Polishing pad positioning device

By using a first positioning member made of elastic material in the polishing pad positioning device to press against the inner peripheral wall of the liquid supply hole, coaxial positioning of the positioning rod and the liquid supply hole is achieved, and the problem of low positioning efficiency and accuracy in the prior art is solved, and the efficiency and accuracy of the polishing pad positioning are improved.

CN222891049UInactive Publication Date: 2025-05-23BEIJING TIANKE HEDA SEMICON CO LTD
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Patent Information

Application Number
CN202421069339.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-16
Publication Date
2025-05-23
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing polishing pad positioning method is cumbersome, with low positioning efficiency and accuracy, and can easily lead to damage to the edge of the liquid supply hole and shorten the service life.

Method used

A polishing pad positioning device is provided, including a positioning rod and a first positioning member. The first positioning member is made of elastic material and is pressed against the inner peripheral wall of the liquid supply hole of the upper polishing disk through the first positioning surface to realize the coaxial positioning of the positioning rod and the liquid supply hole.

Benefits of technology

It improves the accuracy and efficiency of the positioning of the polishing pad, simplifies the operation process, avoids damage to the edge of the liquid supply hole, and extends the service life of the equipment.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses a polishing pad positioning device. The polishing pad positioning device comprises a positioning rod and a first positioning piece. The positioning rod is provided with a first end and a second end; the first positioning piece is arranged at the first end, and a first positioning surface is formed on the peripheral wall of the first positioning piece; the first positioning piece is made of an elastic material, and the first positioning piece is used for abutting against the inner circumferential wall of a liquid supply hole of the upper polishing disc through the first positioning face so that the positioning rod and the liquid supply hole can be coaxially positioned; the second end of the positioning rod is used for being coaxially positioned with a liquid passing hole of the polishing pad. When the positioning device is applied, the positioning precision of the polishing pad can be improved, the operation is simple, and the positioning efficiency of the polishing pad can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of chemical mechanical polishing, and in particular to a positioning device for a pre-opened polishing pad. Background Art

[0002] CMP (Chemical Mechanical Polishing) is a key technology for surface processing of semiconductor wafers. It achieves efficient removal of excess material on the wafer surface and global nano-level flattening through the coordinated cooperation of chemical corrosion and mechanical grinding. Some CMP equipment uses upper and lower polishing discs for double-sided polishing. Usually, polishing pads are set on the surfaces of the upper and lower polishing discs, and a liquid supply hole is opened on the upper polishing disc. A liquid through hole connected to the liquid supply hole is opened on the polishing pad corresponding to the upper polishing disc. The upper end of the liquid supply hole is connected to a liquid supply pipe for supplying polishing liquid. When in use, the upper and lower polishing discs rotate in reverse at high speed, and the polishing liquid enters between the upper and lower polishing discs through the liquid supply hole and the liquid through hole in turn, and flows continuously. Under the coordinated action of chemical corrosion of the polishing liquid and mechanical grinding of the polishing disc, the wafer surface is polished. Among them, the polishing pad matched with the upper polishing disc is one of the main consumables of CMP equipment, which needs to be replaced frequently during the production process.

[0003] At present, the replacement of polishing pads usually adopts the method of first sticking the pad and then drilling the hole, that is, first stick the polishing pad to the lower surface of the upper polishing plate, then find the position of the liquid supply hole through the polishing pad, and use a marking tool, such as an awl, to mark the position, and finally use a hole-opening tool, such as a hammer and an awl, to knock, form a punch between the cone head and the edge of the liquid supply hole, cut the polishing pad, and complete the opening of the liquid hole. In actual operation, the method of sticking the pad first and then drilling the hole often requires people to manually find the holes one by one, which is inefficient and unsafe, and is also prone to damage the edge of the liquid supply hole, shortening the service life of the upper polishing plate. To this end, the related technology adopts the method of first drilling a hole and then sticking the pad to replace the polishing pad, that is, the corresponding liquid holes are opened in the polishing pad in advance, and then the polishing pad is placed under the upper polishing plate. After the liquid holes and the liquid supply holes are aligned, the polishing pad is stuck to the upper polishing plate. The key to this technology lies in the positioning between the liquid holes of the polishing pad and the liquid supply holes of the upper polishing plate. There are often dozens of liquid supply holes, which are staggered on multiple circles of different diameters. The distribution pattern is relatively complex, which brings challenges to the positioning of the two.

[0004] In the prior art, two methods are used to position the polishing pad: perforation positioning and lateral positioning. Among them, the perforation positioning method uses a long screw for positioning, specifically, the liquid supply tube is first removed, and then the long screw is used to pass through the liquid supply hole from top to bottom to find the liquid through hole of the polishing pad for positioning. This method requires the removal of the liquid supply tube, which is cumbersome to operate and has low positioning efficiency. In addition, the liquid supply hole is generally thinner at the top and thicker at the bottom. In order to pass through the liquid supply hole, the screw is generally thinner than the upper part of the liquid supply hole. After extending out of the liquid supply hole, it is easy to tilt, making it difficult to ensure coaxiality with the liquid supply hole, making it difficult to align the liquid supply hole and the liquid through hole, and the positioning accuracy is low. The lateral positioning method uses a positioning tool with a top screw and a positioning pin for positioning. Specifically, the positioning tool and the positioning groove on the edge of the side wall of the upper polishing plate are fixedly connected using the top screw, and then the positioning pin below is used to position to the corresponding positioning hole on the polishing pad. This method requires the positioning tool to be fixed with a top screw before positioning, which is cumbersome to operate and has low positioning efficiency. Moreover, it can only be positioned at the positioning hole on the outermost circumference of the polishing pad, and the positioning accuracy is low. It can be seen that the existing polishing pad positioning methods are cumbersome to operate, and the positioning efficiency and positioning accuracy are both low.

