Wafer classified storage device for optoelectronic device production
By designing a chip classification storage device for optoelectronic device production, using transmission dumping components, sorting components, shock-absorbing and telescopic components and mobile components, the problem of manual picking of optoelectronic device chip storage in the prior art is solved, and batch efficient storage is achieved.
Patent Information
- Application Number
- CN202420510253.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-16
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-03-16
AI Technical Summary
In the prior art, the storage of optoelectronic device chips requires manual selection, which is time-consuming and labor-intensive, causing inconvenience to staff.
A chip classification storage device for the production of optoelectronic devices is designed, including a conveying dumping assembly, sorting assembly, shock-absorbing telescopic assembly and a moving assembly. Through the combination of these components, batch transmission, pouring, sorting, moving and storage are realized.
It realizes batch transmission, pouring and sorting of optoelectronic device chips, reduces the time and labor intensity of manual operation, and improves storage efficiency and convenience.
Smart Images

Figure CN222896674U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of optoelectronic device storage devices, in particular to a wafer classification storage device for the production of optoelectronic devices. Background Art
[0002] Optoelectronic devices are devices that use semiconductor technology to combine light and electrons to achieve the conversion and control of light and electricity. The core of optoelectronic devices is the photoelectric effect, which uses photoelectric induction to make electrons flow, completing energy conversion and signal transmission.
[0003] In the prior art, optoelectronic device wafers are mostly manually picked one by one and then stored, which is time-consuming and labor-intensive and brings great inconvenience to the staff. Utility Model Content
[0004] In order to solve the above-mentioned existing problems, the utility model provides a chip classification and storage device for optoelectronic device production. By arranging a conveying and dumping component, it can achieve the effect of batch conveying and dumping optoelectronic device wafers. By arranging a sorting component, it can achieve the effect of batch sorting optoelectronic device wafers. By arranging a shock-absorbing telescopic component and a moving component, it can achieve the effect of moving, lifting and shock-absorbing according to the actual needs of the user.
[0005] The technical solution adopted by the utility model is as follows:
[0006] A wafer classification and storage device for producing optoelectronic devices comprises a main platform, a conveying and dumping assembly, a sorting assembly, a storage bin, a shock-absorbing and telescopic assembly and a moving assembly, wherein the conveying and dumping assembly is arranged on one side of the top of the main platform, the sorting assembly is arranged on the bottom of the main platform, the storage bin is arranged on the other side of the top of the main platform, and the shock-absorbing and telescopic assembly and the moving assembly are both arranged on the bottom of the main platform.
[0007] Furthermore, the conveying dumping assembly includes a support plate, a conveying motor, a conveying shaft, a conveying roller, a conveying belt and a conveying frame, the support plate is symmetrically arranged on the main platform, the conveying motor is arranged on the inner wall of the support plate, the conveying shaft is arranged by the conveying motor toward the side wall of the other support plate, the conveying roller is arranged on the conveying shaft, the conveying belt is arranged on the conveying shaft, and the conveying frame is arranged on the conveying belt.
[0008] Furthermore, the support plate, the conveying shaft and the conveying roller are arranged in two groups.
[0009] Furthermore, the sorting component includes a concave bin, a motor support plate, a reciprocating motor, a reciprocating shaft, a screening frame, a support frame and a storage drawer. The concave bin is arranged on the main platform and below the conveyor belt, and the concave bin is not provided with a bottom wall. The motor support plate is arranged below the main platform, the reciprocating motor is arranged on the support plate, the reciprocating shaft extends from the output shaft of the reciprocating motor and passes through the two side walls of the concave bin. The screening frame is arranged on the reciprocating shaft and in the concave bin. The support frame is arranged at the bottom of the main platform, and the storage drawer is slidably arranged on the support frame.
[0010] Furthermore, the shock-absorbing telescopic assembly includes a hydraulic telescopic rod, a limit damper, a shock-absorbing spring and a foot pad, the hydraulic telescopic rod is arranged at the bottom of the main platform, the limit damper is arranged at the bottom of the hydraulic telescopic rod, the shock-absorbing spring is arranged on the limit damper, and the foot pad is arranged below the shock-absorbing spring.
[0011] Furthermore, the moving assembly includes a connecting rod and a universal wheel, the connecting rod is arranged at the bottom of the main platform, and the universal wheel is arranged at the bottom of the connecting rod.
