixedly connected to the right side of the slider (503); the top of the connecting plate (602) is horizontally aligned with the bottom of the plug-in block (601); and the positioning rod (603) is located at the bottom of the connecting plate (602).

5. A chamfering machine for processing silicon wafer edges as claimed in claim 3, characterized in that: The adjusting mechanism (7) comprises a rotating motor (701), a screw rod (702) and a rotating shaft block (703); the rotating shaft block (703) is located on the right side of the workbench (2) and is fixedly connected to the right side of the workbench (2); the left side of the screw rod (702) and the right side of the rotating shaft block (703) are movably connected via a rotating shaft; the rotating motor (701) is located on the right side of the screw rod (702) and is fixedly connected to the right side of the screw rod (702); and the inner cavity of the slider (503) and the surface of the screw rod (702) are connected via threads.

6. A chamfering machine for processing silicon wafer edges as claimed in claim 4, characterized in that: The inner cavity of the connecting plate (602) is provided with a connecting hole (8), the bottom of the plug-in block (601) is provided with a positioning groove (9), the top of the positioning rod (603) passes through the connecting hole (8) and extends to the inner cavity of the positioning groove (9), and the surface of the positioning rod (603) is connected to the inner cavity of the connecting hole (8) and the positioning groove (9) by threads.

7. A chamfering machine for processing silicon wafer edges as claimed in claim 5, characterized in that: The right side of the screw rod (702) is movably connected to a support plate (10) via a rotating shaft, the front and rear sides of the left side of the support plate (10) are fixedly connected to a support rod (11), the left side of the support rod (11) is fixedly connected to the surface of the workbench (2), and the front and rear sides of the left side of the rotating motor (701) are fixedly connected to the surface of the support plate (10).

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