[0005] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects is still a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0006] The purpose of this application is to provide a polishing pad positioning device to improve positioning accuracy and positioning efficiency.

[0007] In order to solve the above technical problems, the present application provides a polishing pad positioning device, comprising a positioning rod and a first positioning member;

[0008] The positioning rod has a first end and a second end; the first positioning member is arranged at the first end, and the outer peripheral wall of the first positioning member forms a first positioning surface;

[0009] The first positioning member is made of elastic material and is used to press against the inner wall of the liquid supply hole of the upper polishing plate through the first positioning surface so that the positioning rod and the liquid supply hole are coaxially positioned; the second end of the positioning rod is used for coaxial positioning with the liquid hole of the polishing pad.

[0010] The polishing pad positioning device provided in the present application is provided with a first positioning piece at the first end of the positioning rod, and the first positioning piece is made of elastic material. The outer peripheral wall of the first positioning piece forms a first positioning surface. When in use, the first positioning piece can be inserted into the liquid supply hole of the upper polishing plate, and the elastic deformation performance of the first positioning piece is utilized. Under the squeezing effect of the inner peripheral wall of the liquid supply hole on the first positioning piece, the first positioning surface is pressed against the inner peripheral wall of the liquid supply hole, so that the positioning rod is not easy to tilt relative to the liquid supply hole, and the coaxial positioning accuracy between the positioning rod and the liquid supply hole is relatively guaranteed. On this basis, the second end of the positioning rod is utilized to perform coaxial positioning between the positioning rod and the liquid hole of the polishing pad, and realize coaxial positioning between the liquid hole and the corresponding liquid supply hole, which can improve the positioning accuracy of the polishing pad, and is simple to operate, and can improve the positioning efficiency of the polishing pad.

[0011] Optionally, the first positioning member is in the shape of a sleeve, and is sleeved on an outer peripheral wall of the first end.

[0012] Optionally, the polishing pad positioning device further includes a second positioning member;

[0013] The second positioning member is arranged on the outer peripheral wall of the positioning rod and is located on the side of the first positioning member close to the second end. The second positioning member has a second positioning surface, which faces the first positioning member; the second positioning surface is used to abut the lower surface of the upper polishing plate.

[0014] Optionally, the second positioning member is made of a magnet, and the second positioning member can be adsorbed on the upper polishing plate.

[0015] Optionally, the second positioning member is provided with a first threaded hole, the outer peripheral wall of the positioning rod is provided with a first external thread, and the second positioning member and the positioning rod are threadedly connected.

[0016] Optionally, the polishing pad positioning device further includes a third positioning member;

[0017] The third positioning member is disposed at the second end of the positioning rod, and the third positioning member can move along the axial direction of the positioning rod to extend or shorten the length of the polishing pad positioning device.

[0018] Optionally, the outer peripheral wall of the third positioning member forms a third positioning surface, and the third positioning member is used to abut against the inner peripheral wall of the liquid passage hole through the third positioning surface, so that the positioning rod and the liquid passage hole are coaxially positioned.

[0019] Optionally, the third positioning member is provided with a second threaded hole, the outer peripheral wall of the positioning rod is provided with a second external thread, and the third positioning member and the positioning rod are threadedly connected. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A schematic diagram of the three-dimensional structure of the polishing pad positioning device of the first embodiment provided in the present application;

[0021] Figure 2 for Figure 1 perspective drawing;

[0022] Figure 3 for Figure 1 The main view;

[0023] Figure 4 for Figure 1 Bottom view of

[0024] Figure 5 for Figure 2 A top view of

[0025] Figure 6 for Figure 3 AA section view;

[0026] Figure 7 A schematic diagram of the three-dimensional structure of a polishing pad positioning device according to a second embodiment of the present application;

[0027] Figure 8 for Figure 7 perspective drawing;

[0028] Fig. 9 for Figure 7 The main view;

[0029] Fig.10 for Figure 8 A top view of

[0030] Fig.11 This is a schematic diagram of the positioning group selection during the positioning process of the polishing pad positioning device of the first embodiment provided in the present application.

[0031] The reference numerals in the above drawings are described as follows:

[0032] 1-positioning rod, 1a-first external thread, 1b-second external thread, 1c-first step surface, 1d-second step surface, 11-upper rod section, 12-middle rod section, 13-lower rod section;

[0033] 2-first positioning member, 2a-first positioning surface;

[0034] 3-second positioning member, 3a-second positioning surface, 3b-first threaded hole;

[0035] 4-third positioning member, 4a-third positioning surface, 4b-second threaded hole;

[0036] 5- Polishing pad;

[0037] a-liquid hole, a0-initial positioning hole, a1-first positioning hole, a2-second positioning hole, a3-third positioning hole. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] It should be noted that the terms "upper" and "lower" in this application are all based on Figure 1 The up-down direction is the axial direction of the positioning rod 1 . For details, please refer to the direction indicated by the arrow in the corresponding figure.