[0012] Furthermore, the hydraulic telescopic rod, limit damping, shock absorbing spring, foot pad, connecting rod and universal wheel are arranged in four groups.
[0013] The beneficial effects achieved by the utility model using the above structure are as follows:
[0014] 1. By setting up the conveying and dumping components, the effect of batch conveying and dumping optoelectronic device wafers can be achieved;
[0015] 2. By setting up the sorting components, the effect of sorting optoelectronic device wafers in batches can be achieved;
[0016] 3. By setting up shock-absorbing telescopic components and mobile components, the effects of movement, lifting and shock absorption can be achieved according to the actual needs of the user. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the structure of a wafer classification and storage device for optoelectronic device production proposed by the utility model;
[0018] Figure 2 This is a schematic cross-sectional structure diagram of a wafer classification and storage device for optoelectronic device production proposed by the utility model;
[0019] Figure 3 This is a structural schematic diagram of another perspective of a wafer classification and storage device for optoelectronic device production proposed by the utility model;
[0020] Figure 4 This is a schematic cross-sectional structure diagram from another perspective of a wafer classification and storage device for optoelectronic device production proposed by the utility model.
[0021] Among them, 1. main platform, 2. conveying and dumping component, 3. sorting component, 4. storage bin, 5. shock-absorbing and telescopic component, 6. moving component, 7. support plate, 8. conveying motor, 9. conveying shaft, 10. conveying roller, 11. conveyor belt, 12. conveying frame, 13. concave bin, 14. motor support plate, 15. reciprocating motor, 16. reciprocating shaft, 17. screening frame, 18. support frame, 19. storage drawer, 20. hydraulic telescopic rod, 21. limit damping, 22. shock-absorbing spring, 23. foot pad, 24. connecting rod, 25. universal wheel. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0023] like Figure 1-4 As shown, a wafer classification and storage device for the production of optoelectronic devices includes a main platform 1, a conveying and dumping component 2, a sorting component 3, a storage bin 4, a shock-absorbing and telescopic component 5 and a moving component 6. The conveying and dumping component 2 is arranged on one side of the top of the main platform 1, the sorting component 3 is arranged on the bottom of the main platform 1, the storage bin 4 is arranged on the other side of the top of the main platform 1, and the shock-absorbing and telescopic component 5 and the moving component 6 are both arranged on the bottom of the main platform 1.
[0024] like Figure 1-4 As shown, the conveying dumping assembly 2 includes a support plate 7, a conveying motor 8, a conveying shaft 9, a conveying roller 10, a conveying belt 11 and a conveying frame 12. The support plate 7 is symmetrically arranged on the main platform 1, the conveying motor 8 is arranged on the inner wall of the support plate 7, the conveying shaft 9 is arranged from the conveying motor 8 to the side wall of the other support plate 7, the conveying roller 10 is arranged on the conveying shaft 9, the conveying belt 11 is arranged on the conveying shaft 9, and the conveying frame 12 is arranged on the conveying belt 11.
[0025] like Figure 1-4 As shown, the support plate 7, the conveying shaft 9 and the conveying roller 10 are arranged in two groups.
[0026] like Figure 1-4As shown, the sorting component 3 includes a concave bin 13, a motor support plate 14, a reciprocating motor 15, a reciprocating shaft 16, a screening frame 17, a support frame 18 and a storage drawer 19. The concave bin 13 is arranged on the main platform 1 and is also arranged below the conveyor belt 11, and the concave bin 13 is not provided with a bottom wall. The motor support plate 14 is arranged below the main platform 1, the reciprocating motor 15 is arranged on the support plate 14, the reciprocating shaft 16 is extended from the output shaft of the reciprocating motor 15 and passes through the two side walls of the concave bin 13, the screening frame 17 is arranged on the reciprocating shaft 16 and is arranged in the concave bin 13, the support frame 18 is arranged at the bottom of the main platform 1, and the storage drawer 19 is slidably arranged on the support frame 18.
[0027] like Figure 1-4 As shown, the shock-absorbing telescopic assembly 5 includes a hydraulic telescopic rod 20, a limit damper 21, a shock-absorbing spring 22 and a foot pad 23. The hydraulic telescopic rod 20 is arranged at the bottom of the main platform 1, the limit damper 21 is arranged at the bottom of the hydraulic telescopic rod 20, the shock-absorbing spring 22 is arranged on the limit damper 21, and the foot pad 23 is arranged below the shock-absorbing spring 22.