[0040] Unless otherwise specified, the "polishing pad" mentioned in this application refers to the polishing pad that is matched with the upper polishing plate (not shown in the figure) of the CMP equipment used for double-sided polishing. When positioning and installing the polishing pad, the polishing pad can be placed below the upper polishing plate, and after positioning the liquid supply hole of the upper polishing plate and the liquid passing hole of the polishing pad, the polishing pad can be installed on the lower surface of the upper polishing plate.

[0041] The terms "first", "second", etc. mentioned in this application are only used to facilitate the description of two or more structures or components with the same or similar structures and / or functions, and do not imply any special limitation on the order and / or importance.

[0042] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the three-dimensional structure of the polishing pad positioning device of the first embodiment provided in the present application.

[0044] In the first embodiment provided in the present application, the polishing pad positioning device includes a positioning rod 1 and a first positioning member 2; the positioning rod 1 has a first end and a second end; the first positioning member 2 is arranged at the first end, and the outer peripheral wall of the first positioning member 2 forms a first positioning surface 2a; the first positioning member 2 is made of elastic material, and the first positioning member 2 is used to press against the inner peripheral wall of the liquid supply hole of the upper polishing plate through the first positioning surface 2a, so that the positioning rod 1 and the liquid supply hole are coaxially positioned; the second end of the positioning rod 1 is used for coaxial positioning with the liquid hole a of the polishing pad 5.

[0045] In this way, compared with the prior art in which the screw used in the perforation positioning method is prone to tilt after passing through the liquid supply hole, resulting in low positioning accuracy, and the positioning tool used in the lateral positioning method can only be positioned to the outermost positioning hole of the polishing pad 5, resulting in low positioning accuracy, when the polishing pad positioning device of the embodiment of the present application is used, on the one hand, the first positioning member 2 can be coaxially arranged with the positioning rod 1, and the first positioning member 2 can be inserted from bottom to top into the liquid supply hole of the upper polishing disk, and the elastic deformation performance of the first positioning member 2 is utilized, and the inner peripheral wall of the liquid supply hole squeezes the first positioning member 2 to achieve The first positioning surface 2a is pressed against the inner wall of the liquid supply hole, so that the positioning rod 1 is not easy to tilt relative to the liquid supply hole, thereby relatively ensuring the coaxial positioning accuracy between the positioning rod 1 and the liquid supply hole. On this basis, the second end of the positioning rod 1 is used to perform coaxial positioning between the positioning rod 1 and the liquid hole a of the polishing pad 5, thereby realizing coaxial positioning between the liquid hole a and the corresponding liquid supply hole, thereby improving the positioning accuracy of the polishing pad. On the other hand, since the positioning operation can be performed between the upper polishing plate and the polishing pad, multiple groups of liquid supply holes and liquid holes a can be fully utilized for positioning, thereby further improving the positioning accuracy.

[0046] Compared with the perforation positioning method in the prior art which requires the removal of the liquid supply tube, resulting in cumbersome operation and low positioning efficiency, and the lateral positioning method which requires the use of a top screw to fix the positioning tooling and then perform positioning, resulting in cumbersome operation and low positioning efficiency, the polishing pad positioning device provided in the embodiment of the present application does not require the removal of the liquid supply tube, nor does it require the use of a top screw to fix the positioning tooling. It only requires inserting the first positioning piece 2 into the liquid supply hole and then operating the second end of the positioning rod 1, which makes the operation simple and can improve the efficiency of polishing pad positioning.

[0047] In addition, the perforation positioning method in the prior art requires the removal of the liquid supply tube before positioning begins, which is easy to damage the liquid supply tube, and the polishing liquid remaining in the liquid supply tube is easy to drip onto the polishing pad, and the polishing liquid remaining in the liquid supply hole is also easy to be brought into the polishing pad by the screw, which is easy to contaminate the polishing pad. After positioning is completed, when the upper polishing plate moves downward to fit the polishing pad, the screw is pushed upward, and its outer wall and the inner wall of the liquid supply hole may produce friction, which is easy to wear the liquid supply hole. The polishing pad positioning device provided in the embodiment of the present application does not need to remove the liquid supply tube. During positioning, the first positioning member 2 can be inserted into the partial space at the lower end of the liquid supply hole, so that the liquid supply tube will not be damaged and the polishing pad will not be easily contaminated. After positioning is completed, it is only necessary to pull the first positioning member 2 downward away from the liquid supply hole. In addition, the first positioning member 2 is made of elastic material, which is not easy to damage the liquid supply hole.

[0048] In addition, the positioning tool used in the lateral positioning method in the prior art is only suitable for positioning between the polishing pad with a positioning hole and the upper polishing plate with a positioning groove, and has low applicability. Moreover, the upper polishing plate is often provided with a cover extending to the side wall, and the space between the cover and the side wall of the upper polishing plate is small, so that the lateral positioning is limited by the narrow space and the operation is inconvenient. The polishing pad positioning device provided in the embodiment of the present application can be positioned between the upper polishing plate and the polishing pad 5, so the operation space is relatively sufficient and the operation is more convenient. Moreover, the positioning is performed by using the liquid supply hole of the upper polishing plate and the liquid passage hole a of the polishing pad 5, and is not limited by the structural limitations of the upper polishing plate and the polishing pad caused by the above-mentioned positioning holes and positioning grooves, so it has high applicability.

[0049] Please refer to Figure 2 , Figure 2 for Figure 1 perspective view.

[0050] In actual configuration, the structural form of the first positioning member 2 is not limited.

[0051] As an alternative, please refer to Figure 1 and Figure 2 The first positioning member 2 is sleeve-shaped, and the first positioning member 2 is sleeved on the outer peripheral wall of the first end of the positioning rod 1. In this way, the first positioning member 2 and the positioning rod 1 are firmly connected, and the coaxial accuracy of the first positioning member 2 and the positioning rod 1 is also easily guaranteed. When in use, the wall surface corresponding to the entire outer peripheral wall of the first positioning member 2 forms the first positioning surface 2a, and the first positioning member 2 is inserted into the liquid supply hole. Part of the positioning rod 1 can also be located in the liquid supply hole. The part of the first positioning surface 2a located inside the liquid supply hole can be pressed against the inner peripheral wall of the liquid supply hole, thereby realizing the coaxial positioning of the positioning rod 1 and the liquid supply hole.

[0052] Of course, in another scheme not shown, the first positioning member 2 can also be a rod-shaped structure that is easy to process, which can be coaxially fixed to the first end face of the positioning rod 1. When in use, the first positioning member 2 can be inserted into the liquid supply hole, and the positioning rod 1 is located below the liquid supply hole; in another scheme not shown, the first positioning member 2 can also include at least one group of positioning blocks, each group of positioning blocks includes two fan-shaped positioning blocks, and the two positioning blocks can be coaxially fixed to the outer peripheral wall of the first end of the positioning rod 1, and the wall surface corresponding to the outer peripheral wall of the positioning block forms a first positioning surface 2a, and the connecting line of the two first positioning surfaces 2a at least partially coincides with the diameter of the positioning rod 1. In this way, when in use, the inner peripheral wall of the liquid supply hole can radially squeeze the two positioning blocks, so that the first positioning surface 2a is radially pressed against the inner peripheral wall of the liquid supply hole, thereby realizing the coaxial positioning of the first positioning member 2 and the liquid supply hole, thereby realizing the coaxial positioning of the positioning rod 1 and the liquid supply hole.

[0053] The first positioning member 2 provided in the embodiment of the present application is made of elastic material, wherein the elastic material is a type of material with the ability to recover deformation, which can be elastically deformed under the action of external force and can recover to its original state after the external force is removed. It can be a rubber material, such as fluororubber, or a thermoplastic elastomer material, or a silicone, which is not limited in the present application. As an optional solution, the first positioning member 2 is made of silicone material, which not only has good elasticity and ability to recover deformation, but also can ensure that the first positioning surface 2a is pressed against the inner wall of the liquid supply hole during positioning, relatively ensuring the positioning accuracy, and can also quickly recover the deformation after being pulled out of the liquid supply hole, which is not easy to affect the next use, and also has good corrosion resistance, is not easily corroded by the residual corrosive polishing liquid in the liquid supply hole, and can be used stably for a long time.

[0054] During specific use, the positioning rod 1 can be held with one hand to insert the first positioning piece 2 into the liquid supply hole. The first positioning piece 2 can be set to have an interference fit with the liquid supply hole, so that the entire polishing pad positioning device is fixed to the liquid supply hole and is not easy to fall off. In the subsequent positioning process with the liquid hole a, there is no need to hold the positioning rod 1 by hand. The positioning can be completed by operating the second end of the positioning rod 1 with one hand. The operation is convenient and the positioning efficiency is further improved.

[0055] Please refer to Figure 3 , Figure 3 for Figure 1 main view.

[0056] In the embodiments provided in this application, Figures 1 to 3 As shown, the polishing pad positioning device also includes a second positioning member 3; the second positioning member 3 is arranged on the outer peripheral wall of the positioning rod 1 and is located on the side of the first positioning member 2 close to the second end, and the second positioning member 3 has a second positioning surface 3a, and the second positioning surface 3a faces the first positioning member 2; the second positioning surface 3a is used to abut the lower surface of the upper polishing disk.

[0057] It is not difficult to understand that the second positioning surface 3a can be perpendicular to the axis of the positioning rod 1. When in use, after the first positioning member 2 is inserted into the liquid supply hole, the second positioning surface 3a can be used to abut the lower surface of the upper polishing plate to ensure the verticality of the positioning rod 1 and the lower surface of the upper polishing plate. Since the axis of the liquid supply hole is perpendicular to the lower surface of the upper polishing plate, the positioning rod 1 and the liquid supply hole can be further ensured to be coaxial, thereby improving the positioning accuracy.

[0058] In actual configuration, the material of the second positioning member 3 is not limited.

[0059] As an optional solution, the second positioning member 3 can be made of a magnet. In this way, when in use, the second positioning member 3 can be adsorbed on the upper polishing plate, further ensuring that the second positioning surface 3a is in close contact with the lower surface of the upper polishing plate, thereby improving the positioning accuracy. It also further ensures that after the first positioning member 2 is inserted into the liquid supply hole, the connection between the entire polishing pad positioning device and the upper polishing plate is more stable, further ensuring the reliability of the one-handed positioning operation.