[0028] like Figure 1-4 As shown, the moving assembly 6 includes a connecting rod 24 and a universal wheel 25 . The connecting rod 24 is arranged at the bottom of the main platform 1 , and the universal wheel 25 is arranged at the bottom of the connecting rod 24 .
[0029] like Figure 1-4 As shown, the hydraulic telescopic rod 20, the limit damping 21, the shock absorbing spring 22, the foot pad 23, the connecting rod 24 and the universal wheel 25 are arranged in four groups.
[0030] During specific use, the staff first pours the wafers into the conveying frame 12 in batches, starts the conveying motor 8 to drive the conveying shaft 9 to rotate, the conveying shaft 9 drives the conveying roller 10 to rotate, the conveying roller 10 drives the conveyor belt 11 to move, drives the conveying frame 12 to move forward to the recessed bin 13, and then dumps it into the screening frame 17, starts the reciprocating motor 15, the reciprocating motor 15 drives the reciprocating shaft 16 to reciprocate, and the reciprocating shaft 16 drives the screening frame 17 to reciprocate left and right, and the small wafers fall from the screening frame 17 into the storage drawer 19. When the storage drawer 19 is full, it is pulled out and dumped into the storage bin 4 to complete the storage effect. When the device needs to move, lift the hydraulic telescopic rod 20 to make the universal wheel 25 contact the ground to achieve the moving effect. When it needs to stop, lower the hydraulic telescopic rod 20 to make the foot pad 23 contact the ground to achieve the parking effect. The shock-absorbing spring 22 can reduce the vibration generated when the device is working.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
[0032] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. A wafer sorting and storage device for producing optoelectronic devices, characterized in that: It includes a main body platform, a conveying and dumping component, a sorting component, a storage bin, a shock-absorbing and telescopic component and a moving component. The conveying and dumping component is arranged on one side of the top of the main body platform, the sorting component is arranged on the bottom of the main body platform, the storage bin is arranged on the other side of the top of the main body platform, and the shock-absorbing and telescopic component and the moving component are both arranged on the bottom of the main body platform; The conveyor dumping assembly includes a support plate, a conveyor motor, a conveyor shaft, a conveyor roller, a conveyor belt and a conveyor frame, wherein the support plate is symmetrically arranged on the main platform, the conveyor motor is arranged on the inner side wall of the support plate, the conveyor shaft is arranged from the conveyor motor to the side wall of the other support plate, the conveyor roller is arranged on the conveyor shaft, the conveyor belt is arranged on the conveyor shaft, and the conveyor frame is arranged on the conveyor belt; The support plate, the transmission shaft and the transmission roller are provided in two groups; The sorting component includes a concave bin, a motor support plate, a reciprocating motor, a reciprocating shaft, a screening frame, a support frame and a storage drawer. The concave bin is arranged on the main platform and below the conveyor belt, and the concave bin is not provided with a bottom wall. The motor support plate is arranged below the main platform, the reciprocating motor is arranged on the support plate, the reciprocating shaft extends from the output shaft of the reciprocating motor and passes through the two side walls of the concave bin. The screening frame is arranged on the reciprocating shaft and in the concave bin. The support frame is arranged at the bottom of the main platform, and the storage drawer is slidably arranged on the support frame.
2. The wafer sorting and storage device for producing optoelectronic devices according to claim 1, characterized in that: The shock-absorbing telescopic assembly includes a hydraulic telescopic rod, a limit damper, a shock-absorbing spring and a foot pad. The hydraulic telescopic rod is arranged at the bottom of the main platform, the limit damper is arranged at the bottom of the hydraulic telescopic rod, the shock-absorbing spring is arranged on the limit damper, and the foot pad is arranged below the shock-absorbing spring.
3. The wafer sorting and storage device for producing optoelectronic devices according to claim 2, characterized in that: The moving assembly comprises a connecting rod and a universal wheel, wherein the connecting rod is arranged at the bottom of the main platform, and the universal wheel is arranged at the bottom of the connecting rod.
4. The wafer sorting and storage device for producing optoelectronic devices according to claim 3, characterized in that: The hydraulic telescopic rod, the limit damping, the shock absorbing spring, the foot pad, the connecting rod and the universal wheel are arranged in four groups.