[0060] It can be understood that the magnet used in the second positioning member 3 can generate a magnetic field, which can attract ferromagnetic materials such as metals such as iron, cobalt and nickel, and their alloys and compounds, and the upper polishing plate can be made of ferromagnetic materials. The specific material of the second positioning member 3 is not limited. For example, it can be a general magnet such as a ferrite magnet, or a strong magnet such as a neodymium iron boron magnet. It is specifically set according to the material of the upper polishing plate. As an optional solution, the second positioning member 3 is made of a neodymium iron boron magnet. In this way, the second positioning member 3 can have a higher magnetic field strength, which can enhance the adsorption force of the second positioning member 3 on the upper polishing plate, enhance the stability of the connection between the polishing pad positioning device and the upper polishing plate, make the positioning operation more stable, and also enable the material range of the adsorbable upper polishing plate to be wider, for example, it can be a commonly used stainless steel material.

[0061] In actual setting, the structural form of the second positioning member 3 is not limited. For example, it can be a step integrally provided on the outer peripheral wall of the positioning rod 1, and the step has an upward step surface, and the step surface forms the second positioning surface 3a. It can also be a boss integrally provided on the outer peripheral wall of the positioning rod 1, and the upper end surface of the boss forms the second positioning surface 3a. It can also be a positioning block separately fixed to the outer peripheral wall of the positioning rod 1, and the upper surface of the positioning block forms the second positioning surface 3a. Figure 2 As shown, a positioning sleeve is separately sleeved on the outer peripheral wall of the positioning rod 1, and the upper end surface of the positioning sleeve forms a second positioning surface 3a.

[0062] In this embodiment, if Figure 2 As shown, the second positioning member 3 is provided with a first threaded hole 3b, and the outer peripheral wall of the positioning rod 1 is provided with a first external thread 1a, and the first external thread 1a can cooperate with the first threaded hole 3b to enable the second positioning member 3 and the positioning rod 1 to be threadedly connected. In this way, the coaxiality of the second positioning member 3 and the positioning rod 1 can be accurately guaranteed by threaded connection, so as to ensure the verticality between the second positioning surface 3a and the axis of the positioning rod 1, thereby improving the positioning accuracy, and the processing accuracy of the thread is easy to ensure, so as to easily ensure the verticality here. In addition, the threaded connection also facilitates the disassembly of the second positioning member 3 and the positioning rod 1, which is convenient for the inspection and replacement of the two.

[0063] In addition, the flatness of the second positioning surface 3a during machining can be controlled to ensure the verticality between the second positioning surface 3a of the second positioning member 3 and the axis of the positioning rod 1, thereby improving the positioning accuracy.

[0064] Please refer to Figures 4 to 6 , Figure 4 for Figure 1 Bottom view of Figure 5 for Figure 2 A top view of Figure 6 for Figure 3 AA section view.

[0065] In actual use, the method of coaxial positioning between the second end of the positioning rod 1 and the liquid passage hole a of the polishing pad 5 is not limited. For example, the overall length of the polishing pad positioning device can be set to be less than the height of the positioning space between the upper polishing plate and the polishing pad 5, so that the polishing pad positioning device can enter between the upper polishing plate and the polishing pad 5 for positioning operation. In this case, the second end of the positioning rod 1 may not extend into the interior of the liquid passage hole a, but only be located above the liquid passage hole a, and the coaxial positioning of the positioning rod 1 and the liquid passage hole a can be performed by human eye observation. Of course, the overall length of the polishing pad positioning device can also be set to be greater than or equal to the height of the above-mentioned positioning space, and the elastic deformation performance of the first positioning member 2 can be used to squeeze the entire polishing pad positioning device into the above-mentioned positioning space for positioning operation. In this case, after the first positioning member 2 is inserted into the liquid supply hole, the second end of the positioning rod 1 can not extend into the interior of the liquid passage hole a for positioning operation as described above, and can also extend into the interior of the liquid passage hole a for positioning operation. Obviously, the latter has higher positioning accuracy and is more convenient to operate. In addition, other positioning members may be provided at the second end of the positioning rod 1 and extended into the interior of the liquid passage hole a to achieve precise coaxial positioning between the positioning rod 1 and the liquid passage hole a.

[0066] In the embodiment provided in the present application, the polishing pad positioning device also includes a third positioning member 4; the third positioning member 4 is arranged at the second end of the positioning rod 1, and the third positioning member 4 can move along the axial direction of the positioning rod 1 to extend or shorten the length of the polishing pad positioning device.

[0067] In this way, during specific use, before positioning begins, the third positioning member 4 can be moved upward to shorten the polishing pad positioning device to a length that is easy to enter the positioning space between the upper polishing disk and the polishing pad 5; after positioning begins, the third positioning member 4 can be moved downward to extend the length of the polishing pad positioning device, so that the operator can observe the relative position between the third positioning member 4 and the liquid hole a to be positioned, and the third positioning member 4 can be extended into the interior of the liquid hole a for precise positioning; after positioning is completed, the third positioning member 4 can be moved upward to shorten the length of the polishing pad positioning device, so that the polishing pad positioning device leaves the polishing pad 5, forming a spacing between the polishing pad positioning device and the polishing pad 5, and providing space for the polishing pad positioning device to subsequently exit from the upper polishing disk.

[0068] It can be seen that the third positioning member 4 which can move axially along the positioning rod 1 makes it easier for the polishing pad positioning device to enter and exit the positioning space, and also makes the positioning operation more convenient, which can not only improve the positioning efficiency to a large extent, but also improve the positioning accuracy.

[0069] In actual setting, the structure of the third positioning member 4 for achieving positioning is not limited.

[0070] As an alternative, please combine Figure 1 , Figure 4 and Figure 5 It is understood that the outer peripheral wall of the third positioning member 4 can form a third positioning surface 4a, and the third positioning member 4 is used to abut the inner peripheral wall of the liquid hole a through the third positioning surface 4a, so that the positioning rod 1 and the liquid hole a are coaxially positioned. It is understood that the third positioning member 4 can be coaxially arranged with the positioning rod 1. When the third positioning member 4 is inserted into the liquid hole a, the third positioning surface 4a can abut the inner peripheral wall of the liquid hole a to achieve the coaxial positioning between the third positioning member 4 and the liquid hole a, and relatively guarantee the accuracy of the coaxial positioning between the positioning rod 1 and the liquid hole a. On the basis of the relative guarantee of the coaxial positioning accuracy between the positioning rod 1 and the liquid supply hole by the first positioning member 2 above, the coaxial positioning accuracy of the liquid supply hole and the liquid hole a is relatively guaranteed.

[0071] In actual setting, the structure of the third positioning member 4 to achieve axial movement is not limited. For example, the third positioning member 4 can be block-shaped, specifically two fan-shaped positioning blocks, which are coaxially arranged on the outer peripheral wall of the second end of the positioning rod 1, and two sliding grooves can be opened on the outer peripheral wall of the positioning rod 1, and parts of the two fan-shaped positioning blocks are slidably arranged in the two sliding grooves, so that they can slide up and down along the axial direction; the third positioning member 4 can also be rod-shaped, and a sliding hole is coaxially opened on the end face of the second end of the positioning rod 1, and the third positioning member 4 is slidably arranged in the sliding hole, so that it can slide up and down along the axial direction; the third positioning member 4 can also be sleeve-shaped, and the third positioning member 4 can be slidably sleeved on the outer peripheral wall of the second end of the positioning rod 1 so that it can slide up and down along the axial direction. Of course, the third positioning member 4 can also be threadedly connected to the outer peripheral wall of the second end of the positioning rod 1 so that it can move up and down along the axial direction; the third positioning member 4 can also be made of elastic material, and one end of it can be fixedly connected to the second end of the positioning rod 1, and its elastic deformation performance can be used to lengthen the other end of the third positioning member 4. After the pulling force disappears, the third positioning member 4 can also be shortened to its original length, thereby realizing the axial movement of the third positioning member 4.

[0072] In the embodiments provided in this application, Figure 2 and Figure 6 As shown, the third positioning member 4 is provided with a second threaded hole 4b, the outer peripheral wall of the positioning rod 1 is provided with a second external thread 1b, and the third positioning member 4 and the positioning rod 1 are threadedly connected.

[0073] With such a configuration, the third positioning member 4 and the positioning rod 1 can be connected by a threaded connection to realize the conversion of the rotational motion of the third positioning member 4 into an axial linear motion. The length of the polishing pad positioning device can be extended or shortened by simply rotating the third positioning member 4. The operation is convenient and the efficiency of positioning between the positioning rod 1 and the liquid hole a can be improved. In addition, the coaxiality between the third positioning member 4 and the positioning rod 1 can be more accurately guaranteed to improve the positioning accuracy. The processing accuracy of the thread is easy to guarantee, so that the coaxiality here can be easily guaranteed. In addition, the threaded connection also facilitates the disassembly of the third positioning member 4 and the positioning rod 1, which is convenient for the inspection and replacement of the two.

[0074] It is not difficult to understand that the polishing pad positioning device provided in the above-mentioned embodiment of the present application can combine the elastic deformation positioning of the first positioning member 2, the magnetic adsorption positioning of the second positioning member 3 and the telescopic positioning of the third positioning member 4. Compared with the fixed length screw used in the perforation positioning method and the mechanical fastening technology used in the lateral positioning method in the prior art, it can achieve a major breakthrough, and can directly position between the liquid supply hole of the upper polishing plate and the liquid hole a of the polishing pad 5. The positioning accuracy and positioning efficiency are greatly improved, and the positioning operation can be completed quickly and accurately by a single person, with one hand, without removing the liquid tube.

[0075] In actual configuration, the structural form of the positioning rod 1 is not limited. Figure 6 The outer peripheral wall of the positioning rod 1 is provided with a first step and a second step, the first step is located above the second step, the first step has a first step surface 1c, the second step has a second step surface 1d, the first step surface 1c is arranged upward, and the second step surface 1d is arranged downward, the part of the positioning rod 1 located above the first step surface 1c is the upper rod section 11, the part located below the second step surface 1d is the lower rod section 13, and the part located between the first step surface 1c and the second step surface 1d is the middle rod section 12, the first external thread 1a can be provided in the upper rod section 11, and the second external thread 1b can be provided in the lower rod section 13, the second positioning member 3 and the first positioning member 2 are sequentially mounted on the upper rod section 11, the second positioning member 3 is threadedly connected to the upper rod section 11, and the third positioning member 4 is threadedly connected to the lower rod section 13. When used specifically, the second positioning member 3 can abut against the first step surface 1c, so that the first step surface 1c can be used to position the installation of the second positioning member 3, and the second step surface 1d can also be used to limit the upward movement of the third positioning member 4.

[0076] Please refer to Figures 7 to 10 , Figure 7 This is a schematic diagram of the three-dimensional structure of the polishing pad positioning device of the second embodiment provided in the present application. Figure 8 for Figure 7 Perspective drawing, Fig. 9 for Figure 7 The main view, Fig.10 for Figure 8 Top view of the .

[0077] In actual configuration, the shape of the middle rod section 12 is not limited, for example, it can be Figures 1 to 6 The round rod in the first embodiment is easy to manufacture, and can also be a rod with edges, such as a prismatic rod.

[0078] like Figures 7 to 10 As shown, the main difference between the second embodiment provided by the present application and the above-mentioned first embodiment is that the middle rod section 12 of the positioning rod 1 is a hexagonal prism-shaped rod, which can increase the friction between the human hand and the middle rod section 12 when using the polishing pad positioning device. When in use, the middle rod section 12 can be rotated while the first positioning member 2 is pushed into the liquid supply hole. It is not easy for the human hand and the middle rod section 12 to slip, the operation is more stable, and it is beneficial to improve the positioning efficiency.

[0079] In the embodiment of the present application, the polishing pad 5 is positioned using the polishing pad positioning device provided in the above embodiment. The specific positioning process may include the following steps:

[0080] Positioning group selection step: selecting at least one liquid supply hole and a corresponding liquid passage hole a, each selected liquid supply hole and corresponding liquid passage hole a forming a positioning group;

[0081] Liquid supply hole positioning step: for each positioning group, insert the first positioning member 2 into the liquid supply hole in the positioning group, and the first positioning surface 2a of the first positioning member 2 is pressed against the inner peripheral wall of the liquid supply hole to perform coaxial positioning of the positioning rod 1 and the liquid supply hole;

[0082] Liquid hole positioning step: for each positioning group, rotate the polishing pad 5 and use the second end of the positioning rod 1 to coaxially position the positioning rod 1 and the liquid hole a in the positioning group.

[0083] In the above-mentioned polishing pad positioning process, since the polishing pad 5 is positioned by using the polishing pad positioning device in the above-mentioned embodiment, the positioning accuracy and efficiency are high, and the operation is simple and convenient.

[0084] It is worth noting that since the liquid supply hole and the liquid passage hole a in the positioning group correspond to each other, when the position of the liquid passage hole a is constant, the liquid supply hole also has a corresponding consistent position. Therefore, in the following embodiments, the liquid passage hole a can be taken as an example to illustrate the position setting of the liquid supply hole and the liquid passage hole a in the positioning group.

[0085] In actual use, the positioning groups can be one group, two groups, or more than three groups, and the specific number is not limited.

[0086] As an optional solution, in the step of selecting the positioning group, three positioning groups are formed, corresponding to the three liquid supply holes of the upper polishing plate and the three liquid passage holes a in the polishing pad 5 corresponding to the three liquid supply holes. Taking the liquid passage holes a as an example, the centers of the three liquid passage holes a may not be collinear. In this way, based on the three-point plane determination principle, the three liquid supply holes and the three liquid passage holes a in the positioning group are positioned using the polishing pad positioning device of the embodiment of the present application, so that the positioning between the polishing pad 5 and the upper polishing plate can be achieved, and the other liquid supply holes and the liquid passage holes a are automatically aligned, which relatively guarantees the positioning accuracy of the other liquid passage holes a, thereby improving the positioning rate of the liquid passage holes a in the polishing pad 5, improving the positioning accuracy of the entire polishing pad 5, and at the same time, improving the positioning efficiency.

[0087] Please refer to Fig.11 , Fig.11 This is a schematic diagram of the positioning group selection during the positioning process of the polishing pad positioning device of the first embodiment provided in the present application.

[0088] In actual configuration, the polishing pad 5 often has dozens of liquid holes a, and Fig.11 As shown, they are distributed in a staggered manner on circles of different diameters, and the specific positions of the three liquid-passing holes a in the three positioning groups are not limited.

[0089] In this embodiment, in the positioning group selection step, the three liquid holes a in the three positioning groups are defined as the first positioning hole a1, the second positioning hole a2 and the third positioning hole a3, which specifically meet at least one of the following three conditions:

[0090] The first positioning hole a1, the second positioning hole a2 and the third positioning hole a3 are distributed on different circumferences, so that the positioning group is distributed on as many circumferences as possible, further ensuring the positioning accuracy between other unselected liquid holes a and the corresponding liquid supply holes, and improving the positioning rate of the liquid holes a in the entire polishing pad 5;

[0091] There are two or more liquid holes a distributed on the radial straight line where at least one of the first positioning hole a1, the second positioning hole a2 and the third positioning hole a3 is located, such as Fig.11 As shown by the middle dotted line, the improvement of the positioning accuracy of the liquid-passing hole a in the positioning group can directly improve the positioning accuracy of other liquid-passing holes a on the same radius, thereby further improving the positioning rate of the liquid-passing hole a in the polishing pad 5;

[0092] The angle between the radial straight line where the first positioning hole a1 is located and the radial straight line where the second positioning hole a2 is located is an acute angle, and the angle between the radial straight line where the third positioning hole a3 is located and the radial straight line where the second positioning hole a2 is located is an acute angle, so that the distribution of the positioning group is more compact, which is more conducive to the convenience of positioning operation and further improves the positioning efficiency. Among them, the radial straight line of the first positioning hole a1, the second positioning hole a2 and the third positioning hole a3 refers to the straight line where the line connecting the center of the corresponding hole and the center of the polishing pad 5 is located.

[0093] Obviously, the best effect is achieved when the above three conditions are met at the same time, which can improve both positioning accuracy and positioning efficiency. After actual measurement, after the polishing pad positioning device provided in the embodiment of the present application and the above selected positioning group are used to position the polishing pad 5 and the upper polishing plate, Fig.11 The positioning deviations of all the liquid holes a of the polishing pad 5 can be less than 1 mm, which ensures a high positioning accuracy and is conducive to the smooth operation of the entire CMP equipment after the polishing pad 5 is installed.

[0094] In the embodiment provided in the present application, the upper polishing plate is provided with a positioning groove at the edge of the side wall, and the edge of the polishing pad 5, i.e., the outermost circumference, is provided with a special positioning hole, which corresponds to Fig.11 The initial positioning hole a0 in the positioning group is not used for polishing liquid to pass through, but is only used for positioning in conjunction with the positioning groove. Before the positioning group selection step, an initial positioning step can also be performed, specifically including: rotating the polishing pad 5 so that the initial positioning hole a0 is located below the positioning groove for preliminary positioning. In this way, the foundation can be laid for the precise positioning of the above three positioning groups, further improving the positioning accuracy and positioning efficiency.

[0095] In specific settings, the three liquid holes a of the three positioning groups can be set on the same side of the radial line where the initial positioning hole a0 is located, which is convenient for operators to operate on the same side of the polishing pad 5 and is conducive to improving positioning efficiency.

[0096] During specific operation, three polishing pad positioning devices can be used to position the three positioning groups respectively. The positioning operations of the three positioning groups can be performed sequentially by one operator or collaboratively by three operators, without any specific limitation.

[0097] The principles and implementation methods of the present application are described in this article using specific examples. The description of the above embodiments is only used to help understand the device and its core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A polishing pad positioning device, It is characterized in that It comprises a positioning rod (1) and a first positioning member (2); The positioning rod (1) has a first end and a second end; the first positioning member (2) is arranged at the first end, and the outer peripheral wall of the first positioning member (2) forms a first positioning surface (2a); The first positioning member (2) is made of an elastic material and is used to press against the inner peripheral wall of the liquid supply hole of the upper polishing plate through the first positioning surface (2a) so that the positioning rod (1) and the liquid supply hole are coaxially positioned; the second end of the positioning rod (1) is used to be coaxially positioned with the liquid passage hole (a) of the polishing pad (5).

2. The polishing pad positioning device according to claim 1, It is characterized in that The first positioning member (2) is sleeve-shaped, and the first positioning member (2) is sleeved on the outer peripheral wall of the first end.

3. The polishing pad positioning device according to claim 1 or 2, It is characterized in that The polishing pad positioning device further comprises a second positioning member (3); The second positioning member (3) is arranged on the outer peripheral wall of the positioning rod (1) and is located on a side of the first positioning member (2) close to the second end. The second positioning member (3) has a second positioning surface (3a), and the second positioning surface (3a) faces the first positioning member (2); the second positioning surface (3a) is used to abut against the lower surface of the upper polishing plate.

4. The polishing pad positioning device according to claim 3, It is characterized in that The second positioning member (3) is made of a magnet, and the second positioning member (3) can be adsorbed on the upper polishing plate.

5. The polishing pad positioning device according to claim 3, It is characterized in that The second positioning member (3) is provided with a first threaded hole (3b), the outer peripheral wall of the positioning rod (1) is provided with a first external thread (1a), and the second positioning member (3) and the positioning rod (1) are threadedly connected.

6. The polishing pad positioning device according to claim 1 or 2, It is characterized in that The polishing pad positioning device further comprises a third positioning member (4); The third positioning member (4) is arranged at the second end of the positioning rod (1), and the third positioning member (4) is capable of moving along the axial direction of the positioning rod (1) to extend or shorten the length of the polishing pad positioning device.

7. The polishing pad positioning device according to claim 6, It is characterized in that The outer peripheral wall of the third positioning member (4) forms a third positioning surface (4a), and the third positioning member (4) is used to abut against the inner peripheral wall of the liquid passage hole (a) through the third positioning surface (4a) so as to position the positioning rod (1) and the liquid passage hole (a) coaxially.

8. The polishing pad positioning device according to claim 6, It is characterized in that The third positioning member (4) is provided with a second threaded hole (4b), the outer peripheral wall of the positioning rod (1) is provided with a second external thread (1b), and the third positioning member (4) and the positioning rod (1) are threadedly connected.

Citation Information

Cited By

  • Polishing pad positioning device and method

    CN118181134A

  • A polishing pad positioning device and method

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